A test probe assembly and antenna performance testing device
Patent Information
- Application Number
- CN202521918358.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-05
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2035-09-05
AI Technical Summary
[0002]在不良分析场景中，采用现有的射频探针组件测试天线匹配和天线的整体S11性能时，需通过热风枪拆焊射频测试座并180°旋转重焊，属于破坏性测试
[0015]本申请的实施例提供的测试探针组件和测试设备中，通过设置绝缘顶针和馈电探针，在测试时，利用绝缘顶针将射频测试座内部的簧片顶开，以使射频测试座内部的射频端与天线端断开连接，并通过馈电探针与天线端电连接，使得网络分析仪能够与射频测试座的天线端电连接，从而可测试天线匹配以及天线的整体S11性能，也就是说，在测试过程中无需热风枪拆装射频测试座，有效避免了现有拆焊测试导致PCB焊盘剥离、器件热变形等物理损伤的问题；同时，由于测试过程中无需通过热风枪拆焊，避免了热风枪加热导致虚焊改善、应力形变等干扰测试结果的情况，利于真实反映焊点与天线性能；此外，由于测试时无需对待射频测试座进行拆焊测试，也无需复杂的拆焊工具，能适配多场景高效检测，有助于提高测试效率。
Smart Images
Figure CN224708116U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of communication testing equipment technology, and in particular to a test probe assembly and an antenna performance testing device. Background Technology
[0002] In defect analysis scenarios, testing antenna matching and overall S11 performance using existing RF probe assemblies requires desoldering the RF test socket with a hot air gun and rotating it 180° for resoldering, which is a destructive test. This testing method has the following drawbacks: 1. Heating the RF connector with a hot air gun can easily improve the original poor solder joint, thus interfering with the defect analysis results; 2. Repeated desoldering increases the risk of pad damage, leading to an increased rework failure rate; 3. Including cooling time, each test operation is time-consuming, resulting in low testing efficiency; 4. High-frequency signal paths are prone to impedance mismatch due to multiple soldering operations. Utility Model Content
[0003] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a test probe assembly and an antenna performance testing device, which can reduce desoldering damage and improve testing efficiency.
[0004] An embodiment of the first aspect of this application provides a test probe assembly, including a probe body, an insulating pin, and a feeding probe. The insulating pin and the feeding probe are spaced apart on the probe body. The insulating pin is used to abut against a spring of an RF test socket to disconnect the RF terminal inside the RF test socket from the antenna terminal. The feeding probe is electrically connected to a vector network analyzer, and one end of the feeding probe located outside the probe body is used to electrically connect to the antenna terminal of the RF test socket.
[0005] Furthermore, the probe body includes an abutment portion having an abutment end face, the insulating pin and the power supply probe protruding from the abutment end face, the abutment end face being used to abut against the end face of the RF test socket.
[0006] Furthermore, the abutment portion is presented as a cylinder extending along the length direction of the feed probe, and the probe body includes a housing structure. The housing structure is connected to the side of the abutment portion away from the feed probe, and the radius of the cross-sectional profile of the abutment portion is smaller than the radius of the cross-sectional profile of the housing structure.
[0007] Furthermore, both the abutment portion and the housing structure are conductive, and the abutment portion is electrically connected to the housing structure. The abutment portion is also used for grounding connection with the radio frequency test socket.
[0008] Furthermore, the insulating pin is disposed at the center of the abutment end face.
[0009] Furthermore, it also includes an elastic structure, which is installed inside the housing structure, and the power supply probe is installed on the housing structure through the elastic structure, so that the power supply probe can move relative to the housing structure along its own axis.
[0010] Furthermore, the length of the insulating pin is less than the length of the power supply probe.
[0011] Furthermore, the insulating pin is insulated from the probe body.
[0012] Furthermore, the head of the insulating pin is provided with a frustum-shaped guide portion.
[0013] An embodiment of the second aspect of this application provides an antenna performance testing apparatus, including the test probe assembly as described above.
