An integrated circuit ultrasonic scanning and drying system

Abstract

This utility model discloses an integrated circuit ultrasonic scanning and drying system, including an ultrasonic scanner and a drying component, including a control unit; the ultrasonic scanner, drying component, and control unit are connected; the ultrasonic scanner includes a transmitting module, a receiving module, and a signal processing module; the drying component includes a hot air device, an ion generator, and a diffusion nozzle; the diffusion nozzle includes a nozzle body and an adjustment device. In use, the chip is immersed in deionized water and scanned by the ultrasonic scanner. The control unit dynamically adjusts the ultrasonic scanning parameters based on the chip surface roughness and porosity data to reduce the penetration depth of the coupling water; after scanning, the chip is removed from the decoupling water and dried using the drying component. The hot air blown out by the hot air device carries charged ions generated by the ion generator, which can break the surface tension of water molecules, thereby accelerating evaporation and improving drying efficiency.

Description

Technical Field

[0001] This utility model relates to an ultrasonic testing device for integrated circuits, and more particularly to an ultrasonic scanning and drying system for integrated circuits. Background Technology

[0002] When performing ultrasonic scanning inspection (SAT) on integrated circuits to detect internal defects, the chip needs to be immersed in coupling water (deionized water). The deionized water serves as the coupling medium to transmit ultrasonic signals and detect potential defects inside the chip. However, water stains are easily left on the chip surface after the inspection, which can lead to oxidation and contamination, affecting the appearance and electrical performance. In addition, water stains may seep into solder joints or microstructures, reducing product reliability and causing the product to fail.

[0003] Existing methods for processing chips after ultrasonic testing include manual intervention, natural air drying, and traditional hot air drying. All of these methods suffer from incomplete drying. Hot air drying is difficult to completely remove residual moisture from the micron-level pores inside the chip, while manual intervention and natural air drying are inefficient and prone to introducing secondary contamination. In addition, existing drying methods also have poor process compatibility and cannot be combined with the ultrasonic scanning process for parameter optimization to further reduce water residue while ensuring detection effect and efficiency. Utility Model Content

[0004] In view of the problem of water stains easily remaining in the current ultrasonic testing process of chips, this utility model provides an integrated circuit ultrasonic scanning and drying system that can optimize the drying effect and remove surface water stains.

[0005] To achieve the above objectives, the embodiments of this utility model adopt the following technical solutions:

[0006] An integrated circuit ultrasonic scanning and drying system includes an ultrasonic scanner and a drying component, and includes a control unit; the ultrasonic scanner, the drying component and the control unit are connected; the ultrasonic scanner includes a transmitting module, a receiving module and a signal processing module; the drying component includes a hot air device, an ion generator and a diffusion nozzle; the diffusion nozzle includes a nozzle body and an adjustment device; the nozzle body is provided with an array of air holes.

[0007] According to one aspect of the present invention, the air hole array is a double-row linear array; the double-row linear array is composed of a plurality of air outlet holes.

[0008] According to one aspect of the present invention, the transmitting module includes an ultrasonic transducer and a pulse generator.

[0009] According to one aspect of the present invention, the adjusting device includes wind direction adjustment, air volume adjustment, and adjusting support bracket.

[0010] According to one aspect of the present invention, the hot air device includes a heating element and a fan element.

[0011] According to one aspect of the present invention, a water film thickness sensor is also included; the water film thickness sensor is connected to the control unit.

[0012] Advantages of this utility model:

[0013] The ultrasonic scanning detection and drying process are combined and optimized. The control unit dynamically adjusts the scanning parameters based on the chip surface parameters fed back by the ultrasonic scanning. This ensures the scanning effect and efficiency while minimizing the penetration depth of coupled water in the chip at the source, further reducing the difficulty of drying, drying time, and water stains. The drying components include a hot air device and an ion generator. The hot air containing charged ions can be used to break the surface tension of water molecules, accelerate evaporation, and thus quickly dry the chip, avoiding water stains. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a structural block diagram of an integrated circuit ultrasonic scanning and drying system according to the present invention;

[0016] Figure 2 This is a schematic diagram of the structure of the drying component described in this utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the nozzle body described in this utility model.

