Electronic packaging

Abstract

An electronic package includes a carrier board, an electronic module disposed on the carrier board and including electronic components, an optical module electrically connected to the electronic module and including optical communication components, and an electrical connector electrically connected to the electronic module, so as to facilitate the selection of transmission path by simultaneously configuring the optical module and the electrical connector on the carrier board.

Description

Technical Field

[0001] This application relates to a semiconductor packaging technology, and more particularly to an electronic package having an optical module. Background Technology

[0002] With the booming development of the electronics industry, electronic products are gradually moving towards multifunctionality and high performance. The application of current fifth-generation (5G) communication technology has expanded to various fields such as the Internet of Things (IoT), Industrial Internet of Things (IIoT), cloud computing, artificial intelligence (AI), autonomous vehicles, and medical care. As applications expand, a massive amount of data needs to be efficiently transmitted, processed, and stored. In particular, the demand for data transmission is surging, leading industries to replace electricity with optical fiber as the data transmission medium to improve transmission capacity, efficiency, and distance, while reducing energy consumption during transmission.

[0003] Currently, the industry has developed an optical packaging structure, which mainly sets up an optical engine on the substrate. The optical engine includes an electrically driven chip formed in a fan-out stacked package structure (FO-PoP) and an optical chip placed on the FO-PoP. Then, it is connected to the optical chip by an optical fiber so that the optical signal can be transmitted to the optical engine for communication.

[0004] Figure 1A and Figure 1B This is a schematic diagram of a semiconductor package 1 for existing co-packaged optics. (See diagram below.) Figure 1A and Figure 1B As shown, a plurality of optical engines 11a and an electronic module 11b are respectively provided on the substrate 10 of the semiconductor package 1. Each optical engine 11a includes an electronic integrated circuit (EIC) element 12 and a photonic integrated circuit (PIC) element 13 attached above the electronic integrated circuit element 12. One end of the photonic integrated circuit element 13 is connected to an optical fiber 19, and a shelf 14 is provided below the junction of the photonic integrated circuit element 13 and the optical fiber 19.

[0005] However, in order to connect to the optical fiber 19, the end of the photonic integrated circuit element 13 in the aforementioned semiconductor package 1 must be close to or even protrude from the side of the substrate 10. If it is accidentally damaged, the terminal product will be unable to transmit information, causing problems in the application of the terminal product.

[0006] Therefore, overcoming the problems of the existing technologies mentioned above has become a pressing issue that the industry urgently needs to address. Utility Model Content

[0007] In view of the various deficiencies of the prior art, this application provides an electronic package, including: a carrier board; an electronic module disposed on the carrier board and electrically connected to the carrier board and including at least one electronic component; an optical module electrically connected to the electronic module and including an optical communication element; and an electrical connector for connecting a transmission line and electrically connecting the electronic module.

[0008] In the aforementioned electronic package, the optical module serves as an optical engine.

[0009] In the aforementioned electronic package, the optical communication element is a photonic chip.

[0010] In the aforementioned electronic package, the optical communication element is connected to the transmission element, and the transmission element is a fiber optic array element.

[0011] In the aforementioned electronic package, the optical module is mounted on the carrier plate.

[0012] In the aforementioned electronic package, the optical module is disposed on the electronic module.

[0013] In the aforementioned electronic package, the carrier board has a recess for accommodating the electrical connector.

[0014] In the aforementioned electronic package, the carrier board has a first magnetic portion, and the electrical connector is provided with a second magnetic portion so that the second magnetic portion attracts and combines with the first magnetic portion, thereby placing the electrical connector on the carrier board.

[0015] In the aforementioned electronic package, the electrical connector is formed with at least one positioning pin for insertion into a positioning hole on the carrier plate.

[0016] In the aforementioned electronic package, the electrical connector is disposed on the electronic module.

