A pressure sensor and a vehicle
Patent Information
- Application Number
- CN202522292043.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-29
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2035-10-29
AI Technical Summary
[0002]在汽车的动力总成、底盘与安全、车身舒适性等多个系统中,通常设置有压力传感器,用于监测各压力的变化,以确保行车过程的安全、提升驾驶体验,例如MEMS压力传感器、陶瓷电容式压力传感器、压阻式压力传感器等;然而,现有的压力传感器的制造工艺较复杂,使得压力传感器的制造成本较高
[0017] The pressure sensor provided in this application connects to the component under test via a base. A medium channel is formed inside the base, with the first end of the medium channel connected to the medium under test. An elastic diaphragm is formed at the second end of the medium channel on the base, and a first sensing element is disposed on the side of the elastic diaphragm facing away from the medium channel. A receiving cavity is formed at the top of the base, and a signal processing module is disposed within the receiving cavity. The signal processing module includes a second sensing element corresponding to the first sensing element, and senses the position of the first sensing element through the second sensing element. The signal processing module is then connected to a signal transmission module. Thus, when the medium enters the medium channel, changes in the medium pressure cause the elastic diaphragm to deform, changing the distance between the first and second sensing elements. The second sensing element senses the change in medium pressure, and the signal is processed by the signal processing module and transmitted through the signal transmission module to achieve pressure monitoring of the medium under test. This simplifies the pressure sensor's monitoring principle and manufacturing process, thereby reducing the manufacturing cost of the pressure sensor.
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Figure CN224707601U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of sensor technology, and more specifically, to a pressure sensor and an automobile. Background Technology
[0002] Pressure sensors are typically installed in various systems of automobiles, such as powertrain, chassis and safety, and body comfort, to monitor changes in various pressures to ensure driving safety and improve the driving experience. Examples include MEMS pressure sensors, ceramic capacitive pressure sensors, and piezoresistive pressure sensors. However, the manufacturing process of existing pressure sensors is relatively complex, resulting in high manufacturing costs.
[0003] In conclusion, how to reduce the manufacturing cost of pressure sensors is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content
[0004] In view of this, the purpose of this application is to provide a pressure sensor and an automobile that reduces the manufacturing cost of the pressure sensor.
[0005] To achieve the above objectives, this application provides the following technical solution:
[0006] A pressure sensor includes: a base for connecting a component to be measured; a medium channel formed on the base; a first end of the medium channel for communicating with the medium to be measured; an elastic diaphragm formed on the base at a second end of the medium channel; a first sensing element disposed on the side of the elastic diaphragm opposite to the medium channel; a receiving cavity formed at the top of the base; a signal processing module disposed within the receiving cavity; the signal processing module includes a second sensing element, which is correspondingly disposed to the first sensing element and is used to sense the displacement of the first sensing element; and the signal processing module is connected to a signal transmission module.
[0007] In some embodiments, the base is a metal elastomer, the elastic film is a metal diaphragm, the metal elastomer and the metal diaphragm are an integral structure, and the metal diaphragm is a thin film region formed by the metal elastomer.
[0008] In some embodiments, the medium channel includes a constant diameter section and an enlarged diameter section connected in sequence, wherein the diameter of the enlarged diameter section is larger than the diameter of the constant diameter section, and the enlarged diameter section is located at the second end of the medium channel.
[0009] In some embodiments, the first sensing element is a magnetic block; the second sensing element is a Hall chip.
[0010] In some embodiments, the signal processing module further includes a circuit board, the Hall chip is soldered to the circuit board, and the circuit board is also soldered with filtering electronic components.
[0011] In some embodiments, the signal transmission module includes injection-molded terminals and connectors, the terminals being soldered to the circuit board, and the signal transmission module being used to connect to an electronic control unit.
[0012] In some embodiments, the signal transmission module is located within the receiving cavity of the base, and the base is riveted to the signal transmission module.
[0013] In some embodiments, the base is sealed and glued to the riveted joint of the signal transmission module;
[0014] And / or, the receiving cavity of the base is sealed to the signal transmission module by a first sealing ring.
