Display module and display device

Abstract

This utility model belongs to the field of display technology, specifically relating to a display module and display device. The display module includes: a display layer, comprising a bonding area, a display area, and a bending area connecting the bonding area and the display area; a flexible circuit board electrically connected to the bonding area; and a middle frame connected to the flexible circuit board; wherein the flexible circuit board is at least partially disposed between the middle frame and the bonding area. The display module and display device of this application can achieve narrow bezel requirements.

Description

Technical Field

[0001] This application belongs to the field of display technology, specifically relating to a display module and display device. Background Technology

[0002] With the rapid development of display technology, users' demands for terminal display devices are constantly increasing. In order to meet users' needs for larger screen ratios, various display devices on the market are engaged in fierce competition in terms of narrow bezel design.

[0003] In related technologies, the structural limitations of display devices themselves cannot meet the requirements for narrow bezels. Utility Model Content

[0004] To address the aforementioned technical problems, this utility model provides a display module and display device, aiming to at least partially solve the technical problem that display devices cannot meet the requirements for narrow bezels.

[0005] The technical solution of this utility model is as follows: A display module includes: a display layer including a bonding area, a display area, and a bending area connecting the bonding area and the display area; a flexible circuit board electrically connected to the bonding area; and a middle frame connected to the flexible circuit board; wherein the flexible circuit board is at least partially disposed between the middle frame and the bonding area.

[0006] In some embodiments, the flexible circuit board is bonded to the bonding area, and the middle frame is bonded to the flexible circuit board; wherein the bonding strength between the flexible circuit board and the bonding area is greater than the bonding strength between the middle frame and the flexible circuit board.

[0007] In some embodiments, the flexible circuit board includes a first board, a second board, and a bent board connecting the first board and the second board; wherein the bonding area is located between the first board and the second board, and the second board is located between the middle frame and the bonding area.

[0008] In some implementations, the bending plate is located at the end of the binding area away from the bending area.

[0009] In some embodiments, an adhesive layer is provided between the first plate and the second plate to fill the gap between them.

[0010] In some implementations, the adhesive layer covers the bonding area.

[0011] In some embodiments, the display module further includes a protective layer bonded to the bending area and the adhesive layer.

[0012] In some embodiments, the second plate is provided with a first receiving groove to accommodate the binding area.

[0013] In some implementations, the display module further includes a driver chip disposed between the second board and the bonding area, the driver chip being electrically connected to the bonding area.

[0014] In some implementations, the display module further includes a buffer protective layer disposed between the first plate and the display area, and bonded to the first plate.

[0015] In some implementations, the adhesive strength between the buffer protective layer and the first plate is greater than the adhesive strength between the middle frame and the second plate.

[0016] In some implementations, the bonding area has a first mating area, and one of the first board and the second board has a second mating area; wherein the first mating area and the second mating area are electrically connected.

[0017] In some embodiments, the display module further includes: a display cover plate disposed on the side of the display area away from the binding area; wherein the middle frame has a plane, and the display cover plate is connected to the plane.

[0018] Based on the same inventive concept, this application also provides a display device, including the aforementioned display module.

[0019] The beneficial effects of this utility model include at least the following: Since the display layer includes a bonding area, a display area, and a bending area connecting the bonding area and the display area, the flexible circuit board is electrically connected to the bonding area, and the middle frame is connected to the flexible circuit board. The flexible circuit board is at least partially located between the middle frame and the bonding area. Therefore, the display area can be connected to the middle frame through the flexible circuit board to realize the installation of the display area. This eliminates the need for a support structure and pre-reserved adhesive space in the middle frame, thereby reducing the thickness of the middle frame and reducing the width of the bezel. This meets the requirement of a narrow bezel, increases the proportion of the display area, and improves the user experience.

[0020] Because the mid-frame is connected to the flexible circuit board, which has electronic shielding and insulation functions, and is composed of multiple layers of PI (Polyimide), the flexible circuit board has high structural strength. Therefore, there is no need to set a protective film between the flexible circuit board and the display layer, which can better withstand external forces to protect the bonding area and ensure the safety of the display layer. Moreover, the electronic shielding and insulation functions of the flexible circuit board can effectively prevent external electromagnetic interference from affecting the internal circuits of the display module, while avoiding mutual interference between internal circuits, ensuring that the display layer can work normally and improving the stability of electronic performance.

[0021] Protective films, as an additional material, incur costs in their procurement, processing, and installation. However, by utilizing the inherent characteristics of flexible circuit boards, which eliminate the need for protective films, the material costs of the display module can be directly reduced, thus helping to improve product profit margins and market price competitiveness.

[0022] Traditional designs require reserved installation space for the protective film. This application uses a flexible circuit board to replace the protective film, meaning that the flexible circuit board can perform the function of the protective film. Therefore, no additional space is needed to place the protective film, making more efficient use of the internal space of the display module and providing more possibilities for the layout optimization of other components. For example, the battery capacity can be increased to improve the device's battery life, or the heat dissipation structure can be optimized to improve the device's heat dissipation efficiency.

