Crimping mechanism and testing device

Abstract

The application relates to a crimping mechanism and a testing device. The crimping mechanism comprises a rack, a bearing assembly and a pressure head assembly. The bearing assembly is arranged on the rack and is used for bearing a product to be tested. The pressure head assembly is arranged on the rack and can move towards the bearing assembly or away from the bearing assembly. The pressure head assembly comprises a test plate, a test copper strip and a wire electrically connected to the test copper strip. The test plate has a fitting area and a bending area bent on one side of the fitting area. The test copper strip is arranged on the fitting area and can be fitted on the product to be tested. The wire is arranged on the bending area. The crimping mechanism provided by the application has the fitting area and the bending area bent on one side of the fitting area. The test copper strip is arranged on the fitting area, and the wire is arranged on the bending area. During the crimping test on the product to be tested, only the test copper strip is in contact with the product to be tested, and the wire is not in contact with the product to be tested. The wire does not interfere with the test on the product to be tested, and the reliability and accuracy of the test result of the product to be tested can be improved.

Description

Technical Field

[0001] This application relates to the field of crimping testing technology, and in particular to a crimping mechanism and testing device. Background Technology

[0002] Electronic components such as chips, control boards, and displays must undergo crimping tests before leaving the factory to test whether their performance meets the preset requirements and to ensure their reliability.

[0003] When performing crimp tests on touch displays, an FPC (Flexible Printed Circuit) indenter is typically used to crimp the area of ​​the display to be tested. The FPC indenter consists of a test copper strip and wires electrically connected to the test copper strip. During the pressing process of the FPC indenter, both the test copper strip and the wires will make electrical contact with the area of ​​the display to be tested. Current will flow through the display during the test, which will interfere with the test of the product under test, resulting in low reliability and accuracy of the test results. Utility Model Content

[0004] Therefore, it is necessary to provide a crimping mechanism and testing device to address the problem that the FPC indenter can interfere with the test results of the product under test.

[0005] A crimping mechanism, the crimping mechanism comprising:

[0006] frame;

[0007] A support assembly, which is disposed on the frame, is used to support the product to be tested;

[0008] A pressure head assembly is disposed on the frame and is movable toward or away from the support assembly. The pressure head assembly includes a test plate, a test copper strip, and a wire electrically connected to the test copper strip. The test plate has a bonding area and a bending area bent to one side of the bonding area. The test copper strip is disposed in the bonding area and can be bonded to the product to be tested. The wire is disposed in the bending area.

[0009] In one embodiment, the pressure head assembly further includes a base and a pressure block disposed on the base, the test plate covers the outer peripheral surface of the pressure block, and the bonding area and the bending area are not coplanar.

[0010] In one embodiment, the pressure head assembly further includes a plurality of elastic elements, which are spaced apart along the circumferential direction of the test plate, and the elastic elements are used to connect the test plate to the pressure block.

[0011] In one embodiment, the pressure head assembly further includes multiple guide shafts, which are spaced apart along the circumferential direction of the base. The guide shafts extend toward the direction of movement of the pressure head assembly, are connected to the base, and are movably disposed on the frame along the extension direction of the guide shafts.

[0012] In one embodiment, the pressure head assembly further includes a plurality of guide blocks, which are spaced apart on the pressure block along the circumferential direction of the pressure block;

[0013] The test plate is provided with multiple guide grooves corresponding to the multiple guide blocks, and the guide grooves extend toward the movement direction of the pressure head assembly, and the guide blocks are movably disposed in the guide grooves.

[0014] In one embodiment, the pressure head assembly further includes a counterweight that is detachably disposed on the base.

[0015] In one embodiment, the pressure head assembly further includes a buffer element disposed between the test plate and the pressure block to buffer the external force applied to the test plate.

[0016] In one embodiment, the carrier assembly includes a carrier plate and a carrier cavity disposed on the carrier plate, the carrier cavity being used to carry the product under test.