[0015] In some embodiments, the bottom end of the base is provided with an external thread, and the root of the external thread is provided with a second sealing ring, so as to make the base and the component under test sealed together.
[0016] An automobile includes a pressure sensor as described above.
[0017] The pressure sensor provided in this application connects to the component under test via a base. A medium channel is formed inside the base, with the first end of the medium channel connected to the medium under test. An elastic diaphragm is formed at the second end of the medium channel on the base, and a first sensing element is disposed on the side of the elastic diaphragm facing away from the medium channel. A receiving cavity is formed at the top of the base, and a signal processing module is disposed within the receiving cavity. The signal processing module includes a second sensing element corresponding to the first sensing element, and senses the position of the first sensing element through the second sensing element. The signal processing module is then connected to a signal transmission module. Thus, when the medium enters the medium channel, changes in the medium pressure cause the elastic diaphragm to deform, changing the distance between the first and second sensing elements. The second sensing element senses the change in medium pressure, and the signal is processed by the signal processing module and transmitted through the signal transmission module to achieve pressure monitoring of the medium under test. This simplifies the pressure sensor's monitoring principle and manufacturing process, thereby reducing the manufacturing cost of the pressure sensor. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of the structure of a pressure sensor provided in an embodiment of this application.
[0020] Explanation of reference numerals in the attached figures:
[0021] 100-Base, 110-Medium channel, 120-Elastic film, 130-Magnetic block;
[0022] 210 - Hall effect chip, 220 - Circuit board;
[0023] 310 - Terminal, 320 - Connector;
[0024] 400 - First sealing ring, 500 - Second sealing ring. Detailed Implementation
[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The terminology used in the following embodiments is for the purpose of describing specific embodiments only and is not intended to be a limitation of this application. As used in the specification and appended claims of this application, the singular expressions "a," "an," "the," "the," "the," and "this" are intended to also include expressions such as "one or more," unless the context clearly indicates otherwise. It should also be understood that in the embodiments of this application, "one or more" refers to one, two, or more; "and / or" describes the relationship between related objects, indicating that three relationships may exist; for example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.
[0027] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.
[0028] In this application, "multiple" refers to two or more embodiments. It should be noted that in the description of the embodiments of this application, terms such as "first" and "second" are used only for descriptive purposes and should not be construed as indicating or implying relative importance, nor as indicating or implying order.
[0029] like Figure 1 As shown in the embodiment of this application, the pressure sensor is used to monitor the medium pressure of the component under test. It includes a base 100 for connecting the component under test. The base 100 has a medium channel 110, the first end of which is connected to the medium under test, allowing the medium to enter the pressure sensor. An elastic film 120 is formed at the second end of the medium channel 110, allowing the medium to flow into the medium channel 110 and deform. A first sensing element is provided on the side of the elastic film 120 away from the medium channel 110, causing the first sensing element to deform during the deformation of the elastic film 120. A receiving cavity is formed at the top of the base 100, and a signal processing module is disposed within the receiving cavity. The signal processing module includes a second sensing element, which is correspondingly arranged with the first sensing element. The second sensing element senses the displacement of the first sensing element and acquires and processes the data through the signal processing module. The signal processing module is connected to a signal transmission module to transmit the acquired pressure change of the medium to be measured. Thus, when the medium enters the medium channel 110, the pressure change of the medium causes the elastic diaphragm 120 to deform, changing the distance between the first and second sensing elements. The second sensing element then senses the pressure change of the medium, processes it through the signal processing module, and transmits it through the signal transmission module to achieve pressure monitoring of the medium to be measured. This simplifies the monitoring principle and manufacturing process of the pressure sensor, thereby reducing the manufacturing cost of the pressure sensor.
[0030] like Figure 1As shown in this application, the base 100 is a metal elastomer, and the elastic film 120 is a metal diaphragm. The metal elastomer and the metal diaphragm are an integral structure. The metal diaphragm is a thin film area formed by the metal elastomer at the position corresponding to the second segment of the medium channel 110, so that the medium can drive the metal diaphragm to deform when the pressure changes.
