An adaptive quartz wafer inspection platform

Abstract

This utility model relates to the field of automated testing equipment for electronic components, and more particularly to an adaptive quartz wafer testing platform, including a base, a mover, and a scanner. A gantry is mounted on the top of the base, and limit blocks are connected to both sides of the mover. The mover is slidably connected to the gantry through the limit blocks. A first motor is mounted on the gantry, and a lead screw is rotatably connected to the middle of the gantry. The lead screw is threadedly connected to the mover, and one end of the lead screw is connected to the output shaft of the first motor. A height adjustment component is connected to the bottom of the mover, and an angle adjustment component is provided at the lower end of the height adjustment component. The scanner is installed in the angle adjustment component. Dynamic adjustment of the detection height is achieved through a cylinder and a telescopic block, avoiding image distortion caused by excessively close or far spacing. A second motor drives a rotating shaft, enabling the scanner's optical lens to rotate vertically. This, combined with the horizontal displacement of the mover, forms a composite scanning path, achieving the purpose of covering and scanning irregularly shaped wafers.

Description

Technical Field

[0001] This utility model relates to the field of automated testing equipment for electronic components, and in particular to an adaptive quartz wafer testing platform. Background Technology

[0002] Quartz wafers, as a key basic material in the field of electronic components, are widely used in devices such as oscillators, filters, and sensors. Their performance directly affects the stability and accuracy of electronic systems. Quality inspection of quartz wafers needs to focus on indicators such as appearance defects, dimensional accuracy, and crystal orientation consistency. Traditional manual inspection suffers from low efficiency and high subjectivity, while automated inspection technology, through the combination of machine vision and image processing algorithms, can achieve efficient, non-contact inspection and has become the mainstream direction in the industry.

[0003] Existing quartz wafer inspection equipment typically employs a fixed stage, securing the wafer using mechanical clamps or vacuum adsorption. A high-resolution vision camera then scans the top surface of the wafer along a pre-defined path. During scanning, the camera acquires images of the wafer surface, which are then compared with a standard image library using a defect identification algorithm to determine whether the wafer meets quality requirements. This type of equipment performs stably in inspecting regularly shaped quartz wafers, and because the top surface is the primary functional support surface, traditional inspection strategies often focus on scanning the top surface.

[0004] However, existing equipment has significant limitations when inspecting irregularly shaped quartz wafers or wafers with asymmetric structures. For example, when the top surface area of ​​the wafer is larger than the bottom surface, lateral scanning from only the top surface is insufficient to completely cover the wafer's edges and sidewalls, leading to missed defects or dimensional measurement errors. Furthermore, the asymmetry of irregularly shaped wafers makes traditional fixed-path scanning unable to adapt to the actual wafer contour, reducing the matching degree between the image acquisition area and key detection points, ultimately affecting the accuracy of the inspection results. Utility Model Content

[0005] To overcome the limitations of irregularly shaped wafer detection and insufficient adaptability of scanning paths, this invention provides an adaptive quartz wafer detection platform, aiming to solve the above-mentioned shortcomings.

[0006] An adaptive quartz wafer inspection platform includes a base, a gantry, a mover, a first motor, a lead screw, limit blocks, a scanner, a height adjustment component, and an angle adjustment component. The gantry is mounted on the top of the base. Limit blocks are connected to both sides of the mover and are slidably connected within the gantry. The mover is slidably connected to the gantry via the limit blocks. The first motor is mounted on the gantry. A lead screw is rotatably connected to the middle of the gantry and threadedly connected to the mover. One end of the lead screw is connected to the output shaft of the first motor. A height adjustment component is connected to the bottom of the mover. An angle adjustment component is located at the lower end of the height adjustment component. The scanner is installed within the angle adjustment component. The height adjustment component is used to adjust the distance between the scanner and the quartz wafer, and the angle adjustment component is used to adjust the angle between the scanner and the quartz wafer.

[0007] Furthermore, the height adjustment assembly includes a cylinder and a telescopic block. The cylinder is mounted on the bottom of the mover, and the telescopic block is connected to the bottom of the cylinder's piston rod.

[0008] Furthermore, the angle adjustment assembly includes a second motor and a rotating shaft. The lower end of the telescopic block is rotatably connected to the rotating shaft, the scanner is installed in the middle of the rotating shaft, and the second motor is installed on the side of the telescopic block. The output shaft of the second motor is coaxially connected to the rotating shaft.

[0009] Furthermore, it also includes a placement plate, which is connected to the top surface of the base, and the top surface of the placement plate has several grooves.

[0010] Furthermore, supplementary lighting is also included; supplementary lighting is installed on the side of the gantry frame facing the placement plate.

