A multifunctional headrest

Abstract

The utility model provides a kind of multifunctional headrest, belong to the technical field of seat accessories.It solves the problem of poor comfort of the headrest of the prior art automobile seat.The multifunctional headrest, including headrest seat, headrest sponge being set on headrest seat and headrest face cover being covered in the outside of headrest sponge, the headrest also includes air pump, the headrest sponge includes the sponge main body being connected on the headrest seat, the sponge main body is provided with the installation groove being recessed backwards, semiconductor refrigerating fin and a plurality of headrest air bags being respectively communicated with the air pump are arranged in the installation groove, the air pump can be individually, partially or entirely inflated and deflated to a plurality of headrest air bags, the installation groove is also provided with the sponge cover plate covering semiconductor refrigerating fin and a plurality of headrest air bags, and the semiconductor refrigerating fin can heat or refrigerate the sponge cover plate.The utility model has the advantage of improving the comfort of the headrest of the automobile seat.

Description

Technical Field

[0001] This utility model belongs to the technical field of seat accessories and relates to a multifunctional headrest. Background Technology

[0002] Car seat headrests are important accessories for seats, combining driving comfort and safety protection. They are mainly used to relieve neck fatigue and provide collision cushioning protection. For example, Chinese patent literature discloses a car seat headrest (authorization announcement number: CN223058870U), which includes: headrest frame, headrest foam, and headrest cover.

[0003] Like traditional headrests, this car seat headrest only allows for vertical adjustment of the headrest position, which is relatively simple and can no longer meet users' growing demands for comfort in car seat headrests. Summary of the Invention

[0004] The purpose of this invention is to address the aforementioned problems in existing technologies by proposing a multifunctional headrest. The technical problem this invention aims to solve is how to improve the comfort of car seat headrests.

[0005] The objective of this utility model can be achieved through the following technical solutions:

[0006] A multifunctional headrest includes a headrest base, a headrest sponge disposed on the headrest base, and a headrest cover covering the outside of the headrest sponge. The headrest is characterized by further including an air pump. The headrest sponge includes a sponge body connected to the headrest base. The sponge body has a rearwardly recessed mounting groove. A semiconductor cooling chip and several headrest air bags, each communicating with the air pump, are offset within the mounting groove. The air pump can individually, partially, or completely inflate or deflate the several headrest air bags. A sponge cover plate covering the semiconductor cooling chip and the several headrest air bags is also disposed within the mounting groove. The semiconductor cooling chip can heat or cool the sponge cover plate.

[0007] This multifunctional headrest can provide either cooling or heating to the driver's or passenger's head through the heating or cooling of the foam cover using a semiconductor cooling chip. Cooling lowers the head temperature, providing a refreshing and comfortable feeling, thus reducing fatigue. Heating promotes blood circulation in the head, relaxing the head muscles and alleviating fatigue. Simultaneously, an air pump inflates or deflates several of the headrest airbags individually, partially, or completely. The pressure generated during inflation and deflation is transmitted through the foam cover and headrest cover to the driver's or passenger's head, providing a massage effect. This enhances the comfort of the car seat headrest, quickly relieves driver fatigue, improves driving safety, and enriches the headrest's functionality.

[0008] In the aforementioned multifunctional headrest, the bottom wall of the mounting groove has a first positioning groove in the middle, and the bottom wall of the mounting groove has several second positioning grooves located on both sides of the first positioning groove. The semiconductor cooling chip is disposed in the first positioning groove, and the headrest airbags are all disposed in the second positioning grooves. By disposing the headrest airbags in the second positioning grooves, the groove walls of the second positioning grooves can limit the movement of the headrest airbags, preventing them from shifting during use, thereby improving the reliability of the multifunctional headrest. Furthermore, by disposing the semiconductor cooling chip in the first positioning groove, both the semiconductor cooling chip and the headrest airbags can make better contact with the sponge cover.

