A deep oscillating magnetron sputtering target source with an active cooling system

CN224704677UActive Publication Date: 2026-09-01SUZHOU QIAO GELI PRECISION MASCH CO LTD
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Patent Information

Application Number
CN202522107904.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-30
Publication Date
2026-09-01
Estimated Expiration
2035-09-30

AI Technical Summary

Technical Problem

[0004]现有技术的不足之处在于,磁控溅射镀膜的质量,如致密性、附着力、晶型,会高度依赖沉积和冷却过程中的温度稳定性

Benefits of technology

[0016]在上述技术方案中,本实用新型提供的一种带有主动冷却系统的深振荡磁控溅射靶源,具备以下有益效果:通过将靶材放置于承载台上,并利用承载台内流动的冷却液快速吸收靶材上的热量,实现高效率降温冷却,极大缩短了靶材的冷却时间,而通过向下翻转的引导板端部对靶材施压,促使靶材紧贴于承载台上,保证靶材的热传递处于稳定状态。

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Abstract

This utility model relates to the field of material surface treatment technology, specifically disclosing a deep oscillating magnetron sputtering target source with an active cooling system. It includes a body with a target material, and a sample stage installed within the body. A multi-segment curved support platform is fixedly installed on the sample stage. Support frames for supporting the target material as it detaches from the support platform are movably installed on both sides of the sample stage. Guide plates are fixedly installed on the support frames, and the guide plates, when moved under drive, push the target material against the support platform. The deep oscillating magnetron sputtering target source with an active cooling system provided by this utility model achieves high-efficiency cooling by placing the target material on the support platform and utilizing the coolant flowing within the support platform to rapidly absorb heat from the target material, greatly shortening the cooling time of the target material. Furthermore, the downward-flipping end of the guide plate applies pressure to the target material, causing it to adhere tightly to the support platform, ensuring stable heat transfer of the target material.
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Description

Technical Field

[0001] This utility model relates to material surface treatment technology, specifically a deep oscillation magnetron sputtering target source with an active cooling system. Background Technology

[0002] Deep oscillation magnetron sputtering targets are magnetron sputtering devices that provide energy to the target material through micro-pulse oscillation waveforms. This can eliminate arc discharge in a high-density plasma environment and improve the atomic ionization rate of the target material. Optimizing the target surface coating process can improve the properties of the target surface, such as optical thin films and wear-resistant coatings.

[0003] For example, the publication (announcement) number: CN110468381B, publication (announcement) date: 2021-08-10, discloses a high-frequency oscillating pulsed magnetron sputtering method, including the following steps: 1) The sample to be coated is immersed in acetone and alcohol solutions respectively for ultrasonic cleaning, dried, placed on the sample workpiece holder in a vacuum chamber, evacuated, and argon gas is introduced; 2) The high-frequency oscillating pulsed target power supply and the pulsed negative bias substrate power supply are turned on to perform ion bombardment cleaning on the sample surface, and the ion cleaning time is 20-40 min; 3) Reactive gas is introduced, and the vacuum degree in the vacuum chamber reaches 0.4-1.2 Pa. The adjustable inductor is turned on to adjust the pulsed target voltage, and the thin film deposition time is 20-180 min; 4) After the thin film deposition is completed, the high-frequency oscillating pulsed power supply, the pulsed negative bias substrate power supply, the reactive gas valve and the workpiece holder rotation mechanism are turned off. After the temperature in the vacuum chamber drops to room temperature, the coated sample is taken out.

[0004] The drawback of existing technologies is that the quality of magnetron sputtering coatings, such as density, adhesion, and crystal structure, is highly dependent on temperature stability during deposition and cooling. Although deep oscillation magnetron sputtering reduces the background temperature of the target material through magnetic field design, the target material still experiences a temperature rise of 50-300°C due to ion bombardment. If the natural cooling time is too long, the film layer will remain in the high-temperature range for an extended period, which can easily lead to abnormal film grains, increased surface roughness, and thermal stress accumulation accompanied by reduced film adhesion, or even film detachment and performance failure, directly negating its high deposition rate advantage and resulting in coated products that cannot meet production application requirements. Utility Model Content

[0005] The purpose of this invention is to provide a deep oscillating magnetron sputtering target source with an active cooling system to address the aforementioned shortcomings in the prior art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A deep oscillating magnetron sputtering target source with an active cooling system includes a body on which a target material is disposed, and a sample stage installed in the body, wherein a multi-segment curved support stage is fixedly installed on the sample stage. The sample stage is movably mounted on both sides with a support frame for supporting the target material as it is removed from the support stage. A guide plate is fixedly installed on the support frame, and the guide plate, after being driven to move, pushes the target material to fit the support platform.