[0017] In the aforementioned electronic package, the electronic module includes a carrier structure, a first electronic component disposed on the carrier structure, a plurality of conductive pillars disposed on the carrier structure, a covering layer formed on the carrier structure to cover the electronic component and the plurality of conductive pillars, a circuit structure formed on the covering layer, and a second electronic component disposed on the circuit structure.

[0018] In the aforementioned electronic package, the optical module includes a carrier structure, a first electronic component disposed on the carrier structure, a plurality of conductive pillars disposed on the carrier structure, a covering layer formed on the carrier structure to cover the first electronic component and the plurality of conductive pillars, and a circuit structure formed on the covering layer. The first electronic component is an electronic integrated circuit (EIC) component.

[0019] As can be seen from the above, the electronic package of this application has both an optical module and an electrical connector configured on the carrier board to facilitate the selection of transmission paths. Therefore, if one of the transmission paths fails, the electronic package of this application can still use the backup transmission path to transmit signals, thereby improving the stability of the product. Attached Figure Description

[0020] Figure 1A This is a cross-sectional schematic diagram of an existing semiconductor package.

[0021] Figure 1B This is a top view schematic diagram of an existing semiconductor package.

[0022] Figure 2A This is a cross-sectional schematic diagram of the first embodiment of the electronic package of this application.

[0023] Figure 2B This is a top view schematic diagram of the first embodiment of the electronic package of this application.

[0024] Figure 3A This is a cross-sectional schematic diagram of a second embodiment of the electronic package of this application.

[0025] Figure 3B This is a top view schematic diagram of a second embodiment of the electronic package of this application.

[0026] Figure 3C for Figure 3A Another enlarged cross-sectional view of a portion of the sample.

[0027] Figure 3D for Figure 3A Other enlarged cross-sectional schematic diagrams of the various states.

[0028] Figure 4A This is a cross-sectional schematic diagram of a third embodiment of the electronic package of this application.

[0029] Figure 4B This is a top view schematic diagram of a third embodiment of the electronic package of this application.

[0030] Figure 5A This is a cross-sectional schematic diagram of the fourth embodiment of the electronic package of this application.

[0031] Figure 5BThis is a partial top view of a fourth embodiment of the electronic package of this application.

[0032] Figure 5C This is a top view schematic diagram of the fourth embodiment of the electronic package of this application.

[0033] Figure 6A This is a cross-sectional schematic diagram of the fifth embodiment of the electronic package of this application.

[0034] Figure 6B This is a top view schematic diagram of the fifth embodiment of the electronic package of this application.

[0035] Explanation of reference numerals in the attached figures

[0036] 1 Semiconductor package

[0037] 10 substrate

[0038] 11a Optical Engine

[0039] 11b, 2b, 6b electronic modules

[0040] 12 Electronic integrated circuit components

[0041] 13 Photonic integrated circuit elements

[0042] 14 supports

[0043] 19 optical fibers

[0044] 2,3,4,5,6 Electronic packages

[0045] 2a Carrier plate

[0046] 20, 30 Load-bearing structure

[0047] 21,31 First Electronic Component

[0048] 22 Second electronic component

[0049] 23,33 Conductive pillars

[0050] 24, 34 Line Structure

[0051] 25,35 coating layers

[0052] 26 Encapsulation layer

[0053] 27,37 Conductive elements

[0054] 28 base rubber

[0055] 3a, 3b Optical Modules

[0056] 32 Optical Communication Components

[0057] 36 Transmission Components

[0058] 39 ribbon cable

[0059] 4a, 4b, 4c Electrical connectors

[0060] 40 slots

[0061] 41 lead pins

[0062] 410 Solder bump

[0063] 5a Functional Components

[0064] 80 positioning feet

[0065] 800 positioning hole

[0066] 81 First Magnetic Section

[0067] 82 Second Magnetic Section

[0068] 90 recess. Detailed Implementation

[0069] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0070] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0071] Figure 2A and Figure 2B This is a cross-sectional view and a top view schematic diagram of the first embodiment of the electronic package 2 of this application. Figure 2A As shown, the electronic package 2 includes a carrier board 2a, an electronic module 2b disposed on the carrier board 2a, at least one optical module 3a disposed on the carrier board 2a, and at least one electrical connector 4a disposed on the carrier board 2a.