[0031] In some embodiments, the base 100 may be made of steel, such as 316 / 316L stainless steel, 304 stainless steel, or 17-4PH stainless steel, so that the base 100 has good corrosion resistance and mechanical properties, and that the formed metal diaphragm area has excellent elasticity and recoverability, as well as high strength and good fatigue resistance, so that the metal diaphragm can withstand multiple cyclic deformations to ensure accurate monitoring of the medium pressure.
[0032] like Figure 1 As shown, the medium channel 110 includes a constant diameter section and an expanded diameter section connected in sequence. The diameter of the expanded diameter section is larger than that of the constant diameter section, and the expanded diameter section is located at the second end of the medium channel 110. In this way, the expanded diameter section increases the flow area of the medium at the end of the medium channel 110, thereby increasing the area of the elastic film 120 that deforms accordingly when the medium pressure changes, so as to improve the accuracy of the deformation of the first sensing element.
[0033] In this application, the first sensing element is a magnetic block 130, and the second sensing element is a Hall chip 210. The magnetic block 130 and the Hall chip 210 are correspondingly arranged, and the elastic film 120 can drive the magnetic block 130 to move, thereby changing the distance between the magnetic block 130 and the Hall chip 210. This changes the magnetic field lines passing through the Hall chip 210, thus changing the magnetic field strength. Specifically, when the magnetic block 130 is close to the Hall chip 210, the number of magnetic field lines passing through the Hall chip 210 increases, resulting in a stronger magnetic field. When the magnetic block 130 is far away from the Hall chip 210, the number of magnetic field lines passing through the Hall chip 210 decreases, resulting in a weaker magnetic field. Thus, through the change in magnetic field strength, the Hall chip 210 can output a corresponding Hall voltage, thereby forming an electrical signal that can be processed by the signal processing module.
[0034] like Figure 1 As shown, the signal processing module also includes a circuit board 220, on which the Hall chip 210 is soldered. The circuit board 220 is also soldered with filtering electronic components. This allows the changing electrical signal generated by the Hall chip 210 to be transmitted to the filtering electronic components through the circuit board 220. The filtering electronic components purify the electrical signal output by the Hall chip 210, ensuring the accuracy and stability of the electrical signal, thereby improving the accuracy of the pressure sensor detection data.
[0035] It should be noted that filtering electronic components are typically circuit networks composed of resistors, capacitors, and inductors, which can screen and filter electrical signals and filter out different types of interference to ensure the accuracy of the obtained data.
[0036] like Figure 1 As shown, after obtaining the electrical signal data converted from the change in medium pressure, it is transmitted through a signal transmission module. The signal transmission module includes injection-molded terminals 310 and connectors 320. Terminals 310 are soldered onto circuit board 220 and fixedly supported by connectors 320. The first end of terminal 310 is soldered onto circuit board 220, and the second end of terminal 310 is connected to electronic control unit (ECU). By transmitting the pressure change signal to the ECU, the ECU can perform subsequent processing, calculation and decision-making to execute corresponding commands.
[0037] like Figure 1 As shown, the signal transmission module is located in the receiving cavity of the base 100, and the base 100 is riveted to the signal transmission module. Specifically, the top of the base 100 is initially open to allow the signal transmission module to enter from the top of the base 100 and connect to the signal processing module. Then, the two sides of the base 100 are riveted inward so that the signal transmission module is riveted inside the base 100 to ensure the relative stability of the signal transmission module and to ensure the stable operation of the pressure sensor.
[0038] In this application, to ensure that the pressure sensor has a sealed cavity, at the riveting point between the base 100 and the signal transmission module, such as Figure 1 At point A, a sealing connection is made by applying adhesive to ensure the internal seal of the pressure sensor.
[0039] Furthermore, in this application, the receiving cavity of the base 100 and the signal transmission module are sealed together by a first sealing ring 400 to further ensure the sealing effect inside the pressure sensor.
