Display module and display device

Abstract

This utility model provides a display module and display device. The display module includes a display panel, a circuit assembly, and a sealant. The display panel includes a planar portion and a bonding portion located on one side of the planar portion. The end of the bonding portion away from the planar portion forms a first side surface. The circuit assembly includes a first circuit portion connected to the bonding portion and a second circuit portion extending away from the bonding portion along the junction of the first circuit portion and the bonding portion. The side of the second circuit portion closer to the first side surface forms a first preset angle with the first side surface. The first preset angle is an obtuse angle, which allows the sealant to be placed at the junction of the display panel and the circuit assembly during the dispensing process. Furthermore, the sealant can overflow to both the first side surface and the second circuit portion simultaneously during the curing process, thereby forming a continuous sealing structure at the junction of the two. This improves the sealing reliability and product consistency of the display module under environments such as salt spray, sweat, and immersion in water.

Description

Technical Field

[0001] This utility model relates to the field of battery technology, and in particular to a display module and display device. Background Technology

[0002] With the increasing popularity of mobile terminals and portable electronic devices, products such as mobile phones, tablets and laptops have increasingly higher requirements for overall reliability. In particular, in environmental reliability tests such as waterproofing, sweatproofing and salt spray resistance, higher requirements are placed on the sealing and protection performance of display modules.

[0003] Currently, flexible circuit boards in display modules can be sealed by bonding them to the panel with adhesive backing. In related technologies, the panel cutting edges are mostly right angles. The dispensing equipment uses this edge as a reference, dispensing adhesive on the side closest to the flexible circuit board, and relying on the adhesive to naturally overflow to the side of the panel to form a seal. However, due to fluctuations in dispensing volume, adhesive viscosity, and alignment accuracy, some products have insufficient adhesive overflow, failing to effectively cover the side of the panel, resulting in poor sealing and making them prone to failure in salt spray, sweat, or water immersion tests. Utility Model Content

[0004] This utility model provides a display module and display device. By setting the angle between the first side of the bonding part and the side of the second circuit part near the first side to an obtuse angle, the sealant can overflow to both the panel side and the circuit board side at the same time, forming a continuous sealing structure, thereby improving the sealing reliability and product consistency of the display module in environments such as salt spray, sweat and water immersion.

[0005] To achieve the above functions, the technical solution provided by this utility model embodiment is as follows: This utility model embodiment provides a display module, including: The display panel includes a flat portion and a binding portion located on one side of the flat portion, wherein the end of the binding portion away from the flat portion is provided with a first side surface; The circuit assembly includes a first circuit portion connected to the binding portion, and a second circuit portion extending away from the binding portion along the junction of the first circuit portion and the binding portion, wherein the side of the second circuit portion closer to the first side is provided with a first preset angle between the second circuit portion and the first side, and the first preset angle is an obtuse angle. A sealant is disposed between the circuit assembly and the first side of the bonding portion, the sealant covering at least a portion of the first side, and the edge of the sealant extending from the first side to the second circuit portion.

[0006] Optionally, in one embodiment, the first side surface is a sloped surface or a curved surface.

[0007] Optionally, in one embodiment, the thickness of the bonding portion on the side closer to the sealant is less than the thickness of the bonding portion on the side farther from the sealant.

[0008] Optionally, in one embodiment, the sealant includes a first sealing portion and a second sealing portion, wherein the first sealing portion is located in the middle of the sealant and the second sealing portion is located on both sides of the sealant; In the direction perpendicular to the circuit assembly, the thickness of the first encapsulating portion is greater than the thickness of the second encapsulating portion.

[0009] Optionally, in one embodiment, the minimum thickness of the bonding portion is greater than the maximum thickness of the sealant in a direction perpendicular to the circuit assembly.

[0010] Optionally, in one embodiment, the first side surface is an arc surface, and the first side surface protrudes in a direction away from the sealant.

[0011] Optionally, in one embodiment, the display panel includes a display area and a bonding area located on one side of the display area, the display panel comprising: A base, wherein a first inclined surface is provided at one edge of the binding area; A thin-film transistor layer is disposed on one side of the substrate. The thin-film transistor layer includes an insulating layer, and the insulating layer has a second bevel at the edge of one side of the bonding region. A bonding terminal is disposed on the side of the insulating layer away from the substrate, and the bonding terminal is located within the bonding area; The binding part includes the binding terminal, and the first side includes the first inclined surface and the second inclined surface.

