A wafer offset detection device

Abstract

This application discloses a wafer offset detection device, relating to the field of semiconductor processing technology. The device features a support evenly distributed on a circular transparent cover, ensuring that three sensors on the support are arranged at a 120° angle. The detection beam forms an equilateral triangular region coinciding with the wafer center. A waist-shaped detection groove precisely guides the beam. The sensor's sensing signal is connected in series with the wafer rising signal. During wafer transport, the sensors detect the wafer position. If a sensor does not detect the wafer, the position is normal. If any sensor detects the wafer, the position is offset, the circuit is immediately disconnected, cutting off the wafer rising signal, and the equipment stops, preventing wafer detachment and fragmentation. This solves the technical problem in the prior art where wafer position offset during transport cannot be detected, leading to wafer detachment and fragmentation. It achieves the technical effect of detecting wafer position offset during transport to prevent wafer detachment and fragmentation.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and in particular to a wafer offset detection device. Background Technology

[0002] In semiconductor manufacturing, after wafers undergo processes such as deposition in the process cavity, they are transferred to subsequent processes through the transfer cavity. The stability of this transfer process is crucial to wafer yield and equipment operation.

[0003] Currently, after the wafer completes its process in the process cavity, the transfer arm picks up the wafer from the process cavity through vacuum adsorption or mechanical clamping, and then carries it into the transfer cavity. A vacuum or clean environment is maintained through a sealed structure to prevent the wafer from being contaminated during transfer and to provide a transfer path for the wafer to the next process cavity or inspection cavity, ensuring the continuity of the semiconductor manufacturing process. However, in the existing technology, the transfer process can only realize the basic transfer of the wafer and cannot detect the positional deviation of the wafer during the transfer process, which may lead to its detachment and fragmentation.

[0004] In view of this, we provide a wafer offset detection device to solve the above problems. Utility Model Content

[0005] The purpose of this application is to solve the technical problem in the prior art that the positional shift of the wafer during the transport process cannot be detected, which leads to wafer detachment and fragmentation. In order to solve the above technical problem, a wafer offset detection device is provided that can detect the positional shift of the wafer during the transport process so as not to cause wafer detachment and fragmentation.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solution: a wafer offset detection device, comprising: a transparent cover, the transparent cover including a light-transmitting part and an encapsulation part, the encapsulation part being hollow inside, and the light-transmitting part being disposed inside the encapsulation part; wherein, a bracket, the bracket being vertically disposed on the transparent cover, the bracket including a fixing base, a connecting part and a mounting base, the two ends of the connecting part being vertically connected to the fixing base and the mounting base respectively, the fixing base and the mounting base being disposed on the left and right sides of the connecting part respectively, the fixing base having a fixing hole in the center, the fixing hole being used to cooperate with the connecting part to fix the bracket to the encapsulation part, and the mounting base being disposed above the light-transmitting part; sensors, the sensors being disposed on the top of the mounting base, at least three sensors being provided; the sensors sense the wafer position, if the sensor does not sense the wafer, the position is normal, if any sensor senses the wafer, the position is offset, the circuit is immediately disconnected, the wafer rise signal is cut off, the equipment stops, and wafer detachment and fragmentation are avoided.

[0007] Furthermore, according to an embodiment of this application, a detection groove is provided on the top of the mounting base, the detection groove being used to guide the light beam of the sensor through the transparent cover.

[0008] Furthermore, according to the embodiments of this application, the two ends of the connecting part are rounded, the fixing base, the connecting part and the mounting base are integrally formed, and the sensors are evenly distributed along the transparent cover.

[0009] Furthermore, according to an embodiment of this application, the bracket and the sensor are set to the same number, and the length of the fixing member is greater than the width of the encapsulation portion.

[0010] Furthermore, according to an embodiment of this application, the included angle between adjacent sensors is 120°, and the detection beams of each sensor form an equilateral triangular detection area.

