Heating and pre-compression equipment

Abstract

This utility model relates to a heating and pre-pressing device. The device includes: a base plate supporting the target device to be pre-pressed and heated; a pre-pressing block located above the base plate applying pressure to a liquid-cooled plate under the drive of a pressure-applying drive device; a liquid drive device, during the process of the pre-pressing block applying pressure to the liquid-cooled plate, outputting the heated liquid stored in a liquid storage device from the outlet of the liquid storage device to the liquid-cooled plate; and after determining that the heating stop condition is met, exporting the cooling liquid in the liquid-cooled plate from the liquid outlet of the liquid-cooled plate to the liquid storage device. This device can heat phase change materials to a liquid state during the pre-pressing process, resulting in a significant phase change effect, high efficiency, and fast speed, thus improving production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of electronic packaging technology, and in particular to a heating and pre-pressing device. Background Technology

[0002] With the increasing computing power demands in fields such as AI (Artificial Intelligence), the power consumption of processors like GPUs (Graphics Processing Units) has risen dramatically, from 450W to 700W and then to 1200W. This increasing processor power poses a significant challenge to heat dissipation. Phase change materials (PCMs), due to their unique physical properties and efficient thermal management capabilities, are widely used in the heat dissipation of high-power GPUs and other processors. To further improve heat dissipation, liquid cooling plates are often used on GPUs and other processors, allowing the heat generated by the processor to be transferred to the liquid cooling plate via the PCMs. For assembly, the PCMs are typically processed into sheets and then installed on the top of the GPU. The liquid cooling plate is then installed on top of the PCMs, followed by pre-stressing and stress testing. However, the stress testing method in these technologies suffers from problems such as incomplete phase change of the PCMs and long processing times. Utility Model Content

[0003] Technical issues

[0004] In view of this, the technical problem to be solved by this utility model is how to improve the speed and effect of the baking machine.

[0005] Solution

[0006] To address the aforementioned technical problems, according to one embodiment of the present invention, a heating and pre-compression device is provided.

[0007] The equipment includes: a base plate, a pre-compression block, a liquid storage device, a liquid driving device, and a pressure driving device. The equipment is used to pre-compress and heat the target device.

[0008] The base plate is used to support the target device to be pre-pressed and heated. The target device includes a processing chip, a heat dissipation material layer covering the processing chip, and a liquid cooling plate located above the processing chip. The material of the heat dissipation material layer is a phase change material.

[0009] A pre-compression block, located above the base plate, is used to apply pressure to the liquid cooling plate under the drive of the pressure application drive device;

[0010] The liquid driving device is used to output the heated liquid stored in the liquid storage device from the outlet of the liquid storage device to the liquid cooling plate during the process of the pre-compression block applying pressure to the liquid cooling plate; and after determining that the heating stop condition is met, to export the cooling liquid in the liquid cooling plate from the liquid outlet of the liquid cooling plate to the liquid storage device.

[0011] In one possible implementation, the pre-compression block is provided with a liquid inlet and a liquid outlet. The liquid inlet is connected to the liquid inlet of the liquid cooling plate through a liquid inlet passage in the pre-compression block, and the liquid inlet is connected to the liquid storage device through a liquid transfer pipe for outputting the heated liquid. The liquid outlet is connected to the liquid outlet of the liquid cooling plate through a liquid outlet passage in the pre-compression block, and the liquid outlet is connected to the liquid storage device through a liquid transfer pipe for receiving the cooling liquid.

[0012] In one possible implementation, each of the liquid transfer tubes includes a first transfer tube and a second transfer tube. One end of each first transfer tube is fixedly connected to the liquid inlet or the liquid outlet of the pre-compression block, and one end of each second transfer tube is fixedly connected to the inlet or the outlet of the liquid storage device. The other ends of the first transfer tube and the other ends of the second transfer tube of the same liquid transfer tube are detachably connected by a quick connector.

[0013] In one possible implementation, the liquid driving device includes:

[0014] A liquid pump, in response to a liquid filling command, draws the heated liquid stored in the liquid storage device from the outlet and delivers it through the liquid transfer pipe and the pre-compression block to the liquid cooling plate.

