dimming film and dimming glass

Abstract

This invention discloses a dimming film and dimming glass. The conductive electrode of the dimming film includes a flexible circuit board, an upper bonding layer, and a lower bonding layer. The conductive part of the flexible circuit board is bonded and fixed to the conductive layer through the lower bonding layer. An upper conductive surface, opposite to the lower bonding layer, is electrically connected to the conductive layer through the upper bonding layer. The upper bonding layer has a first bonding portion and two second bonding portions. The first bonding portion is located between the two second bonding portions, which are bonded and fixed to the electrode mounting area. The first bonding portion is bonded and fixed to the upper conductive surface, pressing and fixing the conductive part to the lower bonding layer, which in turn is pressed and fixed to the electrode mounting area. This invention utilizes the pressure provided by the upper bonding layer to press the upper bonding layer, conductive part, lower bonding layer, and conductive layer together, thereby improving the peel resistance of the conductive part and the peel resistance of the conductive electrode on the conductive layer, and preventing poor electrical contact between the conductive electrode and the conductive layer.

Description

Technical Field

[0001] This utility model relates to the field of electronic light control structure technology, and in particular, to a dimming film and dimming glass. Background Technology

[0002] Currently, most dimming films in smart glass use FPC (Flexible Printed Circuit) as electrodes to achieve dimming functionality. Dimming films are typically formed by sputtering a transparent indium tin oxide (ITO) conductive film onto a PET substrate. Low-temperature silver paste is then used to heat-bond the gold fingers (conductive terminals for external electrical communication) of the flexible circuit board to the conductive film coating, forming the complete conductive electrode of the dimming film. However, due to differences in the coefficients of thermal expansion between the conductive electrode, the substrate of the dimming film, and the gold fingers of the flexible circuit board; the high baking temperature and long time required for silver paste thermosetting; and factors affecting the processing, production, handling, and transportation of the dimming film, the conductive electrode is prone to peeling from the conductive film coating and / or the gold fingers of the flexible circuit board. This results in poor electrical contact, preventing stable and effective current transmission to the conductive film coating of the dimming film, thus causing the dimming function of the film to fail. Utility Model Content

[0003] The purpose of this invention is to provide a dimming film and dimming glass to solve the technical problem that the gold fingers of flexible circuit boards are prone to peeling.

[0004] The above-mentioned objectives of this utility model can be achieved by the following technical solutions:

[0005] This utility model provides a dimming film, comprising: a dimming film body having an electrode mounting area; a conductive electrode including a flexible circuit board, an upper bonding layer, and a lower bonding layer, wherein the flexible circuit board has a conductive portion, and the conductive portion is bonded and fixed to the electrode mounting area through the lower bonding layer; wherein the conductive portion has an upper conductive surface disposed opposite to the lower bonding layer, the upper conductive surface is electrically connected to the electrode mounting area through the upper bonding layer, and the upper bonding layer has a first bonding portion and two second bonding portions, the first bonding portion being located between the two second bonding portions, the two second bonding portions being bonded and fixed to the electrode mounting area, the first bonding portion being bonded and fixed to the upper conductive surface and pressing and fixing the conductive portion to the lower bonding layer, and the lower bonding layer being pressed and fixed to the electrode mounting area.

[0006] In an embodiment of this utility model, the upper bonding layer further has two third bonding portions, which are located between the two second bonding portions and the first bonding portion. The lower bonding layer has a fourth bonding portion and two fifth bonding portions, which are located between the two fifth bonding portions. The fourth bonding portion is bonded and fixed between the conductive portion and the electrode mounting area, and the two fifth bonding portions are bonded and fixed between the two third bonding portions and the electrode mounting area.

[0007] In an embodiment of this utility model, the bonding length between the third bonding portion and the fifth bonding portion is greater than or equal to 20mm.

[0008] In this embodiment of the invention, both the upper and lower adhesive layers extend along the length direction of the conductive portion. The length of the lower adhesive layer is greater than or equal to the length of the conductive portion, and the length of the upper adhesive layer is greater than the length of the lower adhesive layer. The width of both the upper and lower adhesive layers is greater than or equal to the width of the conductive portion. The upper surface of the conductive portion is covered by the upper adhesive layer in the width direction, and the lower surface of the conductive portion is covered by the lower adhesive layer in the width direction.

