Longitudinal sealing and rapid cooling structure of fully automatic vertical packaging machine

Abstract

This utility model discloses a longitudinal sealing rapid cooling structure for a fully automatic vertical packaging machine, relating to the technical field of longitudinal sealing rapid cooling structures. It includes a vertical packaging machine body with a longitudinal sealing area. A pair of liquid storage frames are located at the bottom of the longitudinal sealing area, and one side of each pair of liquid storage frames is fixedly connected to one side of the vertical packaging machine body. This utility model utilizes the flexibility of a thermally conductive silicone pad to increase the contact area between the copper heat-conducting block and the packaging material, filling gaps and improving heat transfer efficiency. Combined with the circulating flow of coolant, it absorbs heat at the sealing point of the packaging material after longitudinal sealing, achieving rapid cooling and allowing the seal to reach a stable state more quickly. Simultaneously, the heat-absorbing end of the semiconductor cooling chip absorbs heat from the coolant, actively cooling the coolant and reducing its temperature, ensuring the cooling effect of the cooling structure.

Description

Technical Field

[0001] This utility model belongs to the technical field of longitudinal sealing rapid cooling structure, and in particular relates to a longitudinal sealing rapid cooling structure for a fully automatic vertical packaging machine. Background Technology

[0002] The fully automatic vertical packaging machine is a highly efficient automated equipment that integrates functions such as bag making, filling, sealing, printing, punching, and counting. The longitudinal sealing of the fully automatic vertical packaging machine is achieved by heating and pressurizing to seal the longitudinal edges of the packaging material. After sealing, the material is still in a high-temperature state, so a longitudinal sealing cooling structure is needed to cool it down, so that the seal can reach a stable state more quickly and avoid cracking or leakage of the seal due to pulling or vibration.

[0003] Currently, in fully automatic vertical packaging machines, the cooling structure is generally located at the bottom of the longitudinal sealing mechanism. After heat sealing, it immediately descends to the cooling zone. The cooling zone usually has a built-in circulating water cooling system or air cooling module. Heat is quickly dissipated through copper heat-conducting blocks, causing the sealing temperature to drop rapidly to the setting threshold, enabling the seal to reach a stable state more quickly. However, in actual use, when the copper heat-conducting blocks come into contact with the sealing area of ​​the packaging material, the uneven surface often prevents them from fully adhering, creating gaps and reducing heat transfer efficiency. Furthermore, during the circulating water cooling process, the heat in the coolant is difficult to dissipate quickly by relying solely on flow, accumulating inside and affecting subsequent cooling, resulting in a poorer cooling effect. Therefore, this utility model proposes a rapid cooling structure for the longitudinal sealing of a fully automatic vertical packaging machine. Utility Model Content

[0004] This invention provides a rapid cooling structure for the longitudinal sealing of a fully automatic vertical packaging machine. The conductive cooling mechanism utilizes the flexibility of the thermally conductive silicone pad to increase the contact area between the copper heat-conducting block and the packaging material, filling gaps and improving heat transfer efficiency. Combined with the circulating flow of coolant, it absorbs heat from the sealing point of the packaging material after longitudinal sealing, achieving rapid cooling and allowing the seal to reach a stable state more quickly. Simultaneously, the heat-absorbing end of the semiconductor cooling chip absorbs heat from the coolant, actively cooling the coolant and lowering its temperature to ensure the cooling effect of the structure. The heat dissipation mechanism uses an exhaust fan to quickly expel the heat released from the heat-releasing end of the semiconductor cooling chip, accelerating heat diffusion and preventing a decrease in cooling efficiency due to poor heat dissipation, ensuring long-term stable operation of the cooling structure. Furthermore, the design of the connecting pipe allows the heat absorbed during cooling to be used for preheating the packaging material, improving energy utilization. In summary, this invention solves the problems in the prior art.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0006] The longitudinal sealing and rapid cooling structure of the fully automatic vertical packaging machine of this utility model includes:

[0007] The vertical packaging machine body has a longitudinal sealing area, and a pair of liquid storage frames are provided at the bottom of the longitudinal sealing area. One side of each pair of liquid storage frames is fixedly connected to one side of the vertical packaging machine body.

