A coaxial TO-CAN packaged optical transmitting component

Abstract

The utility model relates to the field of optical communication technology provides a kind of coaxial TO-CAN encapsulated light emitting component, including base, further include the heat sink for heat conduction, the heat sink is equipped with light-emitting chip and several pads, each the pad is electrically connected with the base, at least one group of adjacent two pads between being equipped with the film resistance for generating heat.The utility model relates to a kind of coaxial TO-CAN encapsulated light emitting component, by the pad between the heat sink is set film resistance, i.e. can avoid the installation of film resistance to occupy the position on the heat sink, also can provide heat and be passed to light-emitting chip by heat sink, to increase power consumption as cost, improve the low-temperature performance of product, satisfy industrial grade application demand.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, specifically to a coaxial TO-CAN packaged optical transmitting component. Background Technology

[0002] Currently, most high-speed multimode short-range modules use COB packaging to meet commercial-grade temperature requirements. However, for industrial applications, coaxial TO-CAN hermetically sealed packaging is necessary. The most common high-speed multimode product solution on the market uses a 7-pin high-frequency base with a flat-window lens, coupled to a PEI adapter. This solution offers advantages such as low material cost and simple manufacturing process; however, it suffers from poor EMI performance, poor anti-reflection performance, and lack of support for operating temperatures. Utility Model Content

[0003] The purpose of this invention is to provide a coaxial TO-CAN packaged optical emitting component, which can at least solve some of the defects in the prior art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a coaxial TO-CAN packaged light emitting component, including a base and a heat sink for heat conduction, wherein the heat sink is provided with a light-emitting chip and a plurality of pads, each of the pads being electrically connected to the base, and at least one set of two adjacent pads being provided with a thin-film resistor for generating heat.

[0005] Furthermore, the thin-film resistor is attached to the sidewall of the pad.

[0006] Furthermore, the base is also equipped with a backlight detector, the heat sink is disposed on the backlight detector, and the backlight detector is electrically connected to the base.

[0007] Furthermore, the heat sink is bonded to the backlight detector using insulating adhesive.

[0008] Furthermore, it also includes a cap covering the base, wherein the heat sink, the solder pad, and the thin-film resistor are all located within the coverage area of ​​the cap.

[0009] Furthermore, the cap is welded to the base.

[0010] Furthermore, it also includes an adapter with a ceramic insert, the adapter being disposed on the cap.

[0011] Furthermore, the adapter has a converging lens on the side facing the cap.

[0012] Furthermore, the adapter is a metal adapter, which covers part of the cap.

[0013] Furthermore, the base is a Kovar base or a ceramic base.

[0014] Compared with the prior art, the beneficial effects of this utility model are: a coaxial TO-CAN packaged light emitting component, by setting thin film resistors between the pads on the heat sink, can avoid the thin film resistors occupying the space on the heat sink, and can also provide heat and transfer it to the light-emitting chip through the heat sink. At the cost of increased power consumption, it improves the low-temperature performance of the product and meets the needs of industrial applications. Attached Figure Description

[0015] Figure 1 An exploded view of a coaxial TO-CAN packaged optical emitting component provided for an embodiment of this utility model;

[0016] Figure 2 A cross-sectional structural diagram of a coaxial TO-CAN packaged optical emitting component provided for an embodiment of this utility model;

[0017] Figure 3 A schematic diagram of the structure of the components on the base of a coaxial TO-CAN packaged optical emitting assembly provided for an embodiment of this utility model;

[0018] Figure 4 A schematic diagram of the structure of the components on the base of a coaxial TO-CAN packaged optical emitting assembly after wire bonding, provided for an embodiment of this utility model;

[0019] In the attached diagram, the following labels are used: 1-base; 2-heat sink; 3-pad; 4-thin film resistor; 5-backlight detector; 6-cap; 7-adapter; 8-converging lens; 9-light-emitting chip. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0021] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4This utility model provides a coaxial TO-CAN packaged light emitting component, including a base 1 and a heat sink 2 for heat conduction. The heat sink 2 has a light-emitting chip 9 and several pads 3, each of which is electrically connected to the base 1. At least one set of adjacent pads 3 has a thin-film resistor 4 for generating heat between them. In this embodiment, by placing the thin-film resistor 4 between the pads 3 on the heat sink 2, the mounting of the thin-film resistor 4 can avoid occupying space on the heat sink 2, while providing heat and transferring it to the light-emitting chip 9 through the heat sink 2. This improves the low-temperature performance of the product at the cost of increased power consumption, meeting the requirements of industrial applications. Since the thin-film resistor 4 has almost no thickness, it can be cleverly placed between two pads 3, avoiding covering the heat sink 2 and occupying space. The operating current of the thin-film resistor 4 reaches several hundred milliamps. When the light-emitting chip 9 performs poorly at low temperatures, the temperature of the light-emitting chip 9 is increased by the heat generated by the thin-film resistor 4. The pads 3 on the heat sink 2 facilitate connection to the pins of the base 1. Preferably, the base 1 is a high-frequency base, and its pins are connected to the chip electrodes through input lines to realize the electro-optical conversion function. The light-emitting chip 9 is used to convert electrical signals into optical signals and is encapsulated on the heat sink 2 using silver paste. The base 1 is either a Kovar base 1 or a ceramic base 1. When using a Kovar base 1, the surface is nickel-plated and gold-plated, and the metal and glass parts are sintered using a high-temperature solder sintering process. When using a ceramic base 1, the metal connection between the upper and lower surfaces is achieved through metal vias. The heat sink 2 is made of aluminum nitride or aluminum nitride material, and the upper surface has segmented gold-plated pads 3 to shorten the signal line bonding length and improve product performance.