[0009] In an embodiment of this utility model, the electrode mounting area has an inner boundary adjacent to the intermediate light control layer of the dimming film body, and the conductive electrode is spaced apart from the inner boundary.

[0010] In an embodiment of this invention, the distance between the conductive electrode and the inner boundary is greater than or equal to 2 mm.

[0011] In embodiments of this utility model, the upper bonding layer is a single-sided conductive adhesive strip, with the conductive adhesive layer of the single-sided conductive adhesive strip facing downwards; or the upper bonding layer is a double-sided conductive adhesive strip; or the upper bonding layer is formed by drying and curing conductive silver paste.

[0012] In an embodiment of this utility model, the conductive part further has a lower conductive surface, and the lower conductive surface is electrically connected to the electrode mounting area through the lower bonding layer.

[0013] In embodiments of this utility model, the lower bonding layer is a double-sided conductive adhesive strip; or the lower bonding layer is a cured conductive silver paste layer; or the lower bonding layer is a cured anisotropic conductive adhesive film layer.

[0014] In the embodiments of this utility model, the lower bonding layer is a high-temperature resistant adhesive strip; or the lower bonding layer is a cured high-temperature resistant adhesive layer.

[0015] This utility model also provides a dimming glass, including the dimming film described above.

[0016] The features and advantages of this utility model are:

[0017] The dimming film and dimming glass of this invention feature a conductive electrode with an added upper bonding layer and a conductive surface on the conductive part of the flexible circuit board. The electrode is then bonded and fixed to the upper conductive surface via a first bonding portion of the upper bonding layer, and simultaneously bonded and fixed to the electrode mounting area of ​​the dimming film body via two second bonding portions of the upper bonding layer. This allows the conductive part to be electrically connected to the electrode mounting area through the upper bonding layer, while the pressure provided by the upper bonding layer presses the upper bonding layer, conductive part, lower bonding layer, and electrode mounting area together. This improves the anti-peeling ability of the conductive part between the upper and lower bonding layers, as well as the anti-peeling ability of the conductive electrode on the electrode mounting area, preventing poor electrical contact between the conductive electrode and the electrode mounting area. Even if the conductive part peels off from the lower bonding layer, current can still be transmitted to the lower electrode mounting area through the upper bonding layer, ensuring the normal use of the dimming film. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a front view of a dimming film after the bonding layer has been applied in one embodiment of the present invention.

[0020] Figure 2 This is a three-dimensional schematic diagram of the dimming film before the bonding layer is applied in one embodiment of the present invention.

[0021] Figure 3 This is a schematic diagram of the current flow of the conductive electrode in one embodiment of the present invention.

[0022] Figure 4 This is a front view of the dimming film before the bonding layer is applied in one embodiment of the present invention.

[0023] Figure 5 This is a front view of the dimming film after the upper bonding layer has been compacted in another embodiment of the present invention.

[0024] Figure 6 This is a schematic diagram of the current flow of the conductive electrode in another embodiment of the present invention.

[0025] Figure 7 This is a three-dimensional schematic diagram of the dimming film before the upper bonding layer is compacted in another embodiment of the present invention.

[0026] Figure 8 This is a front view of the dimming film before the upper bonding layer is compacted in another embodiment of the present invention.

[0027] Figure 9 This is a schematic diagram showing the current flow of the conductive electrode in Comparative Example 1.

[0028] In the picture:

[0029] 1. Dimming film body; 11. Upper substrate layer; 12. Upper conductive layer; 13. Middle light control layer; 14. Lower conductive layer; 141. Electrode mounting area; 1411. Inner boundary; 1412. First outer boundary; 1413. Second outer boundary; 1414. Third outer boundary; 15. Lower substrate layer;

[0030] 2. Conductive electrode; 21. Flexible circuit board; 211. Circuit layer; 2111. Conductive part; 2112. Upper conductive surface; 2113. Lower conductive surface; 212. Cover layer; 22. Upper bonding layer; 221. First bonding part; 222. Second bonding part; 223. Third bonding part; 23. Lower bonding layer; 231. Fourth bonding part; 232. Fifth bonding part;

[0031] 3. Anisotropic conductive adhesive film layer; 4. Conductive silver paste layer. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Implementation Method 1

[0034] like Figure 1 As shown, this utility model provides a dimming diaphragm, including a dimming diaphragm body 1 and a conductive electrode 2, wherein the conductive electrode 2 is installed in the electrode mounting area 141 of the dimming diaphragm body 1.

