A remotely monitored semiconductor equipment transport device

Abstract

This utility model relates to the field of semiconductor equipment technology, specifically to a remotely monitored semiconductor equipment transport device, comprising a limiting component and a fixing component. The limiting component consists of a base, a connecting block, a baffle, a fixing plate, a hydraulic rod, and the limiting block. The connecting block is mounted on the surface of the base, and the baffle is rotatably connected to the inner wall of the connecting block. The fixing plate is fixedly connected to the surface of the base below the baffle. In this remotely monitored semiconductor equipment transport device, the limiting component allows the connecting block fixed to the base to limit the baffle during use. The hydraulic rod fixed to the fixing plate, connected to an external power source, can push the baffle upwards to flip it. The limiting block connects the baffle and the hydraulic rod. After the semiconductor equipment is placed on top of the base, the baffle can limit and block the lower half of the semiconductor equipment surface, preventing the semiconductor equipment from shaking during transport and improving the stability of the transport device.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, specifically to a semiconductor equipment transportation device that can be remotely monitored. Background Technology

[0002] Semiconductor equipment refers to specialized machines and systems used to manufacture semiconductor devices (such as chips, memory, and sensors). They are the core "mother machines" of the modern electronics industry, directly determining the chip's process precision, production capacity, and yield.

[0003] However, existing remotely monitored semiconductor equipment transport devices have the following drawbacks: (1) Existing remotely monitored semiconductor equipment transport devices have weak limiting functions. When transporting existing semiconductor equipment, it is troublesome to hoist it into the transport device during the placement and retrieval process. The surface of the transport device is sealed, making it difficult to place and retrieve the equipment.

[0004] (2) Existing remotely monitored semiconductor equipment transport devices have weak fixed functions. Existing transport devices can only place semiconductor equipment inside. During transportation or shaking, the transport device will cause the semiconductor equipment to shake and be damaged. Utility Model Content

[0005] The purpose of this invention is to provide a remotely monitored semiconductor equipment transport device to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a remotely monitored semiconductor equipment transport device, comprising a limiting component and a fixing component. The limiting component consists of a base, a connecting block, a baffle, a fixing plate, a hydraulic rod, and a limiting block. The connecting block is mounted on the surface of the base, and the baffle is rotatably connected to the inner wall of the connecting block. The fixing plate is fixedly connected to the surface of the base below the baffle. The hydraulic rod is mounted on the top of the fixing plate, and the limiting block is mounted on the bottom of the baffle. The fixing component consists of a support bar, a suction cup, an air valve, and an air outlet. The support bar is fixedly connected to the inner bottom wall of the base. A suction cup is installed on one side of the inner wall of the base located on the support bar. An air valve is provided on the inner wall of the suction cup. An air outlet is installed on the bottom end of the base located on the surface of the air valve.

[0007] Optionally, there are four suction cups, which are symmetrically distributed and used to adhere to four positions on the bottom of the semiconductor device, forming a four-point adhesion and adsorption.

[0008] Optionally, an anti-slip pad is installed at the top of the support strip. The top of the anti-slip pad has anti-slip texture. The installation of the anti-slip pad can improve the stability of the fit with the semiconductor device and increase the friction.

[0009] Optionally, there are four baffles arranged at equal intervals, which can limit the movement of the semiconductor device around its perimeter.

[0010] Optionally, a sensor is installed on the inner bottom wall of the base on the side of the suction cup. There are four sensors, which are symmetrically distributed. The sensors are installed to fit with the semiconductor device and to monitor the presence of the semiconductor device. The sensors are connected to an external host for remote monitoring.

[0011] Optionally, a support block is installed at the bottom of the base, and a steel plate is provided on the inner wall of the support block. The support block is used to support and stabilize the base, and the steel plate is used to increase the strength of the base support. An opening is provided at the bottom of the support block to facilitate a forklift to insert into the bottom and pull the device out of the truck.

