A board-level electronic component fault detection device

Abstract

This utility model relates to the technical field of electronic component fault detection equipment, and in particular to a board-level electronic component fault detection device, including an operation box with an opening on the upper side and a fixed platform fixedly installed inside. The fixed platform is connected to a support plate through a position adjustment component for placing board-level electronic components. A rosin atomizing component is fixedly installed on the operation box for atomizing rosin. The rosin atomizing component includes a support arm, which is bent. One end of the support arm is rotatably connected to a slider, which is slidably installed in a groove. The groove is located at one corner of the upper side of the operation box. The other end of the support arm is fixedly connected to a clamping component, which engages with a connecting handle. A rosin atomizer is fixedly installed at the lower end of the connecting handle. The clamping component is C-shaped and connected to a locking fastener for locking the clamping component, thereby fixing the connecting handle. The above structure can uniformly atomize rosin and cover the surface of the board-level electronic components, which helps to detect faults such as poor soldering and cold soldering at the component solder joints.

Description

Technical Field

[0001] This utility model belongs to the technical field of electronic component fault detection equipment, and in particular relates to a board-level electronic component fault detection device. Background Technology

[0002] In today's highly integrated electronic devices, circuit boards, as the core carriers of various electronic products, are crucial. The chips, resistors, capacitors, and other board-level electronic components soldered onto their surfaces collectively determine the operational reliability of the equipment. In practical applications, these board-level electronic components are prone to failure due to problems such as loose solder joints, aging from long-term use, and damage from electrostatic discharge. If faulty components are not located and addressed in a timely manner, it will not only lead to the failure of the circuit board's functionality but also seriously affect the quality and lifespan of the entire electronic product.

[0003] For fault detection of board-level electronic components on circuit boards, existing technologies can use rosin smoke to help locate fault points. However, the operation process is manual and has obvious limitations: during the test, the staff must first hold the soldering iron, dip the tip of the soldering iron into an appropriate amount of rosin paste, and then turn on the power to heat the soldering iron. The high temperature of the soldering iron tip causes the rosin paste to melt and evaporate. The rosin smoke produced needs to be manually controlled by the staff to slowly cover the surface of the circuit board.

[0004] In the above process, the amount of pine smoke produced depends entirely on the amount of rosin paste applied. Applying too much rosin paste will result in excessive pine smoke and uneven coverage, while applying too little rosin paste will result in insufficient pine smoke and an inability to form a complete detection layer. At the same time, the staff needs to continuously hold the high-temperature soldering iron to adjust its position, which not only makes it difficult to accurately control the pine smoke coverage area (especially for densely packed component areas on the circuit board), but also makes the operation inconvenient. Furthermore, it is easy to cause burns to the staff due to hand tremors or excessively high soldering iron temperature, or to accidentally touch sensitive components on the circuit board, resulting in secondary damage. Utility Model Content

[0005] Based on the above background, the purpose of this utility model is to provide a board-level electronic component fault detection device. By setting a rosin atomizing component, rosin can be uniformly atomized and covered on the surface of the board-level electronic component, which helps to detect faults such as poor soldering and cold soldering at the component solder joints.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A board-level electronic component fault detection device includes an operation box, the operation box having an opening on its upper side and a fixed platform fixedly disposed inside, the fixed platform being connected to a support plate via a position adjustment component, and the support plate being used to place board-level electronic components. The operation box is fixedly equipped with a rosin atomizing component for atomizing rosin; The rosin atomizing assembly includes a support arm, which is bent. One end of the support arm is rotatably connected to a slider, which is slidably disposed in a groove. The groove is located at one corner of the upper side of the operating box. The other end of the support arm is fixedly connected to a clamping member, which engages with a connecting handle. A rosin atomizer is fixedly disposed at the lower end of the connecting handle. The clamping member is C-shaped and connected to a locking fastener, which is used to lock the clamping member, thereby fixing the connecting handle.

