Backlight module, display module and display device

Abstract

Embodiments of the present application provide a backlight module, a display module and a display device, and relate to the technical field of display. The backlight module comprises a frame, a light guide plate, a light bar circuit board, a light emitting device, a light bar adhesive and a conductive structure. The light guide plate is arranged on the frame, one side of the light bar circuit board is electrically connected with the light emitting device, and the light bar adhesive connects the light bar circuit board with a light emitting surface of the light guide plate. The conductive structure is in electrical contact with the light emitting surface of the light guide plate, and the conductive structure is bent to a side of the frame away from the light guide plate and is in electrical contact with the frame. The conductive structure forms a conductive path between the light guide plate and the frame, and the light emitting surface of the light guide plate is in electrical communication with the frame. Static electricity on the light guide plate can be conducted to the frame through the conductive path. After the static electricity on the light guide plate is conducted to the frame, the static electricity is directly grounded, the real-time conduction between the static electricity of the light guide plate and the grounding end of the whole machine is realized, and thus the problem that static electricity of the light guide plate itself causes howling noise can be avoided.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a backlight module, a display module, and a display device. Background Technology

[0002] Currently, in product development in the display field, especially in projects with high frequencies of 120Hz or higher, the problem of high-frequency howling noise is often encountered. That is, in a quiet environment, after running the touch function program, a "hissing" sound can be heard. This howling noise causes significant noise interference to users and seriously affects the user experience. Utility Model Content

[0003] This application proposes a backlight module, a display module, and a display device, aimed at improving the howling noise problem.

[0004] In a first aspect, this application provides a backlight module, including a frame, a light guide plate, a light strip circuit board, a light-emitting device, a light strip adhesive, and a conductive structure.

[0005] The light guide plate is mounted on the frame. One side of the LED strip circuit board is electrically connected to the light-emitting device and connected to the light-emitting surface of the light guide plate via LED strip adhesive. The conductive structure is in electrical contact with the light-emitting surface of the light guide plate, and the conductive structure is bent to the side of the frame away from the light guide plate and in electrical contact with the frame.

[0006] In other words, in this embodiment, the conductive structure forms a conductive path between the light guide plate and the frame, electrically connecting the light-emitting surface of the light guide plate to the frame. Static charge on the light guide plate can be conducted to the frame through this conductive path. It is understood that in the display device, the frame is electrically connected to the copper leakage area of ​​the flexible circuit board, thus grounding the frame. Based on this, in this embodiment, the static charge on the light guide plate is directly grounded after being conducted to the frame, achieving real-time conduction between the static charge on the light guide plate and the overall device grounding terminal, thereby avoiding the problem of howling noise caused by static charge on the light guide plate itself.

[0007] In some embodiments, the conductive structure includes a conductive adhesive strip and a conductive edge-sealing tape. The conductive adhesive strip is disposed on the side of the light guide plate away from the frame and is in electrical contact with the light-emitting surface of the light guide plate.

[0008] One end of the conductive edge-binding tape is positioned on the side of the conductive strip away from the frame and makes electrical contact with the conductive strip. The other end is bent to the side of the frame away from the light guide plate and makes electrical contact with the frame.

[0009] In some embodiments, the conductive edging tape includes a laminated conductive layer and a light-shielding layer. One end of the conductive layer is disposed on the side of the conductive tape away from the frame and is in electrical contact with the conductive tape, while the other end is bent to the side of the frame away from the light guide plate and is in electrical contact with the frame. The light-shielding layer covers the side of the conductive layer away from the frame.

[0010] In some embodiments, the backlight module further includes a cutout penetrating the LED strip circuit board and the LED strip adhesive, the cutout exposing the light-emitting surface of the light guide plate. A conductive adhesive strip is disposed within the cutout and is in electrical contact with the light-emitting surface of the light guide plate.

[0011] In some embodiments, the backlight module further includes a light-shielding tape disposed on the side of the LED strip circuit board away from the LED strip adhesive, and the light-shielding tape also passes through the cutout.

[0012] In some embodiments, along the direction perpendicular to the light-emitting surface of the light guide plate, the thickness of the conductive adhesive strip is equal to the sum of the thicknesses of the light-shielding tape, the LED strip circuit board, and the LED strip adhesive.

[0013] In some embodiments, the side of the backlight module where the light-emitting device is located includes two corner areas. The backlight module includes two cutouts and two conductive strips. The two cutouts are located in the two corner areas respectively, and the two conductive strips are located in the two corner areas respectively. The conductive strips are disposed in the corresponding cutouts.

