A MEMS galvanometer mirror protection structure

Abstract

This invention provides a protective structure for a MEMS galvanometer mirror, including an actuator chip body, a MEMS galvanometer mirror, and a top cover. The top cover is disposed on the actuator chip body via a biodegradable adhesive layer, forming a cavity between the top cover and the actuator chip body. The MEMS galvanometer mirror is mounted on the actuator chip body, housed within the cavity, and is in a non-contact state with the top cover. The biodegradable adhesive layer connects the top cover and the actuator chip body to form a cavity, physically isolating the MEMS galvanometer mirror from the external environment, preventing scratches and contamination of the mirror due to contact, collision, or dust during manufacturing, transportation, and assembly. The biodegradable adhesive layer can be completely removed, achieving non-destructive peeling of the top cover, ensuring sealing stability during protection while avoiding secondary damage to the mirror during removal, thus improving product yield and reliability.

Description

Technical Field

[0001] This utility model belongs to the field of microelectromechanical systems (MEMS) technology, specifically relating to a MEMS galvanometer mirror protection structure. Background Technology

[0002] MEMS (Micro-Electro-Mechanical Systems) piezoelectric fast reflectors, as a type of high-precision optical deflection device based on MEMS technology and piezoelectric driving principle, have been widely used in cutting-edge fields such as adaptive optics systems, laser communication, precision optical measurement and aerospace remote sensing due to their significant advantages such as small size (typically in the millimeter to centimeter range), fast response speed (microsecond to millisecond range), high deflection accuracy (arcsecond range).

[0003] The core functional area of ​​a MEMS piezoelectric fast reflector, namely the reflective mirror, typically requires extremely high surface precision. Its surface roughness often needs to be controlled at the nanometer level. Furthermore, to ensure good optical reflection performance, the mirror surface is usually coated with multiple layers of high-reflectivity optical thin films, such as gold, silver, aluminum, or dielectric films. These high-precision optical thin films, as well as the mirror substrate material itself, are susceptible to irreversible physical scratches and indentations during the manufacturing, transportation, storage, and subsequent integration and assembly of MEMS piezoelectric fast reflectors. These scratches and indentations can occur due to factors such as operator hand contact, tool impacts, or environmental particles, directly leading to device performance degradation or even failure, severely restricting product yield and reliability.

[0004] To address these challenges, the industry currently relies on several protection solutions, but all have inherent drawbacks. Sealing in dry, clean containers offers only limited protection during storage and transportation, failing to protect against physical contact risks during manufacturing and assembly. While protective tapes are easy to use, their adhesiveness is difficult to control precisely: excessive adhesion can cause optical films to peel off or damage the mirror substrate, while insufficient adhesion can lead to self-detachment; furthermore, the application process can generate air bubbles or gaps, resulting in incomplete protection, and some tapes can cause mirror contamination due to material migration. Peelable coating technology avoids the adhesion problems of tapes, but its coating uniformity is difficult to guarantee, easily forming areas that are too thick or too thin at mirror edges or microstructures, affecting accuracy and protective effectiveness; coating curing often requires specific conditions (such as high temperatures), potentially affecting the performance of piezoelectric components; and coating removal relies on specific solvents, posing a risk of mirror corrosion or secondary contamination from solvent residue.

[0005] Therefore, there is an urgent need to provide a MEMS galvanometer mirror protection structure to provide reliable, safe and residue-free protection for the MEMS piezoelectric fast reflector mirror. Utility Model Content

[0006] This invention addresses all or part of the problems in the prior art by providing a MEMS galvanometer mirror protection structure. The upper cover and the actuator chip body are connected by a biodegradable adhesive layer to form a closed cavity, placing the MEMS galvanometer mirror within the cavity and isolating it from the external environment. This prevents mirror scratches, film damage, and contamination caused by personnel contact, tool collisions, or environmental dust during subsequent stages such as manufacturing, transportation, and assembly. Furthermore, the biodegradable adhesive layer allows for the non-destructive removal of the upper cover, ensuring a stable seal during protection. This also avoids secondary damage to the mirror that may be caused by traditional tapes or coatings during removal, improving the yield and reliability of the MEMS galvanometer in the production and packaging processes.