[0012] Compared with the prior art, the beneficial effects of this utility model are: 1. This remotely monitored semiconductor equipment transport device, through the setting of a limiting component, uses a connecting block fixed to the base to limit the baffle during use. The hydraulic rod fixed to the fixed plate is connected to an external power source and can push the baffle upward to flip it. The limiting block is used to connect the baffle and the hydraulic rod. After the semiconductor equipment is placed on the top of the base, the baffle can limit and block the lower half of the semiconductor equipment surface to prevent the semiconductor equipment from shaking during transportation, thereby improving the stability of the device during transportation.

[0013] 2. This remotely monitored semiconductor equipment transport device, through the setting of fixed components, uses a support bar to fit against the bottom of the semiconductor equipment to support it during use, and a suction cup to fit against the bottom of the semiconductor equipment to increase stability. When it is necessary to separate the suction cup from the semiconductor equipment, the air valve connected to an external power source can discharge the air inside the suction cup from the air outlet. The four air valves are controlled by the same controller, thereby ensuring that the semiconductor equipment can be separated from the device, facilitating transportation. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall appearance of the present utility model; Figure 2 This is a schematic diagram showing the disassembled positioning component of this utility model; Figure 3 This is a schematic diagram showing the disassembled fixing components of this utility model; Figure 4 This is a side sectional view of the base of this utility model.

[0015] In the diagram: 1. Limiting component; 101. Base; 102. Connecting block; 103. Baffle; 104. Fixing plate; 105. Hydraulic rod; 106. Limiting block; 2. Fixing component; 201. Support bar; 202. Suction cup; 203. Air valve; 204. Air outlet; 3. Anti-slip pad; 4. Sensor; 5. Supporting block; 6. Steel plate. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figures 1-4 As shown, this utility model provides a technical solution: a remotely monitored semiconductor equipment transport device, including a limiting component 1 and a fixing component 2. The limiting component 1 consists of a base 101, a connecting block 102, a baffle 103, a fixing plate 104, a hydraulic rod 105, and a limiting block 106. The connecting block 102 is mounted on the surface of the base 101, and the baffle 103 is rotatably connected to the inner wall of the connecting block 102. The fixing plate 104 is fixedly connected to the surface of the base 101 below the baffle 103. The hydraulic rod 105 is mounted on the top of the fixing plate 104, and the bottom of the baffle 103... A limiting block 106 is installed at the end, and a connecting block 102 fixed to the base 101 is used to limit the position of the baffle 103. The hydraulic rod 105 fixed to the fixing plate 104 is connected to an external power source and can push the baffle 103 upward to flip it. The limiting block 106 is used to connect the baffle 103 and the hydraulic rod 105. After the semiconductor device is placed at the top of the base 101, the baffle 103 can limit and block the lower half of the surface of the semiconductor device to prevent the semiconductor device from shaking during transportation, thereby improving the stability of the device during transportation. The model of the hydraulic rod 105 is PC32PA026B04 - 0250XF1. The fixing component 2 consists of a support bar 201, a suction cup 202, an air valve 203, and an air outlet 204. The support bar 201 is fixedly connected to the inner bottom wall of the base 101. The suction cup 202 is installed on one side of the support bar 201 on the inner wall of the base 101. The air valve 203 is provided on the inner wall of the suction cup 202. The air outlet 204 is installed on the surface of the air valve 203 at the bottom end of the base 101. The support bar 201 is used to fit against the bottom end of the semiconductor device to support the semiconductor device. The suction cup 202 is used to fit against the bottom end of the semiconductor device to increase stability. When it is necessary to separate the suction cup 202 from the semiconductor device, the air valve 203 can be connected to an external power source to discharge the air inside the suction cup 202 from the air outlet 204. The four air valves 203 are controlled by the same controller, which can ensure that the semiconductor device is separated from the device and facilitate transportation. There are four suction cups 202, which are symmetrically distributed. The symmetrical distribution of the suction cups 202 is used to attach to four positions on the bottom of the semiconductor device, forming a four-point adhesion and adsorption. The top of the support strip 201 is equipped with an anti-slip pad 3. The top of the anti-slip pad 3 is provided with anti-slip texture. The installation of the anti-slip pad 3 can improve the stability of the fit with the semiconductor device and increase the friction. There are four baffles 103, which are arranged at equal intervals. The equal intervals of the baffles 103 can limit the movement of the semiconductor device around its perimeter. Sensor 4 is installed on the inner bottom wall of the base 101 on the side of the suction cup 202. There are four sensors 4, which are symmetrically distributed. The sensors 4 are installed to fit with the semiconductor device and to monitor the presence of the semiconductor device. The sensors 4 are connected to the external host terminal for remote monitoring. The sensor 4 is a Leuze PRK 3C series high-performance photoelectric sensor. A support block 5 is installed at the bottom of the base 101. A steel plate 6 is provided on the inner wall of the support block 5. The support block 5 is used to support and stabilize the base 101, and the steel plate 6 is used to increase the strength of the support of the base 101. An opening is provided at the bottom of the support block 5 so that a forklift can insert into the bottom and pull the device out of the truck.

