A novel continuous exposure apparatus for etched wafers

Abstract

This utility model relates to a novel continuous exposure device for etched wafers in the field of etching processing technology. It includes an exposure machine and two conveyor belts. Each conveyor belt is equipped with a material gripping assembly, and one of the conveyor belts has a positioning assembly. The positioning assembly includes a positioning rod, a lifting stop rod, and a push rod. The positioning rod is located in the middle of the upper end of the conveyor belt. The push rod is positioned on both sides of the conveyor belt via a first driving component. The lifting stop rod is slidably mounted on the conveyor belt. A second driving component is provided on the conveyor belt to cooperate with the lifting stop rod. This utility model uses the first and second driving components to move the lifting stop rod and the push rod, cooperating with the positioning rod and the conveyor belt to adjust and position the etched wafer. The material gripping assembly precisely places the etched wafer into the exposure machine for exposure. After exposure, the material gripping assembly removes the etched wafer from the exposure machine and places it on the other conveyor belt for transport to the next process, completing the continuous exposure operation of the etched wafer.

Description

Technical Field

[0001] This utility model relates to the field of etching processing technology, specifically to a novel continuous exposure device for etched wafers. Background Technology

[0002] Etching, as a precision image transfer technology, is widely used in various fields such as PCB (Printed Circuit Board) manufacturing, signage production, and precision parts manufacturing. Its production process includes five core steps: pretreatment, coating, exposure and development, chemical etching, and post-processing. During the exposure and development process, a film is bonded to an etched sheet coated with photosensitive emulsion, and then exposed to an exposure lamp. This causes a chemical reaction in the photosensitive emulsion, precisely transferring the image from the film to the etched sheet, thus achieving a high-precision exposure effect.

[0003] Existing exposure devices rely on manual operation to align and bond the etched sheet with the film inside the exposure machine, and then the exposure machine performs the exposure operation. However, during long-term operation or mass production, repetitive manual operation is prone to fatigue errors, leading to a decrease in the bonding accuracy between the etched sheet and the film, affecting development quality and reducing production efficiency. This, in turn, impacts the overall product yield and market competitiveness. Therefore, this invention proposes a novel continuous exposure device for etched sheets. Summary of the Invention

[0004] This invention provides a novel continuous exposure device for etched wafers. Through the cooperation of the material gripping component and the positioning component, it achieves automated gripping and precise positioning of etched wafers, solving the problem of fatigue error caused by manual operation.

[0005] The objective of this utility model is achieved through the following means:

[0006] A novel continuous exposure apparatus for etched wafers includes an exposure machine and two conveyor belts respectively disposed at both ends of the exposure machine. Each of the two conveyor belts is provided with a material gripping component that cooperates with the exposure machine, and one of the conveyor belts is provided with a positioning component.

[0007] The positioning component includes a positioning rod, several lifting stops, and push rods. The positioning rod is located in the middle of the upper end of the conveyor belt. The several push rods are slidably installed on both sides of the conveyor belt via a first driving member. The lifting stops are slidably installed on the conveyor belt. The conveyor belt is provided with a second driving member that cooperates with the lifting stops.

[0008] Furthermore, the first driving component is a bidirectional lead screw module, and both ends of the bidirectional lead screw module are provided with connecting frames. Several support rods are linearly arrayed on the upper end of the connecting frames, and the push rod is detachably installed on the upper end of the support rods.

[0009] Furthermore, the connecting frame is provided with guide sleeves on both sides, and the conveyor belt is provided with guide rods that cooperate with the guide sleeves.

[0010] Furthermore, the conveyor belt is provided with a linear rail that cooperates with the lifting stop lever, and the lifting stop lever is provided with a slider that cooperates with the linear rail.

[0011] Furthermore, the material gripping assembly includes a sliding frame and an adjustable frame that can slide up and down. The adjustable frame is provided with a plurality of suction cup groups. The conveyor belt is provided with a moving module that cooperates with the sliding frame. The sliding frame is provided with a third driving component that cooperates with the adjustable frame.

[0012] Furthermore, a sliding groove is provided through the adjustment frame, and a sliding block that cooperates with the suction cup assembly is provided in the sliding groove. A fixing rod that cooperates with the sliding block is provided on the suction cup assembly.