[0072] The carrier board 2a is a circuit board, such as a coreless substrate, a substrate with a core layer, a through silicon interposer (TSI) with conductive silicon vias (TSVs), or other board types, and is not limited to the above.

[0073] In this embodiment, at least one functional element 5a, such as an antenna, a heat sink, or a passive element such as a resistor, capacitor, or inductor, can be configured on the carrier board 2a as needed.

[0074] The electronic module 2b includes a carrier structure 20, at least one first electronic component 21 disposed on the carrier structure 20, a plurality of conductive pillars 23 disposed on the carrier structure 20, a covering layer 25 disposed on the carrier structure 20 to cover the first electronic component 21 and the conductive pillars 23, a circuit structure 24 disposed on the covering layer 25, at least one second electronic component 22 disposed on the circuit structure 24, and an encapsulation layer 26 covering the second electronic component 22.

[0075] In this embodiment, the electronic module 2b has a plurality of conductive elements 27 disposed on the carrier structure 20 for placement and electrical connection to the carrier plate 2a. For example, the conductive elements 27 are solder balls or metal bumps such as copper bumps, and these conductive elements 27 can be covered by the adhesive 28 between the carrier plate 2a and the carrier structure 20.

[0076] The load-bearing structure 20 is fabricated using a redistribution layer (RDL) specification, and is electrically connected to the multiple conductive posts 23 and multiple conductive elements 27.

[0077] The first electronic component 21 is an active component, a passive component, or a combination of both, and the active component is, for example, a semiconductor wafer, while the passive component is, for example, a resistor, a capacitor, or an inductor.

[0078] In this embodiment, the first electronic component 21 is a semiconductor wafer, but it is not limited thereto.

[0079] The conductive post 23 is electrically connected to the bearing structure 20 and the circuit structure 24, and the material forming the conductive post 23 is a metal such as copper or solder.

[0080] The covering layer 25 is an insulating material, such as polyimide (PI), dry film, or an encapsulating colloid or molding compound such as epoxy resin.

[0081] In this embodiment, the coating layer 25 can be formed by methods such as liquid compounding, injection, lamination, or compression molding.

[0082] The circuit structure 24 is manufactured using the redistribution layer (RDL) specification, and it electrically connects the multiple conductive pillars 23, the first electronic component 21, and the second electronic component 22.

[0083] The second electronic component 22 is an active component, a passive component, or a combination of both. The active component is, for example, a semiconductor wafer, while the passive component is, for example, a resistor, a capacitor, or an inductor. In this embodiment, the second electronic component 22 is a semiconductor wafer electrically connected to the circuit structure 24, but it is not limited thereto.

[0084] The encapsulation layer 26 is an insulating material, such as polyimide (PI), dry film, or an encapsulating colloid or molding compound such as epoxy resin.

[0085] In this embodiment, the encapsulation layer 26 can be formed using methods such as liquid compounding, injection, lamination, or compression molding. It should be understood that the material of the encapsulation layer 26 may be the same as or different from the material of the covering layer 25.

[0086] The optical module 3a serves as an optical engine (OE) and is electrically connected to the carrier 2a and the electronic module 2b. Its composition is similar to that of the electronic module 2b, except that it includes a carrier structure 30, at least one first electronic component 31 disposed on the carrier structure 30, a plurality of conductive pillars 33 disposed on the carrier structure 30, a covering layer 35 disposed on the carrier structure 30 to cover the first electronic component 31 and the conductive pillars 33, a circuit structure 34 disposed on the covering layer 35, and a plurality of conductive components 37 disposed on the carrier structure 20 to connect to the carrier 2a. The first electronic component 31 is, for example, an electronic integrated circuit (EIC) component, which further includes at least one optical communication component 32 disposed on the circuit structure 34 and a transmission component 36 for communicating with the optical communication component 32. The similarities between the optical module 3a and the electronic module 2b will not be described again here.

