A light engine
Patent Information
- Application Number
- CN202521762486.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-19
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2035-08-19
AI Technical Summary
而该结构在粘接光纤阵列的时候存在多种公差叠加,会导致在透镜耦合时,耦合损耗较大,对耦合要求较高
[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: An optical engine, by setting the optical fiber array on the side wall of the mounting groove, avoids the bonding tolerance between the optical fiber array and the pad, as well as the bonding tolerance between the pad and the bottom of the mounting groove, which greatly reduces coupling loss, improves yield, and better meets the optical power requirements of 2km, 10km and above. At the same time, it avoids the reliability risk caused by excessively thick adhesive layer at the optical fiber array and the pad, and avoids the mechanical interference risk caused by excessively thin adhesive layer. Moreover, it saves the component cost of the pad and the management cost of pad grading.
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Figure CN224708264U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical communication technology, specifically to an optical engine. Background Technology
[0002] from Figure 1 and Figure 2 Existing fiber optic arrays are typically attached to the bottom of the housing using spacers to compensate for the required height. The optical path of the fiber optic array needs to be aligned with the optical path of the laser emitted by the laser chip. However, this structure introduces multiple tolerances during fiber optic array bonding, leading to significant coupling loss during lens coupling and thus requiring high precision in coupling. Utility Model Content
[0003] The purpose of this invention is to provide a light engine that can at least solve some of the defects in the prior art.
[0004] To achieve the above objectives, the present invention provides the following technical solution: an optical engine, comprising a housing with a mounting slot, and further comprising an optical emitting module for outputting a light beam and an optical fiber array for receiving the light beam, wherein the optical emitting module and the optical fiber array are both disposed in the mounting slot, and the optical fiber array is mounted on the side wall of the mounting slot.
[0005] Furthermore, the fiber array is bonded to the side wall of the mounting groove with adhesive.
[0006] Furthermore, the optical emission module includes a laser array and a lens array, and the laser beam output by the laser array is collimated by the lens array and then output to the optical fiber array.
[0007] Furthermore, the laser array includes four lasers arranged side by side, the lens array includes four lenses corresponding to the four lasers, and the fiber array includes four receiving ends corresponding to the four laser beams.
[0008] Furthermore, the lens is a silicon lens.
[0009] Furthermore, an isolator is provided on the optical path of the fiber array near the optical emitting module.
[0010] Furthermore, the number of isolators is consistent with and corresponds one-to-one with the number of lasers in the optical emission module.
[0011] Furthermore, it also includes a semiconductor cooler for regulating the temperature of the light emitting module.
[0012] Furthermore, the semiconductor cooler is disposed on the bottom of the mounting groove, and the light emitting module is disposed on the semiconductor cooler.
[0013] Furthermore, the semiconductor cooler is bonded to the bottom of the mounting groove.
[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: An optical engine, by setting the optical fiber array on the side wall of the mounting groove, avoids the bonding tolerance between the optical fiber array and the pad, as well as the bonding tolerance between the pad and the bottom of the mounting groove, which greatly reduces coupling loss, improves yield, and better meets the optical power requirements of 2km, 10km and above. At the same time, it avoids the reliability risk caused by excessively thick adhesive layer at the optical fiber array and the pad, and avoids the mechanical interference risk caused by excessively thin adhesive layer. Moreover, it saves the component cost of the pad and the management cost of pad grading. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the structure of a traditional light engine;
[0016] Figure 2 for Figure 1 A schematic diagram of the structure from the main viewpoint;
[0017] Figure 3 A schematic diagram of the structure of a light engine provided in an embodiment of this utility model;
[0018] Figure 4 for Figure 3 A schematic diagram of the structure from the main viewpoint;
[0019] In the attached diagram, the following labels are used: 1-tube shell; 2-mounting slot; 3-light emitting module; 4-laser; 5-fiber array; 6-lens array; 7-isolator; 8-semiconductor cooler; 9-adhesive application point; 10-pad. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.
[0021] Please see Figure 3 and Figure 4This utility model provides an optical engine, including a housing 1 with a mounting groove 2, an optical emitting module 3 for outputting a light beam, and an optical fiber array 5 for receiving the light beam. Both the optical emitting module 3 and the optical fiber array 5 are disposed in the mounting groove 2, and the optical fiber array 5 is mounted on the side wall of the mounting groove 2. In this embodiment, the housing 1 is recessed to form the mounting groove 2, and all components are disposed within this groove. By placing the optical fiber array 5 on the side wall of the mounting groove, the bonding tolerance between the optical fiber array 5 and the pad 10, as well as the bonding tolerance between the pad 10 and the bottom of the mounting groove, is avoided, greatly reducing coupling loss, improving yield, and better meeting the optical power requirements of 2km, 10km, and above. It also avoids the reliability risks caused by excessively thick adhesive layers at the optical fiber array 5 and the pad 10, and the mechanical interference risks caused by excessively thin adhesive layers. Furthermore, it eliminates the component costs of the pad 10 and the management costs of grading the pad 10. In contrast, in conventional technologies, such as... Figure 1 and Figure 2 The fiber optic array 5 is mounted on the bottom of the trench via a spacer 10. This creates tolerance issues with the adhesive between the fiber optic array 5 and the spacer 10, as well as with the adhesive between the spacer 10 and the trench bottom. This embodiment cleverly eliminates the spacer 10, as... Figure 4 As shown, the bottom of the fiber optic array 5 is suspended, and the fiber optic array 5 is directly placed on the side wall of the mounting groove 2. This not only saves the cost of the pad 10, but also reduces the tolerance accumulation caused by the pad 10, avoiding many risks. Preferably, the side wall of the mounting groove 2 has an adhesive dot 9, and the adhesive dot 9 is marked with a scale, which can provide a distance reference for the movement of the fiber optic array 5 and facilitate coupling.