[0012] Optionally, in one embodiment, the first preset included angle is greater than or equal to 110 degrees and less than or equal to 160 degrees.

[0013] Optionally, in one embodiment, the display panel further includes a bending portion connected between the flat portion and the binding portion, and the flat portion and the binding portion are disposed opposite to each other in a direction perpendicular to the display module; The circuit assembly is located on the side of the bonding portion away from the planar portion.

[0014] This utility model provides a display device, which includes any of the display modules described above.

[0015] The beneficial effects of this utility model embodiment are as follows: This utility model embodiment provides a display module and a display device. The display module includes a display panel, a circuit assembly, and a sealant. The display panel includes a planar portion and a bonding portion located on one side of the planar portion. The end of the bonding portion away from the planar portion forms a first side surface. The circuit assembly includes a first circuit portion connected to the bonding portion and a second circuit portion extending away from the bonding portion along the junction of the first circuit portion and the bonding portion. The side of the second circuit portion near the first side surface forms a first preset angle with the first side surface. The first preset angle is an obtuse angle, which allows the sealant to be placed at the junction of the display panel and the circuit assembly during the dispensing process. Furthermore, the sealant can overflow to both the first side surface and the second circuit portion during the curing process, thereby forming a continuous sealing structure at the junction of the two. This improves the sealing reliability and product consistency of the display module under environments such as salt spray, sweat, and immersion in water. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the display module provided in an embodiment of the present utility model; Figure 2 Provided for the embodiments of this utility model Figure 1 A schematic diagram of the first type of cross section corresponding to AA' in the middle; Figure 3 Provided for the embodiments of this utility model Figure 2 Enlarged view corresponding to point B in the image; Figure 4 Provided for the embodiments of this utility model Figure 1 A schematic diagram of the second cross section corresponding to AA' in the middle; Figure 5 Provided for the embodiments of this utility model Figure 4 Enlarged view corresponding to point C; Figure 6 Provided for the embodiments of this utility model Figure 1 A schematic diagram of the third cross section corresponding to AA' in the middle; Figure 7 A cross-sectional schematic diagram of the display panel provided in an embodiment of this utility model; Figure 8 This is a schematic diagram of the structure of the display device provided in an embodiment of the present utility model.

[0018] Explanation of reference numerals in the attached figures: 1-Display module; 10-Display panel; 11-Planar portion; 12-Bent portion; 13-Bonding portion; 131-First side surface; 101-Substrate; 1010-First inclined surface; 1011-First substrate; 1012-Spacer layer; 1013-Second substrate; 10400-Second inclined surface; 1030-Third inclined surface; 132-Bonding terminal; 102-Light-shielding layer; 103-Buffer layer; 104-Thin film transistor layer; 1040-Insulating layer; 1041-Thin film transistor; 1042-Active layer; 1043-Gate insulating layer; 1044-Gate; 1045-Interlayer insulating layer; 1046-Source; 1047-Drain; 105-Passivation layer; 106 - Planarization layer; 107-Pixel definition layer; 108-Light-emitting device layer; 1081-Anode layer; 1082-Light-emitting layer; 1083-Cathode layer; 109-Bonding trace; 20-Circuit assembly; 21-First circuit section; 22-Second circuit section; 30-Sealant; 31-First sealing section; 32-Second sealing section; 33-Third circuit section; 40-Encapsulation structure; 50-Composite support layer; 60-First backplate; 70-Supporting member; 80-Second backplate; 90-Functional film layer; 110-Protective layer; 120-Adhesive layer; 1000-Display area; 2000-Bending area; 3000-Bonding area; α-First preset angle; 2-Display device; 3-Middle frame. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of the present utility model and are not intended to limit the present utility model. In the present utility model, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower in the actual use or working mode of the device, specifically the drawing direction in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only, and features specified as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections or connections that allow for communication; direct connections or indirect connections through an intermediate medium; and connections within two components or interactions between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0022] The following disclosure provides many different embodiments for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, examples of various specific processes and materials are provided, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0023] Please combine Figures 1 to 3 ;in, Figure 1 This is a schematic diagram of the structure of the display module provided in an embodiment of the present utility model; Figure 2 Provided for the embodiments of this utility model Figure 1 A schematic diagram of the first type of cross section corresponding to AA' in the middle; Figure 3 Provided for the embodiments of this utility model Figure 2 The enlarged view corresponding to point B in the image.