[0087] In this embodiment, the optical communication element 32 is a photonic IC that protrudes from the side of the cladding layer 35, and the transmission element 36 is a fiber optic array unit (FAU) that is equipped with a set of ribbon cables 39, such as optical fibers, to transmit signals.

[0088] The electrical connector 4a is a connection port for connecting transmission lines and electrically connects the carrier board 2a and the electronic module 2b. It has at least one slot 40, and the bottom of the slot 40 is provided with a plurality of through-pins 41 so that the through-pins 41 are electrically connected to the carrier board 2a through solder bumps 410.

[0089] The electronic package 2 of this application can be connected to the ribbon cable 39 via the optical communication element 32 and the transmission element 36 to effectively improve reliability and service life.

[0090] Furthermore, the electronic package 2 of this application, through the configuration of the optical module 3a and the electrical connector 4a, facilitates the selection of the transmission path, as shown in the following usage scenarios:

[0091] Scenario 1: When the electronic package 2 is used in a high-speed transmission product, the optical module 3a is used as the main signal transmission path, while the electrical connector 4a is used as the backup transmission path.

[0092] Scenario 2: When the electronic package 2 is used in a product with low-speed transmission, the electrical connector 4a is used as the main signal transmission path, while the optical module 3a is used as the backup transmission path.

[0093] Scenario 3: When the electronic package 2 is used in a product that uses both high and low speed transmission, the optical module 3a and the electrical connector 4a are used as signal transmission paths.

[0094] Furthermore, if a problem occurs in one of the transmission paths of the electronic package 2 of this application, the backup transmission path can still be used for signal transmission, thereby improving the stability of the product.

[0095] In addition, the electronic package 2 can be manufactured using existing semiconductor packaging process materials and equipment, so there is no need to develop new processes or purchase new equipment, and thus no large amount of additional costs are incurred. Therefore, the electronic package 2 of this application can not only reduce the production cost of the final product, but also greatly improve feasibility.

[0096] Figure 3A and Figure 3B This is a cross-sectional and top view schematic diagram of the second embodiment of the electronic package 3 of this application. The difference between this embodiment and the first embodiment lies in the placement of the optical module 3b; other configurations are largely the same, so the similarities will not be described again below.

[0097] like Figure 3A and Figure 3B As shown, the optical module 3b is disposed on the circuit structure 24 and electrically connected to the circuit structure 24 by a conductive element 37.

[0098] In this embodiment, the encapsulation layer 26 does not cover the optical module 3b; or, as Figure 3C As shown, the encapsulation layer 26 can simultaneously cover the second electronic component 22 and the optical module 3b. In other embodiments, such as Figure 3D As shown, the encapsulation layer covering the second electronic component 22 and the optical module 3b may not be formed.

[0099] Figure 4A and Figure 4B This is a cross-sectional and top view schematic diagram of the third embodiment of the electronic package 4 of this application. The difference between this embodiment and the second embodiment lies in the configuration of the electrical connector 4a; other configurations are largely the same, so the similarities will not be described again below.

[0100] like Figure 4A and Figure 4B As shown, the carrier plate 2a has at least one recess 90 to accommodate the electrical connector 4a.

[0101] Figure 5A , Figure 5B and Figure 5C This is a cross-sectional and top view schematic diagram of the fourth embodiment of the electronic package 5 of this application. The difference between this embodiment and the second embodiment lies in the configuration of the electrical connector 4b; other configurations are largely the same, so the similarities will not be described again below.

[0102] like Figure 5A , Figure 5B and Figure 5C As shown, the carrier plate 2a has at least one first magnetic part 81, which is like a magnet, and the bottom of the electrical connector 4b is provided with a second magnetic part 82, which is like a magnet, so that the second magnetic part 82 and the first magnetic part 81 are attracted and combined, so that the electrical connector 4b is disposed on the carrier plate 2a.

