wafer box transport box

Abstract

This utility model discloses a wafer cassette transport box, comprising: a box body and a cushioning pad. The cushioning pad is disposed inside the box body, and the hardness of the cushioning pad is less than that of the box body. A receiving groove is provided within the cushioning pad for accommodating the bottom of the wafer cassette. According to this utility model embodiment, by placing the wafer cassette on the cushioning pad inside the box body and utilizing the receiving groove within the cushioning pad to accommodate the bottom of the wafer cassette, the bottom of the wafer cassette can be fixed, reducing vibrations generated during transport and preventing the wafer cassette from being bumped or knocked inside the transport box. The lower hardness of the cushioning pad provides good cushioning, reducing vibrations generated during transport and minimizing the amplitude of vibrations, resulting in smoother wafer transport and preventing significant jolting between the wafer cassette and the wafer, thus reducing collisions between the wafers inside the wafer cassette.

Description

Technical Field

[0001] This utility model relates to the field of wafer transportation technology, and in particular to a wafer box transfer box. Background Technology

[0002] A wafer is a silicon chip used to fabricate silicon semiconductor circuits. Wafers are brittle and thin, and to ensure their safe storage and handling during production and transportation, and to avoid damage and contamination, they are generally stored in wafer cassettes. However, in related technologies, wafer cassettes experience significant vibrations during transportation, making it easy for wafers to collide with the inner walls of the cassette and break. Therefore, improvements are needed. Utility Model Content

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one objective of the present invention is to provide a wafer cassette transport box that can reduce the amplitude of vibration transmitted to the wafer cassette during transportation, thereby reducing impacts on the wafers inside the cassette.

[0004] A wafer cassette transport box according to an embodiment of the present invention includes: a box body; a buffer pad disposed in the box body, the buffer pad having a hardness less than that of the box body, a groove formed on the upper surface of the buffer pad, a limiting protrusion provided in the groove, a plurality of limiting protrusions being arranged at intervals along the circumference of the buffer pad, the plurality of limiting protrusions jointly defining a receiving groove for receiving the bottom of the wafer cassette.

[0005] According to an embodiment of the present invention, the wafer cassette transport box, by placing the wafer cassette on a cushioning pad inside the box and utilizing the receiving groove within the cushioning pad to accommodate the bottom of the wafer cassette, can fix the bottom of the wafer cassette, reducing vibration generated during transportation and preventing the wafer cassette from being bumped or knocked inside the wafer cassette transport box. The cushioning pad has low hardness, providing good cushioning, thus reducing the vibration generated during the transportation of the wafer cassette transport box, resulting in a smaller vibration amplitude and smoother wafer transport. The transport is smoother, avoiding significant jolting between the wafer cassette and the wafer, reducing collisions between the wafers inside the cassette. Furthermore, multiple limiting bumps are arranged circumferentially along the buffer pad, collectively defining the receiving groove. These limiting bumps act as guides for the wafer cassette, ensuring a more stable placement of the wafer cassette bottom within the receiving groove. This reduces vibrations during transport and prevents collisions between the wafer cassette and the inner wall of the wafer cassette transport box, further minimizing collisions between the wafers inside the cassette.

[0006] According to some embodiments of the present invention, each of the limiting protrusions is connected to the sidewall of the groove.

[0007] According to some embodiments of the present invention, each of the limiting protrusions has a guide surface formed on the side facing the receiving groove, and the guide surface extends obliquely in an upward direction toward the side wall of the groove.

[0008] According to some embodiments of the present invention, the groove is further provided with a foolproof protrusion, which is located on the outer periphery of the receiving groove and between two adjacent limiting protrusions.

[0009] According to some embodiments of the present invention, one of the buffer pad and the box body is provided with a positioning protrusion and the other is provided with a positioning hole, and the positioning protrusion is accommodated in the positioning hole.

[0010] According to some embodiments of the present invention, the housing includes two first sidewalls arranged opposite to each other along a first direction, the upper end face of the first sidewall is a first end face, one of the first end faces is provided with a foolproof protrusion or one end of the two first end faces along a second direction is provided with the foolproof protrusion, the second direction, the first direction and the up and down direction intersect each other.

[0011] According to some embodiments of this utility model, the cushioning pad is a foam plastic part.

[0012] According to some embodiments of the present invention, the housing includes two second sidewalls arranged opposite to each other along a second direction, and side openings are formed on the second sidewalls.