[0013] Furthermore, the suction cup assembly includes a support frame and several suction nozzles. The support frame is provided with several through slots that cooperate with the several suction nozzles, and the several suction nozzles are slidably installed in the several through slots.

[0014] Furthermore, the exposure machine includes a worktable and a lifting plate slidably mounted on the worktable. Both the lifting plate and the worktable are provided with a light-transmitting plate and a film pressure plate. The lifting plate and the worktable are respectively provided with an exposure lamp that cooperates with the light-transmitting plate. The worktable is provided with a fourth driving component that slidably cooperates with the lifting plate.

[0015] Furthermore, both the lifting plate and the worktable are provided with guide rails and a fifth driving component that cooperate with the exposure lamp. One end of the exposure lamp is provided with a sliding plate, and both sides of the sliding plate are provided with guide blocks that cooperate with the guide rails.

[0016] The beneficial effects of this utility model are as follows: Driven by the first and second driving components, the lifting stop and push rod move, cooperating with the positioning rod and conveyor belt to achieve the adjustment and positioning of the etched sheet. The etched sheet is then precisely placed into the exposure machine by the material gripping assembly for exposure. After exposure, the etched sheet is removed from the exposure machine by the material gripping assembly and placed on the conveyor belt at the other end for transport to the next process, completing the continuous exposure operation of the etched sheet. Attached Figure Description

[0017] Figure 1 This is a first structural schematic diagram of a novel continuous exposure apparatus for etching wafers according to the present invention;

[0018] Figure 2 This is a schematic diagram of the second structure of a novel continuous exposure apparatus for etching wafers according to the present invention;

[0019] Figure 3 for Figure 2 Enlarged diagram of A in the middle;

[0020] Figure 4 for Figure 2 Enlarged diagram of B in the diagram;

[0021] Figure 5 This is a cross-sectional view of a novel continuous exposure apparatus for etching wafers according to this utility model;

[0022] Figure 6 for Figure 5 Enlarged diagram of C in the middle;

[0023] Figure 7 for Figure 5 Enlarged diagram of D in the middle;

[0024] Figure 8 This is a first partial cross-sectional view of a novel continuous exposure apparatus for etching wafers according to this utility model;

[0025] Figure 9 This is a second partial sectional view of a novel continuous exposure device for etching wafers according to this utility model; the reference numerals in the figure are as follows: 1-exposure machine, 11-worktable, 111-fourth driving component, 12-lifting plate, 13-light-transmitting plate, 14-film pressure plate, 15-exposure lamp, 151-sliding plate, 152-guide block, 16-guide rail, 17-fifth driving component, 2-conveyor belt, 21-second driving component, 22-linear rail, 23-moving module, 24-guide rod, 3-material gripper. Components: 31-Sliding frame, 32-Adjusting frame, 321-Sliding groove, 322-Sliding block, 33-Suction cup assembly, 331-Fixing rod, 332-Support frame, 3321-Through groove, 333-Suction nozzle, 34-Third driving component, 4-Positioning component, 41-Positioning rod, 42-Lifting stop bar, 421-Slider, 43-Push rod, 44-First driving component, 441-Two-way lead screw module, 442-Connecting frame, 4421-Guide sleeve, 443-Support rod. Detailed Implementation

[0026] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0027] In this embodiment, refer to Figure 1 - Figure 9 The present invention is a novel continuous exposure device for etching wafers, comprising an exposure machine 1 and two conveyor belts 2 respectively located at both ends of the exposure machine 1. Each of the two conveyor belts 2 is provided with a material gripping component 3 that cooperates with the exposure machine 1, and one of the conveyor belts 2 is provided with a positioning component 4.

[0028] In operation, the conveyor belt 2, equipped with the positioning component 4, is connected to the equipment of the previous process. The etched sheet is positioned and adjusted by the conveyor belt 2, which then grips the adjusted etched sheet and feeds it into the exposure machine 1 to adhere it to the film. The exposure machine 1 then completes the exposure process. After exposure, the etched sheet is removed by the gripping component 3 at the other end, placed on the conveyor belt 2, and transported to the next process, thus achieving continuous exposure production.