[0014] As can be seen from the above technical solutions, the embodiments of this application have at least the following beneficial effects:
[0015] The test probe assembly and test equipment provided in the embodiments of this application, by setting an insulating pin and a feeding probe, during testing, uses the insulating pin to push open the spring inside the RF test socket, thereby disconnecting the RF end inside the RF test socket from the antenna end, and electrically connecting it to the antenna end through the feeding probe, so that the network analyzer can be electrically connected to the antenna end of the RF test socket, thereby testing the antenna matching and the overall S11 performance of the antenna. In other words, there is no need to use a hot air gun to disassemble and assemble the RF test socket during the test, effectively avoiding the physical damage problems such as PCB pad peeling and component thermal deformation caused by existing desoldering tests. At the same time, since there is no need to use a hot air gun to desolder during the test, the interference of test results caused by hot air gun heating, such as cold solder joint improvement and stress deformation, is avoided, which is conducive to truly reflecting the solder joint and antenna performance. In addition, since there is no need to desolder the RF test socket during the test, and no complicated desoldering tools are required, it can be adapted to multiple scenarios for efficient testing, which helps to improve test efficiency. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the cross-sectional structure of an RF test socket;
[0018] Figure 2 for Figure 1The diagram shows the connection between the RF terminal and the antenna terminal in the RF test socket. In the diagram, a is a schematic diagram of the RF terminal and the antenna terminal being electrically connected through a spring, and b is a schematic diagram of the RF terminal and the antenna terminal being disconnected.
[0019] Figure 3 This is a schematic diagram of the structure of a test probe assembly according to an embodiment of this application;
[0020] Figure 4 This is a schematic diagram of the structure of a test probe assembly according to one embodiment of this application from another perspective;
[0021] Figure 5 This is a schematic diagram of the structure of a test probe assembly according to another embodiment of this application.
[0022] Figure label:
[0023] 10. RF test socket; 11. Through hole; 12. RF terminal; 13. Spring contact; 14. Antenna terminal;
[0024] 110. Probe body; 111. Abutting part; 1111. Abutting end face; 112. Shell structure; 120. Insulating pin; 130. Power supply probe. Detailed Implementation
[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0026] Figure 1 A cross-sectional view of an RF test socket 10 is shown. Figure 1 As shown, the RF test socket 10 includes an RF terminal 12, a spring 13, and an antenna terminal 14. The RF terminal 12 is elastically connected to the antenna terminal 14 via the spring 13 to achieve electrical connection. A through hole 11 is provided in the middle of the RF test socket 10, and the spring 13 is partially located on the extended side of the through hole 11. External forces passing through the through hole 11 and pushing the spring 13 can separate the spring 13 from the antenna terminal 14, thereby disconnecting the RF terminal 12 from the antenna terminal 14.
[0027] See Figure 2 , Figure 2A schematic diagram of the connection state between the RF terminal 12 and the antenna terminal 14 is shown. In the diagram, a is a schematic diagram of the state in which the reed 13 abuts against the antenna terminal 14. At this time, the RF terminal 12 is electrically connected to the antenna terminal 14 through the reed 13. b is a schematic diagram of the state in which the reed 13 is separated from the antenna terminal 14. At this time, the RF terminal 12 is disconnected from the antenna terminal 14.
[0028] See Figures 3 to 5 As shown, an embodiment of the first aspect of this application discloses a test probe assembly, including a probe body 110, an insulating pin 120, and a power supply probe 130.
[0029] Specifically, the insulating pin 120 and the feeding probe 130 are spaced apart on the probe body 110. The insulating pin 120 is used to abut against the spring 13 of the RF test socket 10 so that the RF terminal 12 inside the RF test socket 10 is disconnected from the antenna terminal 14. The feeding probe 130 is electrically connected to the vector network analyzer. The end of the feeding probe 130 located outside the probe body 110 is used to electrically connect to the antenna terminal 14 of the RF test socket 10.
