A server with an independent power supply air duct

Abstract

This utility model provides a server with an independent power supply airflow, relating to the field of server design technology. Its key technical features include: a chassis and a power supply, wherein the power supply is located inside the chassis. The chassis includes a base plate and side plates. The power supply is fixed to the base plate. A cold air vent is provided on the side plate of the chassis. A power supply air inlet is provided on the power supply. A power supply baffle is provided on the side of the power supply with the power supply air inlet. The power supply baffle is a hollow cuboid with two openings, which are respectively used to connect the cold air vent and the power supply air inlet. By introducing cold air from outside the chassis through the cold air vent, the hot air from the CPU's rear end is prevented from affecting the power supply, thereby reducing the temperature of the power supply air inlet and keeping the power supply in a better temperature environment. The direct advantage is that it prevents the power supply from derating or stopping output, ensuring normal server operation and indirectly extending the power supply's lifespan.

Description

Technical Field

[0001] This utility model relates to the field of server design technology, and in particular to a server with an independent power supply air duct. Background Technology

[0002] A server is a high-performance, highly reliable dedicated computer whose core function is to act as a "central service provider" in a network, centrally managing and delivering critical resources and services to client devices (such as personal computers and mobile phones). Its main uses include: acting as a central data repository (file server), securely storing and facilitating the sharing of documents, databases, and multimedia files by authorized users within the network; hosting and running critical business software (application server), such as enterprise management systems (ERP / CRM), allowing multiple users to access them simultaneously; hosting websites (web server), storing web page files and responding to browsing requests from users worldwide; efficiently managing and processing massive amounts of structured data (database server), providing support for applications; and handling the sending, receiving, storage, and routing of emails (mail server), ensuring the foundation of communication. Furthermore, the powerful hardware resources of servers support virtualization technology, allowing them to be partitioned into multiple isolated virtual machines to run different systems and applications, significantly improving resource utilization; simultaneously, they form the cornerstone of cloud computing services (cloud server), providing flexible and scalable computing, storage, and network resources and delivering them on demand via the Internet (IaaS / PaaS / SaaS).

[0003] In current technology, most servers are equipped with high-performance, high-power CPUs and GPUs. As power consumption increases, heat dissipation becomes more and more difficult. At the same time, the temperature at the CPU's exhaust port is getting higher and higher, which also causes the power supply's intake port to get very hot. This seriously affects the lifespan of the power supply and may even cause the power supply to dredge or stop outputting power due to excessively high power supply intake port temperature, directly affecting the operation of the entire server. Utility Model Content

[0004] The purpose of this invention is to solve the problem in the prior art where excessively high power supply inlet temperature leads to power supply derating and even power outages, affecting the operation of the entire server.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A server with an independent power supply air duct includes a chassis and a power supply. The power supply is located inside the chassis. The chassis includes a base plate and a side plate. The power supply is fixed to the base plate. A cold air vent is provided on the side plate of the chassis. A power supply air inlet is provided on the power supply. A power supply baffle is provided on the side of the power supply with the power supply air inlet. The power supply baffle is a hollow cuboid with two openings for connecting the cold air vent and the power supply air inlet, respectively.

[0006] Preferably, one of the openings is located on the side pointing towards the power supply air inlet, for abutting against the power supply air inlet, and the other opening is located at one end of the power supply baffle along its length, and one end of the opening in the length direction of the power supply baffle extends towards the cold air inlet to form an extension.

[0007] Preferably, the cold air vent is a grille opening on the side panel, and the outer end of the cold air vent can be connected to an external cold air source.

[0008] Preferably, the chassis is further provided with functional components, including a motherboard, memory, CPU and heat sink, wherein the motherboard is fixed above the supporting base plate and is located in front of the power supply, and the memory, CPU and heat sink are located above the motherboard.

[0009] Preferably, the cooling vent is located between the motherboard and the power supply.

[0010] Preferably, the motherboard has a built-in fan at the end opposite to the power supply, and the built-in fan is connected to the motherboard for power via a cable.

[0011] Preferably, the CPU air shroud is provided on the upper side of the motherboard.

[0012] Preferably, the CPU air shroud is located above the memory, the CPU, and the heat sink.

[0013] Compared with the prior art, this application has the following beneficial effects: By introducing cool air from outside the chassis through the cooling vents, the hot air from the back of the CPU is prevented from affecting the power supply, thereby reducing the temperature at the power supply's air intake and keeping the power supply in a better temperature environment. The direct advantage is that it prevents the power supply from derating or stopping its output, ensuring the normal operation of the server and indirectly extending the power supply's lifespan.

[0014] In addition, the openings on both sides of the power supply baffle form an independent air duct between the cold air inlet and the power supply air inlet, providing cold air to the power supply air inlet and isolating hot air from other places, ensuring that the power supply operates in a low-temperature environment. Attached Figure Description

[0015] Figure 1 This is a partially enlarged schematic diagram of a server with an independent power supply duct according to one embodiment of this application, used to show the internal structure of the server.

[0016] Figure 2 This is an enlarged schematic diagram of a server power supply with an independent power air duct according to one embodiment of this application, used to show the independent air duct of the power supply.

[0017] In the diagram, 11 is the built-in fan; 12 is the memory; 13 is the CPU and heatsink; 14 is the CPU shroud; 15 is the power supply; 17 is the chassis; 18 is the motherboard; 21 is the air vent; 22 is the power supply air inlet; and 23 is the power supply baffle. Detailed Implementation

[0018] The present invention will be further described in detail below with reference to specific embodiments.