[0011] Furthermore, according to an embodiment of this application, the transparent cover is circular, and a plurality of mounting holes are provided on the transparent cover, which are evenly distributed circumferentially on the encapsulation part.

[0012] Furthermore, according to an embodiment of this application, the center of the mounting hole and the center of the fixing hole are aligned on the same axis.

[0013] Furthermore, according to an embodiment of this application, the center of the equilateral triangular detection region coincides with the geometric center of the wafer.

[0014] Furthermore, according to an embodiment of this application, the bracket is connected to the transparent cover via a connector that passes through the fixing hole and the mounting hole.

[0015] Furthermore, according to an embodiment of this application, the detection groove is configured as an oblong shape, and the fixing hole and mounting hole are configured as circular shapes.

[0016] Compared with the prior art, this application has the following beneficial effects: the support is evenly distributed on the circular transparent cover, ensuring that the three sensors on the support are arranged at a 120° angle, the detection beam forms an equilateral triangular area and coincides with the center of the wafer, the waist-shaped detection groove accurately guides the beam, the sensor sensing signal is connected in series with the wafer rising signal, when the wafer is transported, the sensor senses the wafer position, if the sensor does not sense the wafer, the position is normal, if any sensor senses the wafer, the position is off, the circuit is immediately disconnected, the wafer rising signal is cut off, the equipment stops, and the wafer is prevented from being detached and broken, thus solving the technical problem in the prior art that the wafer position shift during the transport process cannot be detected, which leads to its detachment and breakage, and achieving the technical effect of being able to detect the wafer position shift during the transport process so as not to cause it to be detached and broken. Attached Figure Description

[0017] The present application will be further described below with reference to the accompanying drawings and embodiments.

[0018] Figure 1 This is a schematic diagram of the structure of a wafer offset detection device according to an embodiment of this application.

[0019] Figure 2 This is a front view schematic diagram of a wafer offset detection device according to an embodiment of this application.

[0020] Figure 3 This is a schematic diagram of the structure of a wafer offset detection device bracket according to an embodiment of this application.

[0021] Figure 4 This is a top view schematic diagram of a wafer offset detection device bracket according to an embodiment of this application.

[0022] Figure 5 This is a schematic diagram of the left-side structure of a wafer offset detection device bracket according to an embodiment of this application.

[0023] In the attached diagram: 1. Transparent cover; 11. Encapsulation part; 12. Light-transmitting part; 13. Mounting hole; 2. Bracket; 21. Fixing hole; 22. Connecting part; 23. Fixing base; 24. Mounting base; 25. Detection groove. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this utility model clear and complete, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of this utility model, and are merely used to explain the embodiments of this utility model. They are not intended to limit the embodiments of this utility model. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0025] In the description of this utility model, it should be noted that the terms "center," "middle," "upper," "lower," "left," "right," "inner," "outer," "top," "bottom," "side," "vertical," and "horizontal," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "a," "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] For purposes of simplicity and illustration, the principles of the embodiments are described primarily by way of example. In the following description, numerous specific details are set forth to provide a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that these embodiments may not be limited to these specific details in practice. In some instances, well-known methods and structures have not been described in detail to avoid unnecessarily obscuring these embodiments. Furthermore, all embodiments can be used in combination with each other.

[0028] Example 1:

[0029] like Figure 1 , 2 As shown in Figure 3, this embodiment provides a wafer offset detection device, including: a transparent cover 1, which includes a light-transmitting part 12 and an encapsulation part 11. The encapsulation part 11 is hollow inside, and the light-transmitting part 12 is disposed inside the encapsulation part 11; wherein, a support 2 is vertically disposed on the transparent cover 1, and the support 2 includes a fixing base 23, a connecting part 22, and a mounting base 24. The two ends of the connecting part 22 are respectively vertically connected to the fixing base 23 and the mounting base 24. The fixing base 23 and the mounting base 24 are respectively disposed on the left and right sides of the connecting part 22, and the fixing base 23 is centrally located. There is a fixing hole 21, which is used to fix the bracket 2 to the packaging part 11 with the connector. The mounting base 24 is set above the light-transmitting part 12. There are sensors, which are set on the top of the mounting base 24. At least three sensors are provided. During the wafer transfer process, the sensing signal of the sensor is connected in series with the wafer rise signal. The sensor senses the wafer position. If the sensor does not sense the wafer, the position is normal. If any sensor senses the wafer, the position is off. The circuit is immediately disconnected, the wafer rise signal is cut off, the equipment stops, and the wafer is removed and fragments are avoided.

