A precision calendering mechanism for PO substrate

Abstract

This utility model discloses a precision calendering mechanism for PO substrates, including a frame, a take-up and unwinding assembly, a preheating assembly, a cooling assembly, two sets of calendering assemblies, and three sets of substrate support assemblies. The take-up and unwinding assembly is disposed at the inlet and outlet ends of the frame. The preheating assembly is disposed inside the frame near the inlet end, and the cooling assembly is disposed inside the frame near the outlet end. The two sets of calendering assemblies are disposed between the preheating and cooling assemblies. The three sets of substrate support assemblies are equidistantly connected to the inner top surface of the frame, respectively located between the preheating assembly, the cooling assembly, and the two sets of calendering assemblies. The purpose of this utility model is to overcome the shortcomings of existing precision calendering mechanisms for PO substrates, improve the thickness uniformity of PO substrates, and ensure the performance consistency of UV anti-adhesion substrates used for wafer grinding and dicing.

Description

Technical Field

[0001] This utility model relates to a precision calendering mechanism for PO substrate. Background Technology

[0002] In semiconductor manufacturing processes, the grinding and dicing processes place extremely high demands on the uniformity of UV (ultraviolet light) anti-adhesion substrates. As a core component of UV anti-adhesion substrates, the thickness uniformity of PO (polyolefin) substrates directly determines the effectiveness of the substrates. Currently, PO substrates on the market are mainly produced by casting lines. Although high-precision casting processes are used to produce PO substrates, the thickness tolerance is limited by the casting mechanism. Therefore, precision calendering is the only way to increase the thickness of the cast PO substrate.

[0003] However, because PO substrate is relatively soft, it becomes even softer under heat and is prone to shrinkage under tension. Therefore, traditional calendering equipment uses tension-controlled conveying, which easily leads to deformation and wrinkles of the PO substrate, seriously affecting the calendering quality. This results in increased thickness deviation of the PO substrate after calendering, ultimately causing poor performance consistency of UV-reduced PO substrate in semiconductor processing.

[0004] Therefore, a precision calendering mechanism for PO substrate is proposed to address the above problems. Utility Model Content

[0005] The purpose of this invention is to overcome the existing defects by providing a precision calendering mechanism for PO substrates, thereby improving the thickness uniformity of PO substrates and ensuring the performance consistency of UV anti-adhesion substrates used for wafer grinding and dicing.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a precision calendering mechanism for PO substrate, comprising a frame, a winding and unwinding assembly, a preheating assembly, a cooling assembly, two sets of calendering assemblies, and three sets of substrate support assemblies;

[0007] The winding and unwinding assembly is disposed at the inlet and outlet ends of the frame; the preheating assembly is disposed inside the frame near the inlet end, the cooling assembly is disposed inside the frame near the outlet end, and the two sets of calendering assemblies are disposed between the preheating assembly and the cooling assembly; the three sets of substrate support assemblies are equidistantly connected to the inner top surface of the frame, respectively located between the preheating assembly, the cooling assembly and the two sets of calendering assemblies.

[0008] Preferably, the preheating assembly includes a preheating roller group, which is disposed inside the frame on one side near the inlet end.

[0009] Preferably, the cooling assembly includes a cooling roller assembly disposed inside the frame on one side near the outlet end.

[0010] Preferably, the calendering assembly includes a calendering roll group, which is disposed between the preheating roll group and the cooling roll group.

[0011] Preferably, the substrate support assembly includes an air nozzle and a precision servo cylinder, the air nozzle being connected to the output end of the precision servo cylinder, and the fixed end of the precision servo cylinder being connected to the inner top surface of the frame.

[0012] Preferably, it also includes three distance sensors, which are disposed on the bottom surface of the frame; the three distance sensors are respectively located directly below the three air nozzles.

[0013] Preferably, the unwinding assembly includes an unwinding mechanism, which is located at the inlet end on the right side of the frame.

[0014] Preferably, the unwinding and rewinding assembly further includes a winding mechanism, which is located at the exit end on the left side of the frame.