[0014] In some embodiments, along the opposite directions of the two corner areas, the LED strip adhesive includes a body portion and first lug portions located on opposite sides of the body portion, the first lug portions including a boundary near the body portion. A cutout extends through the body portion and exposes the boundary of the first lug portions.

[0015] In some embodiments, the backlight module includes a side where a light-emitting device is disposed, and along a direction parallel to the side, the opposite side edges of the LED strip circuit board extend beyond the opposite side edges of the LED strip adhesive.

[0016] The conductive structure comprises a first part, a second part, and a third part connected in sequence. The first part is in electrical contact with the light-emitting surface of the light guide plate. The second part is located on the side of the LED strip circuit board near the LED strip adhesive and overlaps with the edge of the LED strip circuit board that extends beyond the LED strip adhesive, but the second part does not overlap with the LED strip adhesive. The third part is bent to the side of the frame away from the light guide plate and is in electrical contact with the frame.

[0017] In some embodiments, the backlight module further includes an optical film located on the side of the light guide plate away from the frame. The optical film includes a second lug, and a first portion is also connected to the second lug.

[0018] In some embodiments, the conductive structure includes conductive cloth, conductive copper foil, or conductive aluminum foil.

[0019] On the other hand, this application also provides a display module, including the backlight module, display panel, and flexible circuit board mentioned in any of the embodiments of the first aspect above. The display panel is located on the backlight module and is located on the light-emitting surface side of the light guide plate. One end of the flexible circuit board is electrically connected to the display panel, and the other end is bent to the side of the frame away from the light guide plate and makes electrical contact with the frame.

[0020] In another aspect, this application also provides a display device, including the aforementioned display module and controller, wherein the controller is electrically connected to the display module.

[0021] The above-mentioned display modules and display devices have the same structure and beneficial technical effects as the backlight modules provided in some of the above embodiments, and will not be described again here. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in some embodiments of this application will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not actual dimensions of the products or actual processes of the methods involved in the embodiments of this application.

[0023] Figure 1 This application provides a schematic diagram of the structure of a backlight module;

[0024] Figure 2 This is an exploded view of the LED strip circuit board and LED strip adhesive in related technologies;

[0025] Figure 3 This is a magnified view of a portion of the backlight module at the light-emitting device in a related technology.

[0026] Figure 4 for Figure 1 A magnified view of a portion of the backlight module at the light-emitting device;

[0027] Figure 5 A partial enlarged view of the light-emitting device in another backlight module provided in this application;

[0028] Figure 6 for Figure 5 An exploded view of the LED strip circuit board and LED strip adhesive in the backlight module shown.

[0029] Figure 7 for Figure 5 A partial rear view of the backlight module shown;

[0030] Figure 8 This is a schematic diagram of the structure of a display module provided in an embodiment of this application;

[0031] Figure 9 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Detailed Implementation

[0032] The technical solutions in some embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application are within the scope of protection of this application.

[0033] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and encompassing, that is, "including, but not limited to".

[0034] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0035] In describing some embodiments, the term "connection" and its derivative expressions may be used. The term "connection" should be interpreted broadly; for example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. For example, in describing some embodiments, the term "connection" may be used to indicate that two or more components have direct physical or electrical contact with each other.

[0036] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0037] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0038] This document describes exemplary embodiments with reference to cross-sectional views, which are intended as idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations caused, for example, by manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0039] In the development of LCD products, especially in projects with high frequencies of 120Hz or higher, the problem of howling noise is often encountered. That is, after running touch-screen programs in a quiet environment, a "hissing" sound can be heard, which affects the user experience. Moreover, the noise level varies between different products, ranging from mild to severe, with some products reaching noise levels of Lv2 to Lv3.

[0040] In related technologies, liquid crystal display products include a backlight module and a display panel stacked together, which are electrically connected by a bent flexible circuit board. One end of the flexible circuit board is electrically connected to the display panel, and the other end is bent to the back of the backlight module. A copper leakage area is provided on the flexible circuit board on the back of the backlight module, and the copper leakage area is attached to the metal frame of the backlight module by conductive double-sided adhesive.