[0008] The system includes a heat conduction cooling mechanism and a heat dissipation mechanism, both of which are located at the bottom of the longitudinal sealing area. The heat conduction cooling mechanism is used to cool the sealing area of ​​the packaging material after longitudinal sealing, and the heat dissipation mechanism is used to dissipate the heat conducted in.

[0009] The conductive cooling mechanism includes a pair of copper heat-conducting block bodies. Each pair of copper heat-conducting block bodies has a thermally conductive silicone pad fitted on its outer wall. A first circulation pipe is fixedly connected to the side of the copper heat-conducting block body near the liquid storage frame. An electric telescopic rod is fixedly connected between the outer wall of the first circulation pipe and one side of the liquid storage frame. First corrugated pipes are fixedly connected to both ends of the first circulation pipe, and both first corrugated pipes are fixedly connected to the side of the liquid storage frame near the first circulation pipe. A second circulation pipe is fixedly connected to the side of the liquid storage frame away from the first circulation pipe. A circulating water pump is installed on the second circulation pipe, and one side of the circulating water pump is fixedly connected to the side of the liquid storage frame away from the first circulation pipe. The pump's suction end and discharge end are fixedly connected to the second circulation pipe. A pair of heat-conducting rods are fixedly connected to the inner wall of the second circulation pipe. A pair of semiconductor refrigeration chips are fixedly connected to the outer wall of the second circulation pipe. One end of each heat-conducting rod penetrates the second circulation pipe and contacts the heat-absorbing end of the semiconductor refrigeration chip. The end of the semiconductor refrigeration chip away from the heat-conducting rod is the heat-releasing end.

[0010] Furthermore, the top of the liquid storage frame is provided with an addition port, and a sealing plug is fitted on the top of the addition port, with the outer wall of the sealing plug in close contact with the inner wall of the addition port.

[0011] Furthermore, each of the pair of heat-conducting rods is fitted with a water flow agitator on its outer wall, and the water flow agitator is rotatably connected to the heat-conducting rod via a bearing.

[0012] Furthermore, the copper heat-conducting block body has multiple pairs of evenly distributed heat-conducting plates fixedly connected to the side near the liquid storage frame, and all pairs of heat-conducting plates are fixedly connected to the outer wall of the first circulation pipe.

[0013] Furthermore, the inner wall of the thermally conductive silicone pad is fixedly connected with multiple pairs of elastic clips, and the copper thermally conductive block body has slots on both sides, with the elastic clips engaging with the slots.

[0014] Furthermore, the heat dissipation mechanism includes a pair of exhaust hoods that are threadedly connected to the body of the vertical packaging machine. The pair of exhaust hoods are respectively sleeved on the outside of two pairs of semiconductor cooling chips. A second corrugated pipe is fixedly connected to the side of the pair of exhaust hoods away from the second circulation pipe, and a connecting pipe is fixedly connected to one end of the second corrugated pipe. An exhaust fan is fixedly connected inside the connecting pipe.

[0015] Furthermore, each of the two exhaust hoods is fixedly connected to an L-shaped plate on the side near the vertical packaging machine body, and both L-shaped plates are connected to the vertical packaging machine body by hexagonal bolts.

[0016] The present invention has the following advantages over the prior art:

[0017] 1. This technical solution, through the set conductive cooling mechanism, can utilize the flexibility of the thermally conductive silicone pad to increase the contact area between the copper heat-conducting block body and the packaging material, fill the gap, improve the heat conduction efficiency, and, in conjunction with the circulation of coolant, absorb the heat at the sealing point of the packaging material after longitudinal sealing, thereby achieving rapid cooling and enabling the seal to reach a stable state more quickly. At the same time, the heat-absorbing end of the semiconductor cooling chip absorbs the heat in the coolant, actively cooling the coolant, reducing the temperature of the coolant, and ensuring the cooling effect of the cooling structure.