[0035] Specifically, in combination Figure 2 As shown, the dimming film body 1 includes two substrate layers, two conductive layers and an intermediate light control layer 13. The two conductive layers are disposed on the inner surfaces of the two substrate layers, and the intermediate light control layer 13 is disposed between the two conductive layers. The intermediate light control layer 13 and the conductive layer (defined as the upper conductive layer 12) and the substrate layer (defined as the upper substrate layer 11) located on the same side as the intermediate light control layer 13 are respectively provided with a hollow area, so that an electrode mounting area 141 for mounting the conductive electrode 2 is formed on the conductive layer (defined as the lower conductive layer 14) on the other substrate layer (defined as the lower substrate layer 15).

[0036] like Figure 1 As shown, in this embodiment of the present invention, the conductive electrode 2 includes a flexible circuit board 21, an upper bonding layer 22, and a lower bonding layer 23. The flexible circuit board 21 has a conductive portion 2111, which is bonded and fixed to the electrode mounting area 141 via the lower bonding layer 23. The conductive portion 2111 has an upper conductive surface 2112 disposed opposite to the lower bonding layer 23. The upper conductive surface 2112 is electrically connected to the electrode mounting area 141 via the upper bonding layer 22. The upper bonding layer 22 has a first bonding portion 221 and two second bonding portions 222. The first bonding portion 221 is located between the two second bonding portions 222. The two second bonding portions 222 are bonded and fixed to the electrode mounting area 141. The first bonding portion 221 is bonded and fixed to the upper conductive surface 2112 and presses the conductive portion 2111 tightly and fixes it to the lower bonding layer 23. The lower bonding layer 23 is also pressed and fixed to the electrode mounting area 141.

[0037] like Figure 1 As shown, in this invention, the dimming film has an upper bonding layer 22 added to the conductive electrode 2, and a conductive surface 2112 is provided on the conductive portion 2111 of the flexible circuit board 21. The electrode 2 is then bonded and fixed to the conductive surface 2112 via the first bonding portion 221 of the upper bonding layer 22, and simultaneously bonded and fixed to the electrode mounting area 141 of the dimming film body 1 via the two second bonding portions 222 of the upper bonding layer 22. This allows the conductive portion 2111 to be electrically connected to the electrode mounting area 141 via the upper bonding layer 22, while also utilizing the power provided by the upper bonding layer 22. The pressure presses the upper bonding layer 22, the conductive part 2111, the lower bonding layer 23, and the electrode mounting area 141 together, thereby improving the peel resistance of the conductive part 2111 between the upper bonding layer 22 and the lower bonding layer 23, as well as the peel resistance of the conductive electrode 2 on the electrode mounting area 141. This prevents poor electrical contact between the conductive electrode 2 and the electrode mounting area 141. Even if the conductive part 2111 peels off from the lower bonding layer 23, the current can still be transmitted to the electrode mounting area 141 through the upper bonding layer 22 to ensure the normal use of the dimming film.

[0038] Combination Figure 3 As shown, in order to improve the electrical performance reliability of the conductive electrode 2, in some embodiments of this invention, the conductive part 2111 also has a lower conductive surface 2113, which is electrically connected to the electrode mounting area 141 through the lower bonding layer 23. That is, the conductive part 2111 can transmit current to the upper bonding layer 22 and then to the electrode mounting area 141 through the upper conductive surface 2112, and can also transmit current to the lower bonding layer 23 and then to the electrode mounting area 141 through the lower conductive surface 2113, thereby forming a multi-layer current compensation protection, further improving the reliability of the conductive electrode 2.

[0039] Specifically, the lower bonding layer 23 is a double-sided conductive adhesive strip, which has a lower cost. Optionally, the lower bonding layer 23 is formed by drying and curing conductive silver paste, which has excellent conductivity. Optionally, the lower bonding layer 23 is a cured anisotropic conductive adhesive film layer, that is, the anisotropic conductive adhesive film is formed by hot pressing and curing to form the lower bonding layer 23, which has good conductivity and good adhesion.