[0041] During the research on the howling noise problem, the noise disappeared when the copper leakage area of ​​the flexible circuit board was electrically isolated from the metal frame of the backlight module. Further research revealed that the metal frame grounded through the copper leakage area acts as one electrode plate, while the display panel acts as another, and the various materials of the module act as an intermediate medium. After the touch function program is run, the touch signal in the display panel periodically flips its level, creating a frequency-changing potential difference between the two electrode plates, forming an external electric field. Under the piezoelectric effect, the corresponding materials in the intermediate medium oscillate and emit noise. Through layer-by-layer disassembly and research, it was finally confirmed that the electrostatic level of the light guide plate in the backlight module is the main cause of the noise. Disassembly and testing showed that when the electrostatic charge of the light guide plate is controlled within ≤200V, the noise level can be effectively controlled.

[0042] Currently, static electricity removal from light guide plates is mainly achieved by adding ion fans during the manufacturing process and blowing away static electricity on the unloading platform. While this method can effectively remove static electricity from the light guide plate during the assembly of the backlight module, various transfer and transportation processes still occur after the backlight module is assembled. These processes inevitably cause vibration to the product, which in turn causes the light guide plate inside the backlight module to rub against other materials, leading to an increase in the static electricity level of the light guide plate. This, in turn, can induce howling noise again in the final display product.

[0043] In other words, simply removing static electricity during the backlight module manufacturing process cannot effectively solve the noise problem.

[0044] Based on this, this application provides a backlight module, such as Figure 1 As shown, Figure 1 This is a schematic diagram of the structure of a backlight module provided in this application.

[0045] The backlight module 10 includes a frame 11, a light guide plate 12, a light strip circuit board 13, a light-emitting device 14, a light strip adhesive 15, and a conductive structure 20. The frame 11 serves as a support and load-bearing element, and the light strip circuit board 13 transmits control signals to the light-emitting device 14 to control the light-emitting device 14 to emit light. The light emitted by the light-emitting device 14 is conducted within the light guide plate 12 and finally emitted from its light-emitting surface.

[0046] The light guide plate 12 is disposed on the frame 11. One side of the LED strip circuit board 13 is electrically connected to the light-emitting device 14 and is connected to the light-emitting surface of the light guide plate 12 through LED strip adhesive 15. The conductive structure 20 is in electrical contact with the light-emitting surface of the light guide plate 12, and the conductive structure 20 is bent to the side of the frame 11 away from the light guide plate 12 and in electrical contact with the frame 11.

[0047] For example, the frame 11 here is made of metal, such as an iron frame. In the display device formed based on the backlight module 10, the frame 11 is electrically connected to the copper drain area on the flexible circuit board to ground the frame 11, thereby improving the product's electrostatic discharge resistance. For example, static electricity around the frame 11 is conducted to the copper drain area of ​​the flexible circuit board for grounding, thereby preventing electrostatic discharge damage to the light-emitting device 14 inside the backlight module 10. Furthermore, by effectively and promptly conducting static electricity, problems such as radio frequency issues in the entire device can also be avoided.

[0048] In this embodiment, the conductive structure 20 forms a conductive path between the light guide plate 12 and the frame 11, electrically connecting the light-emitting surface of the light guide plate 12 to the frame 11. Electrostatic charges on the light guide plate 12 can be conducted to the frame 11 through this conductive path. Based on this, in the display device formed using this backlight module, the electrostatic charges on the light guide plate 12 are directly grounded after being conducted to the frame 11, achieving real-time conduction between the electrostatic charge of the light guide plate 12 and the grounding terminal of the entire device. After the backlight module 10 is assembled, even if vibration during transport causes friction of materials, resulting in electrostatic charges on the light guide plate 12, these charges can be quickly grounded through this conductive path. This allows the electrostatic charge of the light guide plate to be controlled within the range of ≤200V, thus avoiding the problem of noise induced by electrostatic discharge from the light guide plate 12 itself.

[0049] In some embodiments, such as Figure 1 As shown, the conductive structure 20 includes a conductive adhesive strip 201 and a conductive edge-wrapping tape 202. The conductive adhesive strip 201 is disposed on the side of the light guide plate 12 away from the frame 11 and is in electrical contact with the light-emitting surface of the light guide plate 12.

[0050] One end of the conductive edge-binding tape 202 is located on the side of the conductive strip 201 away from the frame 11 and is in electrical contact with the conductive strip 201. The other end is bent to the side of the frame 11 away from the light guide plate 12 and is in electrical contact with the frame 11.