[0022] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 The thin-film resistor 4 is attached to the sidewall of the pad 3. In this embodiment, the thin-film resistor 4 is very thin, almost without thickness, which allows it to be attached to the sidewall of the pad 3.

[0023] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 The base 1 is also equipped with a backlight detector 5, and the heat sink 2 is disposed on the backlight detector 5. The backlight detector 5 is electrically connected to the base 1. Preferably, the heat sink 2 is bonded to the backlight detector 5 with insulating adhesive. In this embodiment, the backlight detector 5 is disposed on the base 1 to monitor the magnitude of reflected light within the TO cavity, and monitors the magnitude of light emitted from the chip by converting it according to a certain ratio. The received reflected light signal can be converted into an electrical signal, mainly used for optical power monitoring, and is encapsulated on the base 1 with an insulating adhesive patch.

[0024] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 The optical emitting assembly also includes a cap 6 covering the base 1. The heat sink 2, the solder pad 3, and the thin-film resistor 4 are all located within the coverage area of ​​the cap 6. The cap 6 is welded to the base 1. In this embodiment, the function of the cap 6 is to ensure the airtightness of the entire TO-CAN, and it is welded to the base 1 by resistance welding. The cap 6 is made of metal and is formed by die-casting or high-temperature sintering of metal and glass components. The glass component can be a flat window glass plate or a lens.

[0025] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 The optical transmitting assembly also includes an adapter 7 with a ceramic ferrule, which is disposed on the cap 6. Preferably, the adapter 7 is a metal adapter 7, which covers part of the cap 6. In this embodiment, the adapter 7 can be an XMD single-ring structure or a double-ring structure, and its main function is to convert the light emitted by the laser into an optical fiber converter. The adapter 7 uses an austenitic stainless steel shell and has a ceramic ferrule inside, which can be connected to an external optical fiber for transmitting optical signals. Using the adapter 7 with a ceramic ferrule, higher return loss parameters can be obtained by controlling the APC angle of the ceramic ferrule to meet the high return loss requirements of special customers. Using the metal shell adapter 7 is equivalent to adding another layer of metal shielding outside the TO-CAN, effectively improving the EMI performance of the entire product.

[0026] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 The adapter 7 has a converging lens 8 on the side facing the cap 6. In this embodiment, the converging lens 8 is installed between the TO-CAN and the end face of the adapter 7. The Gaussian beam emitted by the TO-CAN is converted into converging light by the lens, and the converged light is coupled into the adapter 7. The converging lens 8 can be passively bonded or actively coupled, and is bonded to the adapter 7 with adhesive.

[0027] The assembly method of this optical emitting component is as follows:

[0028] Step 1: Attach a backlight detector 5 to the center of the base 1 with insulating adhesive. After baking and curing, attach the heat sink 2 to the backlight detector 5 with insulating adhesive, aligning the top and bottom edges with the edges of the backlight detector 5. Bake and cure a second time. Finally, attach the light-emitting chip 9 to the heat sink 2 with silver paste, aligning the light-emitting area of ​​the chip with the center of the base 1. Bake and cure a third time.

[0029] Step 2: Complete the gold wire bonding process to form a structure like... Figure 4 The structure shown.

[0030] Step 3: Using resistance welding to seal the cap, the cap 6 is welded to the component completed in Step 2 above to form an airtight structure and complete the TO fabrication;

[0031] Step 4: Use epoxy resin adhesive to directly fix the focusing lens 8 into the mounting hole on the adapter 7, and bake to cure;

[0032] Step 5: Couple the components completed in Step 3 with those completed in Step 4 on the automatic coupling equipment to achieve light-seeking. After ensuring that the output light power reaches the target value, pre-cure with UV adhesive, then fill with epoxy resin adhesive and bake at high temperature for secondary curing. Assembly is then complete.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A coaxial TO-CAN packaged optical emitting component, comprising a base, characterized in that: It also includes a heat sink for heat conduction, on which a light-emitting chip and several pads are provided, each of the pads being electrically connected to the base, and at least one set of two adjacent pads being provided with a thin-film resistor for generating heat.

2. The optical emitting component in a coaxial TO-CAN package as described in claim 1, characterized in that: The thin-film resistor is attached to the sidewall of the pad.

3. The optical emitting component in a coaxial TO-CAN package as described in claim 1, characterized in that: The base is also equipped with a backlight detector, the heat sink is disposed on the backlight detector, and the backlight detector is electrically connected to the base.

4. The optical emitting component in a coaxial TO-CAN package as described in claim 3, characterized in that: The heat sink is bonded to the backlight detector with insulating adhesive.

5. The optical emitting component in a coaxial TO-CAN package as described in claim 1, characterized in that: It also includes a cap covering the base, wherein the heat sink, the solder pad, and the thin-film resistor are all located within the coverage area of ​​the cap.

6. The optical emitting component in a coaxial TO-CAN package as described in claim 5, characterized in that: The cap is welded to the base.

7. A coaxial TO-CAN packaged optical emitting component as described in claim 5, characterized in that: It also includes an adapter with a ceramic insert, the adapter being disposed on the cap.

8. A coaxial TO-CAN packaged optical emitting component as described in claim 7, characterized in that: The adapter has a converging lens on the side facing the cap.

9. A coaxial TO-CAN packaged optical emitting component as described in claim 7, characterized in that: The adapter is a metal adapter, which covers part of the cap.

10. A coaxial TO-CAN packaged optical emitting component as described in claim 1, characterized in that: The base is a Kovar base or a ceramic base.

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