A transport device for processing semiconductor equipment parts

Abstract

This utility model relates to the field of semiconductor equipment component transportation technology, specifically a transportation device for processing semiconductor equipment components. It includes a clamping assembly and a separating assembly. The clamping assembly comprises a loading box, a sealing cover, a spring, a lower pressure plate, a miniature air pump, an inflation tube, a silicone pressure block, and a pressure sensor. The sealing cover is snapped onto the top of the loading box, and a spring is fixedly connected to the bottom edge of the sealing cover. The lower pressure plate is fixedly connected to the bottom of the spring, and a miniature air pump is fixedly connected to the inner wall of the lower pressure plate. In use, this transportation device for processing semiconductor equipment components, through the arrangement of the loading box, sealing cover, spring, lower pressure plate, miniature air pump, inflation tube, silicone pressure block, and pressure sensor, allows the operator to place the semiconductor equipment components, cover the loading box with the sealing cover, and then the lower pressure plate at the bottom of the sealing cover, in conjunction with the silicone pressure block at the bottom, presses down on the semiconductor equipment components.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment parts transportation technology, specifically a transportation device for semiconductor equipment parts processing. Background Technology

[0002] Semiconductor component manufacturing refers to the process of using a series of specific processes to manufacture semiconductor materials into components that meet the needs of various electronic devices. These processes cover multiple key steps such as photolithography, etching, and doping. Semiconductor component manufacturing also involves the use of transportation devices.

[0003] A semiconductor equipment parts processing transport device disclosed in CN222793568U uses a cylinder to activate a telescopic rod that automatically raises and lowers the box cover. During the descent of the box cover and the pressure plate, the bottom of the pressure plate contacts the semiconductor equipment parts stacked in the compartment, thereby achieving a pressing effect on the semiconductor equipment parts in the compartment, preventing the semiconductor equipment parts in the transport box from shaking during transportation, and ensuring the quality and safety of the semiconductor equipment parts.

[0004] However, the transport device for processing semiconductor equipment parts has the following disadvantages: (1) The transport device for processing semiconductor equipment parts has a weak flexible pressing function. The device uses an elastic structure and a pressure plate to press down on the internally filled semiconductor equipment parts. However, this pressing method cannot guarantee the accurate positioning of the semiconductor equipment parts and may also cause damage to the parts due to excessive squeezing.

[0005] (2) The semiconductor equipment parts processing transport device has a weak separation function. The device uses a fixed method to install the partition, which divides the device into four placement spaces. This may cause the space utilization rate of the device to decrease due to the small number of parts. Utility Model Content

[0006] The purpose of this invention is to provide a transport device for processing semiconductor equipment parts, so as to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a transport device for processing semiconductor equipment parts, comprising a clamping assembly and a separating assembly. The clamping assembly consists of a loading box, a sealing cover, a spring, a lower pressure plate, a micro air pump, an inflation tube, a silicone block, and a pressure sensor. The top of the loading box is snapped with a sealing cover, the bottom edge of the sealing cover is fixedly connected to a spring, the bottom of the spring is fixedly connected to a lower pressure plate, the inner wall of the lower pressure plate is fixedly connected to a micro air pump, one end of the micro air pump is fixedly connected to an inflation tube, one end of the inflation tube is fixedly connected to a silicone block, and the inner bottom wall of the silicone block is fixedly connected to a pressure sensor. The partition assembly consists of a positioning rod fixed to the center of the bottom wall of the loading box, a mounting groove, and a baffle. The outer surface of the positioning rod has a mounting groove, the inner wall of the mounting groove is fitted with a baffle, and the top of the positioning rod is provided with a positioning component.

[0008] Preferably, a trolley is fixedly connected to the bottom of the loading box, and a push rod is fixedly connected to one end of the trolley. The operator can hold the push rod and push the trolley to move and transport the semiconductor equipment parts inside the loading box.

[0009] Preferably, the bottom edge of the trolley is provided with a mounting groove, and the inner wall of the mounting groove is fixedly connected with a caster wheel, so that the trolley can roll and move by the caster wheel at the bottom.