[0007] This invention provides a protective structure for a MEMS galvanometer mirror, including an actuator chip body, a MEMS galvanometer mirror, and a top cover. The top cover is disposed on the actuator chip body via a biodegradable adhesive layer, forming a cavity between the top cover and the actuator chip body. The MEMS galvanometer mirror is mounted on the actuator chip body, housed within the cavity, and is in a non-contact state with the top cover. The biodegradable adhesive layer connects the top cover and the actuator chip body to form a cavity, physically isolating the MEMS galvanometer mirror from the external environment, preventing scratches and contamination of the mirror due to contact, collision, or dust during manufacturing, transportation, and assembly. The biodegradable adhesive layer can be completely removed, achieving non-destructive peeling of the top cover, ensuring sealing stability during protection while avoiding secondary damage to the mirror during removal, thus improving product yield and reliability.

[0008] The actuator chip body is bonded to the MEMS galvanometer mirror. The bonding connection establishes a robust and stable mechanical fixation and an efficient energy transfer path, ensuring the efficient transfer of driving energy from the actuator to the mirror. At the same time, its excellent structural stability can effectively resist vibration and impact during transportation and use, ensuring the long-term reliability and performance consistency of the device.

[0009] The upper cover has a box-like structure, including a top cover and sidewalls extending downward from the edge of the top cover. The top cover and the downward-extending sidewalls form a closed protective cavity, ensuring that the internal MEMS galvanometer mirrors are isolated from the external environment, providing a comprehensive physical barrier to prevent accidental contact and contamination during operation.

[0010] The top cover has a rectangular structure, and the sidewalls are rectangular frame structures perpendicular to the top cover. This facilitates the alignment and connection between the top cover and the actuator chip body, providing a reliable protective structure.

[0011] The bottom of the sidewall is connected to the upper surface of the actuation chip body via the biodegradable adhesive layer. This provides uniform support and stable mechanical fixation for the upper cover, forming a continuous and reliable sealing structure that effectively isolates the external environment.

[0012] The inner wall spacing of the opposing sidewalls is greater than the diameter of the MEMS galvanometer mirror surface. This ensures that the MEMS galvanometer mirror surface remains in non-contact with the upper cover, protecting the MEMS galvanometer mirror surface structure.

[0013] The actuator chip body has a groove, and the central axis of the groove coincides with the central axis of the actuator chip body. This ensures that the optical center of the MEMS galvanometer mirror coincides with the drive center, improving device accuracy and long-term operational stability.

[0014] The MEMS galvanometer mirror is bonded to the groove, and the central axis of the MEMS galvanometer mirror coincides with the central axis of the groove. This ensures that the optical center of the mirror is aligned with the drive center, suppresses mirror tilting and motion coupling caused by deviation, and improves the pointing accuracy, motion stability, and long-term operational reliability of the device.

[0015] The biodegradable adhesive layer is a pyrolytic tape. This facilitates reliable fixing and controlled removal of the top cover. The top cover is peeled off cleanly through thermal control, effectively avoiding issues of mirror contamination or corrosion.

[0016] The upper cover material can be polyetheretherketone, polyimide, surface-passivated titanium alloy, or surface-passivated aluminum alloy. It features lightweight construction, high mechanical strength, and high environmental stability, effectively preventing contamination of the internal cavity. The diverse material selection allows for flexible adaptation to various application scenarios.

[0017] Compared with existing technologies, the advantages of this invention are as follows: It provides a protective structure for the mirror surface of a MEMS galvanometer. A biodegradable adhesive layer connects the upper cover to the actuator chip body, forming a cavity that isolates the MEMS galvanometer mirror surface from the external environment. This effectively prevents scratches, film damage, or contamination of the mirror surface caused by personnel contact, tool collisions, or dust intrusion during manufacturing, transportation, and assembly. Subsequent controlled degradation of the biodegradable adhesive layer allows for the non-destructive peeling of the upper cover. This ensures the structural sealing and stability during the protection period, while avoiding secondary damage to the mirror surface caused by traditional tapes or coatings during removal, thus improving the product yield and long-term reliability of MEMS galvanometers throughout the entire production and packaging process. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1A schematic diagram of the MEMS galvanometer mirror protection structure provided by this utility model.

[0020] Figure 2 A schematic diagram of the upper cover structure provided by this utility model.

[0021] Figure reference numerals: 1-Actuation chip body, 2-MEMS galvanometer mirror surface, 3-Upper cover, 31-Top cover, 32-Side wall, 4-Degradable adhesive layer. Detailed Implementation

[0022] The following description and accompanying drawings fully illustrate specific embodiments of the present invention to enable those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, procedural, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Some portions and features of some embodiments may be included in or replace portions and features of other embodiments.