[0024] This embodiment provides a display module 1, which includes an encapsulation structure 40, a display panel 10, a composite support layer 50, a circuit assembly 20, and a sealant 30. The encapsulation structure 40 is disposed on the light-emitting side of the display panel 10 and is used to encapsulate and protect the display panel 10. The display panel 10 can be an organic light-emitting diode display panel 10, or it can be other types of self-emissive or non-self-emissive display panels 10. This embodiment does not limit the type of display panel 10.

[0025] The display panel 10 includes a flat portion 11, a binding portion 13 disposed opposite to the flat portion 11, and a bent portion 12 connecting the flat portion 11 and the binding portion 13. The composite support layer 50 is disposed on the side of the flat portion 11 near the binding portion 13 to enhance the structural strength and support stability of the display panel 10. The material of the composite support layer 50 includes, but is not limited to, metallic or plastic materials, such as aluminum alloy, stainless steel (SUS), injection-molded copper sheet, copper pillar, or thermoplastic polymer structural material (ABS). When the material of the composite support layer 50 is a metallic material, it provides high-strength support and also has good thermal conductivity, which can effectively disperse the heat generated by the display panel 10 during operation, thereby dissipating the heat generated by the display panel 10 and improving the display uniformity and reliability of the display panel 10.

[0026] The binding portion 13 has a first side surface 131 at one end away from the planar portion 11; the circuit assembly 20 includes, but is not limited to, a flexible circuit board, and the circuit assembly 20 is disposed on the side of the binding portion 13 away from the planar portion 11; wherein, the circuit assembly 20 includes a first circuit portion 21 connected to the binding portion 13, and a second circuit portion 22 extending away from the binding portion 13 along the junction of the first circuit portion 21 and the binding portion 13, and a first preset angle is provided between the side of the second circuit portion 22 near the first side surface 131 and the first side surface 131, the first preset angle being an obtuse angle, thereby increasing the space opening at the junction of the display panel 10 and the circuit assembly 20 to form the first preset angle that opens outward.

[0027] It should be noted that in related technologies, the cut edge of the display panel 10 is usually a right-angle structure, and the dispensing equipment needs to use this right-angle edge as a positioning reference for applying adhesive. In order to prevent the adhesive from flowing onto the surface of the display panel 10, the dispensing position needs to be offset a certain distance from the edge of the display panel 10 towards the circuit board side, relying on the adhesive to naturally overflow to the side of the display panel 10 to form a seal.

[0028] It is understood that in this embodiment, by setting a first preset angle between the side of the second circuit section 22 near the first side 131 and the first side 131, the first preset angle is an obtuse angle, which increases the space opening at the junction of the second circuit section 22 and the first side 131, and the dispensing position of the sealant 30 can be set at the junction of the display panel 10 and the circuit assembly 20.

[0029] Furthermore, the first preset included angle is greater than or equal to 110 degrees and less than or equal to 160 degrees. By controlling the size of the first preset included angle, a moderately outward transition angle can be formed between the first side 131 of the binding part 13 and the second circuit part 22 of the circuit assembly 20, so that the dispensing position can be accurately located at the junction of the first side 131 and the second circuit part 22, and the sealant 30 can be guaranteed to have sufficient overflow space before curing.

[0030] Understandably, since the first preset angle geometrically provides a larger adhesive contact area and a lower surface curvature barrier, the sealant 30 can simultaneously overflow along the first side 131 and the side of the second circuit section 22 away from the first side 131 during the dispensing and curing stages. This achieves double-sided coverage of the side of the display panel 10 and the circuit assembly 20, thereby avoiding the problem of insufficient adhesive overflow caused by dispensing deviation in related technologies, reducing the sensitivity of the dispensing process to the application position and amount of adhesive, and making the coverage of the sealant 30 more uniform and continuous. At the same time, the cured sealant 30 can effectively block the penetration of salt spray, sweat and moisture, improving the reliability and service life of the display module 1 in complex environments such as high humidity, corrosion and immersion.

[0031] Specifically, the sealant 30 includes, but is not limited to, room temperature curing silicone, epoxy, or UV curing adhesives, which have good adhesion and resistance to damp heat. The sealant 30 is disposed between the circuit assembly 20 and the first side 131 of the bonding portion 13, covering at least a portion of the first side 131, and the edge of the sealant 30 extends from the first side 131 to the second circuit portion 22, thereby enabling the sealant 30 to adhere tightly between the first side 131 and the second circuit portion 22, forming a double-sided sealing interface, which can effectively prevent the penetration of salt spray, sweat, and moisture, and improve the reliability and service life of the display module 1 in complex environments such as high humidity, corrosion, and immersion.