[0007] As a further description of the above technical solution: the support platform is provided with inlets and outlets on both sides.

[0008] As a further description of the above technical solution: the inlet and outlet are connected to pipelines on their outer sides.

[0009] As a further description of the above technical solution: a side frame is fixedly installed on the side of the sample stage, and the bearing frame is movable in the side frame.

[0010] As a further description of the above technical solution: a rotating shaft is rotatably provided on the side frame, and the bearing frame and the guide plate are fixed on the rotating shaft at a predetermined included angle.

[0011] As a further description of the above technical solution: the guide plate has equally spaced openings.

[0012] As a further description of the above technical solution: a damping pad is fixedly installed on the bearing frame.

[0013] As a further description of the above technical solution: multiple air blowing components are fixedly installed on the inner wall of the machine body.

[0014] As a further description of the above technical solution: the air blowing component is provided with multiple exhaust ports.

[0015] As a further description of the above technical solution: the guide plate after the activity is used to guide the exhaust of the air blowing component.

[0016] In the above technical solution, the deep oscillation magnetron sputtering target source with active cooling system provided by this utility model has the following beneficial effects: by placing the target material on the support platform and using the coolant flowing in the support platform to quickly absorb the heat on the target material, high-efficiency cooling is achieved, which greatly shortens the cooling time of the target material. Furthermore, by applying pressure to the target material through the downward flipping end of the guide plate, the target material is made to stick tightly to the support platform, ensuring that the heat transfer of the target material is in a stable state. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0018] Figure 1 A schematic diagram of the deep oscillation magnetron sputtering target source body and its internal sample stage and air blowing components provided for an embodiment of this utility model; Figure 2 A schematic diagram of the exposed portion of the body and its internal sample stage, support frame and air blowing component provided for an embodiment of this utility model; Figure 3 A front view of the exposed portion of the main body and its internal sample stage, support frame and air blowing component provided for an embodiment of this utility model; Figure 4 This is a schematic diagram of the assembly of the sample stage, support frame, and guide plate provided in an embodiment of the present utility model; Figure 5 A front sectional view of the sample stage, support frame, and guide plate after assembly, as provided in this embodiment of the utility model.

[0019] Explanation of reference numerals in the attached figures: 1. Body; 2. Target material; 3. Sample stage; 31. Support stage; 32. Inlet and outlet; 33. Piping; 34. Side frame; 4. Rotating shaft; 41. Support frame; 42. Guide plate; 43. Plate opening; 5. Air blowing component. Detailed Implementation

[0020] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0021] Please see Figure 1-5 This utility model provides a technical solution, including the following embodiments: Example

[0022] Combination Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, this embodiment provides a component for rapid cooling of the target material 2, which is integrated into the sample stage 3 for supporting the placement of the target material 2. By placing the target material 2 on the support stage 31 and utilizing the coolant flowing within the support stage 31 to rapidly absorb the heat on the target material 2, high-efficiency cooling is achieved, greatly shortening the cooling time of the target material 2.

[0023] Secondly, by applying pressure to the target material 2 at the end of the downward-flipping guide plate 42, the target material 2 is made to adhere tightly to the support platform 31, ensuring that the heat transfer of the target material 2 is in a stable state. When the guide plate 42 flips upward, the support frame 41 actively picks up the target material 2, causing the target material 2 to be lifted away from the support platform 31, so that the target material 2 has a larger contact surface in the vacuum environment of the machine body 1, ensuring the adhesion and formation of the film layer.

[0024] Specifically, the support stage 31 is composed of multiple S-shaped directional pipes and is fixed to the sample stage 3 by welding or bolting. A low-temperature coolant, such as deionized water, silicone oil, or ethylene glycol solution, flows inside the support stage 31, which can improve the heat absorption efficiency through heat conduction.

[0025] Furthermore, the inlet and outlet 32 ​​on both sides of the support platform 31 are connected by pipes 33 so that the liquid pump and liquid storage tank in the machine body 1 can circulate and transport the heated coolant, thus ensuring the cooling effect of the support platform 31. Example

[0026] Combination Figure 3 , Figure 4 and Figure 5 As shown, this embodiment provides components for supporting the target 2, namely a support frame 41 and a guide plate 42 welded to the rotating shaft 4. During magnetron sputtering coating of the target 2, the support frame 41 supports the target 2, and the rubber damping pad on the support frame 41 provides an anti-slip function. After the magnetron sputtering coating of the target 2 is completed, the rotating shaft 4 rotates to flip the support frame 41 downwards, allowing the support frame 41 to pass through the side frame 34, and the support frame 41 gradually straightens from an inclined position. Figure 5 As shown, during the gradual verticalization process, the target 2 is slowed down by the damping pad as it falls, thus allowing the target 2 to fall slowly and stably onto the support platform 31. Subsequently, the support frame 41, which continues to rotate, rotates downwards corresponding to the guide plate 42 until the end of the guide plate 2 actively contacts the target 2 and applies pressure to both sides of the target 2, so that the target 2 is firmly fixed on the support platform 31 for heat conduction.

