A dual-sided air-cooled convection optimized heat dissipation structure for UVC deep ultraviolet LED chips.

Abstract

This utility model relates to the field of heat dissipation structures, and more particularly to a double-sided air-cooled convection optimized UVC deep ultraviolet chip lamp bead heat dissipation structure. It includes a heat-conducting plate for thermally conductive contact between the UVC deep ultraviolet chip lamp bead and the solder paste. The heat-conducting plate, as the initial stage of heat dissipation, bears the crucial responsibility of quickly absorbing the initial heat dissipated by the chip and requires good thermal conductivity to ensure that heat can be transferred from the chip to its interior in a timely and efficient manner. Several U-shaped heat pipes are fixed inside the heat-conducting plate. This double-sided air-cooled convection optimized UVC deep ultraviolet chip lamp bead heat dissipation structure, with its stable airflow channels formed by unidirectional fans, avoids the uneven heat dissipation problems caused by "airflow dead zones" from a single-sided fan or "airflow collisions" from a reverse fan, ensuring consistent heat dissipation effects across all areas of the fin array.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structure, and in particular to a double-sided air-cooled convection optimized heat dissipation structure for UVC deep ultraviolet chip lamp beads. Background Technology

[0002] LED chips generate heat during use, especially high-power chips, requiring a heat dissipation structure. Traditional heat dissipation structures, such as single-sided air cooling, only introduce airflow on one side of the device, easily creating an "airflow dead zone" on the other side. When dealing with high-power UVC deep ultraviolet LED chips (10W and above), heat cannot be conducted from the chip to the entire heat dissipation structure in a timely manner. The high heat generated by the chip is difficult to dissipate quickly on one side, causing the temperature near the chip to rise sharply, increasing thermal resistance, and severely limiting overall heat dissipation efficiency, failing to meet the chip's high-efficiency heat dissipation requirements. For example, in some traditional small UVC disinfection lamps, when a single-sided fan is operating, the temperature in the area where the chip is located often exceeds the safe threshold by 20-30℃, seriously affecting the lifespan and luminous performance of the LED chip. A heat dissipation structure using a single heat pipe suffers from insufficient heat pipe quantity, making it difficult to quickly dissipate heat when high-power chips generate significant amounts of heat. Taking a common single-heat-pipe UVC air purifier as an example, when the chip power reaches 10W, a single copper rod heat pipe can only transfer heat through metal conduction. Compared to the phase-change heat transfer of a copper U-shaped heat pipe, the efficiency is tens of times lower. The temperature near the chip continues to rise, leading to a 10%-20% decrease in light output power, thus failing to achieve efficient heat dissipation. Non-directional convection cooling structures, such as some early UVC sterilization equipment, have haphazardly arranged fans and chaotic airflow directions, creating airflow collisions between the heat sink fin arrays. This prevents heat from being effectively removed from the fin surface, resulting in underutilization of the heat sink fin area and overall low cooling efficiency.

[0003] Therefore, it is necessary to provide a double-sided air-cooled convection optimized heat dissipation structure for UVC deep ultraviolet chip lamp beads to solve the above-mentioned technical problems. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a double-sided air-cooled convection optimized heat dissipation structure for UVC deep ultraviolet chip lamp beads.

[0005] This utility model provides a double-sided air-cooled convection optimized heat dissipation structure for UVC deep ultraviolet LED chips. It includes a heat-conducting plate for thermally contacting the UVC deep ultraviolet LED chip via solder paste. The heat-conducting plate, as the initial stage of heat dissipation, plays a crucial role in rapidly absorbing the initial heat dissipated by the chip and requires excellent thermal conductivity to ensure timely and efficient heat transfer from the chip to its interior. Several U-shaped heat pipes, made of copper, are fixed inside the heat-conducting plate. These heat pipes are highly efficient heat transfer elements; the internal working fluid evaporates upon heating and liquefies upon cooling at the condenser end, creating a continuous cycle that rapidly directs heat to the distal end. In this structure, a U-shaped heat pipe is embedded within a heat-conducting plate, rapidly dispersing the heat absorbed by the chip over a wider area, thus improving the speed and evenness of heat transfer. Several heat dissipation fins, made of aluminum, are fixed parallel to the U-shaped heat pipe. Aluminum is an ideal material for heat dissipation fins due to its low density, low cost, ease of processing, and good thermal conductivity. The fins have mounting holes that fit tightly against the U-shaped heat pipe, ensuring a secure connection and efficient heat transfer from the heat pipe to the fins. Numerous heat dissipation fins are fixed parallel to the heat pipe, forming a heat dissipation fin array. Airflow channels are created between adjacent fins, greatly expanding the heat dissipation area and maximizing the contact area between air and the fins, thus enhancing convective heat transfer. The heat dissipation fin array consists of several heat dissipation fins with airflow channels between adjacent fins. Cooling fans are installed on both sides of the heat dissipation fin array.