[0032] Please combine Figures 1 to 3 In one embodiment, the display module 1 may further include a first back plate 60, a support member 70, and a second back plate 80; the first back plate 60 is located between the planar portion 11 and the composite support layer 50, the second back plate 80 is located between the composite support layer 50 and the binding portion 13, and the support member 70 is located between the second back plate 80 and the binding portion 13.

[0033] Furthermore, the display module 1 also includes a functional film layer 90 and a protective layer 110. The functional film layer 90 is located between the encapsulation structure 40 and the display panel 10, and is used to adjust optical performance or enhance the stability of the display panel 10. The protective layer 110 is located on one side of the bent portion 12 and extends from above the flat portion 11 to the side of the bonding portion 13 away from the flat portion 11, thereby forming a full-coverage protection for the bent portion 12, preventing external mechanical stress or moisture intrusion, and further improving the reliability of the display module 1.

[0034] Specifically, the functional film layer 90 includes, but is not limited to, a polarizer located on the light-emitting side of the display panel 10, and the orthographic projection of the functional film layer 90 in the direction perpendicular to the display panel 10 covers the planar portion 11; the protective layer 110 may be disposed in the same layer as the polarizer, and the protective layer 110 may include a photocurable resin.

[0035] The encapsulation structure 40 can be attached to the side of the functional film layer 90 away from the display panel 10 via an adhesive layer 120. The adhesive layer 120 includes, but is not limited to, optically clear adhesive (OCA). Specifically, the encapsulation structure 40 includes, but is not limited to, a flexible substrate. The material of the flexible substrate includes, but is not limited to, one of cover window (CW) and ultra-thin glass (UTG).

[0036] It is understood that the functional film layer 90, including the polarizer, and the encapsulation structure 40, including the flexible substrate and the flexible cover plate, are only used as examples. The film layer structure of the functional film layer 90 and the film layer structure of the encapsulation structure 40 in this embodiment are not specifically limited. For example, in one embodiment, the encapsulation structure 40 also includes a repairable protective film (Circulating Protective Film, CPF) located on the side of the flexible cover plate away from the flexible substrate. The repairable protective film is attached to the side of the flexible cover plate away from the display panel 10. When the repairable protective film is scratched during use, it can be replaced at a repair shop to avoid long-term appearance defects caused by scratches. In one embodiment, the display module 1 described above can also be prepared using polarizer-less technology.

[0037] Please continue to combine Figures 1 to 3In one embodiment, the first side surface 131 is a slope, and the first side surface 131 gradually slopes from the end near the circuit assembly 20 to the direction away from the circuit assembly 20, so that the second circuit part 22 and the first side surface 131 form the first preset angle. The first preset angle can provide a smooth geometric transition space at the junction of the display panel 10 and the circuit assembly 20, so that the dispensing position of the sealant 30 can be arranged closer to the junction of the bonding part 13 and the second circuit part 22.

[0038] Furthermore, one end of the first side surface 131 is connected to the side of the binding portion 13 near the circuit assembly 20, and the other end of the first side surface 131 is connected to the side of the binding portion 13 away from the circuit assembly 20. The first side surface 131 is inclined relative to the side of the circuit assembly 20 near the binding portion 13, so that the first side surface 131 is an outwardly gradually opening inclined structure, which widens the space corresponding to the dispensing position of the sealant 30, making it easier for the sealant 30 to be deposited and controlled.

[0039] During the dispensing process, the adhesive can flow naturally along the inclined surface and, under the action of gravity and surface tension, form a continuous coating layer between the first side surface 131 and the side of the second circuit section 22 closest to the first side surface 131. Compared with the right-angle structure in related technologies, the first preset angle not only improves the wettability and self-leveling properties of the adhesive at the interface, but also reduces the risk of air bubble inclusion and incomplete sealing, improves the adhesion strength and sealing uniformity between the sealant 30 and the display panel 10 and the circuit board, thereby improving the moisture-proof, waterproof and anti-pollution performance of the display module 1 and extending the service life of the device in complex environments.

