electronic devices

Abstract

An electronic device includes a metal housing, a screen module, an insulating frame, and a conductive layer. The metal housing has a metal barrier. The screen module is disposed laterally to the metal barrier, with a first gap between them. The insulating frame is connected to the metal housing and includes a first portion positioned opposite the metal barrier along the thickness direction of the electronic device. At least a portion of the conductive layer is disposed on the surface of the first portion facing the metal barrier, and a second gap exists between the at least portion of the conductive layer on the first portion and the metal barrier along the thickness direction of the electronic device. In this application, static electricity on the screen module can be guided through the conductive layer to a position corresponding to the first portion, and can be conducted to the metal barrier and the metal housing by breaking down the air layer at the second gap, achieving static discharge. This application eliminates the need for sharp discharge structures, simplifies the fabrication process, and eliminates the need for ESD devices, effectively saving costs.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and more specifically to an electronic device. Background Technology

[0002] During the use of mobile phones and other electronic devices, static electricity may be generated on the side of the screen module due to friction and other factors. Static electricity may cause electronic products to restart, freeze, have poor signal or be interrupted. Therefore, electrostatic discharge (ESD) protection for electronic products is crucial.

[0003] For foldable electronic devices, flexible screen modules are used. Since the flexible screen module will deform during bending, it cannot be directly fixed to the shell of the foldable electronic device by means of adhesive. Instead, there needs to be a certain gap between the side of the flexible screen module and the shell. The existence of this gap makes it difficult for static electricity on the side of the flexible screen module to be effectively discharged. Utility Model Content

[0004] In view of this, this application provides an electronic device to solve the problem of the difficulty in effectively dissipating static electricity on flexible screen modules in the prior art.

[0005] This application provides an electronic device, comprising: a metal casing, a screen module, an insulating frame, and a conductive layer. The metal casing has a metal barrier. The screen module is disposed laterally on the metal barrier and has a first gap with the metal barrier. The insulating frame is connected to the metal casing and includes a first portion that is positioned opposite the metal barrier along the thickness direction of the electronic device. At least a portion of the conductive layer is disposed on the surface of the first portion facing the metal barrier, and along the thickness direction of the electronic device, at least a portion of the conductive layer on the first portion has a second gap with the metal barrier.

[0006] In this application, static electricity on the screen module can be guided to the position corresponding to the first part through the conductive layer, and can be further conducted to the metal barrier by breaking down the air layer at the second gap. The static electricity can then be guided to the metal shell through the metal barrier, achieving static discharge. This application does not require a sharp discharge structure, has a simple manufacturing process, and does not require ESD devices, effectively saving costs.

[0007] In one possible implementation, a recessed structure is provided on the end face of the metal barrier wall facing the first portion along the thickness direction of the electronic device, forming a second gap between the recessed structure and the conductive layer on the first portion. The position of the recessed structure on the end face of the metal barrier wall is further away from the conductive layer of the first portion than other positions on the end face of the metal barrier wall, thereby preventing accidental contact between the metal barrier wall and the conductive layer and causing RSE (Reactive Electrostatic Discharge) problems. Simultaneously, the surface of the recessed structure facing the first portion is a metal surface, allowing static electricity in the conductive layer of the first portion to break down the air layer at the second gap and conduct to the metal barrier wall, achieving static discharge.

[0008] In one possible implementation, the width of the second gap along the thickness direction of the electronic device is greater than or equal to 0.01 mm and less than or equal to 0.3 mm. By ensuring the width of the second gap is within this range, it is possible to ensure that static electricity can properly break down the air layer at the second gap and be conducted to the metal barrier and metal casing for grounding discharge. Simultaneously, it can prevent accidental contact between the conductive layer on the first part and the metal barrier, thus avoiding RSE (Reactive Electrostatic Discharge) problems.

[0009] In one possible implementation, a support portion is provided on the metal barrier wall along the thickness direction of the electronic device towards the end face of the first part. A first insulating layer is provided on the support portion, and the support portion abuts against the conductive layer on the first part through the first insulating layer. The first insulating layer, located between the metal barrier wall and the conductive layer, serves as insulation, preventing direct contact between the conductive layer and the metal barrier wall, thus avoiding RSE (Reactive Electrostatic Discharge) issues. Simultaneously, it enables the metal barrier wall to support the insulating frame, ensuring the reliability of the connection between the insulating frame and the metal housing. With the support portion abutting against the conductive layer of the first part through the first insulating layer, the recessed structure can increase the width of the second gap. This ensures that electrostatic discharge from the conductive layer at the air layer in the second gap is conducted to the metal barrier wall, while also preventing the conductive layer from contacting the inner surface of the recessed structure and causing RSE issues.