[0030] The support 2 is evenly distributed on the circular transparent cover 1, ensuring that the three sensors on the support 2 are arranged at a 120° angle. The detection beam forms an equilateral triangular area and coincides with the center of the wafer. The waist-shaped detection groove 25 accurately guides the beam. The sensor sensing signal is connected in series with the wafer rising signal. When the wafer is being transported, the sensor senses the wafer position. If the sensor does not sense the wafer, the position is normal. If any sensor senses the wafer, the position is off, the circuit is immediately disconnected, the wafer rising signal is cut off, the equipment stops, and the wafer is prevented from being detached or broken. This solves the technical problem in the prior art that the wafer position shift during the transport process cannot be detected, which leads to wafer detachment and breakage. It achieves the technical effect of being able to detect the wafer position shift during the transport process and thus prevent it from being detached or broken.

[0031] Example 2:

[0032] like Figure 1 , 3 As shown in Figure 4, a detection groove 25 is provided on the top of the mounting base 24. The detection groove 25 is used to guide the light beam of the sensor through the transparent cover 1. The detection groove 25 is waist-shaped, and the fixing hole 21 and the mounting hole 13 are circular.

[0033] The waist-shaped detection slot 25, with its semi-circular ends and rectangular middle section, precisely constrains the detection beam emitted by the sensor. The semi-circular ends physically constrain the beam edge, reducing divergence, while the rectangular middle section provides a straight-line propagation path for the beam, ensuring it penetrates the transparent cover 1 vertically and stably, and is accurately projected onto the wafer surface. The circular fixing hole 21 and mounting hole 13 securely connect the bracket 2 to the transparent cover 1 via connectors, ensuring the bracket 2 is precisely positioned. After the bracket 2 is stably installed, the position of the waist-shaped detection slot 25 on the mounting base 24 is also fixed, providing a stable beam emission reference for the sensor. During wafer transport, the sensor's beam is projected onto the wafer surface. The equilateral triangular detection area formed by the three sensors fully covers the wafer. When the wafer is in the correct position, the beam reflection meets the preset standard. If the wafer shifts, the reflected light signal received by at least one sensor changes, disconnecting the sensing signal circuit connected in series with the wafer's rising signal, cutting off the rising signal, and stopping the equipment. This prevents the shifted wafer from continuing to be transported, thus preventing wafer detachment and fragmentation. This achieves the technical effect of detecting wafer position shifts during transport to prevent detachment and fragmentation.

[0034] An elastic retaining ring is added to the top of the mounting base 24 to cooperate with the waist-shaped detection groove 25, which restricts the sensor within the elastic retaining ring. The mechanical limiting of the retaining ring controls the verticality deviation of the sensor, reduces the deviation of the beam in sensing the wafer caused by the sensor displacement, improves the beam guidance accuracy, and maintains the equilateral triangle detection area coincident with the center of the wafer. A silicone rubber pad is set on the inner wall. The silicone rubber pad absorbs vibration energy. Through the dual functions of mechanical pre-tightening and vibration absorption, the installation accuracy and vibration resistance of the sensor are improved, so that the beam detection area accurately covers the edge of the wafer, captures small displacements, and effectively avoids wafer detachment and fragmentation problems caused by displacement. In this way, the technical effect of detecting the positional displacement of the wafer during the transport process can be achieved, so as not to cause wafer detachment and fragmentation.