[0023] When disassembling the display module, the disassembly pull is applied to the flexible circuit board through the mid-frame. Due to the high structural strength of the flexible circuit board, the disassembly pull is dispersed and borne by the circuit board itself, preventing the pull from directly affecting the display layer and causing damage. This ensures the safety of the display layer and effectively separates the mid-frame from the display layer. Furthermore, because the disassembly pull does not directly affect the display layer, operators can perform the disassembly more boldly and quickly, without spending a lot of time and effort controlling the direction and magnitude of the pull, thus shortening the disassembly time and improving efficiency.

[0024] Since no supporting structure is designed between the display cover and the middle frame, the supporting structure component is reduced compared to the traditional design, making the overall structure of the display module simpler and reducing structural complexity. This helps to improve production and assembly efficiency and reduce assembly errors and failure risks caused by too many components. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 These are schematic diagrams of the display module structure in some embodiments; Figure 2 for Figure 1 The image shows a cross-sectional view of the module along axis AA. Figure 3 for Figure 1 The BB-direction cross-sectional view of the display module is shown in the middle; Figure 4 for Figure 1A schematic diagram of the flexible circuit board of the display module in its unfolded state; Figure 5 for Figure 1 A schematic diagram of the flexible circuit board of the display module in a bent state; Figure 6 for Figure 1 A schematic diagram showing the display layer of the display module in a bent state.

[0027] In the attached image: Display layer 10, bonding area 11, first docking area 111, display area 12, bending area 13, protective layer 14, display layer back film 15; Flexible circuit board 20, first board 21, second board 22, first receiving groove 221, second receiving groove 222, second docking area 223, bending plate 23, adhesive layer 24. Middle frame 30, first middle frame 31, second middle frame 32; Driver chip 40; Buffer protective layer 50; Display cover 60; Optical transparent adhesive 70; Polarizer layer 80; Display cover ink 90; 100g of adhesive for the mid-frame; Second adhesive 110. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] It should be noted that all directional indications in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0030] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] Furthermore, in this utility model, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0032] With the rapid development of display technology, users' demands for terminal display devices are constantly increasing. In order to meet users' needs for larger screen ratios, various display devices on the market are engaged in fierce competition in terms of narrow bezel design.

[0033] The following approach is used when manufacturing display devices: Option 1 involves bonding the mid-frame with adhesive at the edge of the Cover Glass. However, this requires additional adhesive application space and support structure, resulting in a thicker mid-frame. Furthermore, it necessitates reserving space for adhesive application, which increases the narrow bezel of the display device and reduces the screen-to-body ratio.

[0034] Option 2 involves bonding the mid-frame to the protective film layer on the surface of the display layer using adhesive. However, due to the weak bonding force between the protective film layer and the display layer, the mid-frame is bonded to the protective film layer with low fixing strength, resulting in unstable fixing of the mid-frame. Moreover, during disassembly and repair, the protective film layer and the display layer usually delaminate, and the internal damage to the display layer under tension can render it unusable.

[0035] Based on these technical problems, this application provides a display module and a display device, aiming to solve the technical problem that the display device cannot meet the requirements of narrow bezels.

[0036] The design concept of this application is to connect the middle frame with the flexible circuit board, with the flexible circuit board at least partially located between the middle frame and the bonding area, thereby reducing the thickness of the middle frame and achieving the technical effect of reducing the width of the border.

[0037] Specific technical solutions will now be described in detail with reference to the accompanying drawings, which are not necessarily drawn to scale. Similar or identical reference numerals may be used to designate the same or similar parts in different figures. The use of similar or identical reference numerals in different figures does not mean that all figures including similar or identical reference numerals constitute a single or the same embodiment. The accompanying drawings illustrate the various embodiments discussed in this application in a generalized, illustrative, and not restrictive manner.

[0038] Figure 1 These are schematic diagrams of the display module structure in some embodiments; Figure 2 for Figure 1 The image shows a cross-sectional view of the module along axis AA. Figure 3 for Figure 1 The image shows a BB-direction cross-sectional view of the display module. Combined with... Figure 1 , Figure 2 and Figure 3 The display module in this embodiment includes a display layer 10, a flexible circuit board 20, and a mid-frame 30. The display layer 10 includes a bonding area 11, a display area 12, and a bending area 13 connecting the bonding area 11 and the display area 12. The flexible circuit board 20 is electrically connected to the bonding area 11. The mid-frame 30 is connected to the flexible circuit board 20. The flexible circuit board 20 is at least partially disposed between the mid-frame 30 and the bonding area 11.

[0039] Combination Figure 2 Since the display layer 10 includes a bonding area 11, a display area 12, and a bending area 13 connecting the bonding area 11 and the display area 12, the flexible circuit board 20 is electrically connected to the bonding area 11, and the middle frame 30 is connected to the flexible circuit board 20. The flexible circuit board 20 is at least partially disposed between the middle frame 30 and the bonding area 11. Therefore, the display area 12 can be connected to the middle frame 30 through the flexible circuit board 20 to realize the installation of the display area 12. This allows the middle frame 30 to be designed without a support structure and without reserved adhesive space, thereby reducing the thickness of the middle frame 30 (the thickness of the middle frame 30 is as follows). Figure 2 As shown in the middle T), this reduces the width of the border (the border width is as shown in the middle T). Figure 2 As shown in the middle (L), it meets the narrow bezel requirement, which can increase the proportion of the display area 12 and improve the user experience.