[0010] In one possible implementation, the thickness of the first insulating layer is greater than or equal to 3 μm. By making the thickness of the first insulating layer greater than or equal to 3 μm, damage to the first insulating layer can be avoided, achieving effective insulation and preventing accidental contact between the conductive layer of the first portion and the metal surface on the support portion, thus avoiding RSE problems.

[0011] In one possible implementation, the edge of the support is chamfered, which can reduce the processing difficulty of the first insulation layer, improve the consistency of the first insulation layer at various locations of the metal retaining wall, and avoid damage.

[0012] In one possible implementation, the insulating frame further includes a second portion disposed along the thickness direction of the electronic device on the side of the screen module away from the metal housing, and the orthographic projection of the second portion at least partially coincides with the orthographic projection of the screen module along the thickness direction of the electronic device. At least a portion of the conductive layer is disposed on the surface of the second portion facing the screen module, and the conductive layer on the second portion is electrically connected to the conductive layer on the first portion. The second portion can cover a portion of the screen module near its edge, and can limit the positioning of the screen module, allowing it to be stably positioned between the insulating frame and the metal housing. The conductive layer on the second portion is integrally formed with the conductive layer on the first portion, forming a continuously extending conductive layer, thereby guiding electrostatic energy to a position corresponding to the metal barrier.

[0013] In one possible implementation, a third gap exists between the conductive layer on the second portion and the screen module. This third gap provides space for the screen module to move relative to the insulating frame, preventing sliding friction between the screen module and the insulating frame that could cause wrinkles or wear on the screen module.

[0014] In one possible implementation, the insulating frame further includes a third portion disposed on the side of the metal retaining wall, specifically on the side of the metal retaining wall opposite to the screen module. This third portion can engage with the metal housing, ensuring reliable connection between the insulating frame and the metal housing.

[0015] At least a portion of the conductive layer is disposed on the side of the third portion facing the metal barrier, and the conductive layer on the third portion is electrically connected to the conductive layer on the first portion. Static electricity from the edge region of the screen module can couple to the conductive layer of the second portion and preferentially conduct to the first portion. The static electricity in the conductive layer of the first portion can break down the air layer of the second gap and conduct to the metal barrier for discharge. A small amount of static electricity coupled from the screen module to the conductive layer of the second portion can be conducted to the conductive layer of the third portion and coupled to the metal barrier for discharge. Therefore, the conductive layer of the third portion improves the static electricity discharge efficiency.

[0016] In one possible implementation, a fourth gap exists between the conductive layer on the third portion and the metal barrier, which can prevent the conductive layer of the third portion from directly contacting the metal barrier and thus avoiding the aforementioned RSE problem.

[0017] In one possible implementation, the conductive layer on the first part, the conductive layer on the second part, and the conductive layer on the third part are integrally formed, thereby forming a continuously extending conductive layer, which is beneficial for electrostatic conduction and simplifies the preparation of the conductive layer.

[0018] In one possible implementation, the recessed structure includes a first recess and a second recess. The first recess is disposed on the side of the second recess near the third portion, and the depth of the second recess is greater than the depth of the first recess. A second gap is formed between the second recess and the conductive layer of the first portion. The surface of the second recess facing the first portion is a metal surface. Static electricity in the conductive layer of the first portion can break down the air layer at the second gap and be conducted to the second recess, and further conducted to the metal barrier and metal casing to achieve static discharge.

[0019] In addition, a second insulating layer is provided on the first recess. The first recess is insulated from the conductive layer on the first part and the conductive layer on the third part by the second insulating layer, thereby avoiding the RSE problem caused by the metal barrier accidentally contacting the conductive layer of the third part.

[0020] In one possible implementation, the second insulating layer is disposed on the surface of the first recess facing the first portion, and the second insulating layer is also disposed on the surface of the metal barrier facing the third portion. The second insulating layer is a continuously extending insulating layer, capable of continuously covering the surface of the first recess facing the first portion, the side surface of the metal barrier facing the third portion, and the edge region formed at the intersection of the first recess and the side surface of the metal barrier. This prevents accidental contact between the metal surface of the metal barrier and the conductive layers of the first and third portions, thus avoiding RSE problems.