[0040] Specifically, the thickness of the bonding portion 13 on the side closer to the sealant 30 is less than the thickness of the bonding portion 13 on the side farther from the sealant 30. By setting the bonding portion 13 to a structure with a gradually changing thickness, the dispensing position can be closer to the junction of the display panel 10 and the circuit assembly 20, which is beneficial for the initial wetting and positioning of the sealant 30 at the junction of the first side 131 and the second circuit part 22. At the same time, it can also reduce the local height abrupt change of the sealant 30, reduce the protrusion of the sealant 30 cross section, and avoid the risk of glue accumulation or overflow onto the surface of the display panel 10 due to the excessive edge thickness of the sealant 30.

[0041] It is understandable that by designing the first side 131 of the bonding part 13 as a sloping structure and forming a thickness gradient near the sealant 30, a smooth and controllable dispensing space can be constructed together, allowing the sealant 30 to naturally extend and stably cover the first side 131 and the second circuit part 22 during the dispensing and curing process. This significantly improves the positioning accuracy, adhesion uniformity and encapsulation density of the sealant 30, thereby enhancing the moisture-proof, waterproof and anti-pollution performance of the display module 1 and extending the service life of the device in complex environments such as high humidity, salt spray and sweat.

[0042] Please continue to combine Figures 1 to 3 In one embodiment, the sealant 30 includes a first sealing portion 31 and a second sealing portion 32, wherein the first sealing portion 31 is located in the middle of the sealant 30, and the second sealing portion 32 is located on both sides of the sealant 30; wherein, in the direction perpendicular to the circuit assembly 20, the thickness of the first sealing portion 31 is greater than the thickness of the second sealing portion 32, which allows the sealant 30 to form an arc-shaped cross-section with a large thickness at the center and a small thickness at both sides, thereby providing a higher sealing margin at the junction of the display panel 10 and the circuit assembly 20.

[0043] It should be noted that in the dispensing process, the sealant 30 is typically applied continuously along the junction of the display panel 10 and the circuit assembly 20 using a dispensing needle. Since the initial amount of sealant is concentrated in the central area (the junction of the first side surface 131 and the second circuit section 22), under the combined action of gravity, surface tension, and capillary action between the substrates, the sealant naturally extends from the central area to both sides (the direction of the sealant 30 near the first side surface 131 and the direction of the sealant 30 near the second circuit section 22), thus forming a cross-sectional shape of a thicker sealant line in the middle and thinner at the edges before curing.

[0044] Specifically, the first sealing portion 31 serves as the main sealing portion, and its greater thickness can form sufficient filling at the junction of the display panel 10 and the circuit assembly 20, enhancing the adhesion strength and sealing continuity of the interface and preventing external liquids or gases from seeping in along the interface; the second sealing portion 32 serves as the edge transition portion, and its relatively thin thickness helps the sealant 30 to transition naturally with the adjacent structure, reducing the accumulation of sealant 30 at the edges and the inclusion of air bubbles, thereby improving the adhesion uniformity and sealing density of the sealant 30.

[0045] Furthermore, the adhesive layer morphology of "thick in the middle and thin at both sides" achieved by the natural flow characteristics of the adhesive in this embodiment can realize the automatic leveling and thickness control of the sealant 30 without additional process steps, improve dispensing stability and production consistency, and at the same time ensure the long-term reliability of the display module 1 in terms of moisture-proof, waterproof and salt spray resistance.

[0046] Furthermore, in the direction perpendicular to the circuit assembly 20, the minimum thickness of the bonding portion 13 is greater than the maximum thickness of the sealant 30, so that the upper surface of the sealant 30 will not exceed the minimum thickness position of the bonding portion 13, thus preventing the sealant 30 from overflowing onto the surface of the display panel 10, causing uneven thickness of the sealant 30, which could lead to stress concentration or panel warping during the curing process.

[0047] It should be noted that the fact that at least a portion of the surface of the first side 131 is inclined is merely illustrative. For example: Please refer to... Figure 1 , Figure 4 and Figure 5 In another embodiment, the first side surface 131 is an arc surface, and the first side surface 131 protrudes away from the sealant 30. By designing the first side surface 131 as an arc surface, a locally recessed dispensing space can be formed on the first side surface 131. The first side surface can serve as a guiding surface for the natural convergence of the sealant 30. During the dispensing process, under the combined action of gravity and surface tension, the adhesive can slowly overflow along the arc surface to its lowest side, thereby effectively controlling the flow direction and distribution of the adhesive during the dispensing process, making it easier for the sealant 30 to form a continuous and uniform adhesive line thickness on the first side surface 131. In addition, the first side surface 131 can further prevent the adhesive from overflowing onto the surface of the display panel 10, improving the stability of the dispensing process and the consistency of the product appearance.