[0013] According to some embodiments of the present invention, the box body includes a box body and a movable base plate. The bottom wall of the box body has an installation opening. The movable base plate is installed in the installation opening and can move upward relative to the installation opening. The buffer pad has a clearance opening that penetrates the buffer pad in the vertical direction. The projection of the movable base plate on the reference surface is located within the projection of the clearance opening on the reference surface.

[0014] According to some embodiments of the present invention, the inner peripheral wall of the mounting port extends obliquely towards the side wall of the housing in a direction from bottom to top, and the outer peripheral wall of the movable base plate extends obliquely towards the side wall of the housing in a direction from bottom to top.

[0015] According to some embodiments of the present invention, the movable base plate is provided with a detection port, which penetrates the movable base plate in the vertical direction, and the detection port is used to adapt to a photoelectric sensor on the conveyor line.

[0016] According to some embodiments of the present invention, the bottom surface of the movable base plate is provided with a positioning groove, the positioning groove is used to cooperate with a top rod, and the top rod is used to push the movable base plate upward.

[0017] According to some embodiments of the present invention, the movable base plate is provided with a detection port, which penetrates the movable base plate in the vertical direction. The detection port is used to adapt to a photoelectric sensor on the conveyor line. There are multiple positioning slots, which are located on the outer periphery of the detection port and are arranged at intervals along the circumference of the detection port.

[0018] According to some embodiments of the present invention, the cross-sectional area of ​​the positioning groove gradually increases from top to bottom.

[0019] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of a wafer cassette transport box according to some embodiments of the present invention; Figure 2 yes Figure 1 A schematic diagram of the wafer transfer box from another angle; Figure 3 yes Figure 1 A top view of the wafer transfer box in the middle; Figure 4 yes Figure 1 A bottom view of the wafer transfer box in the middle; Figure 5 yes Figure 1 Exploded view of the wafer transfer box in the image; Figure 6 yes Figure 5 A schematic diagram of the main body of the box; Figure 7 yes Figure 5 A schematic diagram of the movable base plate; Figure 8 yes Figure 5 A schematic diagram of the cushioning pad at another angle.

[0021] Figure label: 100. Wafer box transfer case; 10. Enclosure; 11. Enclosure body; 12. Movable base plate; 121. Inspection port; 122. Positioning groove; 13. Positioning hole; 14. Second side wall; 141. Side opening; 15. First side wall; 151. First end face; 152. Anti-foolproof protrusion; 16. Mounting port; 20. Buffer pad; 21. Receiving groove; 22. Groove; 23. Limiting protrusion; 231. Guide surface; 24. Foolproof protrusion; 25. Positioning protrusion; 26. Clearance opening. Detailed Implementation

[0022] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0023] The following is for reference. Figures 1-8 Description of a wafer transfer box 100 according to an embodiment of the present utility model.

[0024] refer to Figures 1-3 According to an embodiment of the present invention, a wafer cassette transfer box 100 includes a box body 10 and a buffer pad 20. The buffer pad 20 is disposed inside the box body 10, which can protect the wafer cassette and reduce damage to the wafer cassette caused by external impacts and other environmental factors. The hardness of the buffer pad 20 is less than that of the box body 10. A groove 22 is formed on the upper surface of the buffer pad 20, and a limiting protrusion 23 is provided in the groove 22. There are multiple limiting protrusions 23, which are arranged at intervals along the circumference of the buffer pad 20. The multiple limiting protrusions 23 together define a receiving groove 21, which is used to receive the bottom of the wafer cassette.

[0025] For example, the hardness of the cushioning pad 20 is less than that of the box body 10, and the cushioning pad 20 and the box body 10 can be made of materials with different hardness.

[0026] The high hardness of the housing 10 enhances the structural strength of the wafer cassette transport box 100, making it less prone to damage. The low hardness of the buffer pad 20 allows the wafer cassette to be placed on the buffer pad 20 inside the housing 10, effectively cushioning the wafer cassette and reducing vibrations generated during transport. This reduces the impact of wafers inside the wafer cassette on each other.

[0027] The bottom of the wafer cassette is secured by the receiving groove 21 within the buffer pad 20, further reducing vibrations during transport and preventing collisions within the wafer cassette transfer box 100. This minimizes vibrations and ensures smoother wafer transport, preventing significant jolting between the wafer cassette and the wafer. Furthermore, multiple limiting protrusions 23 are spaced circumferentially along the buffer pad 20, collectively defining the receiving groove 21. These protrusions limit the wafer cassette, ensuring its bottom is stably contained within the receiving groove 21 and preventing collisions between the wafer cassette and the inner wall of the box 10 within the wafer cassette transfer box 100.