[0017] In one embodiment, the pressure head assembly includes a plurality of positioning elements, and the support plate has a plurality of positioning holes that mate with the plurality of positioning elements;

[0018] When the pressure head assembly moves toward the bearing assembly, the positioning member can engage with the positioning hole.

[0019] A testing apparatus, the testing apparatus comprising:

[0020] The crimping mechanism as described in any of the above technical solutions.

[0021] In the aforementioned crimping mechanism and testing device, when the crimping head assembly moves towards the support component, the test copper strip can adhere to the product under test. Electrical continuity testing of the product under test is performed using the test copper strip. After the product under test is tested, the crimping head assembly moves away from the support component, facilitating operations such as unloading and replacing the product under test. The crimping mechanism provided in this application, because the test board has a bonding area and a bending area bent to one side of the bonding area, with the test copper strip located in the bonding area and the wire located in the bending area, ensures that only the test copper strip contacts the product under test during the crimping test, while the wire does not. This prevents the wire from interfering with the test, improving the reliability and accuracy of the test results. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the crimping mechanism provided in some embodiments.

[0023] Figure 2 This is a schematic diagram of the pressure head module provided in some embodiments.

[0024] Figure 3 This is a schematic diagram of the structure of the test board and the product under test module provided in some embodiments.

[0025] Figure 4 This is a structural schematic diagram of the pressure head module provided in some embodiments from another perspective.

[0026] Figure label:

[0027] 100. Crimping mechanism;

[0028] 110. Bearing component; 111. Bearing plate; 112. Bearing cavity; 113. Positioning hole; 120. Pressure head assembly; 121. Test plate; 1211. Fitting area; 1212. Bending area; 1213. Guide groove; 122. Test copper strip; 123. Base; 124. Pressure block; 125. Elastic element; 1251. Fixing seat; 126. Guide shaft; 1261. Guide block; 127. Counterweight; 128. Buffer; 129. Positioning element;

[0029] 200. Product to be tested. Detailed Implementation

[0030] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0031] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0032] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0033] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0035] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0036] The technical solutions provided by the embodiments of this application are described below with reference to the accompanying drawings.

[0037] See Figure 1 and Figure 2 As shown, this application provides a crimping mechanism 100, which includes a frame, a support assembly 110, and a crimping head assembly 120. The crimping mechanism 100 is used to perform electrical crimping tests on a product under test 200 to test whether the performance of the product under test 200 meets preset requirements. For example, if the product under test 200 is a touch display screen, the crimping mechanism 100 can perform touch crimping tests on the product under test 200. Of course, in other feasible embodiments, the product under test 200 can also be a chip, an electronic control board, etc. This application does not limit the specific component type of the product under test 200.

[0038] A support assembly 110 is mounted on the frame and is used to support the product under test 200. For example, the pressure head assembly 120 includes a support plate 111 and a support cavity 112 disposed on the support plate 111, the support cavity 112 being used to support the product under test 200. Preferably, the support cavity 112 is integrally formed on the support plate 111 by injection molding, extrusion, or other methods, to simplify the molding process of setting the support cavity 112 on the support plate 111. Furthermore, the support cavity 112 is a contoured cavity, facilitating the placement of the product under test 200 and improving the stability of the product under test 200 within the support cavity 112.

[0039] The pressure head assembly 120 is mounted on the frame and can move towards or away from the support assembly 110. The pressure head assembly 120 includes a test plate 121, a test copper strip 122, and wires. The wires are electrically connected to the test copper strip 122, for example, to one end of the test copper strip 122. The wires are used to test the conductivity, communication, etc., of the copper strip 122. The test plate 121 has a bonding area 1211 and a bending area 1212. The bending area 1212 is bent to one side of the bonding area 1211. The test copper strip 122 is located in the bonding area 1211 and can be bonded to the product 200 under test. The wires are located in the bending area 1212. Thus, when the pressure head assembly 120 moves toward the bearing assembly 110, the test copper strip 122 can be attached to the product under test 200, and the electrical continuity test of the product under test 200 can be performed through the test copper strip 122. After the product under test 200 is tested, the pressure head assembly 120 moves away from the bearing assembly 110, which facilitates the unloading and replacement of the product under test 200.