[0029] The positioning component 4 includes a positioning rod 41, several lifting stops 42, and push rods 43. The positioning rod 41 is located in the middle of the upper end of the conveyor belt 2. The push rods 43 are slidably mounted on both sides of the conveyor belt 2 via a first driving member 44. The lifting stops 42 are slidably mounted on the conveyor belt 2. The conveyor belt 2 is equipped with a second driving member 21 that cooperates with the lifting stops 42. The second driving member 21 controls the lifting stops 42 to slide up and down, thereby contacting the etched sheet on the conveyor belt 2 and achieving positioning adjustment in the forward direction. The first driving member 44 drives the push rods 43 on both sides to slide horizontally, causing the etched sheet to move laterally and fit against the positioning rod 41, achieving precise lateral positioning. By adjusting the spacing between the lifting stops 42, the etched sheet is evenly arranged on the conveyor belt 2, thereby accurately aligning with the film and ensuring consistent exposure results.

[0030] The conveyor belt 2 is formed by a support frame and several rotating shafts. The rotating shafts are rotatably mounted on the support frame through rolling bearings. One end of the support frame is provided with a rotating component connected to the rotating shaft. The rotating component is connected to the rotating shaft through a pulley. The rotating shafts rotate synchronously with the chain through sprockets, thereby achieving the conveying effect.

[0031] The first driving component 44 is a bidirectional lead screw module 441. Both ends of the bidirectional lead screw module 441 are equipped with connecting frames 442. Several support rods 443 are linearly arrayed on the upper end of the connecting frames 442. Push rods 43 are detachably installed on the upper ends of the support rods 443. The bidirectional lead screw module 441 includes a bidirectional threaded lead screw, a lead screw nut, and a drive motor. The bidirectional threaded lead screw is rotatably mounted on the conveyor belt 2 via bearing seats. Both ends of the bidirectional threaded lead screw are equipped with lead screw nuts. The drive motor is fixedly installed on one side of the conveyor belt 2 and connected to the bidirectional threaded lead screw. The connecting frames 442 are connected to the lead screw nut via nut seats.

[0032] The rotation of the drive motor drives the bidirectional threaded screw to rotate, causing the two screw nuts to move synchronously in opposite directions along the screw, which in turn pushes the push rod 43 on the connecting frame 442 and the support rod 443 to move horizontally, so that the etched sheet fits with the positioning rod 41, achieving precise lateral positioning.

[0033] The support rod 443 has a sleeve structure. The lower end of the push rod 43 has an insert that mates with the inner wall of the sleeve. The tight fit between the insert and the inner wall ensures that the push rod 43 slides as the support rod 443 moves, thereby pushing the etched sheet laterally. Guide sleeves 4421 are provided on both sides of the connecting frame 442, and the conveyor belt 2 has guide rods 24 that mate with the guide sleeves 4421. The cooperation between the guide sleeves 4421 and the guide rods 24 ensures that the connecting frame 442 and the support rod 443 remain stable during horizontal movement, thereby ensuring precise movement of the push rod 43 and avoiding deviation.

[0034] The conveyor belt 2 is equipped with a linear guide 22 that cooperates with the lifting stop lever, and the lifting stop lever is equipped with a slider 421 that cooperates with the linear guide 22. Through the cooperation of the linear guide 22 and the slider 421, the lifting stop lever 42 can be smoothly slid up and down under the control of the second drive component 21, thereby cooperating with the etched sheet to achieve precise positioning.

[0035] The material gripping assembly 3 includes a sliding frame 31 and an adjustable frame 32 that can slide up and down. The adjustable frame 32 is equipped with several suction cup assemblies 33. The conveyor belt 2 has a moving module 23 that cooperates with the sliding frame 31. The sliding frame 31 has a third driving component 34 that cooperates with the adjusting frame 32. Controlled by the third driving component 34, the adjusting frame 32 moves up and down within the sliding frame 31, synchronously raising and lowering the suction cup assemblies 33 to contact and grip the etched sheet. Subsequently, the moving module 23 drives the sliding frame 31 to move horizontally, causing the adjusting frame 32 and suction cup assemblies 33 to move along the conveyor belt 2, precisely placing the etched sheet into the exposure machine 1, ensuring accurate alignment between the etched sheet and the film. This achieves automated control of the exposure process, improving production efficiency and accuracy, ensuring uniform exposure for each etched sheet, and ultimately improving the quality of the exposure.