[0009] In the aforementioned multifunctional headrest, the headrest airbag comprises multiple air chambers stacked one on top of the other, with the air chambers connected sequentially. The stacked arrangement of these sequentially connected air chambers ensures that the headrest airbag maintains a stable shape during inflation and deflation; that is, its shape does not change drastically when inflated or deflated.

[0010] In the aforementioned multifunctional headrest, the headrest seat is further equipped with a controller and an airflow distributor. The air pump is connected to the air inlet of the airflow distributor, and several headrest air bags are connected to the air outlet of the airflow distributor via air pipes. Each air pipe is equipped with a solenoid valve to control the opening and closing of the air path. The controller is electrically connected to both the air pump and the solenoid valves to control their opening and closing. The airflow distributor connects the air pump to several headrest air bags. The air pump can be installed inside the seat back. The length of the air pipe connecting the air pump and the airflow distributor has a certain margin to facilitate the adjustment of the headrest's height. Furthermore, by installing solenoid valves on the air pipes to control the opening and closing status, timing, and sequence of the solenoid valves, the controller can control the individual, partial, or complete inflation and deflation of the headrest air bags.

[0011] In the aforementioned multifunctional headrest, a microcontroller and a relay are also installed on the headrest seat. The microcontroller controls the heating or cooling of the thermoelectric cooler via the relay. By using the microcontroller and relay to change the polarity of the current flowing into the thermoelectric cooler, the thermoelectric cooler is controlled to achieve heating or cooling functions, making the control of the thermoelectric cooler more intelligent.

[0012] In the aforementioned multifunctional headrest, the headrest base includes a seat and a headrest back cover detachably connected to the rear side of the seat. A headrest rod extending through the headrest back cover is connected to the seat. The headrest rod has a through-channel extending along its length. Speaker holes are provided on the seat, the foam body, the foam cover, and the headrest cover. An installation cavity can be formed between the seat and the headrest back cover for installing an airflow distributor or other components. The speaker holes on the seat, the foam body, the foam cover, and the headrest cover can be used to transmit sound, further enriching the headrest's functionality. The through-channel on the headrest rod can be used for wiring harnesses and air pipes, ensuring that the wiring harness connecting the microcontroller and the air pipe connecting the air pump are not exposed.

[0013] Compared with existing technologies, the advantages of this multifunctional headrest are as follows: This multifunctional headrest can achieve cold or hot compresses on the driver's head through the heating or cooling of the semiconductor cooling chip. Cold compresses can lower the temperature of the driver's head, making the driver feel cool and comfortable, thereby reducing fatigue. Hot compresses can promote blood circulation in the head, allowing the driver's head muscles to relax, thereby relieving fatigue. At the same time, the air pump can individually, partially or completely inflate and deflate several of the headrest air bags to massage the driver's head, thereby improving the comfort of using the car seat headrest, quickly relieving the fatigue of the driver and passengers, improving safe driving and enriching the headrest's functions. Attached Figure Description

[0014] Figure 1 This is a 3D structural diagram of the multi-functional headrest (excluding the air pump).

[0015] Figure 2 This is an exploded view of this multi-functional headrest (including an air pump).

[0016] Figure 3 This is a three-dimensional structural diagram of the multifunctional headrest pillow rod (with a wire harness or air tube inside the through channel).

[0017] In the diagram, 1. Headrest seat; 1a. Seat body; 1b. Headrest back cover; 2. Headrest foam; 2a. Foam body; 2a1. Mounting groove; 2a2. First positioning groove; 2a3. Second positioning groove; 2b. Foam cover plate; 3. Headrest face cover; 4. Air pump; 5. Semiconductor cooling chip; 6. Headrest air bag; 6a. Air chamber; 7. Airflow distributor; 8. Air pipe; 9. Headrest rod; 9a. Through channel; 10. Speaker hole. Detailed Implementation

[0018] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.