[0040] The aforementioned crimping mechanism 100, because the test plate 121 has a bonding area 1211 and a bending area 1212 bent to one side of the bonding area 1211, the test copper strip 122 is located in the bonding area 1211 and the wire is located in the bending area 1212, during the crimping test of the product under test 200, only the test copper strip 122 contacts the product under test 200, while the wire does not contact the product under test 200. The wire will not interfere with the test of the product under test 200, which can improve the reliability and accuracy of the test results of the product under test 200.

[0041] In one embodiment, see Figures 1-3 As shown, the pressure head assembly 120 also includes a base 123 and a pressure block 124, with the pressure block 124 disposed on the base 123. A test plate 121 covers the outer peripheral surface of the pressure block 124, and the contact area 1211 and the bending area 1212 are not coplanar. For example, if the test plate 121 is a flexible plate, through the flexible deformation of the test plate 121, the test plate 121 can cover the outer peripheral surface of the pressure block 124, ensuring that the contact area 1211 and the bending area 1212 are not coplanar. Thus, during the crimping test of the product under test 200, only the test copper strip 122 contacts the product under test 200, while the wires do not contact the product under test 200. The wires do not interfere with the test of the product under test 200, thereby improving the reliability and accuracy of the test results for the product under test 200.

[0042] It should be noted that in this embodiment, the bending area 1212 is provided with a reinforcing structure to improve the overall structural strength of the test plate 121 and ensure the connection strength between the test plate 121 and the pressure block 124.

[0043] In one embodiment, see Figure 1 and Figure 2 As shown, the pressure head assembly 120 also includes a plurality of elastic elements 125. The plurality of elastic elements 125 are spaced apart along the circumferential direction of the test plate 121, and are used to connect the test plate 121 to the pressure block 124. Exemplarily, as in this embodiment, the pressure block 124 is provided with a fixing seat 1251, and the elastic element 125 is a tension spring. Both ends of the tension spring are provided with hook portions. One hook portion of the tension spring is hooked onto the fixing seat 1251, and the other hook portion is hooked onto the test plate 121, thus connecting the test plate 121 to the pressure block 124 via the tension spring.

[0044] Generally, connecting the test plate 121 and the pressure block 124 using screws or similar methods requires high precision in the locking position and force. Because the test plate 121 is flexible, it is prone to warping and deformation during the locking process. The aforementioned pressing mechanism 100 connects the test plate 121 to the pressure block 124 using multiple elastic elements 125, which are spaced apart along the circumferential direction of the test plate 121. This improves the reliability and stability of the connection between the test plate 121 and the pressure block 124, and allows the test plate 121 to be flexibly connected to the pressure block 124. The elastic deformation of the elastic elements 125 ensures the flatness of the test plate 121 under gravity, improving the tightness of the fit between the test plate 121 and the product under test 200 when the test plate 121 is pressed down and contacts the product under test 200, thereby improving the testing accuracy of the product under test 200. Furthermore, when the test board 121 is attached to the product under test 200, the test board 121 can float slightly and adaptively attach to the surface of the product under test 200, further improving the testing accuracy of the product under test 200.

[0045] In other feasible embodiments, the elastic element 125 can also be a flexible element such as an elastic sheet, silicone part, or plastic part, and the number of elastic elements 125 can be four, six, or other numbers. This application does not limit the specific element type and number of elastic elements 125.

[0046] Further, see Figure 1 , Figure 2 and Figure 4 As shown, the pressure head assembly 120 also includes multiple guide shafts 126, which are spaced apart along the circumferential direction of the base 123. In this embodiment, there are four guide shafts 126, which are respectively located at the four diagonal positions of the base 123. Of course, in other feasible embodiments, there may be two, six, or other numbers of guide shafts 126. This application does not limit the specific number of guide shafts 126.