[0018] 2. This technical solution, through the heat dissipation mechanism, can quickly expel the heat released by the heat-dissipating end of the semiconductor refrigeration chip through the exhaust fan, accelerate heat diffusion, avoid the decrease in cooling efficiency of the semiconductor refrigeration chip due to poor heat dissipation, ensure the long-term stable operation of the cooling structure, and subsequently, through the design of the connection pipe position, the heat absorbed during the cooling process can be used to preheat the packaging material, thereby improving energy utilization.

[0019] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a three-dimensional structural diagram of the longitudinal sealing and rapid cooling structure of the fully automatic vertical packaging machine of this utility model;

[0022] Figure 2 This is a partial cross-sectional structural diagram of the liquid storage frame and the conductive cooling mechanism in this utility model;

[0023] Figure 3 This is a partial cross-sectional schematic diagram of the conductive cooling mechanism in this utility model;

[0024] Figure 4 This is a cross-sectional view of the copper heat-conducting block body and the heat-conducting silicone pad in this utility model.

[0025] Figure 5 This is a partial cross-sectional schematic diagram of the conductive cooling mechanism and the heat dissipation mechanism in this utility model.

[0026] The attached diagram lists the components represented by each number as follows:

[0027] 1. Vertical packaging machine body; 2. Longitudinal sealing area; 3. Liquid storage frame; 301. Sealing plug; 4. Conductive cooling mechanism; 401. Copper heat-conducting block body; 402. Heat-conducting silicone pad; 403. First circulation pipe; 404. First corrugated pipe; 405. Second circulation pipe; 406. Circulating water pump; 407. Semiconductor cooling chip; 408. Heat-conducting rod; 409. Water flow agitator; 4010. Electric telescopic rod; 5. Heat-conducting sheet; 6. Elastic locking block; 7. Locking slot; 8. Heat dissipation mechanism; 801. Exhaust hood; 802. Second corrugated pipe; 803. Connecting pipe; 804. Exhaust fan; 805. L-shaped plate. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0029] In the description of this utility model, it should be understood that the terms "relative", "one end", "inner", "lateral", "end", "both ends", "both sides", "front", "one end face", "the other end face", etc., which indicate orientation or positional relationship, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Specific Implementation Example 1:

[0031] Please see Figures 1-5 As shown, the vertical sealing and rapid cooling structure of the fully automatic vertical packaging machine of this utility model includes a vertical packaging machine body 1, a vertical sealing area 2 on the vertical packaging machine body 1, a pair of liquid storage frames 3 at the bottom of the vertical sealing area 2, and one side of each pair of liquid storage frames 3 is fixedly connected to one side of the vertical packaging machine body 1.

[0032] The conductive cooling mechanism 4 and the heat dissipation mechanism 8 are both located at the bottom of the longitudinal sealing area 2. The conductive cooling mechanism 4 is used to cool the sealing area of ​​the packaging material after longitudinal sealing, and the heat dissipation mechanism 8 is used to dissipate the heat conducted in.

[0033] The conductive cooling mechanism 4 includes a pair of copper heat-conducting block bodies 401. Each pair of copper heat-conducting block bodies 401 has a thermally conductive silicone pad 402 fitted on its outer wall. A first circulation pipe 403 is fixedly connected to the side of the copper heat-conducting block body 401 near the liquid storage frame 3. An electric telescopic rod 4010 is fixedly connected between the outer wall of the first circulation pipe 403 and one side of the liquid storage frame 3. First corrugated pipes 404 are fixedly connected to both ends of the first circulation pipe 403. Each pair of first corrugated pipes 404 is fixedly connected to the side of the liquid storage frame 3 near the first circulation pipe 403. A second... The second circulation pipe 405 is equipped with a circulating water pump 406, and one side of the circulating water pump 406 is fixedly connected to the side of the liquid storage frame 3 away from the first circulation pipe 403. The water pump 406's pumping end and draining end are both fixedly connected to the second circulation pipe 405. A pair of heat-conducting rods 408 are fixedly connected to the inner wall of the second circulation pipe 405, and a pair of semiconductor cooling chips 407 are fixedly connected to the outer wall of the second circulation pipe 405. One end of the heat-conducting rod 408 passes through the second circulation pipe 405 and contacts the heat-absorbing end of the semiconductor cooling chip 407. The end of the semiconductor cooling chip 407 away from the heat-conducting rod 408 is the heat-releasing end.