[0040] Combination Figure 1 and Figure 2 As shown in the embodiment of this utility model, the flexible circuit board 21 has a circuit layer 211 and a cover layer 212 covering the circuit layer 211. The circuit layer 211 may be, but is not limited to, gold foil, copper foil, or other conductive metal layers. The material of the cover layer 212 may be, but is not limited to, polyimide, polyester, and other transparent plastics, or other opaque materials. The conductive portion 2111 is disposed on the circuit layer 211. The cover layer 212 on both the upper and lower sides of the conductive portion 2111 of the flexible circuit board 21 has windows to expose at least a portion of the upper surface and at least a portion of the lower surface of the conductive portion 2111, thereby forming an upper conductive surface 2112 and a lower conductive surface 2113. Preferably, the entire upper surface of the conductive portion 2111 is exposed to maximize the electrical contact area between the upper bonding layer 22 and the conductive portion 2111. Similarly, the entire lower surface of the conductive portion 2111 is exposed to maximize the electrical contact area between the lower bonding layer 23 and the conductive portion 2111.

[0041] like Figure 1 As shown, in some embodiments of this utility model, the upper bonding layer 22 is a cured conductive silver paste layer, that is, the upper bonding layer 22 is formed after the conductive silver paste is dried and cured. Since the conductive silver paste does not need to be attached to other structures after curing to form the upper bonding layer 22, the problem of the cured conductive silver paste cracking under pressure can be avoided. This also avoids the problem of unstable connection and poor electrical contact between the conductive part 2111 and the electrode mounting area 141 caused by the cracking of the conductive silver paste.

[0042] Combination Figure 1 , Figure 2 as well as Figure 4 As shown, during installation, the upper and lower bonding layers 23 are first pre-attached to the lower surface of the conductive part 2111 of the flexible circuit board 21; then the conductive part 2111 with the lower bonding layer 23 attached is pressed onto the electrode mounting area 141 of the dimming film body 1; then conductive silver paste is applied to the corresponding part of the electrode mounting area 141 and the upper surface of the conductive part 2111, and then the dimming film is baked and cured to dry and cure the conductive silver paste to form the upper bonding layer 22.

[0043] like Figure 5As shown, in some other embodiments of this utility model, the upper bonding layer 22 is a single-sided conductive adhesive strip, which has a lower cost and does not require long-term high-temperature baking and curing, significantly improving production efficiency. The conductive adhesive layer of the single-sided conductive adhesive strip is positioned downwards, allowing the upper bonding layer 22 to be bonded and fixed to the conductive part 2111, the electrode mounting area 141, and the fifth bonding part 232 of the lower bonding layer 23 via this conductive adhesive layer. Specifically, the single-sided conductive adhesive strip can be, but is not limited to, a conductive woven fabric single-sided conductive adhesive strip, a conductive fiber single-sided conductive adhesive strip, a conductive copper foil single-sided conductive adhesive strip, or a conductive aluminum foil single-sided conductive adhesive strip.

[0044] like Figure 5 As shown, in some embodiments of this utility model, the upper bonding layer 22 is a double-sided conductive adhesive strip, which can be set with the conductive adhesive layer on either side facing downwards, making installation more convenient. Specifically, the double-sided conductive adhesive strip can be, but is not limited to, a conductive woven fabric double-sided conductive adhesive strip, a conductive fiber double-sided conductive adhesive strip, a conductive copper foil double-sided conductive adhesive strip, or a conductive aluminum foil double-sided conductive adhesive strip.

[0045] Combination Figure 5 , Figure 6 as well as Figure 7 As shown, during installation, the lower bonding layer 23 is first bonded to the electrode mounting area 141 of the dimming film body 1; after the lower bonding layer 23 is bonded and pressed firmly, the conductive part 2111 of the flexible circuit board 21 is bonded to the lower bonding layer 23; finally, the upper bonding layer 22 is attached to the conductive part 2111, the two exposed fifth bonding parts 232 of the lower bonding layer 23, and the electrode mounting area 141 of the dimming film body 1, thereby completing the assembly of the dimming film body 1 and the conductive electrode 2. The upper bonding layer 22, the conductive part 2111, and the lower bonding layer 23 can all be attached manually, using tooling pressing, or by automated adhesive application equipment.

[0046] Combination Figure 1 and Figure 2 As shown, in order to increase the bonding length between the conductive part 2111 and the upper bonding layer 22 and the lower bonding layer 23, both the upper bonding layer 22 and the lower bonding layer 23 extend along the length direction of the conductive part 2111; wherein, the length L2 of the lower bonding layer 23 is greater than or equal to the length l of the conductive part 2111, thereby maximizing the bonding length between the lower bonding layer 23 and the conductive part 2111; the length L1 of the upper bonding layer 22 is greater than the length L2 of the lower bonding layer 23, so that the two ends of the upper bonding layer 22 extend outward relative to the two ends of the lower bonding layer 23 to form two second bonding parts 222 that can be bonded and fixed to the electrode mounting area 141.