[0036] A sliding groove 321 is provided through the adjustment frame 32. A sliding block 322, which mates with the suction cup assembly 33, is located within the sliding groove 321. A fixing rod 331, which mates with the sliding block 322, is provided on the suction cup assembly 33. The sliding block 322 and the sliding groove 321 are precisely matched in size, ensuring that the sliding block 322 can slide smoothly within the sliding groove 321. The fixing rod 331 and the sliding block 322 work together to firmly fix the suction cup assembly 33 to the adjustment frame 32, ensuring stable gripping. When the gripping position of the suction cup assembly 33 needs to be adjusted, simply turn the fixing rod 331 to loosen the sliding block 322 and move it along the sliding groove 321 to the new position. Then tighten the fixing rod 331 to adjust and fix the suction cup assembly 33, thereby enabling flexible gripping of etched sheets of different sizes.

[0037] The suction cup assembly 33 includes a support frame 332 and several suction nozzles 333. The support frame 332 has several through slots 3321 that mate with the suction nozzles 333. The suction nozzles 333 are slidably installed within the through slots 3321. The suction nozzles 333 are fixed to the through slots 3321 by bolts. The design of the through slots 3321 ensures that the position of the suction nozzles 333 can be adjusted appropriately to accommodate etching sheets of different shapes and sizes, thereby ensuring a firm grip. The suction nozzles 333 are connected to an external negative pressure source to generate strong suction, thereby firmly adhering to the etching sheets and ensuring that they do not fall off during movement. When the etching sheet reaches the designated position on the exposure machine 1, the suction nozzles 333 release the negative pressure, releasing the etching sheet, thus completing the loading and unloading operation.

[0038] The exposure machine 1 includes a worktable 11 and a lifting plate 12 slidably mounted on the worktable 11. Both the lifting plate 12 and the worktable 11 are provided with a light-transmitting plate 13 and a film pressure plate 14. The lifting plate 12 and the worktable 11 are each provided with an exposure lamp 15 that cooperates with the light-transmitting plate 13. The worktable 11 is provided with a fourth driving component 111 that slidably cooperates with the lifting plate 12. An exposure area is formed between the worktable 11 and the lifting plate 12.

[0039] Before use, the film is placed on the light-transmitting plate 13 and fixed by the film pressure plate 14 to ensure a tight fit between the film and the light-transmitting plate 13 and guarantee exposure accuracy. After the etching sheet is fed into the exposure area by the material gripping assembly 3, the fourth drive unit 111 controls the lifting plate 12 to move, so that both sides of the etching sheet are in close contact with the film, and the double-sided exposure of the etching sheet is completed by the illumination of the exposure lamp 15.

[0040] After the exposure operation is completed, the fourth drive unit 111 controls the lifting plate 12 to reset, and the etched sheet is picked up by the material gripping component 3 at the other end and placed on the conveyor belt 2, and then transported to the next process through the conveyor belt 2, and the above process is repeated to achieve efficient continuous production.

[0041] Both the lifting plate 12 and the worktable 11 are equipped with guide rails 16 and fifth drive components 17 that cooperate with the exposure lamp 15. One end of the exposure lamp 15 is equipped with a sliding plate 151, and both sides of the sliding plate 151 are equipped with guide blocks 152 that cooperate with the guide rails 16. Through the tight cooperation between the guide blocks 152 and the guide rails 16, the sliding plate 151 can move smoothly along the guide rails 16, thereby adjusting the position of the exposure lamp 15. This ensures that the light uniformly covers the surface of the etched wafer while reducing the energy consumption of the exposure lamp 15 and extending its service life.

[0042] In use, the sliding plate 151 is moved by the fifth driving component 17 to adjust the position of the exposure lamp 15, control the irradiation angle and time of the exposure lamp 15, and ensure that the light evenly covers the surface of the etched sheet, thereby improving the exposure effect.

[0043] The exposure machine 1 has openable and closable protective covers on both sides. The protective covers are rotatably connected to the exposure machine 1 via hinges and other connecting parts. One side of the protective cover is equipped with a locking pin or other fixing part to securely lock the protective cover and ensure operational safety. When it is necessary to open the protective cover for maintenance or film replacement, the operator only needs to move the locking pin to easily open the protective cover for maintenance or other operations.