[0028] According to the wafer cassette transfer box 100 of this utility model embodiment, by placing the wafer cassette on the buffer pad 20 inside the box body 10, and using the receiving groove 21 in the buffer pad 20 to receive the bottom of the wafer cassette, the bottom of the wafer cassette can be fixed, reducing the vibration generated by the wafer cassette during transportation and preventing the wafer cassette from being bumped or knocked inside the wafer cassette transfer box 100. The buffer pad 20 has low hardness and can play a good cushioning role, so that the vibration generated by the wafer cassette transfer box 100 during transportation is weakened by the buffer pad 20, and the vibration amplitude generated by the wafer cassette is smaller. The wafers are transported more smoothly, avoiding significant jolting between the wafer cassette and the wafers, reducing collisions between the wafers inside the cassette. Furthermore, by arranging multiple limiting protrusions 23 at intervals along the circumference of the buffer pad 20, the multiple limiting protrusions 23 together define the receiving groove 21, which allows the limiting protrusions 23 to limit the wafer cassette, thereby making the bottom of the wafer cassette more stably accommodated in the receiving groove 21, reducing the vibration generated by the wafer cassette during transportation, and preventing the wafer cassette from colliding with the inner wall of the box 10 inside the wafer cassette transfer box 100, further reducing collisions between the wafers inside the wafer cassette.

[0029] refer to Figures 1-3 According to some embodiments of the present invention, each limiting protrusion 23 is connected to the side wall of the groove 22.

[0030] For example, the sidewalls of each limiting protrusion 23 and groove 22 can be integrally formed.

[0031] By connecting each limiting bump 23 to the sidewall of the groove 22, the structural strength of the limiting bump 23 can be increased, making the limiting bump 23 less prone to deformation and displacement, thus improving the fixing effect of the limiting bump 23 on the wafer cassette.

[0032] refer to Figures 1-3According to some embodiments of the present invention, each limiting protrusion 23 has a guide surface 231 formed on the side facing the receiving groove 21, and the guide surface 231 extends obliquely in the direction from bottom to top toward the side wall of the groove 22.

[0033] By forming a guide surface 231 on the side of each limiting protrusion 23 facing the receiving groove 21, it can play a guiding role when the wafer cassette is placed into the buffer pad 20. The guide surface 231 extends obliquely from bottom to top towards the side wall near the groove 22, which makes it easier for the bottom of the wafer cassette to be placed into the receiving groove 21, reducing the resistance of placing the wafer cassette into the buffer pad 20, thereby making the process of placing the wafer cassette into the buffer pad 20 smoother and reducing the impact of the wafer inside the wafer cassette.

[0034] refer to Figures 1-3 According to some embodiments of the present invention, the groove 22 is further provided with a foolproof protrusion 24, which is located on the outer periphery of the receiving groove 21 and is located between two adjacent limiting protrusions 23.

[0035] The front and back sides of a wafer have structural differences that are difficult to distinguish quickly with the naked eye. Therefore, when wafers are placed in wafer cassettes for storage, the front and back ends of the cassette are usually designed with a wider section at one end and a narrower section at the other. When the wafer is taken out of the cassette for processing, the front and back of the wafer placed in the cassette can be determined by judging the front and back of the cassette, reducing confusion between the front and back sides of the wafer and avoiding processing errors.

[0036] For example, the orientation of the wafer can be referenced to the e2 direction in the figure. If the orientation of the wafer cassette is inconsistent with the orientation on the wafer cassette transfer box 100, the wafer cassette cannot be placed into the receiving slot 21 of the buffer pad 20.

[0037] By providing anti-foolproof protrusions 24 in the groove 22, the wafer cassette can be placed into the wafer cassette transfer box 100 so that the front and back of the wafer cassette are consistent with the front and back of the wafer cassette transfer box 100. This avoids incorrect placement of the wafer cassette and ensures that the front and back of the wafer cassette are consistent when it is taken out of the wafer cassette transfer box 100. When the wafer is taken out of the wafer cassette, there is no need to judge the front and back of the wafer again, which facilitates direct processing of the wafer.

[0038] refer to Figure 5 According to some embodiments of the present invention, one of the buffer pad 20 and the housing 10 is provided with a positioning protrusion 25, and the other of the buffer pad 20 and the housing 10 is provided with a positioning hole 13, and the positioning protrusion 25 is accommodated in the positioning hole 13.