[0047] In addition, combined Figure 2 and Figure 6As shown, in order to further increase the bonding area between the conductive portion 2111 and the upper adhesive layer 22 and the lower adhesive layer 23, thereby further improving the peel resistance of the conductive portion 2111, the width W of the upper adhesive layer 22 and the width of the lower adhesive layer 23 are both greater than or equal to the width w of the conductive portion 2111. The upper surface of the conductive portion 2111 is covered by the upper adhesive layer 22 in the width direction of the conductive portion 2111, and the lower surface of the conductive portion 2111 is covered by the lower adhesive layer 23 in the same width direction. In this embodiment, the width of the lower adhesive layer 23 is equal to the width W of the upper adhesive layer 22.

[0048] Combination Figure 2 and Figure 6 As shown, the electrode mounting area 141 has an inner boundary 1411 adjacent to the intermediate light control layer 13. To prevent the conductive electrode 2 from short-circuiting by electrically connecting the two electrode mounting areas 141, the conductive electrode 2 and the inner boundary 1411 are spaced apart. Preferably, the distance between the conductive electrode 2 and the inner boundary 1411 is greater than or equal to 2 mm.

[0049] In this embodiment, the electrode mounting area 141 has an inner boundary 1411 and a first outer boundary 1412 that are disposed opposite to each other in the width direction of the conductive part 2111. The width of the electrode mounting area 141 is Z, and the widths of the upper bonding layer 22 and the lower bonding layer 23 are both W. Then, the following relationship exists: ZW≥2mm, which makes the distance between the conductive electrode 2 and the inner boundary 1411 greater than or equal to 2mm, and the conductive electrode 2 is flush with the first outer boundary 1412, or the conductive electrode 2 is located inside the first outer boundary 1412.

[0050] Furthermore, to maximize the bonding length between the upper bonding layer 22 and the electrode mounting area 141, in this embodiment, the length L1 of the upper bonding layer 22 is equal to the length of the electrode mounting area 141. Specifically, the electrode mounting area 141 has a second outer boundary 1413 and a third outer boundary 1414 disposed opposite to each other in the length direction of the conductive portion 2111. The length of the electrode mounting area 141 is the distance between the second outer boundary 1413 and the third outer boundary 1414. The two ends of the upper bonding layer 22 are flush with the second outer boundary 1413 and the third outer boundary 1414.

[0051] like Figure 5As shown, in order to further improve the connection stability between the conductive part 2111, the upper bonding layer 22, the lower bonding layer 23 and the electrode mounting area 141, in this embodiment of the present invention, the upper bonding layer 22 also has two third bonding parts 223. One third bonding part 223 is located between a second bonding part 222 and a first bonding part 221, and the other third bonding part 223 is located between another second bonding part 222 and a first bonding part 221. The lower bonding layer 23 has a fourth bonding part 231 and two fifth bonding parts 232. The fourth bonding part 231 is located between the two fifth bonding parts 232. The fourth bonding part 231 is bonded and fixed between the conductive part 2111 and the electrode mounting area 141. One fifth bonding part 232 is bonded and fixed between a third bonding part 223 and the electrode mounting area 141, and the other fifth bonding part 232 is bonded and fixed between the other third bonding part 223 and the electrode mounting area 141. By adding two third bonding portions 223 to the upper bonding layer 22 and two fifth bonding portions 232 to the lower bonding layer 23, the upper bonding layer 22 is also bonded to the lower bonding layer 23 at both ends of the conductive portion 2111. This allows the upper bonding layer 22, in conjunction with the electrode mounting area 141, to lock the conductive portion 2111 to the lower bonding layer 23, while simultaneously locking the conductive portion 2111 through the cooperation of the upper bonding layer 22 and the lower bonding layer 23. In this embodiment of the invention, to ensure reliable connection between the third bonding portion 223 and the fifth bonding portion 232, the bonding length X between the third bonding portion 223 and the fifth bonding portion 232 is preferably greater than or equal to 20 mm.