[0019] A multifunctional headrest includes a headrest base 1, a headrest sponge 2 disposed on the headrest base 1, and a headrest cover 3 covering the outside of the headrest sponge 2. The headrest also includes an air pump 4. The headrest sponge 2 includes a sponge body 2a connected to the headrest base 1. The sponge body 2a has a rearwardly recessed mounting groove 2a1. A semiconductor cooling chip 5 and several headrest air bags 6, each communicating with the air pump 4, are staggered in the mounting groove 2a1. The air pump 4 can individually, partially, or completely inflate or deflate the several headrest air bags 6. A sponge cover plate 2b covering the semiconductor cooling chip 5 and the several headrest air bags 6 is also disposed in the mounting groove 2a1. The semiconductor cooling chip 5 can heat or cool the sponge cover plate 2b.

[0020] Specifically, the bottom wall of the mounting groove 2a1 has a first positioning groove 2a2 in the middle, and the bottom wall of the mounting groove 2a1 has a plurality of second positioning grooves 2a3 located on both sides of the first positioning groove 2a2. The semiconductor cooling chip 5 is disposed in the first positioning groove 2a2, and the headrest air bag 6 is disposed in the second positioning groove 2a3.

[0021] In this embodiment, the preferred headrest airbag 6 comprises multiple air chambers 6a stacked one after the other, and the multiple air chambers 6a are connected in sequence. The headrest airbag 6 uses multiple air chambers 6a stacked one after the other, so that the headrest airbag 6 can maintain a stable shape when inflated or deflated, that is, the shape of the headrest airbag will not change drastically when it is inflated or deflated.

[0022] More specifically, the headrest seat 1 is also equipped with a controller and an airflow distributor 7. The air pump 4 is connected to the air inlet of the airflow distributor 7. Several headrest air bags 6 are connected to the air outlets of the airflow distributor 7 one by one through air pipes 8. Each air pipe 8 is equipped with a solenoid valve to control the opening and closing of the air path. The controller is electrically connected to both the air pump 4 and the solenoid valve to control their opening and closing. (Refer to...) Figure 2 (Controller and solenoid valves are not shown in the diagram). In this embodiment, four headrest air bags 6 are preferably located at the four corners of the headrest. The controller controls the opening and closing status, opening and closing time, and opening and closing sequence of several solenoid valves to enable the air pump 4 to individually, partially, or completely inflate and deflate the several headrest air bags 6. During the inflation and deflation process, the pressure generated by the several headrest air bags 6 can be transmitted to the head of the driver and passenger through the sponge cover 2b and the headrest cover 3, thereby realizing the massage function of the driver and passenger's head, thereby enhancing the comfort of the headrest and quickly eliminating fatigue.

[0023] The headrest seat 1 is also equipped with a microcontroller and a relay. The microcontroller controls the heating or cooling of the thermoelectric cooler 5 via the relay. In use, the thermoelectric cooler 5 is first energized, causing it to heat or cool the sponge cover 2b. The sponge cover 2b then transfers the heat or cold to the headrest cover 3. The thermoelectric cooler 5 operates using direct current, and it can both cool and heat. That is, the polarity of the direct current determines whether cooling or heating is achieved on the same thermoelectric cooler 5. Since the on-board power supply used by the thermoelectric cooler 5 in this multifunctional headrest is direct current, the switching between heating and cooling functions can be controlled by changing the polarity of the direct current. Alternatively, the microcontroller controls the relay (which has normally open and normally closed terminals) to change the polarity of the current flowing into the thermoelectric cooler 5, thereby controlling the switching between heating and cooling functions.