[0039] refer to Figures 1-3According to some embodiments of the present invention, the box body 10 includes two first side walls 15 arranged opposite to each other along a first direction. The upper end surface of the first side wall 15 is a first end surface 151. One of the first end surfaces 151 is provided with a foolproof protrusion 152, or one end of the two first end surfaces 151 along a second direction is provided with a foolproof protrusion 152. The second direction, the first direction, and the up and down direction intersect each other.

[0040] For example, the first direction can be referenced to direction e1 in the figure, and the second direction can be referenced to direction e2 in the figure.

[0041] For example, the anti-fouling protrusion 152 can be one or multiple.

[0042] By providing a foolproof protrusion 152 on one of the first end faces 151 or providing a foolproof protrusion 152 on one end of both first end faces 151 along the second direction, it is convenient for manual or machine identification of the foolproof protrusion 152 to distinguish the front and back of the box 10, thereby determining the front and back of the wafer in the wafer box in the wafer box transfer box 100. This facilitates the adjustment of the wafer box transfer box 100 during transportation, so that the front and back of the wafer box transfer box 100 are consistent with the second direction. This ensures that the front and back of the wafer box can be kept consistent when it is taken out of the wafer box transfer box 100, making it convenient for the wafer to be processed directly when it is taken out of the wafer box.

[0043] For example, the cushioning pad 20 may have a positioning protrusion 25 and the housing 10 may have a positioning hole 13, or the cushioning pad 20 may have a positioning hole 13 and the housing 10 may have a positioning protrusion 25.

[0044] For example, there can be multiple positioning holes 13 and positioning protrusions 25, with multiple positioning holes 13 and positioning protrusions 25 located on opposite sides of the buffer pad 20 and the housing 10 along the e1 direction.

[0045] By providing a positioning protrusion 25 on one of the buffer pad 20 and the housing 10, and a positioning hole 13 on the other of the buffer pad 20 and the housing 10, the buffer pad 20 can be fixed inside the housing 10, preventing the buffer pad 20 from being taken out when the wafer cassette is removed, making the wafer cassette removal process smoother, and also preventing the buffer pad 20 from being misaligned and affecting the transportation of the next batch of wafer cassettes.

[0046] According to some embodiments of this utility model, the buffer pad 20 is made of foam plastic. Foam plastic has low density and is lightweight, and has a high absorption rate of impact energy. By making the buffer pad 20 a foam plastic part, the overall weight of the wafer cassette transfer box 100 can be reduced, and it can also provide a good cushioning effect for the wafer cassette, making the wafer transport more stable, avoiding large-scale bumps between the wafer cassette and the wafer, and reducing collisions between the wafers inside the wafer cassette.

[0047] refer to Figures 1-2 According to some embodiments of the present invention, the box body 10 includes two second side walls 14 disposed opposite to each other along a second direction, and a side opening 141 is formed on the second side wall 14.

[0048] For example, the placement or removal of wafer cassettes can be done manually or mechanically. When placing a wafer cassette into the wafer cassette transfer box 100, a mechanical gripper can be used to clamp the two sides of the wafer cassette and then move it to the top of the wafer cassette transfer box 100. The box body 10 avoids the mechanical gripper along the side opening 141 on the second side wall 14, allowing the mechanical gripper to fall and place the wafer cassette on the buffer pad 20. After the bottom of the wafer cassette is accommodated in the receiving groove 22, the mechanical gripper releases the wafer cassette.

[0049] By forming a side opening 141 on the second side wall 14 of the housing 10, the side of the housing 10 can avoid the operation objects such as human hands or robotic arms, which facilitates the placement and removal of the wafer cassette. In addition, the side opening 141 on the second side wall 14 can also reduce the obstruction of the wafer cassette by the housing 10. When the wafer cassette transfer box 100 is transported in the conveyor line, it is convenient for the photoelectric detection instrument located on the side of the wafer cassette transfer box 100 to detect the wafer cassette.

[0050] refer to Figures 6-7 According to some embodiments of the present invention, the box 10 includes a box 10 body and a movable base plate 12. The bottom wall of the box 10 body forms an installation opening 16. The movable base plate 12 is installed in the installation opening 16 and can move upward relative to the installation opening 16. The buffer pad 20 is provided with an avoidance opening 26. The avoidance opening 26 penetrates the buffer pad 20 in the vertical direction. The projection of the movable base plate 12 on the reference surface is located within the projection of the avoidance opening 26 on the reference surface.