[0051] In related technologies, the backlight module 10 typically includes an edge-wrapping Mylar structure, which is usually a non-conductive single-sided adhesive tape, such as a biaxially oriented polyethylene terephthalate (BoPET) film. The edge-wrapping Mylar structure is attached to the edge of the backlight module 10 for local insulation, protection, and aesthetic treatment, and can also play a certain role in preventing light leakage and fastening.

[0052] In this embodiment, the non-conductive single-sided tape in the related technology is replaced with the conductive edge-wrapping tape 202 in this application. In addition, a conductive strip 201 is added. The conductive strip 201 and the conductive edge-wrapping tape 202 are used to realize the electrical connection between the light-emitting surface of the light guide plate 12 and the frame 11. This enables real-time conduction between the static electricity of the light guide plate 12 and the grounding terminal of the whole machine, which helps to avoid the problem of howling noise induced by the static electricity of the light guide plate 12 itself.

[0053] For example, the conductive edge-sealing tape 202 includes a stacked conductive layer and a light-shielding layer. The conductive layer is located on the side of the light-shielding layer closest to the light guide plate 12, and serves to conduct electricity. One end of the conductive layer is disposed on the side of the conductive tape 201 away from the frame 11 and is in electrical contact with the conductive tape 201. The other end is bent to the side of the frame 11 away from the light guide plate 12 and is in electrical contact with the frame 11. The light-shielding layer covers the side of the conductive layer away from the frame, serving to protect and prevent light leakage. In this application, the conductive edge-sealing tape 202 is equivalent to conductive single-sided tape, replacing the edge-sealing Mylar structure in related technologies and wrapping the edge of the backlight module 10. It is used for local insulation, protection, and aesthetic treatment, and can play a certain role in fastening, making the various materials of the backlight module 10 assembled compactly, reducing vibration and friction between materials, and helping to reduce the static charge generated by the light guide plate 12 during transportation.

[0054] In some embodiments, such as Figure 1 As shown, the backlight module 10 also includes a cutout K0 that penetrates the LED strip circuit board 13 and the LED strip adhesive 15, exposing the light-emitting surface of the light guide plate 12. The conductive adhesive strip 201 is disposed in the cutout K0 and is in electrical contact with the light-emitting surface of the light guide plate 12.

[0055] In some embodiments, such as Figure 1 As shown, the backlight module 10 also includes a light-shielding tape 16, which is disposed on the side of the light strip circuit board 13 away from the light strip adhesive 15, and the cutout K0 also passes through the light-shielding tape 16.

[0056] like Figure 1As shown, the backlight module 10 typically also includes a frame 31, a reflective sheet 32, a diffuser sheet 33, and a diffuser strip 34. The reflective sheet 32 ​​is located between the light guide plate 10 and the frame 11. The reflective sheet 32 ​​reflects the light transmitted within the light guide plate 22, causing the light to exit towards the light-emitting surface, which helps improve luminous efficiency. The diffuser sheet 33 diffuses the light, further homogenizing and scattering it, reducing uneven brightness and light spots, making the light softer and more uniform. The diffuser strip 34 is attached between the diffuser sheet 33 and the light-shielding tape 16, and the diffuser strip 34 also serves a light-shielding function.

[0057] In related technologies, a light strip adhesive 15 is typically formed on the light strip circuit board 13. The light strip adhesive 15 includes multiple openings K1 that expose the light strip circuit board 13. A light emitter 14 is disposed within one opening K1, and the light emitter 14 is electrically connected to a corresponding pad on the light strip circuit board 13, thereby forming a light strip structure. Furthermore, an adhesive frame 31 is formed within the frame 11.

[0058] Then, the reflector 32, the light guide plate 12, and the light strip structure are assembled, so that part of the light strip circuit board 13 is pasted to the wedge-shaped part of the light guide plate 12 by the light strip adhesive 15, and another part is pasted to the frame 31 by the light strip adhesive 15. The light-emitting device 14 is located on the side of the light guide plate 12 and along the Z direction. There is a certain gap between the light-emitting device 14 and the reflector 32 to avoid interference.

[0059] Finally, the optical films such as diffuser sheet 33, diffuser strip 34, and light-shielding tape 16 are assembled in sequence to form the backlight module.

[0060] In this embodiment, by optimizing the LED strip circuit board 13 and the LED strip adhesive 15, a cutout K0 is formed on the LED strip circuit board 13 and the LED strip adhesive 15, thereby reserving installation space for the conductive adhesive strip 201. Based on this, the backlight module can still be manufactured based on the assembly and manufacturing process of related technologies. It is only necessary to add a conductive adhesive strip 201 application process after the LED strip structure assembly process in related technologies is completed, applying the conductive adhesive strip 201 into the cutout K0, and then assembling and applying the light-shielding tape 16 and the conductive edge-wrapping tape 202.