[0021] In one possible implementation, the conductive layer is made of silver paste, copper foil, or graphite. These materials all have good electrical conductivity and are also easy to prepare.

[0022] In one possible implementation, the electronic device is a foldable electronic device, and the screen module is a flexible screen module.

[0023] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a partial schematic diagram of an electronic device provided in a related art.

[0026] Figure 2 A partial schematic diagram of an electronic device provided in another related technology;

[0027] Figure 3 This is a schematic diagram of the structure of an electronic device provided in one embodiment of this application;

[0028] Figure 4 for Figure 3 Exploded view;

[0029] Figure 5 for Figure 3 Sectional view at point AA;

[0030] Figure 6 A partial cross-sectional view of an electronic device provided in one embodiment of this application;

[0031] Figure 7 for Figure 3 Sectional view at BB;

[0032] Figure 8 A partial cross-sectional view of an electronic device provided in another embodiment of this application;

[0033] Figure 9 A partial cross-sectional view of an electronic device provided in another embodiment of this application;

[0034] Figure 10 A partial cross-sectional view of an electronic device provided in another embodiment of this application.

[0035] Figure label:

[0036] 100-Flexible screen module;

[0037] 200 - Metal frame; 210 - First discharge terminal;

[0038] 300 - Metal frame; 310 - Second discharge terminal;

[0039] 400-ESD devices;

[0040] 1-Metal shell; 11-Metal retaining wall; 111-Recessed structure; 111a-First recessed portion; 111b-Second recessed portion; 112-Supporting portion; 113-Chamfer; 12-First insulating layer; 13-Second insulating layer;

[0041] 2-Insulated frame; 21-First part; 22-Second part; 23-Third part;

[0042] 3-Conductive layer;

[0043] 4-Screen module;

[0044] G1 - First gap; G2 - Second gap; G3 - Third gap; G4 - Fourth gap;

[0045] X - Length direction; Y - Width direction; Z - Thickness direction. Detailed Implementation

[0046] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0047] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0048] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0049] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0050] In the description of this application, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more; the terms "connected," "fixed," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0051] Electronic devices such as mobile phones and tablets typically consist of a metal casing and a screen module. The screen module can be connected to the metal casing for support. During use, static electricity can accumulate near the edges of the screen module due to friction and other factors. Since the edges of the screen module integrate wiring, this static electricity can interfere with the signals transmitted through those wirings, potentially causing malfunctions such as restarts, crashes, signal degradation, or interruptions. Therefore, it is necessary to guide the static electricity from the screen module to the metal casing for discharge.

[0052] For foldable electronic devices such as foldable phones, foldable tablets, or foldable computers, flexible screen modules are used. The flexible screen modules will deform during the bending process, so they cannot be directly fixed to the metal shell by means of adhesives. Instead, there needs to be a certain gap between the side of the flexible screen module and the metal shell. However, the existence of these gaps makes it difficult to effectively dissipate static electricity on the side of the flexible screen module.

[0053] Figure 1 This is a partial schematic diagram of an electronic device provided in a related art, such as... Figure 1As shown, the metal casing includes a metal frame 200 and a metal middle frame 300. The metal middle frame 300 is located on one side of the flexible screen module 100 along its thickness direction, and the metal frame 200 is located to the side of the flexible screen module 100. A gap is maintained between the metal frame 200, the metal middle frame 300, and the flexible screen module 100. To allow static electricity on the flexible display module to be discharged to the metal middle frame 300 through the metal frame 200, a first discharge terminal 210 is provided on the metal frame 200, and a second discharge terminal 310 is provided on the metal middle frame 300. The first discharge terminal 210 and the second discharge terminal 310 are aligned in a direction perpendicular to the thickness direction of the electronic device. Both the first discharge terminal 210 and the second discharge terminal 310 have sharp portions, and the sharp portions of the first discharge terminal 210 and the second discharge terminal 310 are close to each other. When the static electricity on the flexible screen module 100 is discharged to the metal frame 200, the static electricity on the metal frame 200 can generate a tip discharge effect through the sharp parts of the first discharge end 210 and the second discharge end 310, thereby discharging the static electricity from the metal frame 200 to the metal middle frame 300.