[0022] Please see Figure 3 and Figure 4 The fiber optic array 5 is bonded to the side wall of the mounting groove 2 using adhesive. In this embodiment, the fiber optic array 5 and the mounting groove 2 can be bonded using adhesive, including but not limited to UV adhesive. Alternatively, a slot or other structure can be designed on the mounting groove 2 to facilitate the positioning and installation of the fiber optic array 5.
[0023] Please see Figure 3 and Figure 4The optical emitting module 3 includes a laser array and a lens array 6. The laser beam output from the laser array is collimated by the lens array 6 and then output to the fiber array 5. In this embodiment, the optical emitting module 3 is refined, consisting of lasers 4 and lenses. There are multiple lasers 4, such as the four lasers 4 arranged side by side as shown in this embodiment, and four lenses that match them, both forming an array. The lenses can be selected as needed, such as for collimation or focusing. Silicon lenses can be used. The fiber array 5 is designed with four receiving ends corresponding to the four lasers 4, so that the four laser beams after passing through the lenses can enter the fiber array 5. The four lenses are also arranged side by side, just like the four lasers 4.
[0024] Please see Figure 3 and Figure 4 An isolator 7 is provided on the optical path of the fiber array 5 near the optical transmitting module 3. In this embodiment, the isolator 7 is provided at the front end of the fiber array 5 to avoid interference from reverse light on the optical path and ensure that the optical signal is transmitted in a single direction. Preferably, the number of isolators 7 is consistent with the number of lasers 4 in the optical transmitting module 3 and corresponds one-to-one, with one isolator 7 provided on each optical path, and the four isolators 7 are arranged in a straight line.
[0025] Please see Figure 3 and Figure 4 The optical engine also includes a thermoelectric cooler 8 for regulating the temperature of the light emitting module 3. In this embodiment, the thermoelectric cooler 8 (TEC) is designed to regulate the operating environment of the light emitting module 3, which is beneficial to the stable output of the laser 4. Preferably, the thermoelectric cooler 8 is disposed on the bottom of the mounting groove 2, and the light emitting module 3 is disposed on the thermoelectric cooler 8. The thermoelectric cooler 8 can be disposed on the bottom of the mounting groove 2, that is, sandwiched between the light emitting module 3 and the bottom of the mounting groove 2, so as to facilitate the regulation of the operating temperature of the light emitting module 3. Preferably, the size of the thermoelectric cooler 8 is consistent with the space inside the groove, which can facilitate the embedding of the thermoelectric cooler 8 into the mounting groove 2, and then glued to the bottom of the mounting groove 2.
[0026] Please see Figure 3 and Figure 4 The tube shell 1 is cubic in shape and has an opening on one side wall. The fiber array 5 is located near the opening, and the output end of the fiber array 5 faces the opening, which facilitates the installation of the fiber.
[0027] Please see Figure 3 and Figure 4During assembly, the distance from the laser chip 4 on the light emitting module 3 to the bottom of the slot in the housing 1 is first measured. Then, the required distance between the fiber array 5 and the bottom of the slot in the housing 1 is calculated. At this point, the fiber array 5 is pressed down by the nozzle of the pick-and-place machine. The pressure sensor confirms that the fiber array 5 has touched the bottom of the slot in the housing 1, and this position is recorded as the zero point. Then, the nozzle is moved upward to the required distance between the fiber array 5 and the bottom of the slot in the housing 1. Next, adhesive is applied, and the adhesive is cured to fix the fiber array 5 to the side wall of the housing 1. In this embodiment, the bonding position of the fiber array 5 can be freely adjusted, which substantially helps to improve the coupling efficiency of the subsequent lens coupling. It saves spacer 10 parts while improving coupling efficiency.
[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A light engine, comprising a housing having a mounting slot, characterized in that: It also includes an optical emitting module for outputting a light beam and an optical fiber array for receiving the light beam, both of which are disposed in the mounting slot, and the optical fiber array is mounted on the side wall of the mounting slot.
2. A light engine as described in claim 1, characterized in that: The fiber optic array is bonded to the side wall of the mounting slot with adhesive.
3. A light engine as described in claim 1, characterized in that: The optical emission module includes a laser array and a lens array. The laser beam output by the laser array is collimated by the lens array and then output to the optical fiber array.
4. A light engine as described in claim 3, characterized in that: The laser array includes four lasers arranged side by side, the lens array includes four lenses corresponding to the four lasers, and the fiber array includes four receiving ends corresponding to the four laser beams.
5. A light engine as described in claim 4, characterized in that: The lens is a silicon lens.
6. A light engine as described in claim 1, characterized in that: An isolator is provided on the optical path of the fiber array near the optical transmitting module.
7. A light engine as described in claim 6, characterized in that: The number of isolators corresponds to the number of lasers in the optical emission module.
8. A light engine as described in claim 1, characterized in that: It also includes a semiconductor cooler for regulating the temperature of the light-emitting module.
9. A light engine as described in claim 8, characterized in that: The semiconductor cooler is disposed on the bottom of the mounting groove, and the light emitting module is disposed on the semiconductor cooler.
10. A light engine as described in claim 8, characterized in that: The semiconductor cooler is bonded to the bottom of the mounting groove.