[0015] Compared with the prior art, the beneficial effects of this utility model are: the precision calendering mechanism for PO substrate has a reasonable speed gradient, which improves uniformity: each roller group adopts a gradually increasing speed design, and the speed difference is controlled within 0.01% to 0.05%, so that the PO substrate is subjected to uniform force during calendering and cooling, avoiding thickness fluctuations caused by uneven stretching.

[0016] Tension-free support to avoid damage to the substrate: The PO substrate is conveyed without tension by blowing air through the nozzle. The height of the nozzle is adjusted in real time with the help of a distance sensor and a precision servo cylinder to ensure that the substrate is flat and avoid deformation and wrinkling of the substrate due to heat.

[0017] The core effects achieved through the above structure and control technology are: the thickness deviation of the processed PO substrate is ≤ ±2μm (≤ ±1.8μm in some scenarios), the performance consistency of the UV anti-adhesion substrate is improved by more than 30%, and the high precision requirements of the UV anti-adhesion substrate for wafer grinding and cutting in semiconductor manufacturing are met. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0019] Figure 1 This is a schematic diagram of the precision calendering mechanism for PO substrate of this utility model.

[0020] In the diagram: 1. Unwinding mechanism; 2. PO substrate; 3. Frame; 4. Preheating roller assembly; 5. Air nozzle; 6. Distance sensor; 7. Precision servo cylinder; 8. Calendering roller assembly; 9. Cooling roller assembly; 10. Rewinding mechanism. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] like Figure 1 As shown, a precision calendering mechanism for PO substrate includes a frame 3, a take-up and unwinding assembly, a preheating assembly, a cooling assembly, two sets of calendering assemblies, and three sets of substrate support assemblies. The take-up and unwinding assembly is located at the inlet and outlet ends of the frame 3. The preheating assembly is located inside the frame 3 on the side near the inlet end, and the cooling assembly is located inside the frame 3 on the side near the outlet end. The two sets of calendering assemblies are located between the preheating assembly and the cooling assembly. The three sets of substrate support assemblies are equidistantly connected to the inner top surface of the frame 3, respectively located between the preheating assembly, the cooling assembly, and the two sets of calendering assemblies.

[0023] Specifically, the preheating assembly includes a preheating roller group 4, which is located inside the frame 3 on one side near the inlet end.

[0024] Specifically, the preheating roll group 4 includes at least two parallel preheating rolls, the calendering roll group includes at least two cooperating calendering rolls, heating elements are embedded inside the preheating rolls and calendering rolls, the heating elements are electrically connected to the temperature control module, the temperature control module adjusts the temperature of the preheating rolls to the softening point temperature of the PO substrate, and the temperature control module adjusts the temperature of the calendering rolls to 10 to 20 degrees Celsius higher than the softening point temperature of the PO substrate.

[0025] Specifically, the cooling assembly includes a cooling roller group 9, which is located inside the frame 3 on one side near the outlet end.

[0026] Specifically, the cooling roller assembly 9 includes at least two parallel cooling rollers, each with a cooling channel inside. The cooling channel is connected to an external cooling module, which regulates the temperature of the cooling rollers to 10 degrees Celsius below the ambient temperature.

[0027] Specifically, the cooling channels are spirally distributed inside the cooling roller, with the inlet and outlet of the cooling channels located at both ends of the cooling roller. The external cooling module is connected to the inlet and outlet of the cooling channels through pipes to form a cooling medium circulation loop, ensuring uniform surface temperature of the cooling roller.

[0028] Specifically, the calendering assembly includes a calendering roll group 8, which is disposed between the preheating roll group 4 and the cooling roll group 9.

[0029] Specifically, the preheating roller group 4, the calendering roller group 8, and the cooling roller group 9 are each connected to an independent drive module. The drive module drives each roller group to rotate, and the rotation speed of the preheating roller group, the calendering roller group, and the cooling roller group gradually increases along the conveying direction of the PO substrate. The speed difference between adjacent roller groups is controlled within 0.01% to 0.05%.