[0010] Preferably, the inner wall of the spring is provided with a damper, one end of which is fixedly connected to the top of the lower pressure plate. The damper can stabilize the deformation of the spring and at the same time ensure the position of the lower pressure plate and prevent it from shaking.

[0011] Preferably, a rectangular groove is formed at the bottom center of the lower pressure plate, and the inner wall of the rectangular groove is fixedly connected to the top of the outer surface of the silicone block, with the silicone block installed in the rectangular groove on the inner wall of the lower pressure plate.

[0012] Preferably, the inner sidewall of the loading box is provided with a docking groove, the inner wall of the docking groove is engaged with one end of the outer surface of the baffle, and one end of the baffle is engaged in the docking groove on the inner wall of the loading box.

[0013] Compared with this device, the beneficial effects of this utility model are: 1. The transport device for processing semiconductor equipment parts, through the setup of a loading box, sealing cover, spring, lower pressure plate, micro air pump, inflation tube, silicone pressure block, and pressure sensor, allows the operator to place the semiconductor equipment parts in the loading box, cover the loading box with the sealing cover, and the lower pressure plate at the bottom of the sealing cover will cooperate with the silicone pressure block at the bottom to press on the semiconductor equipment parts. The spring will self-adaptively contract, and at the same time, an air chamber is opened in the silicone pressure block. The micro air pump is started to inflate the silicone pressure block through the inflation tube, causing the silicone pressure block to bulge and press against the semiconductor equipment parts until the pressure sensor at the bottom of the air chamber reaches the set pressure. This self-adaptive structure can achieve precise "point-to-point" clamping.

[0014] 2. The transport device for processing semiconductor equipment parts, through the setting of loading box, positioning rod, mounting slot, baffle and positioning component, allows the operator to install the corresponding number of baffles according to the type of semiconductor equipment parts. The baffles are inserted along the mounting slot on the positioning rod, and then the positioning component positions the baffles, so that the baffles divide the loading box into multiple loading slots. This setting can improve the space utilization rate within the device and effectively separate the semiconductor equipment parts. Attached Figure Description

