A support fixture for semiconductor coating

Abstract

This application relates to the field of semiconductor technology and discloses a support fixture for semiconductor coating, comprising: an annular body and a plurality of support platforms; the plurality of support platforms are connected to the inner wall of the annular body and arranged circumferentially along the annular body; an auxiliary ring is provided at one end of the annular body, the auxiliary ring protruding from the annular body in the direction from the inner wall to the outer wall, and the support platforms protruding from the annular body in the direction from the outer wall to the inner wall; the support platforms are connected to the end of the annular body away from the auxiliary ring on the inner wall of the annular body and maintain a predetermined distance from the end of the annular body where the auxiliary ring is provided. This application improves the reliability of wafer coating.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more specifically to a substrate fixture for semiconductor coating. Background Technology

[0002] In semiconductor manufacturing processes, electroplating is frequently used in semiconductor metal deposition. Since electroplating layers cannot be deposited directly on silicon substrates, a seed layer needs to be deposited on the silicon substrate using a vacuum deposition process before electroplating. In related technologies, the support fixture used for vacuum deposition of semiconductor wafers on silicon substrates is a metal ring with annular steps. When the wafer passes through this metal ring for deposition, an annular shielding area is generated. If a deposition layer containing this annular shielding area is used as a seed layer for electroplating, the edges of the seed layer are non-conductive and cannot be electroplated. Utility Model Content

[0003] In view of this, this application provides a support fixture for semiconductor coating to solve the aforementioned technical problems.

[0004] This application discloses a support fixture for semiconductor coating, comprising: The main body is circular and consists of several supporting platforms; A plurality of the support platforms are connected to the inner wall of the annular body and are arranged in a circle along the annular body. An auxiliary ring is provided at one end of the annular body. The auxiliary ring protrudes from the annular body from the inner wall to the outer wall. The support platforms protrude from the annular body from the outer wall to the inner wall. The support platform is connected to the end of the annular body away from the auxiliary ring on the inner wall of the annular body, and maintains a preset distance from the end of the annular body where the auxiliary ring is located.

[0005] In one possible example, the number of support platforms ranges from 8 to 12.

[0006] In one possible example, the number of support platforms is 10.

[0007] In one possible example, the annular body is arranged in a circular structure, and the ends of the plurality of support platforms away from the inner wall of the annular body all point to the center of the annular body.

[0008] In one possible example, several of the support platforms each have a working surface facing the annular body at one end where the auxiliary ring is located, and the working surface is parallel to the horizontal plane.

[0009] In one possible example, several of the support platforms have a back surface opposite to the working surface, the back surface being an inclined surface toward the center of the annular body.

[0010] In one possible example, the cross-sectional profile of the support platform is triangular.

[0011] In one possible example, the support platform tapers from the outer wall to the inner wall of the annular body.

[0012] In one possible example, the annular body has an auxiliary ring at one end and rounded corners near its inner wall.

[0013] In one possible example, the annular body comprises a metal steel ring.

[0014] In summary, compared with the prior art, this application discloses a support fixture for semiconductor coating. The support fixture includes an annular body and several support platforms. The support platforms are connected to the inner wall of the annular body and arranged circumferentially along the annular body. An auxiliary ring is provided at one end of the annular body. The auxiliary ring protrudes from the annular body from the inner wall to the outer wall. The support platforms protrude from the annular body from the outer wall to the inner wall. The support platforms are connected to the end of the annular body away from the auxiliary ring on the inner wall of the annular body and maintain a preset distance from the end of the annular body with the auxiliary ring. That is, through the above settings, the reliability of wafer coating is improved. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a three-dimensional structural diagram of the support fixture used for semiconductor coating in this application; Figure 2 This is a top view of the support fixture used for semiconductor coating in this application; Figure 3 yes Figure 2 AA sectional view of the structure; Figure 4 yes Figure 3 Enlarged view of point B. Detailed Implementation

[0017] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the claims.

[0018] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which must be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.

[0019] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0020] In the following description, the use of suffixes such as "module," "part," or "unit" to denote elements is solely for the purpose of illustrative purposes and has no specific meaning in itself. Therefore, "module," "part," or "unit" may be used interchangeably.

[0021] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the order of description of the following embodiments is not intended to limit the priority of the embodiments.

[0023] As described in the background art, the support fixture used for vacuum coating of semiconductor wafers as silicon substrates is a metal ring with annular steps. When the wafer passes through this metal ring for coating, an annular shielding area is generated. If the coating layer containing this annular shielding area is used as the seed layer for electroplating, the edge of the seed layer is non-conductive and cannot be electroplated.

[0024] Therefore, for reference Figures 1 to 4 This application provides a support fixture for semiconductor coating, including an annular body 1 and several support platforms 2.