[0007] Furthermore, a magnifying observation assembly is also fixedly installed on the operation box. The magnifying observation assembly includes a magnifying glass. One end of the magnifying glass is fixed to the second connecting rod, the other end of the second connecting rod is rotatably connected to the first connecting rod, and the other end of the first connecting rod is rotatably connected to a fixing column. The fixing column is fixed on the operation box.

[0008] Furthermore, the position adjustment assembly includes an X-axis adjustment assembly and a Y-axis adjustment assembly. The fixed end of the X-axis adjustment assembly is fixedly connected to the operating table, the movable end of the X-axis adjustment assembly is fixedly connected to the fixed end of the Y-axis adjustment assembly, and the movable end of the Y-axis adjustment assembly is fixedly connected to the support plate.

[0009] Furthermore, the support plate is also provided with a clamping assembly for clamping the board-level electronic components. The clamping assembly includes track grooves, which are symmetrically arranged. A moving block is slidably arranged in each track groove. A clamping rod is fixedly connected to the upper side of each moving block. A screw is screwed to each moving block. Both screws are rotatably connected to the support plate. One end of the two screws is fixedly connected to the opposite end. A knob is fixed to the other end of one screw. The threads on the two screws are in opposite directions.

[0010] Furthermore, a rubber layer is provided on the surface of the opposite side of the clamping rod.

[0011] Furthermore, a guide shaft is provided inside the slide groove, the guide shaft is fixedly connected to the operating box, and the guide shaft passes through the slider.

[0012] Furthermore, the locking device consists of a bolt and a nut. The bolt passes through both ends of the clamping member and is screwed onto the nut. By rotating the nut, the clamping member can be tightened, thereby fixing and limiting the connection handle.

[0013] This utility model has the following beneficial effects: By setting up a rosin atomization component, rosin can be evenly atomized and covered on the surface of board-level electronic components, which helps to detect faults such as poor soldering and cold soldering at component solder joints. The magnification observation component allows operators to clearly observe the details of rosin adhesion on the component surface.

[0014] The position adjustment assembly is designed so that the support plate can be adjusted in the X and Y axes to accommodate board-level electronic components of different sizes and shapes; The clamping assembly can firmly hold the component, preventing it from moving or shaking during the testing process. The rubber layer on the clamping rod can effectively protect the surface of the component from damage, while increasing the friction of the clamping, making the clamping more secure. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 This is a perspective view of the present utility model; Figure 2 This is a partial three-dimensional representation of the present invention. Figure 1 ; Figure 3 This is a partial three-dimensional representation of the present invention. Figure 2 .

[0017] Explanation of icon numbers: 1. Rosin atomizing assembly; 101. Connecting handle; 102. Clamping component; 103. Locking fastener; 104. Slide groove; 105. Guide shaft; 106. Rosin atomizer; 107. Slider; 108. Support arm; 2. Magnifying observation components; 201. Link 1; 202. Fixing post; 203. Link 2; 204. Magnifying glass; 3. Control box; 301. Fixed platform; 3011. Opening; 4. Position adjustment assembly; 401. X-axis adjustment assembly; 4011. Moving plate; 4012. X-axis linear track; 4013. First lead screw; 4014. First motor; 402. Y-axis adjustment assembly; 4021. Second motor; 4022. Y-axis linear track; 4024. Second lead screw; 5. Support plate; 6. Clamping assembly; 601. Clamping rod; 602. Track groove; 603. Second screw; 604. Moving block.

[0018] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0021] Furthermore, in this utility model, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0022] See Figures 1-3 Board-level electronic component fault detection device.

[0023] Example 1 A board-level electronic component fault detection device includes an operation box 3. The operation box 3 has an opening 3011 on the upper side and a fixed platform 301 is fixedly installed inside. The fixed platform 301 is connected to a support plate 5 through a position adjustment component 4. The support plate 5 is used to place board-level electronic components. The operation box 3 is fixedly equipped with a rosin atomizing component 1 for atomizing rosin; The rosin atomizing component 1 includes a support arm 108, which is bent. One end of the support arm 108 is rotatably connected to a slider 107, which is slidably disposed in a groove 104. The groove 104 is located at one corner of the upper side of the operation box 3. The other end of the support arm 108 is fixedly connected to a clamping member 102, which engages with a connecting handle 101. A rosin atomizer 106 is fixedly disposed at the lower end of the connecting handle 101. The clamping member 102 is C-shaped and is connected to a locking member 103, which locks the clamping member 102 to secure the connecting handle 101.