[0006] Preferably, the heat dissipation fins are provided with mounting holes, and the U-shaped heat pipe is interference-fitted with the mounting holes.

[0007] Preferably, when the cooling fans are activated, both fans blow air in the same direction. Cooling fans are arranged on both sides of the heatsink fin array, and when the fans are activated, the airflow from both fans is consistent. This allows the airflow to flow steadily and directionally through the airflow channels between the fins. This directional airflow continuously removes heat from the fins, creating a powerful forced convection cooling mechanism, which is superior to cooling with a fan on only one side or with turbulent airflow on both sides.

[0008] Preferably, the cooling fan has a U-shaped connecting part with a retaining plate, and the side wall of the heat dissipation fin array has a slot that mates with the retaining plate. The cooling fan's U-shaped connecting part, with its retaining plate fitting into the slot on the side wall of the fin array, facilitates fan installation and disassembly, and makes subsequent maintenance and repair of the heat dissipation structure easier.

[0009] Preferably, the U-shaped heat pipe is made of copper and the heat dissipation fins are made of aluminum.

[0010] Compared with related technologies, the present invention provides the following beneficial effects: Compared to traditional single-sided air cooling, single heat pipe, or non-directional convection heat dissipation structures, this design achieves a dual breakthrough in heat dissipation efficiency and stability: In terms of efficiency, the phase change heat transfer efficiency of copper U-shaped heat pipes is dozens of times that of copper rods of the same specifications, and the heat dissipation area of ​​aluminum fin arrays is dozens of times larger than that of a single metal block. Combined with the directional convection of double-sided fans, the overall heat dissipation efficiency is more than 50% higher than that of traditional structures. It can easily meet the heat dissipation requirements of high-power UVC deep ultraviolet chip lamp beads (such as 10W and above), breaking the limitation of traditional heat dissipation structures on chip power. In terms of stability, the stable airflow channel formed by the unidirectional fans avoids the uneven heat dissipation caused by the "airflow dead zone" of a single-sided fan or the "airflow collision" of a reverse fan, ensuring that the heat dissipation effect of each area of ​​the fin array is consistent. At the same time, the circulating heat transfer mechanism of the U-shaped heat pipe is not affected by the installation angle. Even if the equipment is tilted or vibrated, it can still transfer heat stably, making it suitable for dynamic application scenarios such as mobile disinfection equipment and vehicle-mounted ultraviolet purification devices, ensuring that the heat dissipation performance does not decrease with changes in the usage environment. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram showing the position of the U-shaped heat pipe relative to the heat dissipation fins of this utility model; Figure 3 This is a schematic diagram of the cooling fan structure of this utility model; Figure 4 This is a schematic diagram of the heat dissipation fin structure of this utility model.

[0012] The following are the labels in the diagram: 1. Heat conduction plate; 2. U-shaped heat pipe; 3. Heat dissipation fins; 4. Airflow channel; 5. Cooling fan; 7. U-shaped connector; 8. Card plate; 9. Card slot. Detailed Implementation