[0061] In other words, the morphology of the LED strip circuit board 13 and LED strip adhesive 15 has been simply optimized in this application, reserving installation space for the conductive adhesive strip 201. In addition to adding an extra bonding process for the conductive adhesive strip 201, the manufacturing process is almost unchanged. Correspondingly, there is no need to make a lot of changes to the equipment and operation requirements required for the manufacturing process. The manufacturing cost required to achieve the improvement goal of this application is low and the operability is high.

[0062] Based on the aforementioned manufacturing process, it can be understood that after the conductive adhesive strip 201 is applied, during the application of the light-shielding tape 16, compared with related technologies, the light-shielding tape 16 used in this embodiment has an improved structure with a notch, and the notch of the light-shielding tape 16 is used to expose the conductive adhesive strip 201.

[0063] like Figure 1 As shown, the backlight module 10 includes a display area AA and a non-display area VA. After the light-shielding tape 16 is applied, it covers the LED strip circuit board 13, along... Figure 1 As shown in direction Y, the light-shielding tape 16 extends from the lamp strip circuit board 13 to the diffusion tape 34, and extends along direction Y to the boundary of the non-display area VA, thereby effectively ensuring the light-shielding effect and preventing light from the light guide plate 12 from leaking into the non-display area VA.

[0064] In some embodiments, such as Figure 1 As shown, along the direction perpendicular to the light-emitting surface of the light guide plate 12, that is... Figure 1 In the direction Z shown, the thickness of the conductive adhesive strip 201 is equal to the sum of the thicknesses of the light-shielding tape 16, the LED strip circuit board 13, and the LED strip adhesive 15.

[0065] That is, the cutout K0 penetrates the light-shielding tape 16, the LED strip circuit board 13, and the LED strip adhesive 15. The thickness of the conductive strip 201 along the Z direction is equal to the depth of the cutout K0 along the Z direction. This ensures that one end of the conductive strip 201 is in electrical contact with the light-emitting surface of the light guide plate 12, and the other end is flush with the surface of the light-shielding tape 16 away from the light guide plate 12. Based on this, after applying the conductive edge-wrapping tape 202, the surface of the conductive edge-wrapping tape 202 near the light-shielding tape 16 can extend flat and reliably make electrical contact with the conductive strip 201. This avoids both local bulging and local depression, which helps to ensure the formation of a flat surface for subsequent assembly processes. It also helps to ensure the reliability of the conductive path and prevent the conductive edge-wrapping tape 202 and the conductive strip 201 from breaking at the cutout K0.

[0066] In related technologies, the outer contour of the orthographic projection of the LED strip circuit board 13 onto the frame 11 at least partially overlaps with the outer contour of the orthographic projection of the LED strip adhesive 15 onto the frame 11. For example... Figures 2-3 As shown, Figure 2 This is an exploded view of the LED strip circuit board and LED strip adhesive in related technologies. Figure 3 This is a magnified view of a portion of the backlight module at the light-emitting device in a related technology.

[0067] Combination Figures 2-3Understandably, along direction X, the backlight module 10 includes corner areas R0 located at both ends. Along direction Y, the LED strip adhesive 15 includes a lug structure extending beyond the LED strip circuit board 13. This lug structure is bonded to the light guide plate 12 within the corner area R0, and also serves to bond to the corresponding optical film, providing a fastening effect.

[0068] In some embodiments of this application, in order to form a conductive path between the light guide plate 12 and the frame 11 based on the conductive adhesive strip 201 and the conductive edge-sealing tape 202, such as Figure 4 As shown, Figure 4 for Figure 1 The image shows a partial enlarged view of the backlight module at the light-emitting device. Along direction X, on the side of the backlight module 10 where the light-emitting device 14 is located, the backlight module 10 includes two corner areas R0, two cutouts K0, and two conductive adhesive strips 201. The two cutouts K0 are located in the two corner areas R0, and the two conductive adhesive strips 201 are located in the two corner areas R0, with the conductive adhesive strips 201 disposed within the corresponding cutouts K0.