[0034] In the specific implementation process, after the packaging material passes through the longitudinal sealing zone 2, it moves downwards to between a pair of copper heat-conducting block bodies 401. At this time, a pair of electric telescopic rods 4010 are driven to move a pair of first circulation pipes 403 towards each other with the assistance of the first corrugated pipe 404. This causes the pair of copper heat-conducting block bodies 401 and the thermally conductive silicone pads 402 to approach the packaging material until they come into contact with it. The flexibility of the thermally conductive silicone pads 402 increases the contact area between the copper heat-conducting block bodies 401 and the packaging material, fills the gaps, and improves the heat transfer efficiency. Then, the circulating water pump 4... 06 The coolant inside the storage box 3 is drawn out through the second circulation pipe 405 and flows outward, circulating through the second circulation pipe 405, the first corrugated pipe 404 and the first circulation pipe 403 in sequence. The flowing coolant absorbs the heat from the sealing point of the longitudinally sealed packaging material on the copper heat-conducting block body 401, achieving rapid cooling and enabling the seal to reach a stable state more quickly. At the same time, the heat-absorbing end of the semiconductor cooling chip 407 absorbs the heat from the coolant under the conduction of the heat-conducting rod 408, actively cooling the coolant, reducing the temperature of the coolant, and ensuring the cooling effect of the cooling structure.

[0035] The top of the liquid storage frame 3 has an addition port, and a sealing plug 301 is fitted on the top of the addition port. The outer wall of the sealing plug 301 is in close contact with the inner wall of the addition port.

[0036] The addition port allows staff to easily add coolant into the reservoir 3. After adding the coolant, the sealing plug 301 is placed on top to seal the reservoir and prevent external impurities from entering.

[0037] Among them, the outer walls of a pair of heat-conducting rods 408 are each fitted with a water flow agitator 409, and the water flow agitator 409 is rotatably connected to the heat-conducting rods 408 through bearings.

[0038] The water flow propels the paddle 409 to rotate with the coolant flow, breaking the laminar flow state of the liquid inside the pipe and forming turbulence, which accelerates the transfer of heat to the heat pipe 408 and improves the heat transfer efficiency.

[0039] Among them, the copper heat-conducting block body 401 is fixedly connected to a plurality of evenly distributed heat-conducting plates 5 on the side near the liquid storage frame 3, and the plurality of heat-conducting plates 5 are fixedly connected to the outer wall of the first circulation pipe 403.

[0040] By setting the heat-conducting plate 5, the heat transfer area from the copper heat-conducting block body 401 to the circulating coolant can be increased, thus accelerating the heat transfer.

[0041] The inner wall of the thermal conductive silicone pad 402 is fixedly connected with multiple pairs of elastic clips 6, and the copper thermal conductive block body 401 has slots 7 on both sides, and the elastic clips 6 engage with the slots 7.

[0042] The engagement of the elastic locking block 6 and the locking slot 7 enables convenient installation and disassembly between the thermally conductive silicone pad 402 and the copper thermally conductive block body 401, facilitating subsequent maintenance and replacement. In this embodiment, to reduce the impact of heat on the elastic locking block 6 and the locking slot 7, a protective coating, such as a high-temperature resistant resin coating, can be provided for high-temperature protection to ensure normal use. Specific Implementation Example 2:

[0044] Please see Figure 1 and Figure 5 As shown, in a preferred embodiment, the heat dissipation mechanism 8 includes a pair of exhaust hoods 801 that are threadedly connected to the vertical packaging machine body 1. The pair of exhaust hoods 801 are respectively sleeved on the outside of two pairs of semiconductor cooling chips 407. A second corrugated pipe 802 is fixedly connected to the side of the pair of exhaust hoods 801 away from the second circulation pipe 405, and a connecting pipe 803 is fixedly connected to one end of the second corrugated pipe 802. An exhaust fan 804 is fixedly connected inside the connecting pipe 803.