[0030] It is understandable that the insulating pin 120 can pass through the through hole 11 in the middle of the RF test socket 10 and then contact the spring 13. By pressing down the spring 13 with the insulating pin 120, the spring 13 can be separated from the antenna end 14, thereby disconnecting the RF end 12 from the antenna end 14.
[0031] See Figures 1 to 5 The test probe assembly is equipped with an insulating pin 120 and a feed probe 130. During testing, the insulating pin 120 is inserted into the through hole 11 of the RF test socket 10 to push open the spring 13 inside the RF test socket 10, so that the RF terminal 12 inside the RF test socket 10 is disconnected from the antenna terminal 14, and then electrically connected to the antenna terminal 14 through the feed probe 130, so that the network analyzer can be electrically connected to the antenna terminal 14 of the RF test socket 10, thereby testing the antenna matching and the overall S11 performance of the antenna.
[0032] In other words, the RF test socket 10 does not need to be disassembled with a hot air gun during the testing process, effectively avoiding physical damage such as PCB pad peeling and component thermal deformation caused by existing desoldering tests. At the same time, since the hot air gun is not used for desoldering during the testing process, it avoids interference with the test results caused by hot air gun heating, such as cold solder joint improvement and stress deformation, which is conducive to truly reflecting the performance of solder joints and antennas. In addition, since the RF test socket 10 does not need to be desoldered during the test, and there is no need for complicated desoldering tools, the antenna matching and S11 performance can be quickly detected by using a vector network analyzer and test probe assembly, which can be adapted to multiple scenarios for efficient testing and also helps to improve testing efficiency.
[0033] In some embodiments of this application, see Figures 1 to 4 The probe body 110 includes an abutment portion 111, which has an abutment end face 1111. An insulating pin 120 and a feeding probe 130 protrude from the abutment end face 1111, which is used to abut against the end face of the RF test socket 10. During testing, the insulating pin 120 is aligned with the through hole 11 of the RF test socket 10, and the feeding probe 130 is aligned with the antenna end 14. Then, the test probe assembly is attached to the RF test socket 10. At this time, the abutment end face 1111 of the abutment portion 111 abuts against the RF test socket 10, and the insulating pin 120 pushes the spring 13 downward, causing the spring 13 to separate from the antenna end 14. At the same time, the feeding probe 130 abuts against the antenna end 14, thus achieving an electrical connection between the feeding probe 130 and the antenna end 14. By contacting the end face 1111 with the end face of the RF end 12, the insulating pin 120 and the feed probe 130 can be positioned, so that the downward movement distance of the insulating pin 120 and the feed probe 130 is kept within a reasonable range. This avoids the situation where the feed probe 130 is rigidly abutting against the base of the RF test socket 10 due to excessive downward movement, resulting in bending deformation. This helps to ensure that the feed probe 130 is correctly electrically connected to the antenna end 14.
[0034] In some embodiments of this application, see Figure 3 and Figure 4 The contact portion 111 is a cylinder extending along the length of the feed probe 130. The probe body 110 includes a housing structure 112, which is connected to the side of the contact portion 111 away from the feed probe 130. The radius of the cross-sectional profile of the contact portion 111 is smaller than the radius of the cross-sectional profile of the housing structure 112. In other words, the size of the contact portion 111 near the feed probe 130 is smaller than that of the housing structure 112. This allows the contact portion 111 to easily extend into the RF test socket 10, reducing interference between the contact portion 111 and surrounding devices of the RF test socket 10.
[0035] In some embodiments of this application, both the contact portion 111 and the housing structure 112 are conductors, and the contact portion 111 is electrically connected to the housing structure 112. The contact portion 111 is also used to connect to the ground of the RF test socket 10. During testing, the contact portion 111 is connected to the ground of the RF test socket 10, so that the RF test socket 10, the contact portion 111, and the housing structure 112 can form a Faraday cage, thereby shielding the external electromagnetic interference to the feed probe 130 and helping to ensure the accuracy of the test results.