[0047] The guide shaft 126 extends in the direction of movement of the pressure head assembly 120, and is movably mounted on the frame along its extension direction. Thus, multiple guide shafts 126 achieve a movable connection between the pressure head assembly 120 and the frame, and the guide shafts 126 can guide and limit the movement path of the pressure head assembly 120 towards or away from the support assembly 110, thereby improving the movement accuracy of the pressure head assembly 120. This ensures that the pressure head assembly 120 can be pressed onto the preset position of the product under test 200, improving the testing accuracy of the product under test 200.

[0048] Further, see Figure 1 and Figure 2 As shown, the pressure head assembly 120 also includes a plurality of guide blocks 1261, all of which are disposed on the pressure block 124 and are spaced apart along the circumferential direction of the pressure block 124. The guide blocks 1261 protrude from the outer circumferential surface of the pressure block 124. The number of guide blocks 1261 can be two, four, or other numbers; this application does not limit the specific number of guide blocks 1261.

[0049] The test plate 121 is provided with multiple guide grooves 1213 corresponding to multiple guide blocks 1261, such as the number and position of the guide grooves 1213 corresponding to the guide blocks 1261. The guide grooves 1213 extend in the direction of movement of the indenter assembly 120, and the guide blocks 1261 are movably disposed in the guide grooves 1213. Thus, when the indenter assembly 120 moves toward or away from the product under test 200, the guide blocks 1261 move within the guide grooves 1213 to guide the movement of the indenter assembly 120, thereby improving the movement accuracy of the indenter assembly 120, and further improving the testing reliability and accuracy of the product under test 200 in cooperation with the guide shaft 126.

[0050] Furthermore, see Figure 1 , Figure 2 and Figure 4 As shown, the pressure head assembly 120 also includes a counterweight 127, which is disposed on the base 123. Thus, since the test plate 121 is flexibly connected to the pressure block 124, during the contact process between the test plate 121 and the product under test 200, the test plate 121 may experience warping, deformation, or other defects due to the reaction force of the product under test 200. The counterweight 127 applies a pressing force to the test plate 121. On the one hand, the counterweight 127 can apply a preset pressing force to the product under test 200, ensuring that the product under test 200 undergoes pressing testing under a preset test environment. On the other hand, the counterweight 127 can ensure the tight fit between the test plate 121 and the product under test 200, thereby improving the testing reliability and accuracy of the product under test 200.

[0051] Furthermore, the counterweight 127 is detachably mounted on the base 123, such as by screwing or snapping. By replacing the counterweight 127 with different specifications, the testing environment of the product under test 200 can be adapted to change. The counterweight 127 can be a weight, iron block, or other component with a certain weight mounted on the base 123. This application does not limit the specific type of component used for the counterweight 127.

[0052] In one embodiment, see Figure 1 and Figure 2 As shown, the pressure head assembly 120 also includes a buffer 128. The buffer 128 is disposed between the test plate 121 and the pressure block 124, and is used to buffer the external force acting on the test plate 121. In this embodiment, the buffer 128 can be foam disposed between the test plate 121 and the pressure block 124. Thus, when the pressure head assembly 120 moves toward the product under test 200 and presses against the surface of the product under test 200, the product under test 200 will exert a contact force on the pressure head assembly 120. The buffer 128 buffers and absorbs the contact force, preventing the test plate 121 from deforming or being damaged due to external force during the pressing process, thereby improving the service life of the pressure head assembly 120.

[0053] The buffer 128 can also be a flexible element such as a spring, silicone part, or plastic part. This application does not limit the specific element type of the buffer 128.

[0054] In one embodiment, see Figure 1 and Figure 2 As shown, the pressure head assembly 120 includes multiple positioning elements 129, such as positioning pins protruding from the surface of the base 123. The support plate 111 has multiple positioning holes 113 that mate with the multiple positioning elements 129. Exemplarily, the number and position of the positioning elements 129 correspond to those of the positioning holes 113, and the positioning holes 113 are integrally formed on the support plate 111 by injection molding, extrusion, or other methods to simplify the molding process of opening the positioning holes 113 on the support plate 111.