[0054] However, the sharp parts of the first discharge end 210 and the second discharge end 310 need to be aligned with each other, which places high demands on the processing technology of the first discharge end 210 and the second discharge end 310, and also places high demands on the assembly accuracy of the metal frame 200 and the metal middle frame 300. If the processing tolerance or assembly tolerance control fails, it will be difficult to ensure that the first discharge end 210 and the second discharge end 310 are accurately aligned, and thus it will be difficult to effectively release static electricity.

[0055] Figure 2 A partial schematic diagram of an electronic device provided in another related technology, such as... Figure 2 As shown, instead of the first discharge terminal 210 and the second discharge terminal 310 on the metal frame 200 and the metal mid-frame 300, an electrostatic discharge (ESD) device, hereinafter referred to as ESD device 400, can be provided between the metal frame 200 and the metal mid-frame 300. One port of the ESD device 400 is connected to the metal frame 200, and the other port is connected to the metal bracket. Static electricity on the flexible screen module 100 can be discharged to the metal mid-frame 300 after passing through the metal frame 200 and the ESD device 400 in sequence.

[0056] However, adding an extra ESD device 400 increases costs. At the same time, the ESD device 400 itself is prone to failure such as short circuits, which can cause the metal frame 200 and the metal middle frame 300 to conduct directly, thus affecting the performance of the antenna arranged on the metal frame 200.

[0057] Figure 3This is a schematic diagram of the structure of an electronic device provided in one embodiment of this application, such as... Figure 3 As shown, this application provides an electronic device, which is a foldable electronic device, including but not limited to foldable mobile phones or foldable tablets. This application does not limit the type of electronic device. Specifically, for the foldable electronic device, the screen module is a flexible screen module, which can undergo corresponding flexible deformation during the folding process.

[0058] Figure 4 for Figure 3 Exploded view, such as Figure 4 As shown, the electronic device includes a metal casing 1, an insulating frame 2, and a screen module 4. The insulating frame 2 is connected to the metal casing 1, and the metal casing 1 is provided with a metal retaining wall 11. The screen module 4 is disposed to the side of the metal retaining wall 11. For ease of explanation, the electronic device can be defined as having a length direction X, a width direction Y, and a thickness direction Z, which are all perpendicular to each other. When the electronic device is a foldable electronic device, the axis of rotation of the foldable electronic device is parallel to the width direction Y.

[0059] Figure 5 for Figure 3 The sectional view at point AA, as shown Figure 5 As shown, the electronic device includes a metal casing 1, an insulating frame 2, a conductive layer 3, and a screen module 4. The metal casing 1 is provided with a metal baffle 11, and the screen module 4 is disposed on the side of the metal baffle 11, with a first gap G1 between the screen module 4 and the metal baffle 11. During the folding process of the electronic device, the screen module 4 will undergo corresponding bending deformation, and the screen module 4 will move relative to the metal casing 1 and the insulating frame 2 in a direction perpendicular to the thickness direction Z of the electronic device. The first gap G1 provides space for the movement of the screen module 4, preventing the screen module 4 from being crushed by the baffle and causing damage to the screen module 4.

[0060] The metal shell 1 can be made of metals such as aluminum, and the metal shell 1 and the metal retaining wall 11 can be integrally formed, thereby ensuring the structural reliability of the metal shell 1.

[0061] like Figure 5As shown, the insulating frame 2 is connected to the metal housing 1. The insulating frame 2 includes a first portion 21, which is positioned opposite to the metal barrier 11 along the thickness direction Z of the electronic device. At least a portion of the conductive layer 3 is disposed on the surface of the first portion 21 of the insulating frame 2 facing the metal barrier 11. Along the thickness direction Z of the electronic device, a second gap G2 is formed between the at least portion of the conductive layer 3 on the first portion 21 and the metal barrier 11, that is, an air layer is formed between the at least portion of the conductive layer 3 on the first portion 21 and the metal barrier 11.

[0062] In this design, static electricity on the screen module 4 can be guided through the conductive layer 3 to the position corresponding to the first part 21, and can further conduct to the metal barrier 11 by breaking down the air layer at the second gap G2. The static electricity can then be guided to the metal shell 1 through the metal barrier 11, thus achieving static discharge. This application does not require a sharp discharge structure, has a simple fabrication process, and does not require ESD devices, effectively saving costs.