[0018] Legend: 1. Ultrasonic scanner; 2. Drying assembly; 21. Nozzle body; 211. Air outlet; 22. Air direction adjustment; 23. Air volume adjustment; 24. Support bracket; 3. Control unit; 4. Water film thickness sensor. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example 1

[0021] like Figure 1 , Figure 2 and Figure 3 As shown, an integrated circuit ultrasonic scanning and drying system includes an ultrasonic scanner 1 and a drying component 2, and a control unit 3; the ultrasonic scanner 1, the drying component 2 and the control unit 3 are connected; the ultrasonic scanner 1 includes a transmitting module, a receiving module and a signal processing module; the drying component 2 includes a hot air device, an ion generator and a diffusion nozzle; the diffusion nozzle includes a nozzle body 21 and an adjustment device; the nozzle body 21 is provided with an array of air holes.

[0022] When in use, the chip is immersed in coupling water (deionized water) and scanned and detected by ultrasonic scanner 1. During this process, control unit 3 can detect the roughness and porosity of the chip surface based on the reflected signal received by ultrasonic scanner 1.

[0023] The control unit 3 dynamically adjusts the ultrasonic scanning time based on the roughness and porosity data of the chip surface (such as shortening the high-frequency pulse interval of the driving transducer in the ultrasonic scanner 1) to minimize the penetration depth of the coupling water while ensuring the scanning and detection effect.

[0024] After scanning and testing, the chip is removed from the decoupled water and dried using the drying component 2. The hot air blown out by the hot air device carries charged ions generated by the ion generator, which can break the surface tension of water molecules, thereby accelerating evaporation. In practical applications, evaporation can be completed by blowing the chip surface at 60°C for about 20 minutes. At the same time, the array design of the diffusion nozzles allows the airflow to evenly cover the chip surface and edge gaps, optimizing the drying effect and improving the drying efficiency.

[0025] Common ion generators include corona discharge type (the principle is similar to lightning, where a high-voltage power supply releases high-energy electrons through the tip of a metal or carbon fiber, which combine with oxygen molecules in the air to form negative oxygen ions) and plasma type (applying a high-frequency, high-voltage electric field to ionize the gas and form a plasma containing free electrons, positive and negative ions, which can be constrained by an electromagnetic field). In practical applications, the appropriate type should be selected according to actual needs.

[0026] In this embodiment, the air hole array adopts a double-row linear array composed of several air outlet holes 211; it can allow charged ion wind to uniformly cover both sides of the chip and the edge gaps.

[0027] In practical applications, the transmitting module includes an ultrasonic transducer and a pulse generator. The control unit 3 can dynamically adjust the ultrasonic scanning time according to the reflected signal received by the ultrasonic scanner 1, that is, control the pulse spacing of the pulse generator.

[0028] In practical applications, the adjustment device includes air direction adjustment 22, air volume adjustment 23 and adjustment support bracket 24. The air direction adjustment 22 is mainly used to adjust the direction of the nozzle body 21, the air volume adjustment 23 is used to adjust the air volume of the hot air device, and the support bracket 24 is used to support the entire drying assembly 2 and has a certain pitch angle adjustment function.

[0029] In practical applications, the hot air device includes a heating element and a fan element, which can be used to adjust parameters such as the temperature, wind speed and air volume of the hot air.

[0030] Example 2

[0031] like Figure 1 , Figure 2 and Figure 3 As shown, an integrated circuit ultrasonic scanning and drying system includes an ultrasonic scanner 1 and a drying component 2, and a control unit 3; the ultrasonic scanner 1, the drying component 2 and the control unit 3 are connected; the ultrasonic scanner 1 includes a transmitting module, a receiving module and a signal processing module; the drying component 2 includes a hot air device, an ion generator and a diffusion nozzle; the diffusion nozzle includes a nozzle body 21 and an adjustment device; the nozzle body 21 is provided with an array of air holes.

[0032] When in use, the chip is immersed in coupling water (deionized water) and scanned and detected by ultrasonic scanner 1. During this process, control unit 3 can detect the roughness and porosity of the chip surface based on the reflected signal received by ultrasonic scanner 1.

[0033] The control unit 3 dynamically adjusts the ultrasonic scanning time based on the roughness and porosity data of the chip surface (such as shortening the high-frequency pulse interval of the driving transducer in the ultrasonic scanner 1) to minimize the penetration depth of the coupling water while ensuring the scanning and detection effect.

[0034] After scanning and testing, the chip is removed from the decoupled water and dried using the drying component 2. The hot air blown out by the hot air device carries charged ions generated by the ion generator, which can break the surface tension of water molecules, thereby accelerating evaporation. In practical applications, evaporation can be completed by blowing the chip surface at 60°C for about 20 minutes. At the same time, the array design of the diffusion nozzles allows the airflow to evenly cover the chip surface and edge gaps, optimizing the drying effect and improving the drying efficiency.