[0045] In the specific implementation process, the heat absorption end of the semiconductor refrigeration chip 407 absorbs heat from the coolant and releases it outward from the heat release end. At this time, the exhaust fan 804 drives the released heat to be released outward through the exhaust hood 801, the second corrugated pipe 802 and the connecting pipe 803 in sequence. This can accelerate the heat dissipation, prevent the semiconductor refrigeration chip 407 from losing cooling efficiency due to poor heat dissipation, ensure the long-term stable operation of the cooling structure, and subsequently, the heat absorbed during the cooling process can be used to preheat the packaging material through the design of the position of the connecting pipe 803, thereby improving energy utilization.

[0046] Among them, an L-shaped plate 805 is fixedly connected to one side of the exhaust hood 801 near the vertical packaging machine body 1, and the L-shaped plate 805 is connected to the vertical packaging machine body 1 by hexagonal bolts.

[0047] In this embodiment, the hexagonal bolt connection method involves drilling bolt holes on the L-shaped plate 805 and drilling bolt grooves on the vertical packaging machine body 1. The hexagonal bolts are screwed through the bolt holes and into the bolt grooves for locking and fixing, which enables convenient installation between the exhaust hood 801 and the vertical packaging machine body 1. Subsequently, rotating the hexagonal bolts in the opposite direction causes them to separate from the bolt grooves, which enables convenient disassembly between the exhaust hood 801 and the vertical packaging machine body 1. This method is common knowledge known in the prior art, so it will not be described in detail here.

[0048] The circuits, electronic components, and chip modules involved in this utility model are all existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon. The content protected by this utility model does not involve any improvement to the software and methods.

[0049] All standard parts used in the application documents can be purchased from the market. All components in this application document can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. The electrical components mentioned in this document are all electrically connected to the external main controller and power supply, and the main controller is a conventional known device that can play a control role.

[0050] The working principle of this utility model is as follows:

[0051] In use, after the packaging material is longitudinally sealed in the longitudinal sealing zone 2, it moves downwards to between a pair of copper heat-conducting block bodies 401. At this time, a pair of electric telescopic rods 4010 are driven to move a pair of first circulation pipes 403 towards each other with the assistance of the first corrugated pipe 404. This causes the pair of copper heat-conducting block bodies 401 and the thermally conductive silicone pad 402 to approach the packaging material until they are in full contact with the packaging material for heat conduction. Then, the circulating water pump 406 draws coolant from the storage box 3 through the second circulation pipe 405 and flows it outwards, circulating it through the second circulation pipe 405, the first corrugated pipe 404, and the first circulation pipe 403 in sequence. This allows the flowing coolant to absorb the copper heat-conducting block bodies 401. The heat at the sealing point of the packaging material after longitudinal sealing is rapidly cooled, allowing the seal to reach a stable state more quickly. Simultaneously, the water flow propels the paddle 409 to rotate with the coolant flow, breaking the laminar flow state of the liquid inside the pipe and forming turbulence. This accelerates the heat transfer to the heat conduction rod 408, causing the heat-absorbing end of the semiconductor cooling chip 407 to absorb heat from the coolant under the conduction of the heat conduction rod 408, actively cooling the coolant and lowering its temperature. Then, the heat-releasing end of the semiconductor cooling chip 407 releases heat outward. At this time, the exhaust fan 804 extracts the released heat and releases it outward through the exhaust hood 801, the second corrugated pipe 802, and the connecting pipe 803, accelerating heat discharge and ensuring the long-term stable operation of the cooling structure.