[0018] In this invention, the working steps of the device are as follows: First step: The connecting block 102 fixed to the base 101 is used to limit the position of the baffle 103. The hydraulic rod 105 fixed to the fixing plate 104 is connected to an external power source and can push the baffle 103 upward to flip it. The limiting block 106 is used to connect the baffle 103 and the hydraulic rod 105. After the semiconductor device is placed on the top of the base 101, the baffle 103 can limit and block the lower half of the surface of the semiconductor device to prevent the semiconductor device from shaking during transportation, thereby improving the stability of the device during transportation. The second step: The support bar 201 is used to fit the bottom of the semiconductor device to support it, and the suction cup 202 is used to fit and hold the bottom of the semiconductor device to increase stability. When it is necessary to separate the suction cup 202 from the semiconductor device, the air valve 203 connected to an external power source can discharge the air inside the suction cup 202 from the air outlet 204. The four air valves 203 are controlled by the same controller, which can ensure that the semiconductor device is separated from the device and facilitate transportation. The third step: The installation of anti-slip pad 3 can improve the stability of the fit with the semiconductor device and increase the friction. The installation of sensor 4 is used to fit with the semiconductor device and to monitor the presence of the semiconductor device. Sensor 4 is connected to the external host terminal for remote monitoring. Support block 5 is used to support and stabilize base 101. Steel plate 6 is used to improve the support strength of base 101. The bottom end of support block 5 is provided with an opening to facilitate forklift insertion into the bottom end to pull the device out of the truck.

[0019] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A remotely monitored semiconductor equipment transport device, comprising a limiting component (1) and a fixing component (2), characterized in that: The limiting component (1) consists of a base (101), a connecting block (102), a baffle (103), a fixing plate (104), a hydraulic rod (105), and a limiting block (106). The connecting block (102) is installed on the surface of the base (101), and the baffle (103) is rotatably connected to the inner wall of the connecting block (102). The fixing plate (104) is fixedly connected to the surface of the base (101) below the baffle (103). The hydraulic rod (105) is installed at the top of the fixing plate (104), and the limiting block (106) is installed at the bottom of the baffle (103). The fixing component (2) consists of a support bar (201), a suction cup (202), an air valve (203), and an air outlet (204). The support bar (201) is fixedly connected to the inner bottom wall of the base (101). The suction cup (202) is installed on one side of the inner wall of the base (101) located on the support bar (201). The air valve (203) is provided on the inner wall of the suction cup (202). The air outlet (204) is installed on the surface of the air valve (203) at the bottom end of the base (101).

2. The remotely monitored semiconductor equipment transport device according to claim 1, characterized in that: There are four suction cups (202), and the suction cups (202) are symmetrically distributed.

3. The remotely monitored semiconductor equipment transport device according to claim 1, characterized in that: The top of the support bar (201) is equipped with an anti-slip pad (3), and the top of the anti-slip pad (3) has anti-slip texture.

4. The remotely monitored semiconductor equipment transport device according to claim 1, characterized in that: There are four baffles (103), which are arranged at equal intervals.

5. A remotely monitored semiconductor equipment transport device according to claim 1, characterized in that: Sensors (4) are installed on the inner bottom wall of the base (101) on the side of the suction cup (202). There are four sensors (4) and they are symmetrically distributed.

6. The remotely monitored semiconductor equipment transport device according to claim 1, characterized in that: A support block (5) is installed at the bottom of the base (101), and a steel plate (6) is provided on the inner wall of the support block (5).

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