[0024] A preload is provided between the support arm 108 and the slider 107. By pushing the support arm 108, the clamping member 102 can be rotated to adjust its position. The rosin atomizing component 1 can control the atomization area of ​​the rosin and the height of the rosin atomizer 106. When performing fault detection on board-level electronic components, the board-level electronic components are first placed on the support plate 5. Then, the position of the support plate 5 is adjusted by the position adjustment component 4 so that the board-level electronic components are in a suitable detection position. The operator can rotate the support arm 108 to allow the slider 107 to slide in the slide groove 104, move the clamp 102 to a suitable position, and then insert the connecting handle 101 connected to the rosin atomizer 106 into the clamp 102 and lock it with the locking fastener 103 to ensure that the rosin atomizer 106 is stably fixed. The rosin atomizer 106 is then started to atomize the rosin evenly and spray it onto the board-level electronic components. The fault point is located by the pine smoke adhesion pattern.

[0025] The operation box 3 is also fixedly equipped with a magnifying observation component 2, which includes a magnifying glass 204. The magnifying glass 204 is fixed to one end of a second connecting rod 203. The other end of the second connecting rod 203 is rotatably connected to a first connecting rod 201. The other end of the first connecting rod 201 is rotatably connected to a fixing column 202. The fixing column 202 is fixed on the operation box 3.

[0026] Preferably, preload is provided at the rotatable connection between connecting rod 1 201 and connecting rod 203, and at the rotatable connection between connecting rod 1 201 and fixed column 202. By pulling connecting rod 1 201 and connecting rod 203 to swing, the angle of magnifying glass 204 can be adjusted, and the morphology of rosin adhering to the board-level electronic components placed on the support plate 5 can be easily observed using magnifying glass 204.

[0027] The position adjustment component 4 includes an X-axis adjustment component 401 and a Y-axis adjustment component 402. The fixed end of the X-axis adjustment component 401 is fixedly connected to the operating table, the movable end of the X-axis adjustment component 401 is fixedly connected to the fixed end of the Y-axis adjustment component 402, and the movable end of the Y-axis adjustment component 402 is fixedly connected to the support plate 5.

[0028] Preferably, the X-axis adjustment assembly 401 includes an X-axis linear track 4012, the guide rail of the X-axis linear track 4012 fixes the operating table, the guide block of the X-axis linear track 4012 fixes the moving plate 4011, the moving plate 4011 is fixedly connected to the fixed end of the Y-axis adjustment assembly 402, the lower side of the moving plate 4011 is screwed with a first lead screw 4013, the two ends of the first lead screw 4013 are respectively rotatably connected to the operating table, one end of the first lead screw 4013 is connected to a first motor 4014 through a linkage, and the first motor 4014 is fixed to the lower side of the operating table.

[0029] The linkage can be a transmission wheel and belt drive connection or a sprocket and chain drive connection. The input end of the linkage is fixedly connected to the output shaft of the first motor 4014, and the output end of the linkage is fixedly connected to the end of the first lead screw 4013.

[0030] The control panel is provided with an opening 3011 for the linkage component to pass through.

[0031] The Y-axis adjustment assembly 402 includes a Y-axis linear track 4022. The guide rail of the Y-axis linear track 4022 is fixed to the upper side of the moving plate 4011. The guide block of the Y-axis linear track 4022 is fixed to the lower side of the support plate 5. A second lead screw 4024 is screwed to the lower side of the support plate 5. The second lead screw 4024 is rotatably connected to the moving plate 4011. A second motor 4021 is fixed to one end of the second lead screw 4024. The second motor 4021 is located at the bottom of the moving plate 4011.