[0019] Please see Figure 1 A server with an independent power supply duct includes a chassis 17, functional components, heat dissipation components, and a power supply 15. The chassis 17 is generally a hollow cuboid. The functional components and the heat dissipation components are located inside the chassis 17. The power supply 15 is located at the rear end of the functional components and is used to provide power to the functional components and heat dissipation components inside the server.

[0020] In one implementation, please refer to Figure 1 The chassis 17 includes a base plate and side plates, which are used to support the heat dissipation components.

[0021] Please see Figure 1 The functional components include a motherboard 18, a memory 12, a CPU, and a heat sink 13. The motherboard 18 is fixed above the supporting base plate and is located at the front end of the power supply 15. The memory 12, the CPU, and the heat sink 13 are located above the motherboard 18. The memory 12, the CPU, and the heat sink 13 are important heat-generating systems within the server.

[0022] Please see Figure 2 The heat dissipation component is used to dissipate heat from the functional components and the power supply 15. In one embodiment, the heat dissipation component includes a built-in fan 11, a CPU air duct 14, and an independent air duct. The built-in fan 11 is used to dissipate heat from the motherboard 18. The CPU air duct 14 is used to straighten the airflow for the memory 12, CPU, and heat sink 13. The independent air duct is used to supply cool air to the power supply separately and to isolate the hot air from the CPU and heat sink 13 on the motherboard 18.

[0023] Specifically, the built-in fan 11 is located at the front end of the motherboard 18, and the built-in fan 11 is connected to the motherboard 18 for power supply via a cable.

[0024] The CPU air duct 14 is located above the motherboard 18. In one embodiment, the CPU air duct 14 is located above the memory 12 and the CPU and heat sink 13, and is used to straighten the airflow of the memory 12 and the CPU and heat sink 13 to facilitate the heat dissipation of the CPU.

[0025] Please see Figure 2 The independent air duct includes a cold air inlet 21, a power supply air inlet 22, and a power supply baffle 23. The cold air inlet 21 is located on the side panel of the chassis 17, between the motherboard 18 and the power supply 15. In one embodiment, the cold air inlet 21 is a grille opening on the side panel, and its outer end can be connected to an external cold air source (such as a fan cooler). The power supply air inlet 21 is located on the power supply 15 body. In one embodiment, the power supply air inlet 21 is located on the side of the power supply 15 facing the motherboard 18 and has an opening.

[0026] The power supply baffle 23 is located on the side of the power supply 15 facing the motherboard 18. The power supply baffle 23 is a hollow cuboid with two openings. One opening is located on the side facing the power supply air inlet 21 and is used to abut against the power supply air inlet 21. The other opening is located at one end along its length. The opening along the length of the power supply baffle 23 extends towards the cold air inlet 21 to form an extension. Through the openings on both sides, an independent air duct is formed between the cold air inlet 21 and the power supply air inlet 21, providing cold air to the power supply air inlet 21. On the other hand, it isolates hot air from other places, ensuring that the power supply 15 operates in a low-temperature environment.

[0027] The server with an independent power supply air duct provided in this application introduces cool air from outside the chassis 17 through the setting of the cold air vent 21, avoiding the impact of the hot air from the back of the CPU on the power supply 15, thereby reducing the temperature of the power supply air inlet 21 and keeping the power supply 15 in a better temperature environment. The direct advantage is to prevent the power supply 15 from derating or stopping output, ensuring the normal operation of the server, and indirectly extending the life of the power supply 15.

Claims

1. A server with an independent power supply air duct, comprising a chassis and a power supply, wherein, The power supply is located inside the chassis, characterized in that: the chassis includes a base plate and a side plate, the power supply is fixed on the base plate, a cold air vent is provided on the side plate of the chassis, a power supply air inlet is provided on the power supply, a power supply baffle is provided on the side of the power supply where the power supply air inlet is provided, the power supply baffle is a hollow cuboid, and the power supply baffle has two openings, which are respectively used to connect the cold air vent and the power supply air inlet.

2. A server with an independent power supply duct according to claim 1, characterized in that: One of the openings is located on the side pointing towards the power supply air inlet and is used to abut against the power supply air inlet. The other opening is located at one end of the power supply baffle along its length, and one end of the opening along the length of the power supply baffle extends towards the cold air inlet to form an extension.

3. A server with an independent power supply duct according to claim 2, characterized in that: The cold air vent is a grille opening on the side panel, and the outer end of the cold air vent can be connected to an external cold air source.

4. A server with an independent power supply duct according to claim 3, characterized in that: The chassis also contains functional components, including a motherboard, memory, CPU, and heatsink. The motherboard is fixed above the base plate and is located in front of the power supply. The memory, CPU, and heatsink are located above the motherboard.

5. A server with an independent power supply duct according to claim 4, characterized in that: The cooling vent is located between the motherboard and the power supply.

6. A server with an independent power supply duct according to claim 5, characterized in that: The motherboard has a built-in fan located on the side opposite to the power supply, and the built-in fan is connected to the motherboard via a cable to draw power.

7. A server with an independent power supply duct according to claim 6, characterized in that: The CPU air shroud is located on the upper side of the motherboard.

8. A server with an independent power supply duct according to claim 7, characterized in that: The CPU air shroud is located above the memory, the CPU, and the heat sink.

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