[0052] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. The longitudinal sealing and rapid cooling structure of a fully automatic vertical packaging machine, characterized in that, include: The vertical packaging machine body (1) is provided with a longitudinal sealing area (2), and a pair of liquid storage frames (3) are provided at the bottom of the longitudinal sealing area (2), and one side of each pair of liquid storage frames (3) is fixedly connected to one side of the vertical packaging machine body (1). The conductive cooling mechanism (4) and the heat dissipation mechanism (8) are both located at the bottom of the longitudinal sealing area (2). The conductive cooling mechanism (4) is used to cool the sealing point of the packaging material after longitudinal sealing, and the heat dissipation mechanism (8) is used to dissipate the heat conducted in. The conductive cooling mechanism (4) includes a pair of copper heat-conducting block bodies (401). Each pair of copper heat-conducting block bodies (401) has a thermally conductive silicone pad (402) fitted on its outer wall. A first circulation pipe (403) is fixedly connected to the side of the copper heat-conducting block body (401) near the liquid storage frame (3). An electric telescopic rod (4010) is fixedly connected between the outer wall of the first circulation pipe (403) and one side of the liquid storage frame (3). First corrugated pipes (404) are fixedly connected to both ends of the first circulation pipe (403). Each pair of first corrugated pipes (404) is fixedly connected to the side of the liquid storage frame (3) near the first circulation pipe (403). A second... The second circulation pipe (405) is equipped with a circulating water pump (406), and one side of the circulating water pump (406) is fixedly connected to the side of the liquid storage frame (3) away from the first circulation pipe (403). The pumping end and the draining end of the circulating water pump (406) are both fixedly connected to the second circulation pipe (405). A pair of heat-conducting rods (408) are fixedly connected to the inner wall of the second circulation pipe (405). A pair of semiconductor cooling chips (407) are fixedly connected to the outer wall of the second circulation pipe (405). One end of the heat-conducting rod (408) passes through the second circulation pipe (405) and contacts the heat-absorbing end of the semiconductor cooling chip (407). The end of the semiconductor cooling chip (407) away from the heat-conducting rod (408) is the heat-releasing end.

2. The longitudinal sealing and rapid cooling structure of the fully automatic vertical packaging machine according to claim 1, characterized in that, The top of the liquid storage frame (3) is provided with an addition port, and a sealing plug (301) is fitted on the top of the addition port. The outer wall of the sealing plug (301) is in close contact with the inner wall of the addition port.

3. The longitudinal sealing rapid cooling structure of the fully automatic vertical packaging machine according to claim 1, characterized in that, Each of the pair of heat-conducting rods (408) is fitted with a water flow agitator (409) on its outer wall, and the water flow agitator (409) is rotatably connected to the heat-conducting rod (408) through a bearing.

4. The longitudinal sealing rapid cooling structure of the fully automatic vertical packaging machine according to claim 1, characterized in that, The copper heat-conducting block body (401) is fixedly connected to a plurality of evenly distributed heat-conducting plates (5) on the side near the liquid storage frame (3), and the plurality of heat-conducting plates (5) are fixedly connected to the outer wall of the first circulation pipe (403).

5. The longitudinal sealing rapid cooling structure of the fully automatic vertical packaging machine according to claim 1, characterized in that, The inner wall of the thermal conductive silicone pad (402) is fixedly connected with multiple pairs of elastic blocks (6), and the copper thermal conductive block body (401) has slots (7) on both sides, and the elastic blocks (6) engage with the slots (7).

6. The longitudinal sealing rapid cooling structure of the fully automatic vertical packaging machine according to claim 1, characterized in that, The heat dissipation mechanism (8) includes a pair of exhaust hoods (801) that are threadedly connected to the body (1) of the vertical packaging machine. The pair of exhaust hoods (801) are respectively sleeved on the outside of two pairs of semiconductor cooling chips (407). A second corrugated pipe (802) is fixedly connected to the side of the pair of exhaust hoods (801) away from the second circulation pipe (405), and a connecting pipe (803) is fixedly connected to one end of the second corrugated pipe (802). An exhaust fan (804) is fixedly connected inside the connecting pipe (803).

7. The longitudinal sealing rapid cooling structure of the fully automatic vertical packaging machine according to claim 6, characterized in that, Each of the two exhaust hoods (801) is fixedly connected to an L-shaped plate (805) on the side near the vertical packaging machine body (1), and both L-shaped plates (805) are connected to the vertical packaging machine body (1) by hexagonal bolts.

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