[0023] Example This embodiment provides a MEMS galvanometer mirror surface protection structure, such as... Figure 1 As shown, it includes an actuator chip body 1, a MEMS galvanometer mirror 2 and an upper cover 3. The upper cover 3 is disposed on the actuator chip body 1 through a biodegradable adhesive layer 4, forming a cavity between the upper cover 3 and the actuator chip body 1. The MEMS galvanometer mirror 2 is mounted on the actuator chip body 1, housed in the cavity, and is in a non-contact state with the upper cover 3.

[0024] The actuator chip body 1 and the MEMS galvanometer mirror 2 are connected by bonding. The actuator chip body 1 has a groove, the central axis of which coincides with the central axis of the actuator chip body 1. The MEMS galvanometer mirror 2 is bonded into the groove, and the central axis of the MEMS galvanometer mirror 2 coincides with the central axis of the groove. This ensures that the optical center of the MEMS galvanometer mirror 2 coincides with the driving center, improving device accuracy and long-term operational stability.

[0025] like Figure 2As shown, the upper cover 3 has a box-shaped structure, including a top cover 31 and sidewalls 32 extending downward from the edge of the top cover 31. The top cover 31 is a rectangular structure, and the sidewalls 32 are rectangular frame structures perpendicular to the top cover 31. The bottom of the sidewalls 32 is connected to the upper surface of the actuator chip body 1 through a biodegradable adhesive layer 4. The distance between the inner walls of the opposite sidewalls 32 is greater than the diameter of the MEMS galvanometer mirror 2. In this embodiment, the biodegradable adhesive layer 4 is a pyrolytic tape, which has adhesive and sealing effects before pyrolysis and leaves no residue on the surface after pyrolysis. The pyrolytic tape is used to bond the upper cover 3 and the actuator chip body 1 to form a cavity, which physically isolates the MEMS galvanometer mirror 2 from the external environment, avoiding scratches and contamination of the MEMS galvanometer mirror 2 during manufacturing, transportation, and assembly. Subsequently, the pyrolytic tape is pyrolyzed at a certain temperature, allowing it to be completely removed, achieving non-destructive peeling of the upper cover 3, ensuring the sealing stability during protection, and avoiding secondary damage to the mirror during removal, thereby improving product yield and reliability. The upper cover 3 can be made of polyetheretherketone, polyimide, surface-passivated titanium alloy, or surface-passivated aluminum alloy. It features lightweight, high mechanical strength, and high environmental stability, and the diverse material selection allows for flexible adaptation to various application scenarios.

[0026] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A MEMS galvanometer mirror surface protection structure, characterized in that, The device includes an actuator chip body (1), a MEMS galvanometer mirror (2), and an upper cover (3). The upper cover (3) is disposed on the actuator chip body (1) through a biodegradable adhesive layer (4), forming a cavity between the upper cover (3) and the actuator chip body (1). The MEMS galvanometer mirror (2) is mounted on the actuator chip body (1), housed in the cavity, and is in a non-contact state with the upper cover (3).

2. The MEMS galvanometer mirror surface protection structure according to claim 1, characterized in that, The actuator chip body (1) and the MEMS galvanometer mirror (2) are connected by bonding.

3. The MEMS galvanometer mirror surface protection structure according to claim 1, characterized in that, The upper cover (3) has a box-shaped structure, including a top cover (31) and a side wall (32) extending downward from the edge of the top cover (31).

4. The MEMS galvanometer mirror surface protection structure according to claim 3, characterized in that, The top cover (31) is a rectangular structure, and the side wall (32) is a rectangular frame structure perpendicular to the top cover (31).

5. The MEMS galvanometer mirror surface protection structure according to claim 3, characterized in that, The bottom of the sidewall (32) is connected to the upper surface of the actuation chip body (1) through the biodegradable adhesive layer (4).

6. The MEMS galvanometer mirror surface protection structure according to claim 3, characterized in that, The inner wall spacing of the opposite sidewall (32) is greater than the diameter of the MEMS galvanometer mirror (2).

7. The MEMS galvanometer mirror surface protection structure according to claim 1, characterized in that, The actuator chip body (1) is provided with a groove, and the central axis of the groove coincides with the central axis of the actuator chip body (1).

8. The MEMS galvanometer mirror surface protection structure according to claim 7, characterized in that, The MEMS galvanometer mirror (2) is bonded to the groove, and the central axis of the MEMS galvanometer mirror (2) coincides with the central axis of the groove.

9. The MEMS galvanometer mirror surface protection structure according to claim 1, characterized in that, The biodegradable adhesive layer (4) is a pyrolytic tape.

10. The MEMS galvanometer mirror surface protection structure according to claim 1, characterized in that, The material of the upper cover (3) can be polyetheretherketone, polyimide, surface-passivated titanium alloy or surface-passivated aluminum alloy.

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