[0048] Please combine Figure 1 and Figure 6 ;in, Figure 6 Provided for the embodiments of this utility model Figure 1 A schematic diagram of the third cross section corresponding to AA'.

[0049] In another embodiment, the display module 1 includes a display panel 10, a circuit assembly 20 electrically connected to the display panel 10, and a sealant 30 for sealing the junction of the display panel 10 and the circuit assembly 20 and isolating external moisture and contaminants from intrusion; wherein, the display panel 10 includes a flat portion 11 and a binding portion 13 located on one side of the flat portion 11, and the flat portion 11 and the binding portion 13 are located on the same horizontal plane.

[0050] The circuit assembly 20 includes a first circuit section 21, a third circuit section 33 disposed opposite to the first circuit section 21, and a second circuit section 22 connected between the first circuit section 21 and the third circuit section 33; wherein the first circuit section 21, the second circuit section 22, and the third circuit section 33 are integrally formed; the first circuit section 21 is located on the side of the bonding portion 13 away from the third circuit section 33 and is connected to the bonding portion 13; the second circuit section 22 is bent from the first circuit section 21 toward the third circuit section 33; the third circuit section 33 is located on the side of the bonding portion 13 away from the first circuit section 21 and is used to mount or electrically connect a driver chip.

[0051] Furthermore, the display panel 10 is provided with a first back plate 60, a composite support layer 50, a second back plate 80 and a support member 70 in sequence on the side near the third circuit section 33, for improving the mechanical strength and support stability of the display module 1; wherein, the support member 70 is located between the second back plate 80 and the third circuit section 33, for suppressing local warping and deformation of the circuit assembly 20.

[0052] The binding part 13 has a first side surface 131 at the end away from the planar part 11; the second circuit part 22 has a first preset angle between the side of the second circuit part 22 near the first side surface 131 and the first side surface 131. The first preset angle is an obtuse angle, so that the junction of the display panel 10 and the circuit assembly 20 forms an outward opening first preset angle. The first preset angle can provide more space for the sealant 30 to be dispensed, avoiding the accumulation of adhesive or the phenomenon of incomplete sealing under right-angle structure in related technologies. This allows the dispensing position of the sealant 30 to be arranged at the junction of the display panel 10 and the circuit assembly 20, thereby improving the dispensing accuracy and sealing coverage consistency.

[0053] Specifically, the sealant 30 is disposed between the circuit assembly 20 and the first side surface 131 of the bonding portion 13. The sealant 30 covers at least a portion of the first side surface 131, and the edge of the sealant 30 extends from the first side surface 131 to the second circuit portion 22, thereby enabling the sealant 30 to adhere tightly between the first side surface 131 and the second circuit portion 22, forming a double-sided sealing interface. This effectively blocks the penetration of external media such as salt spray, sweat, and moisture, improving the sealing reliability and long-term stability of the display module 1 in high humidity, corrosive, and immersion environments.

[0054] Furthermore, the display module 1 also includes an encapsulation structure 40, a functional film layer 90, and a protective layer 110; the encapsulation structure 40 is disposed on the light-emitting side of the display panel 10 and is used to encapsulate and protect the display elements inside the display panel 10; the functional film layer 90 is located between the encapsulation structure 40 and the display panel 10 and is used to adjust optical performance or enhance the stability of the display panel 10; the protective layer 110 is disposed on one side of the second circuit section 22 and can extend from above the first circuit section 21 to the side of the third circuit section 33 away from the planar section 11, thereby forming a full-coverage protection for the second circuit section 22, preventing external mechanical stress or moisture intrusion, and further improving the reliability of the display module 1.

[0055] Please combine Figure 1 and Figure 7 ;in, Figure 7 This is a cross-sectional schematic diagram of the display panel 10 provided in an embodiment of the present utility model.

[0056] In one embodiment, the display panel 10 includes a display area 1000 and a bonding area 3000 located on one side of the display area 1000. The display panel 10 includes a substrate 101, a thin-film transistor layer 104, and bonding terminals 132. The substrate 101 has a first inclined surface 1010 at its edge on one side of the bonding area 3000. The thin-film transistor layer 104 is disposed on one side of the substrate 101 and includes an insulating layer 1040. The insulating layer 1040 has a second inclined surface 10400 at its edge on one side of the bonding area 3000. The bonding terminals 132 are disposed on the side of the insulating layer 1040 away from the substrate 101 and are located within the bonding area 3000. The bonding portion 13 includes the bonding terminals 132, and the first side surface 131 includes the first inclined surface 1010 and the second inclined surface 10400.