[0063] In some embodiments, the material of the conductive layer 3 may include silver paste, copper foil, or graphite, etc. Of course, in other embodiments, the conductive layer 3 may also be a conductive part. These materials all have good conductivity and are also easy to prepare the conductive layer 3.

[0064] The width of the second gap G2 between the conductive layer 3 on the first part 21 and the metal barrier 11 needs to meet a certain width requirement. The width of the second gap G2 is the width dimension of the second gap G2 in the thickness direction Z of the electronic device. If the width of the second gap G2 is too large, the static electricity on the conductive layer 3 will be difficult to be guided to the metal barrier 11, and will instead jump to the screen module 4, causing the aforementioned defects in the screen module 4. If the width of the second gap G2 is too small, the conductive layer 3 on the first part 21 will easily come into contact with the metal barrier 11, generating radiated spurious emissions (RSE), affecting the signal quality of the wiring transmission in the screen module 4. Therefore, in this embodiment, the width of the second gap G2 in the thickness direction Z of the electronic device is greater than or equal to 0.01 mm and less than or equal to 0.3 mm. For example, the width of the second gap G2 can be, but is not limited to, 0.01mm, 0.05mm, 0.08mm, 0.10mm, 0.15mm, 0.2mm, 0.25mm, or 0.3mm. Within this size range, the width of the second gap G2 ensures that static electricity can be properly conducted to the metal barrier 11 and the metal casing 1 after breaking down the air layer at the second gap G2, thus achieving grounding and discharge. Simultaneously, it prevents accidental contact between the conductive layer 3 on the first part 21 and the metal barrier 11, thus avoiding RSE problems.

[0065] In some other embodiments, an insulating layer can be provided on the end face of the metal barrier 11 facing the first portion 21, while maintaining a certain gap between the insulating layer and the conductive layer 3 on the first portion 21. This allows for the conduction of electrostatic discharge (ESD) from the conductive layer 3 to the metal barrier 11 after the insulating layer breaks down, while also avoiding RSE problems. However, if the gap between the insulating layer and the conductive layer 3 is too large or the breakdown voltage of the insulating layer is too high, the electrostatic energy may jump to the screen module 4 before the ESD on the conductive layer 3 breaks down the air layer or insulating layer at the gap, causing the aforementioned problems in the screen module 4.

[0066] Figure 6 This is a partial cross-sectional view of an electronic device provided in one embodiment of this application. Figure 7 for Figure 3 The sectional view at BB, as shown Figure 6 and Figure 7 As shown, in this embodiment, a recessed structure 111 is provided on the end face of the metal barrier 11 facing the first part 21 along the thickness direction Z of the electronic device. The recessed structure 111 and the conductive layer 3 on the first part 21 form the aforementioned second gap G2. The position of the recessed structure 111 on the end face of the metal barrier 11 is further away from the conductive layer 3 of the first part 21 than other positions on the end face of the metal barrier 11, thereby avoiding accidental contact between the metal barrier 11 and the conductive layer 3 and causing RSE problems. At the same time, the surface of the recessed structure 111 facing the first part 21 is a metal surface, and the static electricity in the conductive layer 3 of the first part 21 can break down the air layer at the second gap G2 and be conducted to the metal barrier 11, realizing static discharge.

[0067] like Figure 7 As shown, a support portion 112 is provided on the metal barrier 11 along the thickness direction Z of the electronic device toward the end face of the first part 21. A first insulating layer 12 is provided on the support portion 112, and the support portion 112 abuts against the conductive layer 3 on the first part 21 through the first insulating layer 12. The end face of the metal barrier 11 is provided with a recessed structure 111 and a support portion 112. The support portion 112 is adjacent to the recessed structure 111; for example, the support portion 112 is located on both sides of the recessed structure 111. For example, in one embodiment, such as... Figure 7As shown, the support portion 112 is located on both sides of the recessed structure 111 along the width direction Y of the electronic device, and the recessed structure 111 can penetrate the metal retaining wall 11 along the length direction X of the electronic device. Alternatively, in some other embodiments, the support portion 112 can also be located around the recessed structure 111. The first insulating layer 12 can be formed on the support portion 112. For example, the first insulating layer 12 can be an oxide layer formed on the metal retaining wall 11 by anodizing. The first insulating layer 12 is located between the metal retaining wall 11 and the conductive layer 3, and can play an insulating role, avoiding direct contact between the conductive layer 3 and the metal retaining wall 11, thereby avoiding RSE problems. At the same time, it can realize the supporting function of the metal retaining wall 11 for the insulating frame 2, ensuring the reliability of the connection between the insulating frame 2 and the metal housing 1. When the support portion 112 abuts against the conductive layer 3 of the first portion 21 through the first insulating layer 12, the recessed structure 111 can increase the width of the second gap G2. While ensuring that the electrostatic discharge of the conductive layer 3 is conducted to the metal barrier 11 after breaking down the air layer at the second gap G2, it can also prevent the conductive layer 3 from contacting the inner surface of the recessed structure 111 and causing RSE problems.