[0015] In one possible implementation, the liquid pump is further configured to, after determining that the heating stop condition is met, extract the cooling liquid in the liquid cooling plate from the liquid outlet and transport it back to the liquid storage device through the pre-compression block and the liquid transfer pipe.

[0016] In one possible implementation, the heating stop condition includes at least one of the following: the duration for which the heated liquid is filled in the liquid cooling plate exceeds the heating duration, and the temperature of the heat dissipation material layer reaches a first preset temperature.

[0017] In one possible implementation, the first preset temperature is set based on the phase transition temperature of the heat dissipation material layer.

[0018] In one possible implementation, the heating duration is set according to the size of the heat dissipation material layer and the phase change temperature.

[0019] In one possible implementation, the liquid stored in the liquid storage device includes water.

[0020] The liquid storage device is further configured to heat the liquid so that the liquid reaches a second preset temperature after heating, the second preset temperature being greater than the first preset temperature.

[0021] In one possible implementation, the processing chip includes a GPU.

[0022] Beneficial effects

[0023] The heating and pre-pressing device according to the present invention can heat the phase change material to a liquid state during the pre-pressing process, resulting in a significant phase change effect, high efficiency, and fast speed, which greatly improves production efficiency.

[0024] Other features and aspects of the present invention will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0025] The accompanying drawings, which are included in and form part of this specification, illustrate exemplary embodiments, features, and aspects of the present invention together with the specification and serve to explain the principles of the present invention.

[0026] Figure 1 A schematic diagram of a graphics card is shown.

[0027] Figure 2 A schematic diagram of a heating and pre-compression device according to an embodiment of the present invention is shown.

[0028] Figure 3 A schematic diagram of a heating and pre-compression device according to an embodiment of the present invention is shown. Detailed Implementation

[0029] Various exemplary embodiments, features, and aspects of the present invention will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0030] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0031] Furthermore, to better illustrate this utility model, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this utility model can be implemented even without certain specific details. In some instances, methods, means, components, and circuits well-known to those skilled in the art have not been described in detail, in order to highlight the main points of this utility model.

[0032] Phase change materials (PCMs) possess the following performance advantages, making them suitable as heat dissipation materials for chips with high heat dissipation requirements:

[0033] First, high thermal conductivity. The thermal conductivity of phase change materials can be as high as 5W / m·K-8W / m·K, far exceeding that of traditional silicone grease (thermal conductivity of 1W / m·K-3W / m·K). It can quickly transfer heat from the chip to the heat sink, reduce the operating temperature, and avoid performance degradation or damage caused by overheating.

[0034] Second, intelligent phase change characteristics. Because phase change materials are solid at low temperatures and liquid at high temperatures, they can be set to be solid sheets at room temperature for easy pre-installation; when the chip temperature rises to 45℃-60℃, the phase change material softens and flows, filling the tiny gaps between heat dissipation interfaces (such as surface roughness and unevenness), significantly reducing contact thermal resistance and improving heat dissipation efficiency.

[0035] Third, long-term stability. Because phase change materials do not flow excessively or volatilize after phase change, they have strong anti-aging ability and can maintain stable performance even in harsh environments such as high temperature, high humidity, and thermal cycling. Their lifespan can reach 5 to 10 years, making them suitable for industrial and automotive applications.

[0036] To explain the application scenarios of the heating and pre-compression equipment in this utility model, the following is combined with... Figure 1 The graphics card shown is explained below, such as Figure 1 As shown, the graphics card includes a substrate 21, a GPU 22 and related components (not shown) mounted on the substrate 21, a phase change material layer 24 covering the GPU 22, and a liquid cooling plate 23 covering the GPU 22 and related components. During the manufacturing process of the graphics card, it is necessary to complete the processing of the graphics card... Figure 1 After assembly, pre-compression and heat treatment are performed. Pre-compression reduces the contact thermal resistance between the phase change material layer 24 and components such as the liquid cooling plate 23, preventing displacement or deformation of the phase change material layer 24 during subsequent use, enhancing connection stability, and ensuring that the phase change material layer 24 can better perform its heat transfer performance. Heat treatment heats the phase change material layer 24 to above its phase change temperature, causing it to completely transform from a solid to a liquid state, thereby maximizing the thermal management performance of the phase change material layer 24.