[0011] Furthermore, it also includes adjustable feet, with several adjustable feet installed at the bottom of the base.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] 1. The detection height is dynamically adjusted by using a cylinder and a telescopic block to avoid image distortion caused by too close or too far distance. The rotating shaft is driven by a second motor to make the scanner's optical lens rotate vertically. Combined with the horizontal displacement of the mover, a composite scanning path is formed to achieve the purpose of scanning irregularly shaped wafers.

[0014] 2. By synchronously opening and closing the supplementary light at the bottom of the gantry and the scanner, the shadow interference during side inspection is eliminated, enabling multi-dimensional and accurate inspection of irregularly shaped wafers and improving the defect recognition rate and dimensional measurement accuracy of complex-shaped wafers. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0016] Figure 2 This is a three-dimensional structural cross-sectional view of the gantry frame of this utility model.

[0017] Figure 3 This is a schematic diagram showing the connection relationship between the cylinder, the rotating shaft, and the second motor of this utility model.

[0018] The parts and their numbers in the diagram are as follows: 1_Base, 2_Gantry, 3_Movers, 4_First Motor, 5_Lead Screw, 6_Limit Block, 7_Cylinder, 8_Telescopic Block, 9_Scanner, 10_Second Motor, 11_Rotating Shaft, 12_Placement Plate, 13_Groove, 14_Supplemental Light, 15_Adjustable Foot. Detailed Implementation

[0019] The technical solution of this utility model will be further described below with reference to the accompanying drawings.

[0020] Example: An adaptive quartz wafer inspection platform, such as Figures 1-3 As shown, the device includes a base 1, a gantry frame 2, a mover 3, a first motor 4, a lead screw 5, a limiting block 6, a scanner 9, a height adjustment component, and an angle adjustment component. The gantry frame 2 is mounted on the top of the base 1. The limiting blocks 6 are connected to both sides of the mover 3 and are slidably connected to the gantry frame 2. The mover 3 is slidably connected to the gantry frame 2 through the limiting blocks 6. The first motor 4 is mounted on the gantry frame 2. The lead screw 5 is rotatably connected to the middle of the gantry frame 2 and is threadedly connected to the mover 3. One end of the lead screw 5 is connected to the output shaft of the first motor 4. A height adjustment component is connected to the bottom side of the mover 3, and an angle adjustment component is provided at the lower end of the height adjustment component. The scanner 9 is installed in the angle adjustment component. The height adjustment component is used to adjust the distance between the scanner 9 and the quartz crystal, and the angle adjustment component is used to adjust the angle between the scanner 9 and the quartz crystal.

[0021] like Figure 2 and Figure 3 As shown, the height adjustment component includes a cylinder 7 and a telescopic block 8. The cylinder 7 is installed at the bottom of the mover 3, and the telescopic block 8 is connected to the bottom of the piston rod of the cylinder 7. The cylinder 7 drives the telescopic block 8 to move vertically through the extension and retraction of the piston rod, thereby realizing the dynamic adjustment of the distance between the scanner 9 and the wafer.

[0022] like Figure 2 and Figure 3As shown, the angle adjustment assembly includes a second motor 10 and a rotating shaft 11. The lower end of the telescopic block 8 is rotatably connected to the rotating shaft 11. The scanner 9 is installed in the middle of the rotating shaft 11. The second motor 10 is installed on the side of the telescopic block 8. The output shaft of the second motor 10 is coaxially connected to the rotating shaft 11. The second motor 10 drives the rotating shaft 11 to rotate, thereby causing the scanner 9 to change the detection angle, which can perform tilt scanning on the side of the wafer.

[0023] like Figure 1 As shown, it also includes a placement plate 12. The top surface of the base 1 is connected to the placement plate 12. The top surface of the placement plate 12 has several grooves 13. The four grooves 13 are spaced at 90-degree intervals. The grooves 13 on the top surface of the placement plate 12 form a cross positioning mark to help the inspector quickly align the wafer center. The 90-degree interval design is adapted to the natural alignment habit of regular wafers and improves operation efficiency.

[0024] like Figure 1 As shown, it also includes supplementary lights 14. Supplementary lights 14 are installed on the side of the lower end of the gantry 2 facing the placement plate 12. The supplementary lights 14 are located on both sides of the detection path of the scanner 9. They eliminate side shadows by uniform light projection, enhance the clarity of image acquisition, and ensure the recognizability of edge details, especially when detecting thin wafers.

[0025] like Figure 1 As shown, it also includes adjustable feet 15. Several adjustable feet 15 are installed at the bottom of the base 1. The adjustable feet 15 can independently adjust the height of each corner of the base 1 to compensate for minor horizontal errors in the placement plane, ensure the levelness of the gantry 2, and improve the stability of the test.