[0068] In one embodiment, the thickness of the first insulating layer 12 should not be too small. If the thickness of the first insulating layer 12 is too small, it is easily damaged, which can lead to leakage of the metal surface of the support portion 112. This can result in accidental contact between the conductive layer 3 of the first portion 21 and the metal surface of the support portion 112, causing an RSE problem. Therefore, in this embodiment, the thickness of the first insulating layer 12 can be greater than or equal to 3 μm. For example, the thickness of the first insulating layer 12 can include, but is not limited to, 3 μm, 3.2 μm, 3.5 μm, 3.8 μm, or 4.0 μm. This can prevent damage to the first insulating layer 12, achieve effective insulation, and prevent accidental contact between the conductive layer 3 of the first portion 21 and the metal surface of the support portion 112, thus avoiding an RSE problem.

[0069] Figure 8 This is a partial cross-sectional view of an electronic device provided in another embodiment of this application. The metal barrier 11, located at the edge of the support portion 112, generally has an edge formed after molding. The two adjacent faces forming this edge are generally perpendicular or nearly perpendicular to each other, and the included angle formed at the edge is approximately a right angle. This makes the processing of the first insulating layer 12 near the edge difficult, and the first insulating layer 12 formed at the edge is extremely prone to damage. If the first insulating layer 12 is damaged, the conductive layer 3 will directly contact the metal barrier 11, causing an RSE (Reactive SE) problem. Therefore, in this embodiment, as... Figure 8As shown, a chamfer 113 can be provided at the edge of the support portion 112. This chamfer 113 can be a rounded chamfer or a beveled chamfer, thereby reducing the processing difficulty of the first insulating layer 12 at the edge position, improving the consistency of the first insulating layer 12 at various positions of the metal retaining wall 11, avoiding damage, and thus preventing the conductive layer 3 from directly contacting the metal retaining wall 11 and causing RSE problems. In addition, by processing the chamfer 113 at the edge of the support portion 112, the edge of the support portion 112 can also be moved away from the conductive layer 3, which also helps to avoid the conductive layer 3 from directly contacting the metal retaining wall 11 and causing RSE problems.

[0070] like Figure 8 As shown, the insulating frame 2 also includes a second part 22. The second part 22 is disposed on the side of the screen module 4 away from the metal housing 1 along the thickness direction Z of the electronic device, and the orthographic projection of the second part 22 at least partially overlaps with the orthographic projection of the screen module 4 along the thickness direction Z of the electronic device. The second part 22 can cover a portion of the screen module 4 near the edge, and the second part 22 can limit the position of the screen module 4, so that the screen module 4 can be stably disposed between the insulating frame 2 and the metal housing 1.

[0071] In some embodiments, the first part 21 and the second part 22 can be integrally formed, that is, the first part 21 and the second part 22 can be formed together during the manufacturing process of the insulating frame 2, thereby ensuring the integration of the insulating frame 2 and ensuring structural stability.

[0072] like Figure 8 As shown, at least a portion of the conductive layer 3 is disposed on the surface of the second portion 22 facing the screen module 4, and the conductive layer 3 on the second portion 22 is electrically connected to the conductive layer 3 on the first portion 21. The conductive layer 3 on the second portion 22 and the conductive layer 3 on the first portion 21 are integrally formed, creating a continuously extending conductive layer 3, thereby guiding electrostatic energy to the position corresponding to the metal barrier 11.