[0032] Furthermore, the first motor 4014 and the second motor 4021 should also be equipped with motor covers for protection (existing technology, not described in detail, and not shown in the figure).

[0033] By setting the X-axis adjustment component 401 and the Y-axis adjustment component 402, the position of the support plate 5 in the X-axis and Y-axis directions can be adjusted. When it is necessary to adjust the position of the support plate 5 in the X-axis direction, the first motor 4014 is started. The first motor 4014 drives the first lead screw 4013 to rotate through the linkage. Since the moving plate 4011 is screwed to the first lead screw 4013, and the moving plate 4011 slides through the guide block of the X-axis linear track 4012 and the guide rail, the rotation of the first lead screw 4013 will drive the moving plate 4011 to make linear motion in the X-axis direction, thereby driving the moving plate 4011 to move linearly in the X-axis direction. The Y-axis adjustment assembly 402 and the support plate 5, which are fixedly connected, move in the X-axis direction. When it is necessary to adjust the position of the support plate 5 in the Y-axis direction, the second motor 4021 is started. The second motor 4021 drives the second lead screw 4024 to rotate. The support plate 5 is screwed to the second lead screw 4024, and the support plate 5 slides through the guide block of the Y-axis linear track 4022 and the guide rail. Therefore, the rotation of the second lead screw 4024 will drive the support plate 5 to make linear motion in the Y-axis direction, which can easily adjust the support plate 5 to the required position to meet the needs of fault detection of different board-level electronic components.

[0034] A guide shaft 105 is provided inside the slide groove 104. The guide shaft 105 is fixedly connected to the operation box 3 and passes through the slider 107. The guide shaft 105 serves to support and guide.

[0035] The locking device 103 consists of a bolt and a nut. The bolt passes through both ends of the clamping member 102 and is screwed onto the nut. By rotating the nut, the clamping member 102 can be locked, thereby fixing and limiting the connection handle 101.

[0036] Example 2 This embodiment is a further elaboration based on Embodiment 1. Compared with Embodiment 1, this embodiment also has the following technical features: The support plate 5 is also provided with a clamping assembly 6 for clamping the board-level electronic components. The clamping assembly 6 includes a track groove 602, which is symmetrically arranged. A moving block 604 is slidably arranged in each track groove 602. A clamping rod 601 is fixedly connected to the upper side of each moving block 604. A screw is screwed to each moving block 604. Both screws are rotatably connected to the support plate 5. The opposite ends of the two screws are fixedly connected, and a knob is fixed to the other end of one screw. The threads on the two screws are in opposite directions.

[0037] A rubber layer is provided on the opposite side surface of the clamping rod 601.

[0038] By rotating the fixed knob, one of the connected screws can be rotated. Since the two screws are fixedly connected at opposite ends and the threads on the two screws are in opposite directions, both screws will rotate simultaneously. This causes the two moving blocks 604 to move in opposite directions or in a straight line within the track groove 602. The moving blocks 604 drive the clamping rod 601 to move, thereby realizing the clamping or releasing operation of the board-level electronic components. The rubber layer can increase the friction between the clamping rod 601 and the board-level electronic components, and at the same time, it can also play a buffering and protective role to prevent damage to the board-level electronic components during the clamping process.

[0039] The method of using this utility model is as follows: First, place the board-level electronic component to be tested in a suitable position on the support plate 5. If necessary, use the clamping assembly 6 to stably clamp the board-level electronic component by rotating the fixing knob. Based on the approximate range of possible fault points on the board-level electronic component, start the first motor 4014 and the second motor 4021 by operating the X-axis adjustment assembly 401 and the Y-axis adjustment assembly 402. Adjust the position of the support plate 5 in the X-axis and Y-axis directions by rotating the first lead screw 4013 and the second lead screw 4024, so that the board-level electronic component is in a position that is easy to test. Connect the connecting handle with the rosin atomizer 106. 101 is inserted into the clamping part 102 and locked with the locking fastener 103 to ensure that the rosin atomizer 106 is at the appropriate height and is stably fixed. The rosin atomizer 106 is started to atomize the rosin evenly and spray it onto the board-level electronic components. The fault point is located by observing the rosin smoke adhesion pattern on the board-level electronic components. During this process, the angle of the magnifying glass 204 in the magnifying observation component 2 can also be adjusted by pulling the first connecting rod 201 and the second connecting rod 203 to make it easier to observe the rosin adhesion pattern on the board-level electronic components placed on the support plate 5 more clearly, thereby more accurately determining the location of the fault point.