[0024] Meanwhile, the semiconductor cooler 5 is composed of two ceramic plates, with N-type and P-type semiconductor materials (bismuth telluride) in between. This semiconductor element is connected in series in the circuit. The working principle of the semiconductor cooler 5 is as follows: when an N-type semiconductor material and a P-type semiconductor material are connected to form an electrical couple, a direct current is applied to this circuit, which can generate energy transfer. The current flows from the N-type element to the P-type element's junction to absorb heat, becoming the cold end, and flows from the P-type element to the N-type element's junction to release heat, becoming the hot end. One ceramic plate is placed or rests against the sponge cover plate 2b, while the other ceramic plate is not in contact with the sponge cover plate 2b. When the ceramic plate placed on the sponge cover plate 2b is cooled (i.e., when the semiconductor cooler 5 is cooling), the other ceramic plate that is not in contact with the sponge cover plate 2b simultaneously dissipates heat. Therefore, the semiconductor cooler 5 can achieve the function of continuously cooling the sponge cover plate 2b.

[0025] More specifically, the headrest seat 1 includes a seat body 1a and a headrest back cover 1b detachably connected to the rear side of the seat body 1a. A headrest rod 9 is connected to the seat body 1a and extends through the headrest back cover 1b. The headrest rod 9 has a through channel 9a opened along the length direction. Speaker holes 10 are respectively opened on the seat body 1a, the sponge body 2a, the sponge cover plate 2b and the headrest cover 3.

[0026] The specific embodiments described herein are merely illustrative examples illustrating the spirit of this utility model. Those skilled in the art to which this utility model pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of this utility model or exceeding the scope defined by the appended claims.

Claims

1. A multifunctional headrest, comprising a headrest base (1), a headrest sponge (2) disposed on the headrest base (1), and a headrest cover (3) covering the outside of the headrest sponge (2), characterized in that, This headrest also includes an air pump (4). The headrest sponge (2) includes a sponge body (2a) connected to the headrest seat (1). The sponge body (2a) has a recessed mounting groove (2a1). A semiconductor cooling chip (5) and several headrest air bags (6) respectively connected to the air pump (4) are staggered in the mounting groove (2a1). The air pump (4) can inflate or deflate the several headrest air bags (6) individually, partially or completely. A sponge cover plate (2b) covering the semiconductor cooling chip (5) and several headrest air bags (6) is also provided in the mounting groove (2a1). The semiconductor cooling chip (5) can heat or cool the sponge cover plate (2b).

2. The multifunctional headrest according to claim 1, characterized in that, The bottom wall of the mounting groove (2a1) has a first positioning groove (2a2) in the middle, and the bottom wall of the mounting groove (2a1) has a plurality of second positioning grooves (2a3) located on both sides of the first positioning groove (2a2). The semiconductor cooling chip (5) is disposed in the first positioning groove (2a2), and the headrest air bag (6) is disposed in the second positioning groove (2a3).

3. A multifunctional headrest according to claim 1 or 2, characterized in that, The headrest air bag (6) includes multiple air chambers (6a) stacked in front and behind, and the multiple air chambers (6a) are connected in sequence.

4. A multifunctional headrest according to claim 1 or 2, characterized in that, The headrest seat (1) is also equipped with a controller and an airflow distributor (7). The air pump (4) is connected to the air inlet of the airflow distributor (7). Several headrest air bags (6) are connected to the air outlet of the airflow distributor (7) one by one through air pipes (8). The air pipes (8) are equipped with solenoid valves that control the opening and closing of the air path. The controller is electrically connected to the air pump (4) and the solenoid valve respectively to control the opening and closing of both.

5. A multifunctional headrest according to claim 1 or 2, characterized in that, The headrest seat (1) is also equipped with a microcontroller and a relay. The microcontroller controls the heating or cooling of the semiconductor cooling chip (5) through the relay.

6. A multifunctional headrest according to claim 1 or 2, characterized in that, The headrest seat (1) includes a seat body (1a) and a headrest back cover (1b) detachably connected to the rear side of the seat body (1a). A headrest rod (9) is connected to the seat body (1a) and extends through the headrest back cover (1b). The headrest rod (9) has a through channel (9a) opened along the length direction. The seat body (1a), the sponge body (2a), the sponge cover plate (2b) and the headrest cover (3) are all provided with sound holes (10).

Images