[0103] In this embodiment, the bottom of the electrical connector 4b may be formed with at least one positioning foot 80 to be inserted into the positioning hole 800 on the carrier plate 2a, so that the electrical connector 4b is easy to assemble and disassemble.

[0104] Figure 6A and Figure 6B This is a cross-sectional and top view schematic diagram of the fifth embodiment of the electronic package 6 of this application. The difference between this embodiment and the second embodiment lies in the position of the electrical connector 4c; other configurations are largely the same, so the similarities will not be described again below.

[0105] like Figure 6A and Figure 6B As shown, at least one electrical connector 4c is added to the circuit structure 24 of the electronic module 6b, and both the electrical connector 4c and the optical module 3b are located on the electronic module 6b.

[0106] In this embodiment, the first electronic component 21 and the conductive post 23 are also added to the supporting structure 20.

[0107] In summary, the electronic packages 2, 3, 4, 5, 6 of this application simultaneously configure optical modules 3a, 3b and electrical connectors 4a, 4b, 4c on the carrier board 2a to facilitate the selection of transmission paths. Therefore, when one of the transmission paths of the electronic packages 2, 3, 4, 5, 6 of this application encounters a problem, the backup transmission path can still be used for signal transmission, thereby improving the stability of the product.

[0108] In addition, the electronic package 2,3,4,5,6 can be manufactured using existing semiconductor packaging process materials and equipment, so there is no need to develop new processes or purchase new equipment, and thus no large amount of additional costs are incurred. Therefore, the electronic package 2,3,4,5,6 of this application can not only reduce the production cost of the final product, but also greatly improve feasibility.

[0109] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.

Claims

1. An electronic package, characterized in that, include: Carrier plate; An electronic module is disposed on the carrier plate and electrically connected to the carrier plate, and includes at least one electronic component; An optical module, electrically connected to the electronic module and including optical communication elements; as well as Electrical connectors are used to connect transmission lines and electrically connect the electronic module.

2. The electronic package as described in claim 1, characterized in that, This optical module serves as an optical engine.

3. The electronic package as described in claim 1, characterized in that, This optical communication element is a photonic chip.

4. The electronic package as described in claim 1, characterized in that, The optical communication element is connected to the transmission element, and the transmission element is an optical fiber array element.

5. The electronic package as described in claim 1, characterized in that, The optical module is mounted on the carrier plate.

6. The electronic package as claimed in claim 1, characterized in that, The optical module is located on the electronic module.

7. The electronic package as claimed in claim 1, characterized in that, The carrier plate has recesses for accommodating the electrical connector.

8. The electronic package as claimed in claim 1, characterized in that, The carrier plate has a first magnetic part, and the electrical connector is provided with a second magnetic part so that the second magnetic part and the first magnetic part attract and combine, so that the electrical connector is disposed on the carrier plate.

9. The electronic package as claimed in claim 1, characterized in that, The electrical connector is formed with positioning feet for insertion into positioning holes on the carrier board.

10. The electronic package as claimed in claim 1, characterized in that, The electrical connector is located on the electronic module.

11. The electronic package as claimed in claim 1, characterized in that, The electronic module includes a carrier structure, a first electronic component disposed on the carrier structure, a plurality of conductive pillars disposed on the carrier structure, a covering layer formed on the carrier structure to cover the electronic component and the plurality of conductive pillars, a circuit structure formed on the covering layer, and a second electronic component disposed on the circuit structure.

12. The electronic package as claimed in claim 1, characterized in that, The optical module includes a carrier structure, a first electronic component disposed on the carrier structure, a plurality of conductive pillars disposed on the carrier structure, a covering layer formed on the carrier structure to cover the first electronic component and the plurality of conductive pillars, and a circuit structure formed on the covering layer.

13. The electronic package as claimed in claim 12, characterized in that, The first electronic component is an electronic integrated circuit component.

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