[0037] For graphics cards with phase change material layers, the stress testing methods include:

[0038] First, the GPU can be used to run for about 45 minutes under low load to heat the phase change material layer until it undergoes a complete phase change before normal production testing. However, this method is inefficient, especially in winter when the water temperature at the production test site is only about 20°C. The low ambient temperature makes it difficult for the phase change material to reach the phase change temperature, which may result in insufficient idle power consumption to allow the phase change material to undergo a complete phase change, leading to power loss. Even if power loss does not occur, the stress test time needs to be further extended.

[0039] Secondly, using an oven, the graphics card is placed in a 70℃ oven for about 45 minutes to fully heat the phase change material layer. However, this method suffers from low efficiency. Furthermore, even under such high temperatures, some graphics cards still exhibit incomplete phase change. This may be due to uneven heat conduction or poor contact between the phase change material and components such as the liquid cooling plate, or inconsistent performance of the phase change material itself, resulting in some areas failing to complete the phase change.

[0040] To address the aforementioned problems, this utility model provides a heating and pre-pressing device that can heat phase change materials to a liquid state during the pre-pressing process. This device offers significant phase change effects, high efficiency, and fast speed, greatly improving production efficiency.

[0041] like Figure 2 As shown, this utility model provides a heating and pre-compression device comprising: a base plate (not shown in the figure), a pre-compression block 1, a liquid storage device 3, a liquid driving device 4, and a pressure driving device (not shown in the figure). The device is used to pre-compress and heat the target device 5.

[0042] Among them, such as Figure 2 As shown, the target device 5 includes a processing chip 51, a heat dissipation material layer 52 covering the processing chip 51, and a liquid cooling plate 53 located above the processing chip 51. The heat dissipation material layer 52 is made of a phase change material. The target device 5 also includes a substrate 54 for supporting the processing chip 51 and other components of the target device 5. In some embodiments, the processing chip 51 may be a chip with high heat dissipation requirements, such as a GPU, and this invention does not limit this. The liquid cooling plate 53 is a structure that utilizes liquid flow for heat dissipation. The liquid cooling plate 53 has internal channels for liquid flow. The shape of these channels can be serpentine, parallel straight channels, microchannels, finned, cylindrical turbulence-type, etc., and the shape can be set according to actual needs; this invention does not limit this.

[0043] A base plate is used to support the target device 5 to be pre-pressed and heated. In some embodiments, the base plate may also be provided with a groove so that the target device 5 can be placed in the groove to prevent the target device 5 from sliding on the base plate.

[0044] The pre-compression block 1, located above the base plate, is used to apply pressure to the liquid cooling plate 53 under the drive of the pressure application device. The magnitude and duration of the pressure applied to the liquid cooling plate 53 can be set according to actual needs, and this utility model does not impose any limitations on this.

[0045] The liquid driving device 4 is used to output the heated liquid (not shown in the figure) stored in the liquid storage device 3 from the outlet 31 of the liquid storage device 3 to the liquid cooling plate 53 during the process of the pre-compression block 1 applying pressure to the liquid cooling plate 53; and after determining that the heating stop condition is met, to export the cooling liquid (not shown in the figure) in the liquid cooling plate 53 from the liquid outlet (not shown in the figure) of the liquid cooling plate 53 to the liquid storage device 3.

[0046] In some embodiments, the device further includes, for example, Figure 2 The liquid transfer tube 2 shown.

[0047] like Figure 2 As shown, the pre-compression block 1 is provided with a liquid inlet 11 and a liquid outlet 12. The liquid inlet 11 is connected to the liquid inlet (not shown) of the liquid cooling plate 53 through a liquid inlet passage (not shown in the figure) in the pre-compression block 1, and is also connected to the outlet 31 of the liquid storage device 3 through a liquid transfer pipe 2. The liquid outlet 12 is connected to the liquid outlet (not shown in the figure) of the liquid cooling plate 53 through a liquid outlet passage (not shown in the figure) in the pre-compression block 1, and is also connected to the inlet 32 ​​of the liquid storage device 3 through a liquid transfer pipe 2. The liquid inlet passage and the liquid outlet passage can be through holes in the pre-compression block 1 or pre-installed pipelines.