[0030] Specifically, the substrate support assembly includes a nozzle 5 and a precision servo cylinder 7. The nozzle 5 is connected to the output end of the precision servo cylinder 7, and the fixed end of the precision servo cylinder 7 is connected to the inner top surface of the frame 3.

[0031] Specifically, it also includes three distance sensors 6, which are installed on the bottom surface of the frame 3; the three distance sensors 6 are located directly below the three air nozzles 5.

[0032] Specifically, the air nozzle 5 is positioned below the PO substrate 2, with the air blowing direction perpendicular to the lower surface of the PO substrate; the distance sensor 6 is installed below the PO substrate 2 to detect the distance between the PO substrate and the air nozzle in real time; the distance sensor 6 is electrically connected to the control module, the control module is electrically connected to the precision servo cylinder, and the output end of the precision servo cylinder is fixedly connected to the air nozzle; when the distance sensor detects a change in the distance between the PO substrate and the air nozzle, it transmits a signal to the control module, which then controls the precision servo cylinder to drive the air nozzle to move up and down, keeping the distance between the air nozzle and the PO substrate constant.

[0033] Specifically, there are multiple air nozzles 5, which are evenly distributed along the width direction of the PO substrate. Each air nozzle is connected to a precision servo cylinder. The number of distance sensors is the same as the number of air nozzles, and they are set one by one on the side of the air nozzles to realize independent flatness control at each position in the width direction of the PO substrate.

[0034] Specifically, the surfaces of the preheating roll, calendering roll, and cooling roll are all polished, with a surface roughness Ra≤0.02μm, to avoid surface defects of the rolls affecting the surface smoothness of the PO substrate.

[0035] Specifically, the embodiment also includes a temperature sensor and a PID controller. The temperature sensor is respectively attached to the surface of the preheating roll and the calendering roll. The temperature sensor is electrically connected to the PID controller, and the PID controller is electrically connected to the first heating element and the second heating element. The temperature control accuracy can reach ±0.5 degrees Celsius.

[0036] Specifically, the unwinding and take-up assembly includes an unwinding mechanism 1, which is located at the inlet end on the right side of the frame 3. The unwinding and take-up assembly also includes a take-up mechanism 10, which is located at the outlet end on the left side of the frame 3.

[0037] Specifically, both the unwinding roll and the take-up roll are rotatably connected to the frame via bearing seats, and the unwinding roll and the take-up roll are respectively connected to the take-up and unwinding motors. The take-up and unwinding motors are electrically connected to the take-up and unwinding controller, and the take-up and unwinding controller is communicatively connected to the drive controller, so that the take-up and unwinding speeds are matched with the rotational speeds of each roll group.

[0038] Specifically, the embodiment also includes a servo motor and a gearbox. The output end of the servo motor is connected to the input end of the gearbox, the output end of the gearbox is connected to the roller shaft of the corresponding roller group, the servo motor is electrically connected to the drive controller, and the drive controller is communicatively connected to the host computer. The speed control accuracy can reach ±0.005%.

[0039] Specifically, during use, manual or automated equipment installs the rolled PO substrate 2 onto the unwinding mechanism 1, ensuring that one end of the substrate is drawn out flat; the PO substrate 2 is then smoothly conveyed to the preheating roller group 4, and the substrate tension is kept in line with the speed of the subsequent roller group during the conveying process to avoid substrate wrinkles in the initial stage.

[0040] Specifically, PO substrate 2 enters the preheating roller group 4 (at least two parallel preheating rollers with a surface roughness Ra≤0.02μm). The heating elements embedded inside the preheating rollers stabilize the roller surface temperature at the set "substrate softening point temperature" under the drive of the temperature control module. The substrate fully contacts the roller surface in the preheating roller group 4 and gradually reaches a softened state, preparing for the subsequent calendering process. At the same time, due to the polishing treatment of the preheating roller surface, scratches or affecting the flatness of the substrate surface are avoided. After preheating, the substrate is uniformly conveyed to the substrate support component area between the preheating roller group 4 and the calendering roller group 8 under the drive of the preheating roller driven by the drive module (servo motor + gearbox).