[0055] When the pressure head assembly 120 moves toward the bearing assembly 110, the positioning member 129 can engage with the positioning hole 113. In this way, the engagement of the positioning member 129 with the positioning hole 113 can ensure the alignment accuracy between the pressure head assembly 120 and the bearing assembly 110, thereby improving the testing reliability and accuracy of the product under test 200.

[0056] Additionally, see Figure 1 and Figure 2As shown, this application also provides a testing device, which includes a crimping mechanism 100 as described above. The testing device is used to perform an electrical crimping test on the product under test 200 to test whether the performance of the product under test 200 meets the preset requirements.

[0057] In the aforementioned testing apparatus, when the pressure head assembly 120 moves towards the bearing assembly 110, the test copper strip 122 can adhere to the product under test 200. Electrical continuity testing is performed on the product under test 200 using the test copper strip 122. After the test of the product under test 200 is completed, the pressure head assembly 120 moves away from the bearing assembly 110, facilitating operations such as unloading and replacing the product under test 200. Since the test board 121 has a bonding area 1211 and a bending area 1212 bent to one side of the bonding area 1211, with the test copper strip 122 located in the bonding area 1211 and the wire located in the bending area 1212, during the crimping test of the product under test 200, only the test copper strip 122 contacts the product under test 200, while the wire does not contact the product under test 200. The wire does not interfere with the test of the product under test 200, thus improving the reliability and accuracy of the test results for the product under test 200.

[0058] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A crimping mechanism, characterized in that, The crimping mechanism includes: frame; A support assembly, which is disposed on the frame, is used to support the product to be tested; A pressure head assembly is disposed on the frame and is movable toward or away from the support assembly. The pressure head assembly includes a test plate, a test copper strip, and a wire electrically connected to the test copper strip. The test plate has a bonding area and a bending area bent to one side of the bonding area. The test copper strip is disposed in the bonding area and can be bonded to the product to be tested. The wire is disposed in the bending area.

2. The crimping mechanism according to claim 1, characterized in that, The pressure head assembly also includes a base and a pressure block disposed on the base, the test plate covers the outer peripheral surface of the pressure block, and the bonding area and the bending area are not coplanar.

3. The crimping mechanism according to claim 2, characterized in that, The pressure head assembly also includes a plurality of elastic elements, which are spaced apart along the circumferential direction of the test plate, and the elastic elements are used to connect the test plate to the pressure block.

4. The crimping mechanism according to claim 2, characterized in that, The pressure head assembly also includes multiple guide shafts, which are spaced apart along the circumferential direction of the base. The guide shafts extend toward the movement direction of the pressure head assembly, are connected to the base, and are movably mounted on the frame along their extension direction.

5. The crimping mechanism according to any one of claims 2 or 4, characterized in that, The pressure head assembly further includes a plurality of guide blocks, which are spaced apart on the pressure block along the circumferential direction of the pressure block; The test plate is provided with multiple guide grooves corresponding to the multiple guide blocks, and the guide grooves extend toward the movement direction of the pressure head assembly, and the guide blocks are movably disposed in the guide grooves.

6. The crimping mechanism according to claim 2, characterized in that, The pressure head assembly also includes a counterweight, which is detachably mounted on the base.

7. The crimping mechanism according to claim 2, characterized in that, The pressure head assembly also includes a buffer element, which is disposed between the test plate and the pressure block to buffer the external force applied to the test plate.

8. The crimping mechanism according to claim 1, characterized in that, The carrier assembly includes a carrier plate and a carrier cavity disposed on the carrier plate, the carrier cavity being used to carry the product to be tested.

9. The crimping mechanism according to claim 8, characterized in that, The pressure head assembly includes multiple positioning elements, and the support plate has multiple positioning holes that mate with the multiple positioning elements; When the pressure head assembly moves toward the bearing assembly, the positioning member can engage with the positioning hole.

10. A testing apparatus, characterized in that, The testing apparatus includes: The crimping mechanism as described in any one of claims 1-9.

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