[0069] In some embodiments, such as Figure 4 As shown, along the opposite direction X of the two corner areas R0, the LED strip adhesive 15 includes a body portion 151 and first protruding ears 152 located on opposite sides of the body portion 151. The first protruding ears 152 include a boundary L near the body portion 151. A cutout K0 penetrates the body portion 151 and exposes the boundary L of the first protruding ears 152.

[0070] In this embodiment, the cutout K0 is located in the corner area R0 of the backlight module 10. Therefore, along the X direction, the cutout K0 is offset from the opening K1. The cutout K0 does not affect the electrical connection between the light-emitting device 14 and the LED strip circuit board 13 within the opening K1. This ensures that the LED strip adhesive 15 separates the conductive adhesive strip 201 from the light-emitting device 14, preventing a short circuit between them. Furthermore, the area corresponding to the corner R0 has fewer traces within the LED strip circuit board 13, so the cutout K0 has minimal impact on the internal wiring design of the LED strip circuit board 13, thus avoiding the pressure on the internal wiring design caused by the conductive adhesive strip 201.

[0071] contrast Figure 3 and Figure 4 In this embodiment of the application, the lug structure in the related technology is also optimized in conjunction with the setting of the hollow opening K0. For example... Figure 4As shown, the cutout K0 is located in the corner area R0, and part of the lug structure in the related technology is removed, so that the cutout K0 exposes the boundary L of the first lug 152. That is, compared with the lug structure in the related technology, the LED strip adhesive 15 in this embodiment not only has a cutout, but also the part of the lug structure in the direction Y of the cutout is removed. The boundary L of the first lug 152 is flush with one side boundary of the cutout K0, and one side boundary of the cutout K0 in the direction Y is also flush with one side boundary of the body 151. Based on this, the manufacturing process of the cutout K0 is simpler and easier to implement, and the precision control pressure of the application and alignment process of the conductive adhesive strip 201 and the light-shielding tape 16 is lower.

[0072] In some embodiments, such as Figures 5-7 As shown, Figure 5 A partial magnified view of the light-emitting device in another backlight module provided in this application. Figure 6 for Figure 5 The exploded view shows the LED strip circuit board and LED strip adhesive in the backlight module shown. Figure 7 for Figure 5 A partial rear view of the backlight module shown.

[0073] Combination Figure 5 and Figure 6 As shown, the backlight module 10 includes a side where a light-emitting device 14 is disposed. Along the direction parallel to the side, that is, along direction X, the opposite two sides of the light strip circuit board 13 extend beyond the opposite two sides of the light strip adhesive 15.

[0074] Along the Y direction, the two ends of the conductive structure 20 extend beyond the edge of the LED strip circuit board 13. Based on the relative position of the conductive structure 20 and the LED strip circuit board 13, the conductive structure 20 includes a first part 21, a second part 22, and a third part 23 connected in sequence. The first part 21 is in electrical contact with the light-emitting surface of the light guide plate 12. The second part 22 is located on the side of the LED strip circuit board 13 closest to the LED strip adhesive 15 and overlaps with the edge of the LED strip circuit board 13 extending beyond the LED strip adhesive 15; the second part 22 does not overlap with the LED strip adhesive 15. The third part 23 bends to the side of the frame 11 away from the light guide plate 12 and is in electrical contact with the frame 11.

[0075] contrast Figure 2 and Figure 6As can be seen, in this embodiment, the two ends and the lug structure of the LED strip adhesive in the related technology are removed. Compared with the LED strip circuit board 13, the LED strip adhesive 15 is recessed, reserving installation space for the conductive structure 20. Along the Z direction, the second part 22 is set in the same layer as the LED strip adhesive 15. The first part 21 of the conductive structure 20 is in electrical contact with the light-emitting surface of the light guide plate 12, and the third part 23 is bent and then in electrical contact with the back of the frame 11, thereby realizing the conductive path between the light guide plate 12 and the frame 11. The static charge generated on the light guide plate 12 can be grounded in real time, avoiding the howling noise problem.

[0076] In some embodiments, the conductive structure 20 includes conductive cloth, conductive copper foil, or conductive aluminum foil. It is understood that "conductive cloth, conductive copper foil, or conductive aluminum foil" refers to the substrate of the conductive structure 20. In addition, the conductive structure 20 also includes conductive adhesive to ensure conductivity and adhesion. All of these materials have good conductivity and bending properties, ensuring that a good conductive path is maintained after bending. Preferably, the conductive structure 20 includes conductive cloth, which has greater toughness and is less prone to cracking or creases when bent, resulting in higher reliability.