[0035] Common ion generators include corona discharge type (the principle is similar to lightning, where a high-voltage power supply releases high-energy electrons through the tip of a metal or carbon fiber, which combine with oxygen molecules in the air to form negative oxygen ions) and plasma type (applying a high-frequency, high-voltage electric field to ionize the gas and form a plasma containing free electrons, positive and negative ions, which can be constrained by an electromagnetic field). In practical applications, the appropriate type should be selected according to actual needs.

[0036] In this embodiment, the air hole array adopts a double-row linear array composed of several air outlet holes 211; it can allow charged ion wind to uniformly cover both sides of the chip and the edge gaps.

[0037] In practical applications, the transmitting module includes an ultrasonic transducer and a pulse generator. The control unit 3 can dynamically adjust the ultrasonic scanning time according to the reflected signal received by the ultrasonic scanner 1, that is, control the pulse spacing of the pulse generator.

[0038] In practical applications, the adjustment device includes air direction adjustment 22, air volume adjustment 23 and adjustment support bracket 24. The air direction adjustment 22 is mainly used to adjust the direction of the nozzle body 21, the air volume adjustment 23 is used to adjust the air volume of the hot air device, and the support bracket 24 is used to support the entire drying assembly 2 and has a certain pitch angle adjustment function.

[0039] In practical applications, the hot air device includes a heating element and a fan element, which can be used to adjust parameters such as the temperature, wind speed and air volume of the hot air.

[0040] In practical applications, the entry, exit, and transfer of chips into and out of water can all be controlled by a mechanism similar to a robotic arm, achieving contactless operation and avoiding interference with scanning and detection and chip contamination.

[0041] Optionally, the system also includes a water film thickness sensor 4; the water film thickness sensor 4 is connected to the control unit 3 for scanning and detection. After the chip exits the water, the water film thickness on the chip surface is detected. Firstly, the water film thickness can be used to make subsequent adjustments to the chip exiting process (such as exiting angle, speed and trajectory) based on the residual water film thickness to reduce water film residue. Secondly, the initial water film thickness can be measured before drying and combined with the chip parameters (size, thickness and packaging process, etc.) to set drying process parameters, such as temperature, wind speed, time and change curve.

[0042] Furthermore, multiple chips of the same type can be ultrasonically scanned and dried simultaneously, improving efficiency.

[0043] Advantages of this utility model:

[0044] The ultrasonic scanning detection and drying process are combined and optimized. The control unit dynamically adjusts the scanning parameters based on the chip surface parameters fed back by the ultrasonic scanning. This ensures the scanning effect and efficiency while minimizing the penetration depth of coupled water in the chip at the source, further reducing the difficulty of drying, drying time, and water stains. The drying components include a hot air device and an ion generator. The hot air containing charged ions can be used to break the surface tension of water molecules, accelerate evaporation, and thus quickly dry the chip, avoiding water stains.

[0045] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. An integrated ultrasonic scanning and drying system comprising an ultrasonic scanner (1) and a drying assembly (2), characterized in that, It includes a control unit (3); the ultrasonic scanner (1) and the drying assembly (2) are connected to the control unit (3); the ultrasonic scanner (1) includes a transmitting module, a receiving module and a signal processing module; the drying assembly (2) includes a hot air device, an ion generator and a diffusion nozzle; the diffusion nozzle includes a nozzle body (21) and an adjustment device; the nozzle body (21) is provided with an array of air holes.

2. The integrated circuit ultrasonic scanning and drying system of claim 1, wherein, The vent array is a double-row linear array; the double-row linear array is composed of a plurality of air outlet holes (211).

3. The integrated circuit ultrasonic scanning and drying system of claim 1, wherein, The transmitting module includes an ultrasonic transducer and a pulse generator.

4. The integrated circuit ultrasonic scanning and drying system of claim 1, wherein, The regulating device includes wind direction regulating (22), air volume regulating (23) and regulating support bracket (24).

5. The integrated circuit ultrasonic scanning and drying system of claim 1, wherein, The hot air device includes a heating element and a fan element.

6. The integrated circuit ultrasonic scanning and drying system of claim 1, wherein, It also includes a water film thickness sensor (4); the water film thickness sensor (4) is connected to the control unit (3).

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