[0035] like Figure 3 , 4 As shown in Figure 5, the two ends of the connecting part 22 are rounded, the fixing base 23, the connecting part 22 and the mounting base 24 are integrally formed, and the sensors are evenly distributed along the transparent cover 1.

[0036] The design of rounded corners at both ends of the connecting part 22 and the integral molding of the fixing base 23, connecting part 22 and mounting base 24 enhances the overall structural strength of the bracket 2, effectively avoids stress concentration and improves vibration resistance. The rounded corner design further reduces stress concentration, reduces the risk of cracking, and ensures the long-term stability of the sensor installation position. At the same time, the rounded corner design avoids scratching the transparent cover 1 during installation, improves assembly efficiency and accuracy, and reduces the risk of component loosening, ensuring the reliability of wafer offset detection and avoiding wafer detachment and fragmentation problems caused by detection failure due to bracket 2 deformation or installation error.

[0037] like Figure 1 , 3 As shown, the bracket 2 and the sensor are the same number, and the length of the fixing member is greater than the width of the encapsulation part 11. The bracket 2 is connected to the transparent cover 1 through the fixing hole 21 and the mounting hole 13 via a connector. The center of the mounting hole 13 and the center of the fixing hole 21 are aligned on the same axis.

[0038] The design of matching the number of brackets 2 and sensors, the length of the fixing part being greater than the width of the package 11, and the mounting holes 13 and fixing holes 21 being coaxially aligned, ensures detection accuracy and reliability through a triple synergistic effect. The matching number ensures that each sensor is fixed independently, avoiding vibration interference caused by shared structure and making stress distribution more balanced. The coaxial alignment ensures that brackets 2 are installed vertically, and the light beam passes accurately through the light-transmitting part 12, preventing optical path offset errors. The modular structure enables fault isolation, and damage to a single bracket 2 does not affect the positioning of other sensors, significantly improving the stability of wafer offset detection and equipment maintenance efficiency.

[0039] like Figure 1As shown, the angle between adjacent sensors is 120°, and the detection beams of each sensor form an equilateral triangular detection area. The center of the equilateral triangular detection area coincides with the geometric center of the wafer.

[0040] Adjacent sensors are evenly distributed on the transparent cover 1 at a 120° angle. The detection beams emitted by each sensor converge to form an equilateral triangular detection area, and the geometric center of this area coincides with the geometric center of the wafer. The symmetrical structure of the equilateral triangle allows the detection area to uniformly cover all directions of the wafer surface. When the wafer is in the normal position, the beams of the three sensors pass through the outer edge of the wafer without being blocked by the wafer. At this time, the sensing signal and the wafer rising signal are connected in series to form a conductive circuit, and the equipment maintains normal operation. However, when the wafer deviates in any direction during the transfer process, whether it is lateral displacement, rotation, or tilting, its edge will block at least one detection beam, causing the sensor to receive an abnormal reflected signal. At this time, the series circuit is immediately disconnected, quickly cutting off the wafer rising signal and causing the equipment to stop urgently. The symmetry of the equilateral triangle ensures consistent offset detection sensitivity in all directions, preventing blind spots due to different offset directions. Simultaneously, the cascaded logic of the three sensors forms a protection mechanism, preventing false shutdowns caused by misjudgments from a single sensor and enabling rapid response when any sensor detects an offset. Furthermore, the precise alignment of the detection area with the wafer center, combined with the precise guidance of the beam from the waist-shaped detection slot 25, ensures that even minor offsets during wafer transport can be promptly identified. By cutting off the rising signal, further offset is prevented, effectively avoiding wafer detachment or fragmentation caused by collisions with equipment components due to abnormal wafer positioning. This achieves the technical effect of detecting wafer positional offsets during transport, thus preventing wafer detachment and fragmentation.