[0073] Since static electricity mainly exists on the screen module 4 near the edge, the conductive layer 3 of the second part 22 corresponds to the area at the edge of the screen module 4. This allows the static electricity at the edge of the screen module 4 to couple to the conductive layer 3 of the second part 22 and be conducted from the conductive layer 3 of the second part 22 to the conductive layer 3 of the first part 21. The static electricity on the conductive layer 3 of the first part 21 can further break down the air layer at the second gap G2 and be conducted to the metal barrier 11 and the metal shell 1, thus achieving grounding discharge.

[0074] like Figure 8As shown, there is a third gap G3 between the conductive layer 3 on the second part 22 and the screen module 4. This third gap G3 can reserve a certain space when the screen module 4 moves relative to the insulating frame 2, so as to avoid the screen module 4 from having problems such as wrinkles and wear caused by sliding friction resistance between the screen module 4 and the insulating frame 2.

[0075] Figure 9 A partial cross-sectional view of an electronic device provided in another embodiment of this application, such as... Figure 9 As shown, the insulating frame 2 also includes a third part 23, which is disposed on the side of the metal barrier 11 and on the side of the metal barrier 11 away from the screen module 4. The third part 23 can be snapped into the metal housing 1, ensuring the reliability of the connection between the insulating frame 2 and the metal housing 1.

[0076] At least a portion of the conductive layer 3 is disposed on the third portion 23 facing the metal barrier 11, and the conductive layer 3 on the third portion 23 is electrically connected to the conductive layer 3 on the first portion 21. The conductive layer 3 on the third portion 23 and the conductive layer 3 on the first portion 21 can be integrally formed, forming a continuously extending conductive layer 3. In some embodiments, the conductive layer 3 on the first portion 21, the conductive layer 3 on the second portion 22, and the conductive layer 3 on the third portion 23 are integrally formed, thereby forming a continuously extending conductive layer 3. Static electricity in the edge region of the screen module 4 can be coupled to the conductive layer 3 of the second portion 22 and preferentially conducted to the first portion 21. The static electricity in the conductive layer 3 of the first portion 21 can break down the air layer of the second gap G2 and be conducted to the metal barrier 11 for discharge. A small amount of static electricity coupled from the screen module 4 to the conductive layer 3 of the second portion 22 can be conducted to the conductive layer 3 of the third portion 23 and coupled to the metal barrier 11 for discharge. Therefore, the electrostatic discharge efficiency can be improved through the conductive layer 3 of the third part 23.

[0077] like Figure 9 As shown, there is a fourth gap G4 between the conductive layer 3 on the third part 23 and the metal barrier 11. This fourth gap G4 can prevent the conductive layer 3 of the third part 23 from directly contacting the metal barrier 11 and causing the aforementioned RSE problem.

[0078] In one embodiment, the recessed structure 111 can be a groove-shaped structure, and the bottom surface of the recessed structure 111 can have a uniform distance from the conductive layer 3 of the first part 21.

[0079] Figure 10 A partial cross-sectional view of an electronic device provided in another embodiment of this application, such as... Figure 10As shown, the recessed structure 111 includes a first recessed portion 111a and a second recessed portion 111b. The first recessed portion 111a is disposed on the side of the second recessed portion 111b close to the third part 23, and the recess depth of the second recessed portion 111b is greater than the recess depth of the first recessed portion 111a, that is, the first recessed portion 111a and the second recessed portion 111b can form a stepped structure. A second gap G2 is formed between the second recessed portion 111b and the conductive layer 3 of the first part 21. The surface of the second recessed portion 111b facing the first part 21 is a metal surface. Static electricity in the conductive layer 3 of the first part 21 can break through the air layer at the second gap G2 and be conducted to the second recessed portion 111b, and can be further conducted to the metal barrier 11 and the metal shell 1 to achieve static electricity discharge.

[0080] During the assembly of the metal casing 1 and the insulating frame 2, due to assembly errors, accidental contact can easily occur at the edge of the metal retaining wall 11 and in the area near the conductive layer 3 of the third part 23, which can lead to RSE problems. To avoid this problem, in this embodiment, as follows... Figure 10 As shown, a second insulating layer 13 is provided on the first recess 111a. The first recess 111a can be insulated from the conductive layer 3 on the first part 21 and the conductive layer 3 on the third part 23 by the second insulating layer 13, thereby avoiding the RSE problem caused by the metal barrier 11 accidentally contacting the conductive layer 3 of the third part 23.

[0081] The material of the second insulating layer 13 can be the same as that of the first insulating layer 12, which will not be described in detail here.