[0051] For example, when the wafer cassette transfer box 100 transports the wafer cassette to its destination, the ejector device can be used to lift the movable base plate 12 upwards. After the lifted movable base plate 12 moves upwards and passes through the clearance opening 26, it can lift the wafer cassette and continue to move upwards, so that the bottom of the wafer cassette is removed from the receiving groove 21. At this time, it can be taken out manually or by a robotic arm.

[0052] By forming an mounting opening 16 and an movable base plate 12 that can move upward relative to the mounting opening 16 on the bottom wall of the housing 10, the bottom of the wafer cassette can be more smoothly disengaged from the receiving groove 21, avoiding the receiving groove 21 from being too firmly installed with the bottom of the wafer cassette, making it difficult to remove the wafer cassette, and reducing the difficulty of removing the wafer cassette from the wafer cassette transfer box 100.

[0053] refer to Figures 6-7According to some embodiments of the present invention, the inner peripheral wall of the mounting port 16 extends obliquely towards the side wall of the housing 10 in the direction from bottom to top, and the outer peripheral wall of the movable base plate 12 extends obliquely towards the side wall of the housing 10 in the direction from bottom to top.

[0054] For example, after the wafer cassette is removed from the wafer cassette transfer box 100, the ejector retracts downwards, and the movable base plate 12 can return to its original position under the action of gravity as the ejector descends.

[0055] By extending the inner peripheral wall of the mounting opening 16 at an angle from bottom to top toward the side wall of the housing 10, and extending the outer peripheral wall of the movable base plate 12 at an angle from bottom to top toward the side wall of the housing 10, the outer peripheral wall of the movable base plate 12 can be used to limit the inner peripheral wall of the mounting opening 16, preventing the movable base plate 12 from falling out of the mounting opening 16. Furthermore, the inclined outer peripheral wall of the movable base plate 12 can also serve as a guide, making it easier for the movable base plate 12 to slide back to its original position along the outer peripheral wall of the movable base plate 12.

[0056] refer to Figure 4 According to some embodiments of the present invention, the movable base plate 12 is provided with a detection port 121, which penetrates the movable base plate 12 in the vertical direction and is used to adapt to the photoelectric sensor on the conveyor line.

[0057] For example, when the wafer cassette transfer box 100 is transported on the conveyor line and passes above the photoelectric sensor, the photoelectric sensor emits a beam of light upwards, which shines on the bottom of the wafer cassette through the detection port 121 to detect the wafer cassette.

[0058] By providing a detection port 121 on the movable base plate 12, and having the detection port 121 extending through the movable base plate 12 in the vertical direction, the obstruction of the light beam by the movable base plate 12 can be reduced, allowing the light beam of the photoelectric sensor to pass through the movable base plate 12 and detect the wafer cassette inside the wafer cassette transfer box 100, thus making the detection results more accurate.

[0059] refer to Figure 7 According to some embodiments of the present invention, the bottom surface of the movable base plate 12 is provided with a positioning groove 122, which is used to cooperate with a top rod, and the top rod is used to push the movable base plate 12 upward.

[0060] For example, when the wafer cassette transfer box 100 transports the wafer cassette to its destination, the top of the push rod can be inserted into the positioning groove 122. When the push rod moves upward, it can lift the movable base plate 12 upward. After the lifted movable base plate 12 moves upward and passes through the clearance opening 26, it can lift the wafer cassette and continue to move upward, so that the bottom of the wafer cassette is removed from the receiving groove 21.

[0061] By providing a positioning groove 122 on the bottom surface of the movable base plate 12, which cooperates with the top rod, the movable base plate 12 can be fixed, preventing it from slipping when it is pushed upwards. This makes the process of the wafer box being pushed out more smoothly, avoiding large-scale bumps between the wafer box and the wafer, and reducing collisions between the wafers inside the wafer box.

[0062] refer to Figure 7 According to some embodiments of the present invention, a detection port 121 is provided on the movable base plate 12. The detection port 121 penetrates the movable base plate 12 in the vertical direction. The detection port 121 is used to adapt to the photoelectric sensor on the conveyor line. There are multiple positioning slots 122. The multiple positioning slots 122 are located on the outer periphery of the detection port 121, and the multiple positioning slots 122 are arranged at intervals along the circumference of the detection port 121.

[0063] By positioning multiple positioning slots 122 on the outer periphery of the detection port 121 and arranging them at circumferential intervals along the detection port 121, the movable base plate 12 can be more easily kept horizontal during the lifting process, and the wafer cassette supported by the movable base plate 12 can also be more easily kept horizontal. This makes the process of ejecting the wafer cassette more stable, avoids significant turbulence between the wafer cassette and the wafer, and reduces collisions between the wafers inside the wafer cassette.