[0040] Of course, the above description is not intended to limit the present utility model, and the present utility model is not limited to the examples given above. Any changes, modifications, additions or substitutions made by those skilled in the art within the scope of the present utility model should also fall within the protection scope of the present utility model.

Claims

1. A board-level electronic component fault detection device, comprising an operation box (3), characterized in that, The operation box (3) has an opening (3011) on the upper side and a fixed platform (301) is fixedly installed inside. The fixed platform (301) is connected to the support plate (5) through the position adjustment component (4). The support plate (5) is used to place board-level electronic components. The operation box (3) is fixedly equipped with a rosin atomizing component (1) for atomizing rosin; The rosin atomizing component (1) includes a support arm (108), which is bent. One end of the support arm (108) is rotatably connected to a slider (107). The slider (107) is slidably disposed in a groove (104). The groove (104) is opened at one corner of the upper side of the operation box (3). The other end of the support arm (108) is fixedly connected to a clamping member (102). The clamping member (102) and the connecting handle (101) are engaged. The lower end of the connecting handle (101) is fixedly provided with a rosin atomizer (106). The clamping member (102) is C-shaped. The clamping member (102) is connected to a locking member (103). The locking member (103) is used to lock the clamping member (102), thereby fixing the connecting handle (101).

2. The board-level electronic component fault detection device according to claim 1, characterized in that, The operation box (3) is also fixedly equipped with a magnifying observation component (2), which includes a magnifying glass (204). The magnifying glass (204) is fixed to one end of the second connecting rod (203), and the other end of the second connecting rod (203) is rotatably connected to the first connecting rod (201). The other end of the first connecting rod (201) is rotatably connected to the fixing column (202), and the fixing column (202) is fixed on the operation box (3).

3. The board-level electronic component fault detection device according to claim 1, characterized in that, The position adjustment component (4) includes an X-axis adjustment component (401) and a Y-axis adjustment component (402). The fixed end of the X-axis adjustment component (401) is fixedly connected to the operating table, and the movable end of the X-axis adjustment component (401) is fixedly connected to the fixed end of the Y-axis adjustment component (402). The movable end of the Y-axis adjustment component (402) is fixedly connected to the support plate (5).

4. The board-level electronic component fault detection device according to claim 1, characterized in that, The support plate (5) is also provided with a clamping assembly (6) for clamping the board-level electronic components. The clamping assembly (6) includes a track groove (602), which is symmetrically arranged. Each track groove (602) has a sliding block (604) slidably arranged in it. Each moving block (604) has a clamping rod (601) fixedly connected to its upper side. Each moving block (604) is screwed with a screw rod. Both screw rods are rotatably connected to the support plate (5). The opposite ends of the two screw rods are fixedly connected, and the other end of one screw rod is fixed with a knob. The threads on the two screw rods are in opposite directions.

5. The board-level electronic component fault detection device according to claim 4, characterized in that, A rubber layer is provided on the opposite side surface of the clamping rod (601).

6. The board-level electronic component fault detection device according to claim 1, characterized in that, A guide shaft (105) is provided inside the slide groove (104), the guide shaft (105) is fixedly connected to the operation box (3), and the guide shaft (105) passes through the slider (107).

7. The board-level electronic component fault detection device according to claim 1, characterized in that, The locking device (103) is a bolt and a nut. The bolt passes through both ends of the clamping member (102) and is screwed onto the nut. By rotating the nut, the clamping member (102) can be locked, thereby fixing and limiting the connection handle (101).

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