[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0014] Please refer to the following: Figures 1 to 4This invention relates to a double-sided air-cooled convection optimized heat dissipation structure for UVC deep ultraviolet LED chips. The heatsink 1 serves as the "heat receiving starting point" of the entire heat dissipation system, its core function being to achieve tight thermal contact with the UVC deep ultraviolet LED chip via solder paste. Since the UVC deep ultraviolet LED chip continuously generates concentrated heat during operation, if the initial heat cannot be quickly transferred, it can easily lead to chip performance degradation or shortened lifespan. Therefore, the heatsink must possess excellent thermal conductivity (typically copper alloy or high thermal conductivity aluminum alloy). This design ensures that the initial heat generated by the chip is efficiently absorbed by the heatsink in the first instance, while simultaneously laying the foundation for subsequent heat transfer to the U-shaped heat pipe, preventing heat accumulation on the chip surface. Inside the heat-conducting plate 1, several U-shaped heat pipes 2 are installed using embedded fixing methods (such as interference fit, welding, etc.), and all U-shaped heat pipes are made of copper. Copper not only has high thermal conductivity, but also has good compatibility with the working medium inside the heat pipe (such as pure water, ethanol, etc.), ensuring long-term stable operation of the heat pipe. As a highly efficient phase-change heat transfer element, the U-shaped heat pipe works as follows: When the heat absorbed by the heat-conducting plate is transferred to the evaporation section of the U-shaped heat pipe, the working liquid inside the heat pipe is rapidly heated and evaporates into a gaseous state. Under the action of a small pressure difference, the gaseous working fluid quickly flows to the condensation section of the heat pipe (i.e., the area connected to the heat dissipation fins). Upon reaching the condensation section, the gaseous working fluid exchanges heat with the cooler heat dissipation fins, releases heat, and then condenses back into a liquid state. The liquid working fluid then flows back to the evaporation section through the capillary force of the wicks inside the heat pipe (such as wire mesh wicks or grooved wicks), forming a "evaporation-condensation-recirculation" cycle. This phase-change heat transfer method has a much higher heat conduction efficiency than traditional metal heat conduction, and can quickly and evenly distribute the concentrated heat absorbed by the heat-conducting plate to a larger spatial area, effectively improving the speed and uniformity of heat transfer and avoiding overheating in a single area. On the outer surface of each U-shaped heat pipe 2, several heat dissipation fins 3 are fixed in parallel, and all heat dissipation fins are made of aluminum. Aluminum is an ideal material for heat dissipation fins because, firstly, it has a low density (only about 1 / 3 that of copper), which can reduce the weight of the entire heat dissipation structure while ensuring heat dissipation performance, making it suitable for lightweight applications; secondly, aluminum is cheaper than copper and has excellent processing performance (it can be mass-produced through extrusion molding, stamping, etc.), which can quickly manufacture fins with regular structures; in addition, although aluminum has slightly lower thermal conductivity than copper, its heat dissipation performance can be further improved through surface treatment (such as anodizing, nickel plating, etc.), which can fully meet the heat dissipation requirements of UVC deep ultraviolet chip lamp beads. To achieve a stable connection and efficient heat transfer between the heat sink fins and the U-shaped heat pipes, each heat sink fin 3 has a mounting hole 6 that matches the outer diameter of the U-shaped heat pipe 2, and the U-shaped heat pipe 2 and the mounting hole 6 are connected by an interference fit. An interference fit means that the outer diameter of the heat pipe is slightly larger than the inner diameter of the mounting hole. During assembly, pressure is required to press the heat pipe into the mounting hole. This fit ensures that there is no gap between the heat pipe and the fins, minimizing thermal resistance and allowing the heat transferred by the U-shaped heat pipe to be efficiently conducted to the heat sink fins. Several parallel heat dissipation fins 3 together form a heat dissipation fin array. Between adjacent heat dissipation fins 3, evenly distributed airflow channels 4 are naturally formed. The core design principle of the heat dissipation fin array is to "maximize the heat dissipation area"—the heat dissipation area of ​​a single fin is limited, but by arranging multiple fins in parallel, the heat dissipation area can be multiplied, maximizing the contact area between the air and the fins. Simultaneously, the airflow channels 4 between adjacent fins provide a directional path for airflow, avoiding the decrease in heat exchange efficiency caused by airflow turbulence, and creating the necessary conditions for the forced convection heat transfer formed by the subsequent cooling fan. When heat is transferred from the U-shaped heat pipe to the heat dissipation fins, the heat quickly diffuses to the surface of each fin, releasing heat through heat exchange between the fins and the air. The airflow channels ensure that air can fully flow over the fin surface, carrying away more heat. To further enhance the convective heat transfer efficiency between the heat dissipation fins and the air, cooling fans 5 are installed on both sides of the heat dissipation fin array, and the installation positions of the two cooling fans 5 are symmetrical to ensure that the airflow can act evenly on the entire fin array. 1. Fan airflow design and heat dissipation advantages When the cooling fans 5 are activated, both fans 5 blow air in the same direction (e.g., both blowing from the left to the right of the heatsink fin array, or both blowing from the right to the left). The advantage of this unidirectional airflow design is that it creates a stable pressure difference on both sides of the heatsink fin array, driving airflow in a directional, continuous, and uniform manner through the airflow channel 4 between adjacent fins. Compared to designs with fans installed on only one side (which can only generate airflow on one side, easily creating dead zones on the other) or with opposite airflow directions on both sides (airflows collide in the middle of the fin array, leading to turbulent airflow and reduced velocity), the unidirectional airflow creates a powerful forced convection cooling mechanism. The directional airflow continuously and efficiently removes heat from the surface of the heatsink fins, keeping the fins at a consistently low temperature, thus ensuring stable heat dissipation of the condensation section of the U-shaped heat pipe and maintaining its high-efficiency heat transfer performance. 2. Convenient fan installation structure – U-shaped connector 7, clamping plate 8 and clamping slot 9 To facilitate the installation, disassembly, and subsequent maintenance of the cooling fan 5, a U-shaped connecting part 7 is integrally formed on the outer shell of the cooling fan 5, and an elastic retaining plate 8 is provided at the free end of the U-shaped connecting part 7; correspondingly, slots 9 that perfectly match the shape and size of the retaining plate 8 are provided on both side walls of the heat dissipation fin array (usually on the outermost heat dissipation fin or the bracket for fixing the fin). During installation, simply snap the U-shaped connector 7 of the cooling fan onto the side wall of the heatsink fin array, align the retaining plate 8 with the slot 9, and press gently. The retaining plate 8 will then spring into place within the slot 9, quickly securing the fan. For disassembly, simply pinch the elastic end of the retaining plate 8 and release it from the slot 9 to easily remove the fan. This snap-fit ​​connection eliminates the need for screws, nuts, or other fasteners, simplifying the installation process and avoiding the disassembly difficulties caused by rusted or stripped screws in traditional threaded connections. This greatly facilitates subsequent cleaning and replacement of the fan, as well as maintenance of the heatsink fin array (such as cleaning dust between the fins).