[0077] Since the conductive structure 20 has both conductive and adhesive properties, its first part 21 is pasted on the light guide plate 12, and its third part 23 is pasted on the frame 31. Then it extends and bends to the back of the frame 11. In addition to playing a role in electrostatic conduction, its adhesiveness can also play a certain role in fastening, realizing the bonding and fixing between the materials in the backlight module 10, which is beneficial to reduce vibration and reduce the amount of electrostatic charge caused by friction.

[0078] In some embodiments, such as Figure 1 and Figure 5 As shown, the backlight module 10 also includes an optical film 17, which is located on the side of the light guide plate 12 away from the frame 11. For example, the optical film 17 here refers to a lower prism, which is located on the side of the diffuser 33 away from the light guide plate 12. An upper prism 18 is also provided on the side of the lower prism away from the light guide plate 12.

[0079] The lower and upper prisms are used to adjust the direction and distribution of light, converging the light in a specific direction, which helps to improve display brightness and viewing angle, and makes the light emitted after passing through the upper prism fit the display panel in the display device.

[0080] like Figure 5As shown by the dashed line, the optical film 17 includes a second lug 171, and the first part 21 is also connected to the second lug 171. That is, along the Z direction, the first part 21 is located between the second lug 171 and the light guide plate 12. The first part 21 is used to adhere and fix the second lug 171, increasing the adhesion between the optical film 17 and the light guide plate 12, which is beneficial to further improve the tightness and reliability of the backlight module 10.

[0081] On the other hand, this application also provides a display module, such as Figure 8 As shown, Figure 8 This is a schematic diagram of a display module provided in an embodiment of this application. The display module 40 includes a backlight module 10, a display panel 41, and a flexible circuit board 42 as mentioned in any of the embodiments of the first aspect above. The display panel 41 is located on the backlight module 10 and is located on the light-emitting surface side of the light guide plate 12. One end of the flexible circuit board 42 is electrically connected to the display panel 41, and the other end is bent to the side of the frame 11 away from the light guide plate 12 and makes electrical contact with the frame 11.

[0082] For example, the display panel 41 includes a color filter substrate 411 and an array substrate 412, wherein the color filter substrate 411 is located on the side of the array substrate 412 away from the backlight module 10, one end of the flexible circuit board 42 is electrically connected to the array substrate 412 to provide drive control signals, and the copper leakage area at the other end is electrically contacted with the frame 11 to ground the frame 11, so as to improve the product's anti-electrostatic discharge capability, prevent the light-emitting device 14 from being broken down by electrostatic discharge, and also avoid the occurrence of radio frequency problems of the whole machine.

[0083] Within the display module 40, the conductive structure 20 forms a conductive path between the light guide plate 12 and the frame 11. The electrostatic charge on the light guide plate 12 can be electrically connected to the overall grounding terminal in real time through the conductive structure 20 and the frame 11. Whether it is the electrostatic charge remaining on the light guide plate 12 during the assembly of the backlight module 10, or the electrostatic charge formed by the friction of materials during the transportation process after the backlight module 10 is assembled, it can be quickly grounded through this conductive path. This allows the electrostatic charge of the light guide plate to be controlled within the range of ≤200V, which means that the problem of noise induced by electrostatic charge of the light guide plate 12 itself can be avoided.

[0084] Furthermore, this application also provides a display device, such as... Figure 9 As shown, Figure 9 This is a schematic diagram of a display device provided in an embodiment of this application. The display device 50 includes the aforementioned display module 40 and controller 51, with the controller 51 electrically connected to the display module 40.

[0085] like Figure 9As shown, the display device 50 also includes a cover plate 52 and a plurality of controllers 51. Some controllers 51 are located between the array substrate 412 and the cover plate 52 and are electrically connected to the array substrate 412. Other controllers 51 are located on the side of the backlight module 10 away from the cover plate 52 and are electrically connected to the flexible circuit board 42.

[0086] The controller 51 includes a touch chip for providing touch signals to the display panel 41. The touch signal periodically flips its level, causing a frequency-changing potential difference between the electrode plates between the display panel 41 and the frame 11, thus forming an external electric field. In this embodiment, the conductive structure 20 forms a conductive path between the light guide plate 12 and the frame 11. The electrostatic charge on the light guide plate 12 can be electrically connected to the overall grounding terminal in real time through the conductive structure 20 and the frame 11. The light guide plate 12 will no longer oscillate and emit noise under the piezoelectric effect. That is, in this embodiment, the howling noise problem can be effectively solved.