[0036] It is worth noting that one end of the feed probe 130 is located outside the abutment portion 111 and is used for electrical connection with the antenna end 14; the other end of the feed probe 130 is located inside the abutment portion 111 and the housing structure 112 and is electrically connected to the vector network analyzer via a cable.
[0037] The power supply probe 130 is insulated from the contact portion 111 and the housing structure 112. For example, the contact portion 111 is provided with a clearance hole through which the power supply probe 130 passes. The power supply probe 130 protrudes from the clearance hole, and an insulating layer is provided on the outer periphery of the position where the power supply probe 130 contacts the clearance hole of the contact portion 111. In this way, the power supply probe 130 and the contact portion 111 can be insulated from each other.
[0038] In some embodiments of this application, see Figure 3 and Figure 4 An insulating pin 120 is disposed in the middle of the abutment end face 1111. Thus, during the process of inserting the insulating pin 120 into the through hole 11 in the middle of the RF test socket 10, the direction of the force exerted by the abutment portion 111 on the insulating pin 120 can be coaxial with the insulating pin 120, which facilitates the direct transmission of the force to the insulating pin 120 and helps the insulating pin 120 to directly push open the spring 13.
[0039] In some embodiments of this application, the test probe assembly further includes an elastic structure installed within the housing structure 112. The feed probe 130 is mounted on the housing structure 112 via the elastic structure, allowing the feed probe 130 to move relative to the housing structure 112 along its own axis. Thus, when the axial resistance experienced by the feed probe 130 is too great, the feed probe 130 can retract along its own axis, reducing the probability of damage to the feed probe 130.
[0040] It is understandable that in practical applications, the lengths of the insulating pin 120 and the feed probe 130 are specifically set according to the relative positions of the reed 13 and the antenna end 14, so that the insulating pin 120 can push the reed 13 downward and the feed probe 130 can abut against the antenna end 14.
[0041] In one embodiment, the elastic structure includes a spring, one end of which is connected to the housing structure 112 and the other end of which is connected to the feed probe 130. When the end of the feed probe 130 is subjected to a reaction force in the axial direction, the feed probe 130 can compress the spring, thereby contracting.
[0042] In some embodiments of this application, see Figures 1 to 4 The distance between the reed 13 and the end face of the RF test socket 10 is less than the distance between the end face of the RF test socket 10 and the antenna end 14. Based on this, in this embodiment, the length of the insulating pin 120 is less than the length of the feed probe 130, so that while the insulating pin 120 pushes the reed 13 open, it can ensure that the feed probe 130 can contact the antenna end 14.
[0043] In some embodiments of this application, the insulating pin 120 may be made of insulating material or may be formed by forming an insulating layer on the outer periphery of a metal material.
[0044] In this embodiment, the insulating pin 120 includes a metal rod and an insulating layer disposed on the outer periphery of the metal rod. This allows the insulating pin 120 to have good structural rigidity, facilitating the opening of the spring 13 in the RF test socket 10.
[0045] It is understandable that the insulating pin 120 is insulated from the probe body 110 to prevent the spring 13, the insulating pin 120 and the antenna end 14 from forming a conductive path, which would affect the test results.
[0046] In some embodiments of this application, the head of the insulating pin 120 is provided with a frustum-shaped guide portion. This facilitates the insertion of the insulating pin 120 into the through hole 11 of the RF test socket 10, thereby pushing open the spring 13.
[0047] The second aspect of this application discloses an antenna performance testing device, including the test probe assembly as described above, which has all the technical effects of the aforementioned test probe assembly, and will not be repeated here.
[0048] In some embodiments of this application, the antenna performance testing device includes a vector network analyzer and a test probe assembly as described above. The feed probe 130 is electrically connected to the vector network analyzer via a cable. By electrically connecting the test probe assembly to the antenna end of the RF test socket 10, antenna matching and S11 performance can be quickly tested, adapting to efficient testing in multiple scenarios.
[0049] The test probe assembly and antenna performance testing device of this application are described in detail below with reference to a specific embodiment. It should be noted that the following embodiment is merely an exemplary description and should not be construed as limiting the embodiments of this application.