[0015] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A double-sided air-cooled convection optimized heat dissipation structure for UVC deep ultraviolet LED chips, characterized in that, It includes a heat-conducting plate (1) for making thermal contact with UVC deep ultraviolet chip lamp beads through solder paste. Several U-shaped heat pipes (2) are fixed inside the heat-conducting plate (1). Several heat dissipation fins (3) are fixed in parallel on the U-shaped heat pipes (2). Several heat dissipation fins (3) form a heat dissipation fin array. There are airflow channels (4) between adjacent heat dissipation fins (3). Cooling fans (5) are installed on both sides of the heat dissipation fin array.

2. The double-sided air-cooled convection optimized UVC deep ultraviolet chip lamp bead heat dissipation structure according to claim 1, characterized in that, The heat dissipation fins (3) are provided with mounting holes (6), and the U-shaped heat pipes (2) are interference-fitted with the mounting holes (6).

3. The double-sided air-cooled convection optimized UVC deep ultraviolet chip lamp bead heat dissipation structure according to claim 1, characterized in that, When the cooling fan (5) is started, the two cooling fans (5) blow air in the same direction.

4. The double-sided air-cooled convection optimized UVC deep ultraviolet chip lamp bead heat dissipation structure according to claim 1, characterized in that, The cooling fan (5) is provided with a U-shaped connecting part (7), the U-shaped connecting part (7) is provided with a card plate (8), and the side wall of the heat dissipation fin array is provided with a card slot (9) that cooperates with the card plate (8).

5. The double-sided air-cooled convection optimized UVC deep ultraviolet chip lamp bead heat dissipation structure according to claim 1, characterized in that, The U-shaped heat pipe (2) is made of copper, and the heat dissipation fins (3) are made of aluminum.

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