[0041] Specifically, when the PO substrate 2 enters between the preheating roller group 4 and the calendering roller group 8, the lower air nozzle 5 is activated, blowing air in a direction perpendicular to the lower surface of the substrate to form tension-free support, avoiding substrate deformation caused by traditional tension control; the distance sensor 6 detects the distance between the corresponding air nozzle 5 and the lower surface of the substrate in real time. If a distance deviation is detected (such as slight bulging or sagging of the substrate due to heat), the signal is immediately transmitted to the control module; after receiving the signal, the control module drives the precision servo cylinder 7 (fixedly connected to the air nozzle 5) to move up and down, adjusting the height of the air nozzle 5 until the set constant distance is restored, ensuring that the substrate is flat in all positions in the width direction and smoothly transitions to the calendering roller group 8.

[0042] Specifically, the PO substrate 2, which is supported without tension, enters the calendering roll group 8 (at least two calendering rolls that cooperate with each other and have a surface roughness Ra≤0.02μm). The heating element inside the calendering roll maintains the roll surface temperature at "substrate softening point temperature +10~20℃" under the action of the temperature control module, ensuring that the substrate is in a pliable state.

[0043] Specifically, under the drive of an independent drive module, the calendering roll group 8 rotates at a set speed (higher than the speed of the preheating roll group 4, with a speed difference of 0.01% to 0.05%), and precisely calenders the substrate through the pressure between the two rolls, adjusting the substrate thickness to the target size. During the calendering process, due to the polishing treatment of the calendering roll surface and precise temperature and speed control, thickness deviations or surface defects of the substrate are avoided. After calendering is completed, the substrate is conveyed to another set of substrate support components between the calendering roll group 8 and the cooling roll group 9.

[0044] Specifically, the calendered PO substrate 2 enters the substrate support assembly area between the calendering roll group 8 and the cooling roll group 9. In this area, the air nozzle 5, distance sensor 6, and precision servo cylinder 7 repeat the action of step four, and once again ensure the flatness of the substrate through tensionless support, so as to avoid deformation of the calendered substrate due to high temperature during the conveying process.

[0045] Specifically, the substrate smoothly enters the cooling roller group 9 (at least two parallel cooling rollers with a surface roughness Ra≤0.02μm). The cooling channels inside the cooling rollers are connected to the external cooling module. The cooling medium (such as coolant) circulates in the channels to stabilize the roller surface temperature at "space temperature -10℃". The substrate is in full contact with the cooling roller surface, which quickly cools and shapes it, and fixes the thickness dimension after calendering. After cooling, the substrate is conveyed to the winding mechanism 10 under the drive of the cooling roller group 9 (the rotation speed is higher than that of the calendering roller group 8, and the speed difference is 0.01% to 0.05%).

[0046] Specifically, after cooling and shaping, the PO substrate 2 arrives at the winding mechanism 10, which flattens and winds the substrate into a roll to prevent stretching or loosening of the substrate during winding. Once a roll of substrate is wound up, a single calendering operation is completed, and the above process can be repeated for the next roll of substrate.

[0047] This precision calendering mechanism for PO substrates uses temperature parameters tailored to the characteristics of PO substrates for different roller sets: preheating roller temperature = softening point temperature of PO substrate; calendering roller temperature = softening point temperature of PO substrate + 10~20℃; cooling roller temperature = ambient temperature - 10℃. This graded temperature design can avoid thickness deviations caused by uneven softening or untimely cooling of the substrate.

[0048] The design protects the "preheating roller group → calendering roller group → cooling roller group speed gradually increases along the conveying direction" and clearly controls the speed difference between adjacent roller groups to 0.01% to 0.05% to avoid thickness fluctuations caused by uneven stretching of the substrate.