[0057] It is understood that by designing the edges of the substrate 101 and the insulating layer 1040 as a first inclined surface 1010 and a second inclined surface 10400 respectively, and making them together form the first side surface 131, a continuous and smooth transition interface can be formed within the bonding area 3000 of the display panel 10, avoiding the step abrupt changes caused by right-angle structures at the stacked edges in related technologies; at the same time, the first inclined surface 1010 and the second inclined surface 10400 form the first preset angle in space, which can provide a gentle geometric transition space for the subsequent dispensing process, allowing the sealant 30 to spread naturally at this location and form a continuous glue line along the interlayer transition surface, thereby improving the uniformity of the sealant 30 coverage and the sealing reliability.

[0058] Further, the display panel 10 includes a bending region 2000 located between the display area 1000 and the bonding area 3000; the display panel 10 includes a substrate 101, a light-shielding layer 102, a buffer layer 103, a thin-film transistor layer 104, a passivation layer 105, a planarization layer 106, a pixel definition layer 107, a light-emitting device layer 108, and bonding traces 109 stacked together, the bonding traces 109 being disposed on the substrate 101 and located within the bonding area 3000; the bonding pads are electrically connected to the bonding traces 109 to enable the display panel 10 to connect with external electrical components. Signal transmission between paths; wherein, the substrate 101 may include a first substrate 1011, a spacer layer 1012, and a second substrate 1013 stacked sequentially, the first substrate 1011 and the second substrate 1013 may both be rigid substrates or flexible substrates, the materials of the first substrate 1011 and the second substrate 1013 may both be glass, quartz or polyimide, etc.; the material of the spacer layer 1012 includes, but is not limited to, silicon nitride, silicon oxide and other materials with water absorption properties; the light-shielding layer 102 is disposed between the second substrate 1013 and the buffer layer 103.

[0059] The thin-film transistor layer 104 is located within the display area 1000. The thin-film transistor 1041 includes multiple thin-film transistors 1041. The thin-film transistors 1041 can be etch-block type, back-channel etch type, or, depending on the position of the gate 1044 and the active layer 1042, can be classified as bottom-gate thin-film transistors 1041, top-gate thin-film transistors 1041, etc. This embodiment does not impose any limitations on this. The thin-film transistor layer 104 includes an active layer 1042 and a gate insulating layer 104 stacked on the buffer layer 103. 3. Gate 1044, interlayer insulating layer 1045, source 1046, and drain 1047. The thin-film transistor 1041 includes an active layer 1042, gate 1044, source 1046, and drain 1047. The bonding trace 109 can be disposed on the same layer as the source 1046 and the drain 1047 to simplify the process path, shorten the signal transmission path, and improve the driving response performance. It is understood that the thin-film transistor layer 104 is a conventional film layer well known to those skilled in the art, and its specific structure will not be described in detail here.

[0060] The passivation layer 105 is disposed on the side of the thin film transistor layer 104 away from the substrate 101, and the planarization layer 106 is disposed on the side of the passivation layer 105 away from the thin film transistor layer 104. It is used to provide a smooth surface, eliminate surface unevenness of the substrate 101 or other layers, and ensure that subsequent layers (such as pixel definition layer 107, light-emitting device layer 108, etc.) can be deposited uniformly, thereby improving the display effect and performance of the display panel 10.

[0061] The light-emitting device layer 108 includes an anode layer 1081, a light-emitting layer 1082, and a cathode layer 1083 stacked and connected in sequence. The anode layer 1081 includes a plurality of anodes spaced apart. The pixel definition layer 107 includes a plurality of pixel openings corresponding one-to-one with the plurality of anodes, and each pixel opening exposes a portion of the upper surface of the anode. The light-emitting layer 1082 may include a plurality of light-emitting units corresponding one-to-one with the plurality of anodes. The anode is electrically connected to the thin-film transistor 1041. The thin-film transistor 1041 controls the current flow to the anode by adjusting the gate 1044 signal. The anode provides positive charge to drive the light-emitting unit. The organic material in the light-emitting unit recombines under the action of the positive charge of the anode and the negative charge of the cathode layer 1083 to generate electroluminescence and emit visible light.