[0087] The aforementioned display device 50 can be any device that displays either moving (e.g., video) or stationary (e.g., still image) text or images. More specifically, the embodiments are contemplated to be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controllers and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0088] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A backlight module, characterized in that, include: Frame; A light guide plate is disposed on the frame. The light strip circuit board, the light-emitting device, and the light strip adhesive are provided. One side of the light strip circuit board is electrically connected to the light-emitting device and is connected to the light-emitting surface of the light guide plate through the light strip adhesive. A conductive structure is electrically contacted with the light-emitting surface of the light guide plate, and the conductive structure is bent to the side of the frame away from the light guide plate and electrically contacted with the frame.

2. The backlight module according to claim 1, characterized in that, The conductive structure includes a conductive adhesive strip and a conductive edge-sealing tape. The conductive adhesive strip is disposed on the side of the light guide plate away from the frame and is in electrical contact with the light-emitting surface of the light guide plate. One end of the conductive edge-binding tape is positioned on the side of the conductive strip away from the frame and is in electrical contact with the conductive strip. The other end is bent to the side of the frame away from the light guide plate and is in electrical contact with the frame.

3. The backlight module according to claim 2, characterized in that, The conductive edge-sealing tape includes a stacked conductive layer and a light-shielding layer; One end of the conductive layer is disposed on the side of the conductive adhesive strip away from the frame and is in electrical contact with the conductive adhesive strip; the other end is bent to the side of the frame away from the light guide plate and is in electrical contact with the frame. The light-shielding layer covers the side of the conductive layer away from the frame.

4. The backlight module according to claim 2, characterized in that, The backlight module also includes a cutout that penetrates the LED strip circuit board and the LED strip adhesive, and the cutout exposes the light-emitting surface of the light guide plate; The conductive adhesive strip is disposed inside the cutout and makes electrical contact with the light-emitting surface of the light guide plate.

5. The backlight module according to claim 4, characterized in that, The backlight module also includes a light-shielding tape, which is disposed on the side of the LED strip circuit board away from the LED strip adhesive, and the cutout also passes through the light-shielding tape.

6. The backlight module according to claim 5, characterized in that, Along the direction perpendicular to the light-emitting surface of the light guide plate, the thickness of the conductive adhesive strip is equal to the sum of the thicknesses of the light-shielding tape, the light strip circuit board, and the light strip adhesive.

7. The backlight module according to any one of claims 4 to 6, characterized in that, The backlight module has two corner areas on the side where the light-emitting device is located. The backlight module includes two cutouts and two conductive strips. The two cutouts are located in the two corner areas, and the two conductive strips are located in the two corner areas. The conductive strips are disposed in the corresponding cutouts.

8. The backlight module according to claim 7, characterized in that, Along the opposite direction of the two corner areas, the LED strip adhesive includes a body portion and first protruding ears located on opposite sides of the body portion, the first protruding ears including a boundary near the body portion; The cutout extends through the main body and exposes the boundary of the first protruding ear.

9. The backlight module according to claim 1, characterized in that, The backlight module includes a side where the light-emitting device is disposed, and along a direction parallel to the side, the opposite two side edges of the light strip circuit board extend beyond the opposite two side edges of the light strip adhesive; The conductive structure includes a first part, a second part, and a third part connected in sequence. The first part is in electrical contact with the light-emitting surface of the light guide plate. The second part is located on the side of the LED strip circuit board near the LED strip adhesive and overlaps with the edge of the LED strip circuit board that extends beyond the LED strip adhesive. The second part does not overlap with the LED strip adhesive. The third part is bent to the side of the frame away from the light guide plate and is in electrical contact with the frame.

10. The backlight module according to claim 9, characterized in that, The backlight module also includes an optical film, which is located on the side of the light guide plate away from the frame. The optical film includes a second lug, and the first part is also connected to the second lug.

11. The backlight module according to claim 9 or 10, characterized in that, The conductive structure includes conductive cloth, conductive copper foil, or conductive aluminum foil.

12. A display module, characterized in that, include: The backlight module as described in any one of claims 1 to 11; The display panel is located on the backlight module and on the light-emitting side of the light guide plate; The flexible circuit board has one end electrically connected to the display panel and the other end bent to the side of the frame away from the light guide plate, and in electrical contact with the frame.

13. A display device, characterized in that, include: The display module as described in claim 12; The controller is electrically connected to the display module.

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