[0050] See Figures 1 to 5 As shown, in this embodiment, the test probe assembly includes an abutment portion 111, an insulating pin 120, and a power supply probe 130. The abutment portion 111 is used to connect to the ground of the RF test socket 10 and ensure that the test probe assembly is tightly engaged with the RF test socket 10. The insulating pin 120 is used to pry open the spring 13 inside the RF test socket 10. The insulating pin 120 is not connected to the ground or the power supply probe 130. The power supply probe 130 is used to connect to the antenna end 14 of the RF test socket 10.
[0051] During testing, align the feed probe 130 of the test probe assembly with the PIN pin of the antenna end 14 of the RF test socket 10, and align the insulating pin 120 with the through hole 11 of the RF test socket 10. Then, after the test probe assembly is attached to the RF test socket 10, connect it to a vector network analyzer to obtain the return loss performance from the RF test socket 10 to the antenna, including antenna matching.
[0052] The test probe assembly and antenna performance testing device of this embodiment have at least the following technical effects:
[0053] 1. Non-destructive testing: The feed probe 130 is directly connected to the antenna end 14, which does not affect the surrounding devices, helps to maintain the original state of the workpiece under test, and ensures that the variables in the analysis process are controllable;
[0054] 2. Zero damage during testing: This embodiment enables solder joint testing without desoldering, eliminating the risk of pad peeling and reducing the damage rate to 0.
[0055] 3. High-efficiency batch processing: This embodiment completes single-test testing within 5 seconds, supporting batch rework inspection and pipeline testing;
[0056] 4. Scenario Expansion: Only a vector network analyzer and test probe components are needed to quickly detect antenna matching and S11 performance. It has low requirements for the test environment and is suitable for a wide range of scenarios.
[0057] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0058] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0059] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0060] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.
[0061] It should be understood that although the steps in the flowcharts of the accompanying figures are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the accompanying figures may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.
Claims
1. A test probe assembly, characterized in that, The device includes a probe body, an insulating pin, and a feeding probe. The insulating pin and the feeding probe are spaced apart on the probe body. The insulating pin is used to abut against the spring of the RF test socket to disconnect the RF terminal from the antenna terminal inside the RF test socket. The feeding probe is electrically connected to a vector network analyzer, and one end of the feeding probe located outside the probe body is used to electrically connect to the antenna terminal of the RF test socket.
2. The test probe assembly according to claim 1, characterized in that, The probe body includes an abutment portion, the abutment portion having an abutment end face, the insulating pin and the power supply probe protruding from the abutment end face, the abutment end face being used to abut against the end face of the RF test socket.
3. The test probe assembly according to claim 2, characterized in that, The abutment portion is a cylinder extending along the length of the feed probe. The probe body includes a housing structure connected to the side of the abutment portion away from the feed probe. The radius of the cross-sectional profile of the abutment portion is smaller than the radius of the cross-sectional profile of the housing structure.
4. The test probe assembly according to claim 3, characterized in that, Both the abutment portion and the housing structure are conductive, and the abutment portion is conductively connected to the housing structure. The abutment portion is also used for grounding connection with the radio frequency test socket.
5. The test probe assembly according to any one of claims 2 to 4, characterized in that, The insulating pin is located at the center of the contact end face.
6. The test probe assembly according to claim 3, characterized in that, It also includes an elastic structure, which is installed inside the housing structure. The power supply probe is mounted on the housing structure through the elastic structure, so that the power supply probe can move relative to the housing structure along its own axis.
7. The test probe assembly according to claim 1, characterized in that, The length of the insulating pin is less than the length of the power supply probe.
8. The test probe assembly according to claim 1, characterized in that, The insulating pin is insulated from the probe body.
9. The test probe assembly according to claim 1, characterized in that, The head of the insulating pin is provided with a frustum-shaped guide portion.
10. An antenna performance testing device, characterized in that, Includes the test probe assembly as described in any one of claims 1 to 9.