[0025] In the specific implementation process, several support platforms 2 are connected to the inner wall of the annular body 1 and arranged circumferentially along the annular body 1 to support the semiconductor wafer. One end of the annular body 1 is provided with an auxiliary ring 3, which protrudes from the inner wall to the outer wall of the annular body 1 to form a limiting part to prevent the wafer from radially displacing during the coating process. In contrast, the support platforms 2 protrude from the outer wall to the inner wall of the annular body 1, and the support platforms 2 are connected to the end of the annular body 1 away from the auxiliary ring 3 on the inner wall of the annular body 1. The support platforms 2 and the end of the annular body 1 with the auxiliary ring 3 are kept at a preset distance. This preset distance is greater than the thickness of the semiconductor wafer so that the edge of the wafer will not contact the auxiliary ring 3 and the support platform 2 at the same time, thereby avoiding the formation of a continuous blocking ring.

[0026] Therefore, based on the structural design of the annular main body 1, the support platform 2 and the auxiliary ring 3, when the wafer is coated with the seed layer in the fixture, it can ensure the stability of the wafer under force and effectively reduce the shading area. The seed layer formed in this way has a conductive edge and a conductive middle part, which perfectly solves the problem of non-conductive edge of the electroplating seed layer.

[0027] Optionally, the number of support platforms 2 ranges from 8 to 12.

[0028] Preferably, the number of support stages 2 is 10, and this number can ensure the stability of the wafer under force and effectively reduce the shading area.

[0029] In one example, the annular body 1 is arranged in a circular structure, and the ends of several support platforms 2 that are away from the inner wall of the annular body 1 all point to the center of the annular body 1, thereby realizing the effective arrangement of the support platforms 2 and ensuring the stable positioning of the wafer.

[0030] In one example, several support platforms 2 each have a working surface 2a facing the end of the annular body 1 with an auxiliary ring 3. The working surface 2a is parallel to the horizontal plane and is used to stably support the wafer so that it can be better coated.

[0031] Furthermore, each of the support platforms 2 has a back surface 2b opposite to the working surface. The back surface 2b is an inclined surface facing the center of the annular body 1, which can relatively reduce the shading angle during the coating process, reduce the material used for the support fixture, reduce its weight, and save costs.

[0032] Preferably, the cross-sectional profile of the support platform 2 is triangular, thereby ensuring that the support platform 2 is stably connected to the inner wall of the annular body 1.

[0033] Furthermore, the support platform 2 gradually tapers from the outer wall to the inner wall of the annular body 1, forming a tapered structure, which reduces the actual contact area between the wafer and the support platform 2, thus avoiding large-area shading.

[0034] In addition, the annular body 1 has an auxiliary ring 3 at one end and a rounded corner near its inner wall, thus forming a rounded corner transition. The rounded corner can avoid the sharp edge from blocking the wafer, and at the same time improve the uniformity of the coating deposition in the wafer edge area.

[0035] In one example, the annular body 1 includes a metal steel ring made of stainless steel, which serves as the base structure of the annular body 1 and has high mechanical strength and heat resistance.

[0036] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. The technical features of the technical solution of this application can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are also included within the patent protection scope of this application, as long as the combination of these technical features does not contradict each other.

Claims

1. A support fixture for semiconductor coating, characterized in that, include: The main body is circular and consists of several supporting platforms; A plurality of the support platforms are connected to the inner wall of the annular body and are arranged in a circle along the annular body. An auxiliary ring is provided at one end of the annular body. The auxiliary ring protrudes from the annular body from the inner wall to the outer wall. The support platforms protrude from the annular body from the outer wall to the inner wall. The support platform is connected to the end of the annular body away from the auxiliary ring on the inner wall of the annular body, and maintains a preset distance from the end of the annular body where the auxiliary ring is located.

2. The support fixture for semiconductor coating as described in claim 1, characterized in that, The number of support platforms ranges from 8 to 12.

3. The support fixture for semiconductor coating as described in claim 1, characterized in that, The number of support platforms is 10.

4. The support fixture for semiconductor coating as described in claim 1, characterized in that, The annular body is arranged in a circular structure, and the ends of the several support platforms that are away from the inner wall of the annular body all point to the center of the annular body.

5. The substrate fixture for semiconductor coating as described in claim 4, characterized in that, Each of the aforementioned support platforms has a working surface facing the end of the annular body where the auxiliary ring is located, and the working surface is parallel to the horizontal plane.

6. The substrate fixture for semiconductor coating as described in claim 5, characterized in that, Each of the support platforms has a back surface opposite to the working surface, the back surface being an inclined surface toward the center of the annular body.

7. The substrate fixture for semiconductor coating as described in claim 1, characterized in that, The cross-sectional profile of the support platform is triangular.

8. The support fixture for semiconductor coating as described in claim 1, characterized in that, The support platform gradually tapers from the outer wall to the inner wall of the annular body.

9. The support fixture for semiconductor coating as described in claim 1, characterized in that, The annular body has an auxiliary ring at one end and a rounded corner near its inner wall.

10. The substrate fixture for semiconductor coating as described in any one of claims 1 to 9, characterized in that, The annular body includes a metal steel ring.

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