[0044] The beneficial effects of this utility model are as follows: Driven by the first driving component 44 and the second driving component 21, the lifting stop and push rod 43 move, cooperating with the positioning rod 41 and the conveyor belt 2 to achieve the adjustment and positioning of the etched sheet. The etched sheet is then precisely placed into the exposure machine 1 by the material gripping component 3 to achieve the exposure operation. Subsequently, the exposed etched sheet is taken out of the exposure machine 1 by the material gripping component 3 and placed on the conveyor belt 2 at the other end for transport to the next process, completing the continuous exposure operation of the etched sheet.

[0045] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the present utility model without departing from the scope of the present utility model shall fall within the scope of the present utility model.

Claims

1. A novel continuous exposure apparatus for etching wafers, comprising an exposure machine (1) and two conveyor belts (2) respectively disposed at both ends of the exposure machine (1), characterized in that: Both conveyor belts (2) are equipped with a material gripping assembly (3) that cooperates with the exposure machine (1), and one of the conveyor belts (2) is equipped with a positioning assembly (4); The positioning component (4) includes a positioning rod (41), a plurality of lifting stops (42) and push rods (43). The positioning rod (41) is located in the middle of the upper end of the conveyor belt (2). The plurality of push rods (43) are slidably mounted on both sides of the conveyor belt (2) through a first driving member (44). The lifting stops (42) are slidably mounted on the conveyor belt (2). The conveyor belt (2) is provided with a second driving member (21) that cooperates with the lifting stops (42).

2. The novel continuous exposure apparatus for etching wafers according to claim 1, characterized in that: The first driving component (44) is a bidirectional lead screw module (441). Both ends of the bidirectional lead screw module (441) are provided with connecting frames (442). The upper end of the connecting frame (442) has a linear array of several support rods (443). The push rod (43) is detachably installed on the upper end of the support rod (443).

3. The novel continuous exposure apparatus for etching wafers according to claim 2, characterized in that: The connecting frame (442) is provided with guide sleeves (4421) on both sides, and the conveyor belt (2) is provided with guide rods (24) that cooperate with the guide sleeves (4421).

4. The novel continuous exposure apparatus for etching wafers according to claim 1, characterized in that: The conveyor belt (2) is provided with a linear rail (22) that cooperates with the lifting stop bar, and the lifting stop bar is provided with a slider (421) that cooperates with the linear rail (22).

5. The novel continuous exposure apparatus for etching wafers according to claim 1, characterized in that: The material gripping assembly (3) includes a sliding frame (31) and an adjustable frame (32) that can slide up and down. The adjustable frame (32) is provided with a plurality of suction cup groups (33). The conveyor belt (2) is provided with a moving module (23) that cooperates with the sliding frame (31). The sliding frame (31) is provided with a third driving member (34) that cooperates with the adjustable frame (32).

6. The novel continuous exposure apparatus for etching wafers according to claim 5, characterized in that: The adjusting frame (32) is provided with a sliding groove (321) through it. The sliding groove (321) is provided with a sliding block (322) that cooperates with the suction cup assembly (33). The suction cup assembly (33) is provided with a fixing rod (331) that cooperates with the sliding block (322).

7. A novel continuous exposure apparatus for etching wafers according to claim 5 or 6, characterized in that: The suction cup assembly (33) includes a support frame (332) and a plurality of suction nozzles (333). The support frame (332) is provided with a plurality of through slots (3321) that cooperate with the plurality of suction nozzles (333). The plurality of suction nozzles (333) are slidably installed in the plurality of through slots (3321).

8. The novel continuous exposure apparatus for etching wafers according to claim 1, characterized in that: The exposure machine (1) includes a worktable (11) and a lifting plate (12) slidably mounted on the worktable (11). Both the lifting plate (12) and the worktable (11) are provided with a light-transmitting plate (13) and a film pressing plate (14). The lifting plate (12) and the worktable (11) are respectively provided with an exposure lamp (15) that cooperates with the light-transmitting plate (13). The worktable (11) is provided with a fourth driving member (111) that slidably cooperates with the lifting plate (12).

9. The novel continuous exposure apparatus for etching wafers according to claim 8, characterized in that: Both the lifting plate (12) and the worktable (11) are provided with guide rails (16) and fifth driving components (17) that cooperate with the exposure lamp (15). One end of the exposure lamp (15) is provided with a sliding plate (151), and both sides of the sliding plate (151) are provided with guide blocks (152) that cooperate with the guide rail (16).

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