[0082] There may also be a gap between the first recess 111a and the conductive layer 3 of the first portion 21, thereby improving the insulation effect between the first recess 111a and the conductive layer 3 of the first portion 21.

[0083] like Figure 10 As shown, a second insulating layer 13 is disposed on the surface of the first recess 111a facing the first portion 21, and the second insulating layer 13 is also disposed on the surface of the metal barrier 11 facing the third portion 23. This second insulating layer 13 is a continuously extending insulating layer, capable of continuously covering the surface of the first recess 111a facing the first portion 21, the side surface of the metal barrier 11 facing the third portion 23, and the edge area formed at the intersection of the first recess 111a and the side surface of the metal barrier 11. This prevents the metal surface of the metal barrier 11 from accidentally contacting the conductive layer 3 of the first portion 21 and the third portion 23, thus avoiding RSE problems.

[0084] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An electronic device, characterized in that, include: A metal casing, wherein the metal casing is provided with a metal retaining wall; The screen module is disposed on the side of the metal retaining wall and has a first gap with the metal retaining wall; An insulating frame is connected to the metal housing. The insulating frame includes a first portion along the thickness direction of the electronic device, and the first portion is positioned opposite the metal retaining wall. A conductive layer, at least a portion of which is disposed on the surface of the first portion facing the metal barrier, and along the thickness direction of the electronic device, a second gap is formed between the at least portion of the conductive layer on the first portion and the metal barrier.

2. The electronic device according to claim 1, characterized in that, The metal barrier wall has a recessed structure along the thickness direction of the electronic device toward the end face of the first part, and the recessed structure forms a second gap with the conductive layer on the first part.

3. The electronic device according to claim 2, characterized in that, The width of the second gap along the thickness direction of the electronic device is greater than or equal to 0.01 mm and less than or equal to 0.3 mm.

4. The electronic device according to claim 2 or 3, characterized in that, A support portion is provided on the metal barrier wall along the thickness direction of the electronic device toward the end face of the first part. A first insulating layer is provided on the support portion, and the support portion abuts against the conductive layer on the first part through the first insulating layer.

5. The electronic device according to claim 4, characterized in that, The thickness of the first insulating layer is greater than or equal to 3 μm.

6. The electronic device according to claim 4, characterized in that, The edges of the support are chamfered.

7. The electronic device according to claim 2, characterized in that, The insulating frame further includes a second part, which is disposed along the thickness direction of the electronic device on the side of the screen module away from the metal housing, and the orthographic projection of the second part at least partially overlaps with the orthographic projection of the screen module along the thickness direction of the electronic device. At least a portion of the conductive layer is disposed on the surface of the second portion facing the screen module, and the conductive layer on the second portion is electrically connected to the conductive layer on the first portion.

8. The electronic device according to claim 7, characterized in that, There is a third gap between the conductive layer on the second part and the screen module.

9. The electronic device according to claim 7, characterized in that, The insulating frame further includes a third part, which is disposed on the side of the metal barrier and on the side of the metal barrier away from the screen module. At least a portion of the conductive layer is disposed on the third portion facing the metal retaining wall, and the conductive layer on the third portion is electrically connected to the conductive layer on the first portion.

10. The electronic device according to claim 9, characterized in that, There is a fourth gap between the conductive layer on the third part and the metal retaining wall.

11. The electronic device according to claim 9, characterized in that, The conductive layer on the first part, the conductive layer on the second part, and the conductive layer on the third part are integrally formed.

12. The electronic device according to claim 9, characterized in that, The recessed structure includes a first recessed portion and a second recessed portion. The first recessed portion is disposed on the side of the second recessed portion close to the third portion, and the recessed depth of the second recessed portion is greater than the recessed depth of the first recessed portion. A second gap is formed between the second recessed portion and the conductive layer of the first portion. A second insulating layer is provided on the first recess, and the first recess is insulated from the conductive layer on the first part and the conductive layer on the third part through the second insulating layer.

13. The electronic device according to claim 12, characterized in that, The second insulating layer is disposed on the surface of the first recess facing the first portion, and the second insulating layer is also disposed on the surface of the metal retaining wall facing the third portion.

14. The electronic device according to claim 1, characterized in that, The conductive layer is made of materials including silver paste, copper foil, or graphite.

15. The electronic device according to claim 1, characterized in that, The electronic device is a foldable electronic device, and the screen module is a flexible screen module.

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