[0062] Specifically, the insulating layer 1040 includes the gate insulating layer 1043, the interlayer insulating layer 1045, and the passivation layer 105; the buffer layer 103 is provided with a third inclined surface 1030 at the edge of one side of the bonding region 3000, and the third inclined surface 1030, the first inclined surface 1010, and the second inclined surface 10400 are located in the same plane and together constitute the first side surface 131.

[0063] It is understood that by forming a first inclined surface 1010, a third inclined surface 1030, and a second inclined surface 10400 respectively in the bonding area 3000 of the substrate 101, the buffer layer 103, and the insulating layer 1040, and arranging them in the same plane, a continuous and smooth transition interface can be formed in the bonding area 3000 of the display panel 10. Specifically, the first inclined surface 1010, the second inclined surface 10400, and the third inclined surface 1030 form the first preset angle in space, which can provide a gentle geometric transition space for the subsequent dispensing process, so that the sealant 30 can spread naturally at this location and form a continuous glue line along the interlayer transition surface, thereby improving the uniformity of the sealant 30 coverage and the sealing reliability.

[0064] Please see Figure 8 This is a schematic diagram of the structure of the display device provided in an embodiment of the present utility model.

[0065] This embodiment also provides a display device 2, which includes the display module 1 described in any of the above embodiments; wherein, the display device 2 may further include a middle frame 3, which is integrated with the display module 1 to provide support, fixation and protection for the display module 1.

[0066] It is understood that the display module 1 has been described in detail in the above embodiments and will not be described again here; in particular, since the display device 2 adopts all the technical solutions of the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.

[0067] In specific applications, the display device 2 can be at least one of the following devices with display functions: smartphone, tablet computer, mobile phone, video phone, e-book reader, desktop computer, laptop computer, netbook, workstation, server, personal digital assistant, portable media player, MP3 player, mobile medical device, camera, game console, digital camera, car navigation system, electronic billboard, ATM or wearable device.

[0068] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0069] The above provides a detailed description of a display module and display device provided by the embodiments of this utility model. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this utility model. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A display module, characterized by include: The display panel includes a flat portion and a binding portion located on one side of the flat portion, wherein the end of the binding portion away from the flat portion is provided with a first side surface; The circuit assembly includes a first circuit portion connected to the binding portion, and a second circuit portion extending away from the binding portion along the junction of the first circuit portion and the binding portion, wherein the side of the second circuit portion closer to the first side is provided with a first preset angle between the second circuit portion and the first side, and the first preset angle is an obtuse angle. A sealant is disposed between the circuit assembly and the first side of the bonding portion, the sealant covering at least a portion of the first side, and the edge of the sealant extending from the first side to the second circuit portion.

2. The display module of claim 1, wherein, The first side is a sloped surface or a curved surface.

3. The display module of claim 2, wherein, The thickness of the bonding portion on the side closer to the sealant is less than the thickness of the bonding portion on the side farther from the sealant.

4. The display module according to claim 3, characterized in that, The sealant includes a first sealing portion and a second sealing portion, wherein the first sealing portion is located in the middle of the sealant and the second sealing portion is located on both sides of the sealant; In the direction perpendicular to the circuit assembly, the thickness of the first encapsulating portion is greater than the thickness of the second encapsulating portion.

5. The display module according to claim 4, characterized in that, In the direction perpendicular to the circuit assembly, the minimum thickness of the bonding portion is greater than the maximum thickness of the sealant.

6. The display module according to claim 2, characterized in that, The first side surface is curved, and the first side surface protrudes in a direction away from the sealant.

7. The display module according to any one of claims 1 to 6, characterized in that, The display panel includes a display area and a bonding area located on one side of the display area. The display panel includes: A base, wherein a first inclined surface is provided at one edge of the binding area; A thin-film transistor layer is disposed on one side of the substrate. The thin-film transistor layer includes an insulating layer, and the insulating layer has a second bevel at the edge of one side of the bonding region. A bonding terminal is disposed on the side of the insulating layer away from the substrate, and the bonding terminal is located within the bonding area; The binding part includes the binding terminal, and the first side includes the first inclined surface and the second inclined surface.

8. The display module according to any one of claims 1 to 6, characterized in that, The first preset included angle is greater than or equal to 110 degrees and less than or equal to 160 degrees.

9. The display module according to any one of claims 1 to 6, characterized in that, The display panel further includes a bending portion, which is connected between the flat portion and the binding portion, and the flat portion and the binding portion are disposed opposite to each other in a direction perpendicular to the display module; The circuit assembly is located on the side of the bonding portion away from the planar portion.

10. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 9.

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