[0041] like Figure 1 As shown, the transparent cover 1 is circular, and a number of mounting holes 13 are provided on the transparent cover 1. The mounting holes 13 are evenly distributed on the encapsulation part 11 in a circular pattern.

[0042] The transparent cover 1 is designed in a circular shape, with mounting holes 13 evenly distributed along the circumference of the encapsulation section 11, ensuring the performance of the wafer offset detection device from multiple aspects. The circular structure allows the transparent cover 1 to be subjected to uniform force in a vacuum environment, and combined with the sealing structure, it can maintain a high vacuum level and avoid local stress concentration and leakage problems caused by irregular shape. The mounting holes 13 are evenly distributed on the circumference, and when connected to the cavity flange by bolts, the preload can be evenly transmitted, preventing deformation of the transparent cover 1 from affecting the flatness of the light-transmitting section 12. This layout also provides a coaxial alignment reference for the mounting holes 21 of the bracket 2, ensuring accurate sensor installation, aligning the center of the detection area with the geometric center of the wafer, ensuring the optical performance of the light-transmitting section 12 and the accuracy of the sensor layout, and achieving reliable detection of wafer offset.

[0043] Although the illustrative specific embodiments of this application have been described above to enable those skilled in the art to understand this application, this application is not limited to the scope of the specific embodiments. For those skilled in the art, all applications utilizing the concept of this application are protected as long as various variations are within the spirit and scope of this application as defined and determined by the appended claims.

Claims

1. A wafer offset detection apparatus, comprising: The transparent cover comprises a light-transmitting part and an encapsulating part, the encapsulating part is hollow inside, and the light-transmitting part is arranged inside the encapsulating part; Characterized in that a support is vertically arranged on the transparent cover, the support comprises a fixing seat, a connecting part and a mounting seat, the connecting part is vertically connected with the fixing seat and the mounting seat at two ends respectively, the fixing seat and the mounting seat are arranged on the left and right sides of the connecting part respectively, the fixing seat is provided with a fixing hole in the center, the fixing hole is used for cooperating with a connecting piece to fix the support on the encapsulating part, and the mounting seat is arranged above the light-transmitting part; An inductor is arranged on the top of the mounting seat, and the inductor is provided with at least three inductors; The inductor senses the position of the wafer, if the inductor does not sense the wafer, the position is normal, if any inductor senses the wafer, the position is deviated, and the circuit is immediately disconnected to avoid wafer sheeting and fragmentation.

2. The wafer offset detection apparatus according to claim 1, wherein The top of the mounting seat is provided with a detection groove for guiding the light beam of the inductor to pass through the transparent cover.

3. The wafer offset detection apparatus of claim 1, wherein The two ends of the connecting part are rounded, the fixing seat, the connecting part and the mounting seat are integrally formed, and the inductors are uniformly distributed along the transparent cover.

4. The wafer offset detection apparatus of claim 1, wherein The support and the inductor are arranged in the same number, and the length of the fixing seat is greater than the width of the encapsulating part.

5. The wafer offset detection apparatus of claim 1, wherein The included angle between adjacent inductors is 120°, and the detection light beams of each inductor form a regular triangle detection area.

6. The wafer offset detection apparatus of claim 1, wherein The transparent cover is circular, and a plurality of mounting holes are arranged on the transparent cover and are uniformly distributed on the encapsulating part in a circular manner.

7. The wafer offset detection apparatus according to claim 6, wherein The center of the mounting hole is aligned with the center of the fixing hole on the same axis, and the fixing hole and the mounting hole are circular.

8. The wafer offset detection apparatus of claim 5, wherein The center of the regular triangle detection area coincides with the geometric center of the wafer.

9. The wafer offset detection apparatus of claim 6, wherein The support is connected with the transparent cover through the connecting piece penetrating the fixing hole and the mounting hole.

10. The wafer offset detection apparatus of claim 2, wherein The detection groove is in the shape of a waist.

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