[0052] In addition, combined Figure 8 As shown, when both the upper bonding layer 22 and the lower bonding layer 23 are electrically connected to the electrode mounting area 141, the current transmitted from the conductive part 2111 to the lower bonding layer 23 can also be transmitted through the fifth bonding part 232 to the third bonding part 223, and then through the second bonding part 222 to the electrode mounting area 141. In other words, even if the lower bonding layer 23 peels off from the electrode mounting area 141, the conductive electrode 2 can still transmit the current to the electrode mounting area 141 of the dimming film body 1, thereby ensuring the normal use of the dimming film.

[0053] like Figure 1As shown, in some other embodiments of this utility model, the lower bonding layer 23 may not have a conductive function but only provide adhesive force to bond the conductive part 2111 to the electrode mounting area 141. Specifically, the lower bonding layer 23 can be a high-temperature resistant adhesive strip or a high-temperature resistant adhesive layer, that is, the lower bonding layer 23 is formed by coating a layer of high-temperature resistant adhesive and then curing it. Among them, the high-temperature resistant adhesive strip can be a high-temperature resistant (≥100℃) adhesive strip in the prior art; the high-temperature resistant adhesive can be ethyl α-cyanoacrylate (502 glue), phenolic resin glue, silicone glue or epoxy heat-resistant glue. The lower bonding layer 23 is made by using a high-temperature resistant adhesive strip or a high-temperature resistant adhesive, so that the lower bonding layer 23 has a higher bonding strength with the electrode mounting area 141 and the conductive part 2111, and the peel force can even reach more than 30N. Therefore, the mechanical properties of the conductive electrode 2 are further improved, and on this basis, the electrical connection reliability between the conductive electrode 2 and the electrode mounting area 141 can also be improved.

[0054] To facilitate understanding and implementation of the dimming film of this utility model, peel force tests were conducted on the conductive electrodes 2 in some specific embodiments and comparative examples of this utility model. The dimming film bodies in each specific embodiment and comparative example have the same structure, but the conductive electrodes are different. Specifically:

[0055] In specific embodiment one, the lower bonding layer 23 is a double-sided conductive adhesive strip made of conductive copper foil, the conductive part 2111 has an upper conductive surface 2112 and a lower conductive surface 2113, and the upper bonding layer 22 is a single-sided conductive adhesive strip made of conductive copper foil. In specific embodiment two, the lower bonding layer 23 is a double-sided conductive adhesive strip made of conductive fabric, the conductive part 2111 has an upper conductive surface 2112 and a lower conductive surface 2113, and the upper bonding layer 22 is a single-sided conductive adhesive strip made of conductive fabric. In specific embodiment three, the lower bonding layer 23 is a double-sided conductive adhesive strip made of conductive fabric, the conductive part 2111 has an upper conductive surface 2112 and a lower conductive surface 2113, and the upper bonding layer 22 is a single-sided conductive adhesive strip made of conductive copper foil. In specific embodiment four, the lower bonding layer 23 is a double-sided conductive adhesive strip made of conductive aluminum foil, the conductive part 2111 has an upper conductive surface 2112 and a lower conductive surface 2113, and the upper bonding layer 22 is a single-sided conductive adhesive strip made of conductive aluminum foil.

[0056] Combination Figure 9 As shown in Comparative Example 1, the conductive portion 2111 of the flexible circuit board 21 only has a lower conductive surface 2113. The conductive electrode 2 is bonded and fixed to the electrode mounting area 141 by a conductive silver paste layer 4. The conductive portion 2111 is pressed onto the conductive silver paste layer 4 by an anisotropic conductive adhesive film layer 3. In Comparative Example 2, the conductive portion 2111 of the flexible circuit board 21 only has a lower conductive surface 2113. The conductive electrode 2 is bonded and fixed to the electrode mounting area 141 by a conductive copper foil double-sided conductive adhesive strip.

[0057] The peel force test results of conductive electrode 2 in the above specific embodiments and comparative examples are shown in the table below:

[0058]

[0059] In addition, in comparison Figure 3 and Figure 9 As shown, peel force tests were also performed on the conductive electrode 2 in Specific Embodiment 5 and Comparative Example 1. The structure of the dimming film body in Specific Embodiment 5 is the same as that in Comparative Example 1. Furthermore, the lower bonding layer 23 of the conductive electrode 2 in Specific Embodiment 5 is the same as the anisotropic conductive adhesive film layer 3 in Comparative Example 1, and the upper bonding layer 22 of the conductive electrode 2 in Specific Embodiment 5 is the same as the conductive silver paste layer 4 in Comparative Example 1. However, in Specific Embodiment 5, the lower bonding layer 23 of the conductive electrode 2 is first pressed and bonded onto the lower conductive layer 14, and then coated with conductive silver paste and dried to form the upper bonding layer 22. The test results are shown in the table below:

[0060]

[0061] In summary, the anti-peeling performance of the conductive electrode 2 on the lower conductive layer 14 of the dimming film body 1 is greatly improved in this utility model, which in turn effectively improves the electrical connection performance, thereby ensuring the normal use of the dimming film.