[0064] refer to Figure 7 According to some embodiments of the present invention, the cross-sectional area of ​​the positioning groove 122 gradually increases from top to bottom.

[0065] For example, the cross-sectional area of ​​the top of the push rod that mates with the positioning groove 122 can gradually decrease from bottom to top.

[0066] By gradually increasing the cross-sectional area of ​​the positioning groove 122 from top to bottom, the positioning rod can be more easily inserted into the positioning groove 122, reducing the difficulty of positioning the positioning groove 122. This avoids the movable base plate 12 tilting during the ejection process due to minor positioning errors that prevent the positioning rod from being inserted into the positioning groove 122. As a result, the process of ejecting the wafer box is more stable, avoiding significant bumps between the wafer box and the wafer, and reducing collisions between the wafers inside the wafer box.

[0067] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0068] In the description of this utility model, "first feature" and "second feature" may include one or more of the features.

[0069] In the description of this utility model, "multiple" means two or more.

[0070] In the description of this utility model, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or it may include the first and second features not being in direct contact but being in contact through another feature between them.

[0071] In the description of this utility model, the terms "above", "over" and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicate that the first feature is at a higher horizontal level than the second feature.

[0072] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0073] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A wafer cassette transfer box, characterized by, include: Box; A buffer pad is disposed inside the housing. The hardness of the buffer pad is less than that of the housing. A groove is formed on the upper surface of the buffer pad. A limiting protrusion is provided in the groove. There are multiple limiting protrusions. The multiple limiting protrusions are arranged at intervals along the circumference of the buffer pad. The multiple limiting protrusions together define a receiving groove for accommodating the bottom of the wafer cassette.

2. The wafer transfer box according to claim 1, characterized in that, Each of the limiting protrusions is connected to the sidewall of the groove; and / or, each of the limiting protrusions has a guide surface formed on the side facing the receiving groove, the guide surface extending obliquely in an upward direction toward the sidewall of the groove.

3. The wafer transfer box according to claim 1, characterized in that, The groove is also provided with a foolproof protrusion, which is located on the outer periphery of the receiving groove and between two adjacent limiting protrusions.

4. The wafer cassette transfer box according to claim 1, characterized in that, One of the buffer pad and the housing is provided with a positioning protrusion and the other is provided with a positioning hole, the positioning protrusion being accommodated in the positioning hole; And / or, the housing includes two first sidewalls arranged opposite each other along a first direction, the upper end face of the first sidewall is a first end face, one of the first end faces is provided with a foolproof protrusion or one end of the two first end faces along a second direction is provided with the foolproof protrusion, the second direction, the first direction and the up and down direction intersect each other.

5. The wafer cassette transfer box according to claim 1, characterized in that, The cushioning pad is a foam plastic component; and / or, the housing includes two second sidewalls disposed opposite each other along a second direction, with side openings formed on the second sidewalls.

6. The wafer cassette transfer box according to any one of claims 1-5, characterized in that, The enclosure includes an enclosure body and a movable base plate. The bottom wall of the enclosure body has an installation opening. The movable base plate is installed in the installation opening and can move upward relative to the installation opening. The buffer pad has a clearance opening that penetrates the buffer pad in the vertical direction. The projection of the movable base plate on the reference surface is located within the projection of the clearance opening on the reference surface.

7. The wafer cassette transfer box according to claim 6, characterized in that, The inner peripheral wall of the mounting port extends obliquely towards the side wall of the housing from bottom to top, and the outer peripheral wall of the movable base plate extends obliquely towards the side wall of the housing from bottom to top.

8. The wafer transfer box according to claim 6, characterized in that, The movable base plate is provided with a detection port, which extends through the movable base plate in the vertical direction. The detection port is used to adapt to the photoelectric sensor on the conveyor line.

9. The wafer cassette transfer box according to claim 6, characterized in that, The bottom surface of the movable base plate is provided with a positioning groove, which is used to cooperate with the top rod, and the top rod is used to push the movable base plate upward.

10. The wafer cassette transfer box according to claim 9, characterized in that, The movable base plate is provided with a detection port, which penetrates the movable base plate in the vertical direction. The detection port is used to adapt to the photoelectric sensor on the conveyor line. There are multiple positioning slots, which are located on the outer periphery of the detection port and are arranged at intervals along the circumference of the detection port. And / or, the cross-sectional area of ​​the positioning groove gradually increases from top to bottom.

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