[0040] In some embodiments, the terminal 310 is connected to the first end of the circuit board 220, such as... Figure 1 At point C, and at the end where terminal 310 connects to connector 320, such as Figure 1 At point B, all areas are sealed with adhesive to further ensure the sealing effect inside the pressure sensor and thus ensure the accuracy of the monitoring data.
[0041] like Figure 1As shown, the bottom end of the base 100 is provided with an external thread, and a second sealing ring 500 is provided at the root of the external thread, so that the base 100 can be threadedly connected to the component under test through the external thread, and the connection is sealed by the second sealing ring 500 to ensure the stability of the connection.
[0042] The pressure sensor provided in this application embodiment allows the medium to be measured to enter the pressure sensor through the medium channel 110. When the medium pressure changes, it causes the elastic diaphragm 120 to deform, which changes the distance between the magnetic block 130 and the Hall chip 210. This allows the Hall chip 210 to acquire the medium pressure change and convert it into an electrical signal, which is then transmitted to the ECU through the signal transmission module to monitor the medium pressure. This makes the monitoring principle of the pressure sensor simple and the manufacturing process simple, thereby reducing the manufacturing cost of the pressure sensor.
[0043] This application also provides a vehicle that includes the pressure sensor described in the above embodiments.
[0044] Since the pressure sensor described above has the aforementioned technical effects, and the vehicle described above includes the pressure sensor, the vehicle also has the corresponding technical effects, which will not be elaborated here.
[0045] The above description of the embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A pressure sensor, characterized in that, include: A base (100) is used to connect the component to be tested. The base (100) has a medium channel (110). The first end of the medium channel (110) is used to connect the medium to be tested. The base (100) forms an elastic film (120) at the second end of the medium channel (110). A first sensing element is provided on the side of the elastic film (120) away from the medium channel (110). The top of the base (100) forms a receiving cavity, and a signal processing module is provided in the receiving cavity. The signal processing module includes a second sensor, which is correspondingly provided with the first sensor, and the second sensor is used to sense the displacement of the first sensor. The signal processing module is connected to the signal transmission module.
2. The pressure sensor according to claim 1, characterized in that, The base (100) is a metal elastomer, and the elastic film (120) is a metal diaphragm. The metal elastomer and the metal diaphragm are an integral structure, and the metal diaphragm is a thin film area formed by the metal elastomer.
3. The pressure sensor according to claim 1, characterized in that, The medium channel (110) includes a constant diameter section and an enlarged diameter section connected in sequence. The diameter of the enlarged diameter section is larger than the diameter of the constant diameter section, and the enlarged diameter section is located at the second end of the medium channel (110).
4. The pressure sensor according to claim 1, characterized in that, The first sensing element is a magnetic block (130); The second sensing element is a Hall chip (210).
5. The pressure sensor according to claim 4, characterized in that, The signal processing module also includes a circuit board (220), the Hall chip (210) is soldered to the circuit board (220), and the circuit board (220) is also soldered with filter electronic components.
6. The pressure sensor according to claim 5, characterized in that, The signal transmission module includes injection-molded terminals (310) and connectors (320), the terminals (310) being soldered to the circuit board (220), and the signal transmission module being used to connect to an electronic control unit.
7. The pressure sensor according to claim 6, characterized in that, The signal transmission module is located in the receiving cavity of the base (100), and the base (100) is riveted to the signal transmission module.
8. The pressure sensor according to claim 7, characterized in that, The base (100) is sealed and glued to the riveted part of the signal transmission module; And / or, the receiving cavity of the base (100) is sealed to the signal transmission module by a first sealing ring (400).
9. The pressure sensor according to claim 1, characterized in that, The base (100) has an external thread at its bottom end, and a second sealing ring (500) is provided at the root of the external thread to make the base (100) and the component to be tested in a sealed connection.
10. A car, characterized in that, Includes the pressure sensor as described in any one of claims 1-9.