[0048] During the process of the pre-compression block 1 applying pressure to the liquid cooling plate 53, the heated liquid (not shown in the figure) stored in the liquid storage device 3 exits from the outlet 31 of the liquid storage device 3 and passes sequentially through the liquid transmission pipe 2 connected to the liquid inlet 11 of the pre-compression block 1, the liquid inlet 11 of the pre-compression block 1, the liquid inlet passage in the pre-compression block 1, and the liquid inlet of the liquid cooling plate 53 before finally entering the liquid cooling plate 53.

[0049] After the liquid driving device 4 determines that the heating stop condition is met, the cooling liquid (i.e., the liquid after the heated liquid has been cooled and the temperature has been reduced) in the liquid cooling plate 53 exits from the liquid outlet of the liquid cooling plate 53 under the action of the liquid driving device 4, and then passes through the liquid outlet passage in the pre-compression block 1, the liquid outlet 12 of the pre-compression block 1, the liquid transmission pipe 2 connected to the liquid outlet 12 of the pre-compression block 1, and the inlet 31 of the liquid storage device 3, and finally returns to the liquid storage device 3.

[0050] In some embodiments, such as Figure 3 As shown, each of the liquid transfer tubes 2 may include a first transfer tube 61 and a second transfer tube 62. One end of each first transfer tube 61 is fixedly connected to the liquid inlet 11 or liquid outlet 12 of the pre-compression block 1. One end of each second transfer tube 62 is fixedly connected to the inlet 31 or outlet 32 ​​of the liquid storage device 3. The other end of the first transfer tube 61 and the other end of the second transfer tube 62 of the same liquid transfer tube 2 are detachably connected by a quick connector 8.

[0051] In some embodiments, the liquid driving device 4 may include:

[0052] A liquid pump is used to, in response to a liquid filling command, draw heated liquid stored in the liquid storage device 3 from the outlet 31 and transport it through the liquid transfer pipe 2 and the pre-compression block 1 to the liquid cooling plate 53; and after determining that the heating stop condition is met, draw cooling liquid in the liquid cooling plate 53 from the liquid outlet and transport it back to the liquid storage device 3 through the pre-compression block 1 and the liquid transfer pipe 2.

[0053] In some embodiments, the heating stop condition may include at least one of the following: the duration for which the heated liquid fills the liquid-cooled plate 53 exceeds the heating duration, or the temperature of the heat dissipation material layer 52 reaches a first preset temperature. This ensures that the heat dissipation material layer 52 can completely transform into liquid under the heating of the heated liquid.

[0054] In some embodiments, to ensure complete phase change, the first preset temperature is set based on the phase change temperature of the heat dissipation material layer 52. For example, the first preset temperature may be equal to the phase change temperature of the heat dissipation material layer 52.

[0055] In some embodiments, to ensure complete phase change, the heating duration is set according to the size of the heat dissipation material layer 52 and the phase change temperature.

[0056] The starting point for calculating the duration of filling the heated liquid into the liquid cooling plate 53 can be either the time point at which the heated liquid begins to be fed into the liquid cooling plate 53 or the time point at which the heated liquid stops being fed into the liquid cooling plate 53; this invention does not impose any limitation on this. The heating duration can be set according to different starting points.

[0057] In some embodiments, the liquid stored in the liquid storage device 3 may include liquids such as water that will not contaminate the liquid cooling plate 53, and the present invention does not limit this.

[0058] In some embodiments, the liquid storage device 3 is further configured to heat the liquid to a second preset temperature, which is higher than the first preset temperature. To ensure complete phase change, a certain temperature difference exists between the second and first preset temperatures. This temperature difference can be adjusted based on the operating temperature of the target device 5 to ensure successful heating of the heat dissipation material layer without adversely affecting the target device 5. For example, assuming a phase change temperature of 45°C and the target device 5 is a graphics card, the second preset temperature could be 60°C.