[0015] Figure 1 This is the front view of the present invention; Figure 2 This is a schematic diagram of the sealing cap of this utility model; Figure 3 This is a schematic diagram of the silicone block of this utility model; Figure 4 This is a schematic diagram of Embodiment 1 of the present invention; Figure 5 This is a schematic diagram of Embodiment 2 of the present invention. In the diagram: 1. Clamping assembly; 101. Loading box; 102. Sealing cover; 103. Spring; 104. Lower pressure plate; 105. Miniature air pump; 106. Inflation tube; 107. Silicone pressure block; 108. Pressure sensor; 2. Separating assembly; 201. Positioning rod; 202. Mounting slot; 203. Baffle; 3. Positioning assembly; 301. Iron sheet; 302. Magnetic block; 303. Threaded groove; 304. Positioning bolt; 4. Trolley; 5. Push rod; 6. Caster wheel; 7. Damper. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figures 1-3 As shown, this utility model provides a technical solution: a transport device for processing semiconductor equipment parts, including a clamping assembly 1 and a separating assembly 2. The clamping assembly 1 consists of a loading box 101, a sealing cover 102, a spring 103, a lower pressure plate 104, a micro air pump 105, an inflation pipe 106, a silicone pressure block 107, and a pressure sensor 108. The top of the loading box 101 is snapped with the sealing cover 102. The bottom edge of the sealing cover 102 is fixedly connected to the spring 103. The bottom of the spring 103 is fixedly connected to the lower pressure plate 104. The inner wall of the lower pressure plate 104 is fixedly connected to the micro air pump 105. One end of the micro air pump 105 is fixedly connected to the inflation pipe 106. One end of the inflation pipe 106 is fixedly connected to the silicone pressure block 107. The inner bottom wall of the silicone pressure block 107 is fixedly connected to the pressure sensor 108. Through the loading box 101, the sealing cover 102, the spring 103, and the lower pressure plate 104, the pressure sensor 108 is connected to the lower pressure plate 104. The configuration of the pressure plate 104, micro air pump 105, inflation tube 106, silicone pressure block 107, and pressure sensor 108 is as follows: During use, after the operator places the semiconductor equipment parts, the sealing cover 102 is placed on the loading box 101. The lower pressure plate 104 at the bottom of the sealing cover 102, in conjunction with the silicone pressure block 107 at the bottom, presses against the semiconductor equipment parts. The spring 103 self-adaptively contracts. Simultaneously, an air chamber is created within the silicone pressure block 107. The micro air pump 105 is activated, inflating the silicone pressure block 107 through the inflation tube 106, causing the silicone pressure block 107 to bulge and press against the semiconductor equipment parts until the pressure sensor 108 at the bottom of the air chamber reaches the set pressure. This self-adaptive structure enables precise "point-to-point" clamping. The micro air pump 105 is model FAA8006, and the pressure sensor 108 is model HDP862. The partition component 2 consists of a positioning rod 201 fixed to the center of the bottom wall of the loading box 101, a mounting groove 202, and a baffle 203. The outer surface of the positioning rod 201 has a mounting groove 202, and the inner wall of the mounting groove 202 is fitted with a baffle 203. A positioning component 3 is provided on the top of the positioning rod 201. With the configuration of the loading box 101, the positioning rod 201, the mounting groove 202, the baffle 203, and the positioning component 3, during use, the operator can install the corresponding number of baffles 203 according to the type of semiconductor equipment parts, insert the baffles 203 along the mounting groove 202 on the positioning rod 201, and then position the baffles 203 through the positioning component 3, so that the baffles 203 divide the loading box 101 into multiple loading grooves. This configuration can improve the space utilization rate inside the device and effectively separate the semiconductor equipment parts. A trolley 4 is fixedly connected to the bottom of the loading box 101, and a push rod 5 is fixedly connected to one end of the trolley 4. With the configuration of the loading box 101, the trolley 4 and the push rod 5, when in use, the staff can hold the push rod 5 and push the trolley 4 to move and transport the semiconductor equipment parts in the loading box 101. The bottom edge of the trolley 4 is provided with a mounting groove 202, and a caster wheel 6 is fixedly connected to the inner wall of the mounting groove 202. With the trolley 4 and the caster wheel 6, the trolley 4 can roll and move by the caster wheel 6 at the bottom when in use. A damper 7 is provided on the inner wall of the spring 103. One end of the damper 7 is fixedly connected to the top of the lower pressure plate 104. Through the arrangement of the spring 103, the damper 7 and the lower pressure plate 104, the damper 7 can stabilize the deformation of the spring 103 during use, while ensuring the position of the lower pressure plate 104 and preventing it from shaking. A rectangular groove is provided at the bottom center of the lower pressure plate 104. The inner wall of the rectangular groove is fixedly connected to the top of the outer surface of the silicone block 107. With the setting of the lower pressure plate 104 and the silicone block 107, the silicone block 107 is installed in the rectangular groove on the inner wall of the lower pressure plate 104 during use. The inner wall of the loading box 101 is provided with a docking groove. The inner wall of the docking groove is engaged with one end of the outer surface of the baffle 203. With the loading box 101 and the baffle 203, when in use, one end of the baffle 203 is engaged in the docking groove on the inner wall of the loading box 101.

[0018] In this invention, the working steps of the device are as follows: First step: According to the type of semiconductor equipment parts, the staff can install the corresponding number of baffles 203, let the baffles 203 be inserted into the mounting slots 202 on the positioning rod 201, and then position the baffles 203 through the positioning component 3, so that the baffles 203 divide the loading box 101 into multiple loading slots. The second step: After the staff places the semiconductor equipment parts, they put the sealing cover 102 on the loading box 101. The lower pressure plate 104 at the bottom of the sealing cover 102 will cooperate with the silicone pressure block 107 at the bottom to press on the semiconductor equipment parts. The spring 103 will self-contract. At the same time, an air chamber is opened in the silicone pressure block 107. The micro air pump 105 is started to inflate the silicone pressure block 107 through the air inflator 106, so that the silicone pressure block 107 bulges up and presses against the semiconductor equipment parts until the pressure sensor 108 at the bottom of the air chamber reaches the set pressure. Example