[0026] The inspector gently places the quartz wafer into the designated area on the placement plate 12, adjusting its position with both hands to align its center with the crosshair positioning marks formed by the four grooves 13. After pressing the start button, the control system activates the first motor 4 to drive the lead screw 5 to rotate. The lead screw 5, through threaded transmission, drives the mover 3 to move horizontally along the crossbeam of the gantry frame 2. The limit blocks 6 on both sides slide synchronously within the guide rails of the gantry frame 2, ensuring that the scanner 9 maintains a stable horizontal displacement. The scanner 9 performs an initial scan of the top surface of the quartz wafer along a preset path, acquiring height data in real time through the laser ranging module and establishing a three-dimensional contour model. The system automatically calculates the required compensation height based on the model.

[0027] The piston rod of cylinder 7 pushes the telescopic block 8 downward, causing the scanner 9 to descend vertically to the calculated optimal detection height, which can accommodate the detection needs of quartz wafers of different thicknesses. After completing the top surface scan, the mover 3 moves along the guide rail to the side area of ​​the quartz wafer. The second motor 10 drives the scanner 9 to rotate via the rotating shaft 11, keeping the optical lens perpendicular to the side of the quartz wafer. The supplementary light 14 is turned on simultaneously, projecting uniform light onto the side detection area through the light guide plate at the lower end of the gantry 2. The scanner 9 performs multi-angle supplementary scanning on the edge of the quartz wafer.

[0028] After the inspection is completed, the piston rod of cylinder 7 retracts in the reverse direction, pulling the telescopic block 8 to raise the scanner 9 to the initial standby position. The second motor 10 drives the rotating shaft 11 to rotate in the reverse direction to reset, so that the optical lens of the scanner 9 returns to a vertically downward position. After the inspection is completed, the inspector removes the quartz wafer from the placement plate 12. For thin quartz wafers with very little thickness, the inspector can insert a plastic sheet between the groove 13 of the placement plate 12 and the bottom surface of the quartz wafer, and lift the quartz wafer from the bottom to complete the removal operation.

[0029] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of the present invention and should not be construed as limiting the scope of protection of the present invention in any way. Based on this explanation, those skilled in the art can conceive of other specific embodiments of the present invention without creative effort, and these embodiments will all fall within the scope of protection of the present invention.

Claims

1. An adaptive quartz wafer inspection platform, characterized in that, The device includes a base (1), a gantry (2), a mover (3), a first motor (4), a lead screw (5), a limit block (6), a scanner (9), a height adjustment component, and an angle adjustment component. The gantry (2) is mounted on the top of the base (1). The limit blocks (6) are connected to both sides of the mover (3). The limit blocks (6) are slidably connected inside the gantry (2). The mover (3) is slidably connected to the gantry (2) through the limit blocks (6). The first motor (4) is mounted on the gantry (2). The lead screw (5) is rotatably connected to the middle of the gantry (2). The lead screw (5) is threadedly connected to the mover (3). One end of the lead screw (5) is connected to the output shaft of the first motor (4). The height adjustment component is connected to the bottom side of the mover (3). An angle adjustment component is provided at the lower end of the height adjustment component. The scanner (9) is installed inside the angle adjustment component. The height adjustment component is used to adjust the distance between the scanner (9) and the quartz crystal. The angle adjustment component is used to adjust the angle between the scanner (9) and the quartz crystal.

2. The adaptive quartz wafer inspection platform according to claim 1, characterized in that, The height adjustment assembly includes a cylinder (7) and a telescopic block (8). The cylinder (7) is mounted on the bottom of the mover (3), and the telescopic block (8) is connected to the bottom of the piston rod of the cylinder (7).

3. The adaptive quartz wafer inspection platform according to claim 2, characterized in that, The angle adjustment assembly includes a second motor (10) and a rotating shaft (11). The lower end of the telescopic block (8) is rotatably connected to the rotating shaft (11). The scanner (9) is installed in the middle of the rotating shaft (11). The second motor (10) is installed on the side of the telescopic block (8). The output shaft of the second motor (10) is coaxially connected to the rotating shaft (11).

4. The adaptive quartz wafer inspection platform according to claim 1, characterized in that, It also includes a placement plate (12), the top surface of the base (1) is connected to the placement plate (12), and the top surface of the placement plate (12) has several grooves (13).

5. The adaptive quartz wafer inspection platform according to claim 4, characterized in that, It also includes supplementary lights (14), and supplementary lights (14) are installed on the side of the lower end of the gantry (2) facing the placement plate (12).

6. The adaptive quartz wafer inspection platform according to claim 1, characterized in that, It also includes adjustable feet (15), and several adjustable feet (15) are installed on the bottom of the base (1).

Images