[0059] With the above equipment, since the heated liquid directly contacts the phase change material through the liquid cooling plate 53, and the pre-compression block 1 can provide greater pressure, the phase change material can shorten the baking time of 45 minutes in the prior art to about 2 minutes under high temperature and pressure, and the phase change effect is significantly improved, greatly improving production efficiency.

[0060] It should be noted that although the above embodiments have been used as examples to describe the heating and pre-compression equipment, those skilled in the art will understand that the present invention is not limited thereto. In fact, users can flexibly configure each part according to their personal preferences and / or actual application scenarios, as long as it conforms to the solution of the present invention.

[0061] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A heating pre-press apparatus, characterized by, The equipment includes: a base plate, a pre-compression block, a liquid storage device, a liquid driving device, and a pressure driving device. The equipment is used to pre-compress and heat the target device. The base plate is used to support the target device to be pre-pressed and heated. The target device includes a processing chip, a heat dissipation material layer covering the processing chip, and a liquid cooling plate located above the processing chip. The material of the heat dissipation material layer is a phase change material. A pre-compression block, located above the base plate, is used to apply pressure to the liquid cooling plate under the drive of the pressure application drive device; The liquid driving device is used to output the heated liquid stored in the liquid storage device from the outlet of the liquid storage device to the liquid cooling plate during the process of the pre-compression block applying pressure to the liquid cooling plate; and after determining that the heating stop condition is met, to export the cooling liquid in the liquid cooling plate from the liquid outlet of the liquid cooling plate to the liquid storage device.

2. The device according to claim 1, characterized in that, The pre-compression block is provided with a liquid inlet and a liquid outlet. The liquid inlet is connected to the liquid inlet of the liquid cooling plate through the liquid inlet passage in the pre-compression block, and the liquid inlet is connected to the liquid storage device through a liquid transfer pipe for outputting the heated liquid. The liquid outlet is connected to the liquid outlet of the liquid cooling plate through the liquid outlet passage in the pre-compression block, and the liquid outlet is connected to the liquid storage device through a liquid transfer pipe for receiving the cooling liquid.

3. The apparatus of claim 2, wherein, Each of the liquid transfer tubes includes a first transfer tube and a second transfer tube. One end of each first transfer tube is fixedly connected to the liquid inlet or the liquid outlet of the pre-compression block. One end of each second transfer tube is fixedly connected to the inlet or the outlet of the liquid storage device. The other ends of the first transfer tube and the other ends of the second transfer tube of the same liquid transfer tube are detachably connected by a quick connector.

4. The apparatus of claim 2 or 3, wherein, The liquid-driven device includes: A liquid pump, in response to a liquid filling command, draws the heated liquid stored in the liquid storage device from the outlet and delivers it through the liquid transfer pipe and the pre-compression block to the liquid cooling plate.

5. The device according to claim 4, characterized in that, The liquid pump is also used to, after determining that the heating stop condition is met, extract the cooling liquid in the liquid cooling plate from the liquid outlet and transport it back to the liquid storage device through the pre-compression block and the liquid transmission pipe.

6. The apparatus of any one of claims 1-3, wherein, The heating stop conditions include at least one of the following: the duration for which the heated liquid is filled in the liquid cooling plate exceeds the heating duration, or the temperature of the heat dissipation material layer reaches a first preset temperature.

7. The apparatus of claim 6, wherein, The first preset temperature is set according to the phase transition temperature of the heat dissipation material layer.

8. The device according to claim 6, characterized in that, The heating time is set according to the size of the heat dissipation material layer and the phase change temperature.

9. The device according to claim 6, characterized in that, The liquid stored in the liquid storage device includes water. The liquid storage device is further configured to heat the liquid so that the liquid reaches a second preset temperature after heating, the second preset temperature being greater than the first preset temperature.

10. The device according to any one of claims 1-3, characterized in that, The processing chip includes a GPU.

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