[0019] Please refer to Figure 4 The positioning component 3 includes an iron sheet 301 and a magnetic block 302. The top of the positioning rod 201 has a circular slot, and the bottom wall of the circular slot is fixed with the iron sheet 301. The magnetic block 302 is attracted to the iron sheet 301, and the limiting block at the top of the magnetic block 302 blocks the baffle 203, thereby achieving the positioning and installation of the baffle 203. Example

[0020] Please refer to Figure 5 The positioning component 3 includes a threaded groove 303 and a positioning bolt 304. The top of the positioning rod 201 has a threaded groove 303. The positioning bolt 304 is screwed into the threaded groove 303, so that the limiting block at the top of the positioning bolt 304 blocks the baffle 203, thereby achieving positioning and installation of the baffle 203.

[0021] It should be noted that the device structure and accompanying drawings of this utility model mainly describe the principle of this utility model. In terms of the technical aspects of this design principle, the setting of the power mechanism, power supply system and control system of the device is not fully described. However, under the premise that those skilled in the art understand the principle of the above utility model, the specific details of its power mechanism, power supply system and control system can be clearly understood. The control method in the application document is automatic control through a controller. The control circuit of the controller can be implemented by those skilled in the art through simple programming. All standard parts used can be purchased from the market, and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the existing technology. The machinery, parts and equipment adopt conventional models in the existing technology, and the structure and principle of the components known to those skilled in the art can be known by those skilled in the art through technical manuals or conventional experimental methods.

[0022] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A transport device for processing of semiconductor device parts, comprising a compacting assembly (1) and a separating assembly (2), characterized in that: The clamping assembly (1) consists of a loading box (101), a sealing cover (102), a spring (103), a lower pressure plate (104), a micro air pump (105), an inflation tube (106), a silicone pressure block (107), and a pressure sensor (108). The top of the loading box (101) is snapped with a sealing cover (102). The bottom edge of the sealing cover (102) is fixedly connected to a spring (103). The bottom of the spring (103) is fixedly connected to a lower pressure plate (104). The inner wall of the lower pressure plate (104) is fixedly connected to a micro air pump (105). One end of the micro air pump (105) is fixedly connected to an inflation tube (106). One end of the inflation tube (106) is fixedly connected to a silicone pressure block (107). The inner bottom wall of the silicone pressure block (107) is fixedly connected to a pressure sensor (108). The partition component (2) consists of a positioning rod (201), a mounting groove (202) and a baffle (203) fixed in the center of the bottom wall of the loading box (101). The outer surface of the positioning rod (201) is provided with a mounting groove (202), and the inner wall of the mounting groove (202) is fitted with a baffle (203). The top of the positioning rod (201) is provided with a positioning component (3).

2. The transport device for processing semiconductor equipment parts according to claim 1, characterized in that: The bottom of the loading box (101) is fixedly connected to a trolley (4), and one end of the trolley (4) is fixedly connected to a push rod (5).

3. The transport device for processing semiconductor equipment parts according to claim 2, characterized in that: The bottom edge of the trolley (4) is provided with a mounting groove (202), and a caster wheel (6) is fixedly connected to the inner wall of the mounting groove (202).

4. The transport device for semiconductor equipment component processing according to claim 1, characterized in that: The inner wall of the spring (103) is provided with a damper (7), and one end of the damper (7) is fixedly connected to the top of the lower pressure plate (104).

5. The transport device for processing semiconductor equipment parts according to claim 1, characterized in that: The bottom center of the lower pressure plate (104) is provided with a rectangular groove, and the inner wall of the rectangular groove is fixedly connected to the top of the outer surface of the silicone block (107).

6. The transport device for processing semiconductor equipment parts according to claim 1, characterized in that: The inner wall of the loading box (101) is provided with a docking groove, and the inner wall of the docking groove is engaged with one end of the outer surface of the baffle (203).

Images