[0062] Implementation Method 2

[0063] This invention also provides a dimming glass, including a dimming film. The dimming film in this embodiment has the same specific structure, working principle, and beneficial effects as the dimming film in Embodiment 1, and will not be described again here.

[0064] The above descriptions are merely a few embodiments of this utility model. Those skilled in the art can make various modifications or variations to the embodiments of this utility model based on the content disclosed in the application documents without departing from the spirit and scope of this utility model.

Claims

1. A dimming film, characterized in that, include: The dimming diaphragm body has an electrode mounting area; A conductive electrode includes a flexible circuit board, an upper bonding layer, and a lower bonding layer. The flexible circuit board has a conductive portion, which is bonded and fixed to the electrode mounting area by the lower bonding layer. The conductive portion has an upper conductive surface disposed opposite to the lower bonding layer. The upper conductive surface is electrically connected to the electrode mounting area through the upper bonding layer. The upper bonding layer has a first bonding portion and two second bonding portions. The first bonding portion is located between the two second bonding portions. The two second bonding portions are bonded and fixed to the electrode mounting area. The first bonding portion is bonded and fixed to the upper conductive surface and presses the conductive portion tightly and fixed to the lower bonding layer. The lower bonding layer is pressed and fixed to the electrode mounting area.

2. The dimming film as described in claim 1, characterized in that, The upper bonding layer also has two third bonding portions, which are located between the two second bonding portions and the first bonding portion. The lower bonding layer has a fourth bonding portion and two fifth bonding portions, which are located between the two fifth bonding portions. The fourth bonding portion is bonded and fixed between the conductive portion and the electrode mounting area, and the two fifth bonding portions are bonded and fixed between the two third bonding portions and the electrode mounting area.

3. The dimming film as described in claim 2, characterized in that, The bonding length between the third bonding portion and the fifth bonding portion is greater than or equal to 20 mm.

4. The dimming film as described in claim 1, characterized in that, Both the upper bonding layer and the lower bonding layer extend along the length direction of the conductive portion. The length of the lower bonding layer is greater than or equal to the length of the conductive portion, and the length of the upper bonding layer is greater than the length of the lower bonding layer. The width of the upper bonding layer and the width of the lower bonding layer are both greater than or equal to the width of the conductive part. The upper surface of the conductive part is covered by the upper bonding layer in the width direction of the conductive part, and the lower surface of the conductive part is covered by the lower bonding layer in the width direction.

5. The dimming film as described in claim 1, characterized in that, The electrode mounting area has an inner boundary adjacent to the intermediate light control layer of the dimming film body, and the conductive electrode is spaced apart from the inner boundary.

6. The dimming film as described in claim 5, characterized in that, The distance between the conductive electrode and the inner boundary is greater than or equal to 2 mm.

7. The dimming film as described in claim 1, characterized in that, The upper bonding layer is a single-sided conductive adhesive strip, and the conductive adhesive layer of the single-sided conductive adhesive strip is disposed with the conductive adhesive layer facing downwards; or The upper bonding layer is a double-sided conductive adhesive strip; or The upper bonding layer is a cured conductive silver paste layer.

8. The dimming film according to any one of claims 1-7, characterized in that, The conductive part also has a lower conductive surface, which is electrically connected to the electrode mounting area through the lower bonding layer.

9. The dimming film as described in claim 8, characterized in that, The lower bonding layer is a double-sided conductive adhesive strip; or The lower bonding layer is a cured conductive silver paste layer; or The lower bonding layer is a cured anisotropic conductive adhesive film layer.

10. The dimming film according to any one of claims 1-7, characterized in that, The lower bonding layer is a high-temperature resistant adhesive strip; or The lower bonding layer is a cured high-temperature resistant adhesive layer.

11. A type of dimming glass, characterized in that, Includes the dimming film according to any one of claims 1-10.

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