[0027] Specifically, the rotating shaft 4 is connected by a coupling installed at the motor output end, which enables the rotation of the rotating shaft 4 to be controllable, and locks the load-bearing frame 41 and guide plate 42 after flipping, thereby making the target material 2 in the raised state and the attached state more stable.

[0028] Furthermore, the side frames 34 are welded to the side of the sample stage 3 at a predetermined angle, and the two side frames 34 are symmetrically distributed to provide stable rotational support for the two rotating shafts 4. Example

[0029] Combination Figure 3 , Figure 4 and Figure 5As shown, this embodiment provides an airflow cooling function, namely an air blowing component 5 with multiple inclined exhaust ports. After the magnetron sputtering coating of the target material 2 is completed and before the vacuum is broken, the air blowing component 5 is used to fill the machine body 1 with a highly thermally conductive inert gas, such as argon or ammonia. The heat transfer is enhanced by gas convection, and combined with liquid cooling, the cooling rate of the target material 2 can be accelerated.

[0030] Secondly, when the guide plate 42 contacts the upper surface of the target material 2, the frame-shaped support frame 41 does not affect the inert gas flowing along the side wall of the body 1. At this time, the inclined guide plate 42 is in a Venturi state, which accelerates the inert gas flow along the inner wall of the body 1, thereby enhancing the cooling effect on the target material. At the same time, the multiple openings 43 at the end of the guide plate 42 allow the inert gas to pass through the openings 43 and flow directly on the upper surface of the target material 2. Therefore, the heat transfer effect is optimal when both the upper and lower surfaces of the target material 2 are cooled.

[0031] Specifically, a pre-cooling device, the same as the low-temperature coolant in the bearing platform 31, is used to cool the inert gas injected into the blowing component 5 to 0-10°C, thereby improving the cooling effect on the target material 2.

[0032] Furthermore, the exhaust ports are evenly distributed on the air blowing component 5. The air blowing component 5 is fixed to the inner wall of the body 1 with bolts. There are air blowing components 5 that directly blow airflow onto the upper surface of the target material 2, and air blowing components 5 that are accelerated by the airflow by the Venturi structure. The purpose is to ensure the auxiliary cooling capability.

[0033] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A deep oscillation magnetron sputtering target source with an active cooling system, comprising a body (1) on which a target material (2) is disposed, characterized in that, It also includes a sample stage (3) installed in the body (1), on which a multi-section curved support platform (31) is fixedly installed. The sample stage (3) is movably mounted on both sides with a support frame (41) for supporting the target material (2) to detach from the support stage (31). A guide plate (42) is fixedly installed on the support frame (41), and the guide plate (42) after being driven to move pushes the target material (2) to fit the support platform (31).

2. The deep oscillation magnetron sputtering target source with an active cooling system according to claim 1, characterized in that, The support platform (31) has entrances and exits (32) on both sides.

3. A deep oscillating magnetron sputtering target source with an active cooling system according to claim 2, characterized in that, The inlet and outlet (32) are connected to a pipeline (33) on the outside.

4. A deep oscillating magnetron sputtering target source with an active cooling system according to claim 1, characterized in that, The sample stage (3) is fixedly mounted with a side frame (34), and the bearing frame (41) is movable in the side frame (34).

5. A deep oscillating magnetron sputtering target source with an active cooling system according to claim 4, characterized in that, A rotating shaft (4) is rotatably mounted on the side frame (34), and the bearing frame (41) and the guide plate (42) are fixed on the rotating shaft (4) at a predetermined angle.

6. A deep oscillating magnetron sputtering target source with an active cooling system according to claim 1, characterized in that, The guide plate (42) has equally spaced openings (43).

7. A deep oscillating magnetron sputtering target source with an active cooling system according to claim 1, characterized in that, A damping pad is fixedly installed on the bearing frame (41).

8. A deep oscillating magnetron sputtering target source with an active cooling system according to claim 1, characterized in that, Multiple air blowing components (5) are fixedly installed on the inner wall of the machine body (1).

9. A deep oscillating magnetron sputtering target source with an active cooling system according to claim 8, characterized in that, The air blowing component (5) is provided with multiple exhaust ports.

10. A deep oscillating magnetron sputtering target source with an active cooling system according to claim 8, characterized in that, The guide plate (42) after the activity is used to guide the air blowing component (5) to exhaust.

Citation Information

Patent Citations

  • A high-frequency oscillating pulse magnetron sputtering method

    CN110468381B