[0049] The protection system features a combined structure of "air nozzle + distance sensor + precision servo cylinder": the air nozzle is positioned above the substrate, with the air blowing direction perpendicular to the upper surface of the substrate, achieving tension-free support and avoiding substrate deformation and wrinkles caused by traditional tension control; the distance sensor corresponds to each air nozzle (uniformly distributed along the width of the substrate) to detect the distance between the air nozzle and the substrate in real time; the precision servo cylinder is fixedly connected to the air nozzle, receives sensor signals through the control module and drives the air nozzle to move up and down, ensuring a constant distance between the air nozzle and the substrate, and achieving independent flatness control at each position in the width direction of the substrate.

[0050] The process design of "polishing the surfaces of preheating rolls, calendering rolls, and cooling rolls (surface roughness Ra≤0.02μm)" is protected to avoid surface defects of the rolls affecting the original morphology and smoothness of the substrate surface, and to further ensure calendering accuracy.

[0051] This precision calendering mechanism for PO substrate features a reasonable speed gradient to improve uniformity: each roller group adopts a gradually increasing speed design, and the speed difference is controlled within 0.01% to 0.05%, ensuring that the PO substrate is subjected to uniform force during calendering and cooling, and avoiding thickness fluctuations caused by uneven stretching.

[0052] Tension-free support to avoid damage to the substrate: The PO substrate is conveyed without tension by blowing air through the nozzle. The height of the nozzle is adjusted in real time with the help of a distance sensor and a precision servo cylinder to ensure that the substrate is flat and avoid deformation and wrinkling of the substrate due to heat.

[0053] The core effects achieved through the above structure and control technology are: the thickness deviation of the processed PO substrate is ≤ ±2μm (≤ ±1.8μm in some scenarios), the performance consistency of the UV anti-adhesion substrate is improved by more than 30%, and the high precision requirements of the UV anti-adhesion substrate for wafer grinding and cutting in semiconductor manufacturing are met.

[0054] Finally, it should be noted that the above are merely preferred embodiments of this utility model and are not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A precision calendering mechanism for PO substrate, characterized in that, Includes a frame (3), a winding and unwinding assembly, a preheating assembly, a cooling assembly, two sets of calendering assemblies, and three sets of substrate support assemblies; The winding and unwinding assembly is disposed at the inlet and outlet ends of the frame (3); the preheating assembly is disposed inside the frame (3) on the side near the inlet end; the cooling assembly is disposed inside the frame (3) on the side near the outlet end; and the two sets of calendering assemblies are disposed between the preheating assembly and the cooling assembly; and the three sets of substrate support assemblies are equidistantly connected to the inner top surface of the frame (3), respectively located between the preheating assembly, the cooling assembly and the two sets of calendering assemblies.

2. The precision calendering mechanism for PO substrate according to claim 1, characterized in that, The preheating assembly includes a preheating roller group (4), which is disposed inside the frame (3) on one side near the inlet end.

3. The precision calendering mechanism for PO substrate according to claim 2, characterized in that, The cooling assembly includes a cooling roller group (9), which is disposed inside the frame (3) on one side near the outlet end.

4. The precision calendering mechanism for PO substrate according to claim 3, characterized in that, The calendering assembly includes a calendering roll group (8), which is disposed between the preheating roll group (4) and the cooling roll group (9).

5. The precision calendering mechanism for PO substrate according to claim 1, characterized in that, The substrate support assembly includes an air nozzle (5) and a precision servo cylinder (7). The air nozzle (5) is connected to the output end of the precision servo cylinder (7), and the fixed end of the precision servo cylinder (7) is connected to the inner top surface of the frame (3).

6. The precision calendering mechanism for PO substrate according to claim 5, characterized in that, It also includes three distance sensors (6), which are disposed on the bottom surface of the frame (3); the three distance sensors (6) are respectively located directly below the three air nozzles (5).

7. The precision calendering mechanism for PO substrate according to claim 1, characterized in that, The unwinding and winding assembly includes an unwinding mechanism (1), which is located at the inlet end on the right side of the frame (3).

8. The precision calendering mechanism for PO substrate according to claim 1, characterized in that, The unwinding and winding assembly also includes a winding mechanism (10), which is located at the exit end on the left side of the frame (3).

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