[0040] Since the middle frame 30 is connected to the flexible circuit board 20, the flexible circuit board 20 has electronic shielding and insulation functions. The flexible circuit board 20 is composed of multiple layers of PI (Polyimide) and has high structural strength. Therefore, there is no need to set a protective film between the flexible circuit board 20 and the display layer 10. It can better withstand external forces to protect the bonding area 11 and ensure the safety of the display layer 10. Moreover, the electronic shielding and insulation functions of the flexible circuit board 20 can effectively prevent external electromagnetic interference from affecting the internal circuits of the display module, while avoiding mutual interference between internal circuits, ensuring that the display layer 10 can work normally and improving the stability of electronic performance.

[0041] Protective films, as an additional material, incur costs in their procurement, processing, and installation. However, by utilizing the inherent characteristics of the flexible circuit board 20, the need for a protective film is eliminated, directly reducing the material cost of the display module and helping to improve the product's profit margin and market price competitiveness.

[0042] Traditional designs require reserved installation space for the protective film. This application uses a flexible circuit board 20 to replace the protective film, meaning that the flexible circuit board 20 can perform the function of the protective film. Therefore, no additional space is needed to place the protective film, making more efficient use of the internal space of the display module and providing more possibilities for the layout optimization of other components. For example, the battery capacity can be increased to improve the device's battery life, or the heat dissipation structure can be optimized to improve the device's heat dissipation efficiency.

[0043] When disassembling the display module, the disassembly pull is applied to the flexible circuit board 20 through the mid-frame 30. Due to the high structural strength of the flexible circuit board 20, the disassembly pull can be dispersed and borne by the flexible circuit board 20 itself during disassembly. This avoids the disassembly pull directly acting on the display layer 10, which could cause damage to the display layer 10, thus ensuring the safety of the display layer 10 and effectively achieving the separation of the mid-frame 30 from the display layer 10. Moreover, since the disassembly pull does not directly act on the display layer 10, operators can operate more boldly and quickly during disassembly without spending a lot of time and effort controlling the direction and magnitude of the pull, which can shorten the disassembly time and improve disassembly efficiency.

[0044] Since no support structure is designed between the display cover and the middle frame 30, compared with the traditional design, the support structure component is reduced, making the overall structure of the display module simpler, reducing structural complexity, helping to improve production assembly efficiency, and reducing assembly errors and failure risks caused by too many components.

[0045] Combination Figure 2 and Figure 3In some embodiments, the middle frame 30 includes a first middle frame 31 and a second middle frame 32 connected to the first middle frame 31. The first middle frame 31 is disposed along a first direction Z, and the second middle frame 32 is disposed along a second direction X. The first middle frame 31 is connected to the flexible circuit board 20. The first direction Z is perpendicular to the second direction X.

[0046] For example, in the first direction Z, such as Figure 2 As shown, the first direction Z can also be referred to as the length direction, height direction, or vertical direction of the display module or display device. The second direction X is as follows... Figure 2 As shown, the second direction X can also be referred to as the thickness direction or left-right direction of the display module or display device.

[0047] In some embodiments, the width of the border is the distance between the end face of the second middle frame 32 away from the display layer 10 and the display area 11.

[0048] In some embodiments, the display area 12 and the binding area 11 are arranged along the second direction X.

[0049] In some embodiments, to achieve the connection between the flexible circuit board 20 and the bonding area 11 and the middle frame 30, the flexible circuit board 20 is bonded to the bonding area 11, and the middle frame 30 is bonded to the flexible circuit board 20. For example, the flexible circuit board 20 can be connected to the bonding area 11 via a first adhesive, which can be a pressure-sensitive adhesive (such as an acrylic pressure-sensitive adhesive) or foam adhesive. The flexible circuit board 20 can also be connected to the middle frame adhesive 100.

[0050] In some embodiments, in order to ensure the safety of the display layer 10, the bonding strength between the flexible circuit board 20 and the bonding area 11 is greater than the bonding strength between the middle frame 30 and the flexible circuit board 20.

[0051] When disassembling the display module, a disassembly pull force is applied to the mid-frame 30. The disassembly pull force acts on the flexible circuit board 20 through the mid-frame 30. Since the adhesive strength between the flexible circuit board 20 and the bonding area 11 is greater than the adhesive strength between the mid-frame 30 and the flexible circuit board 20, the mid-frame 30 will separate from the flexible circuit board 20 under the action of the disassembly pull force. However, the disassembly pull force will not separate the flexible circuit board 20 from the bonding area 11. In other words, the disassembly pull force will not act on the bonding area 11, ensuring the safety of the bonding area 11 and effectively achieving the effective disassembly of the mid-frame 30 and the display layer 10.

[0052] In some embodiments, the adhesive strength between the flexible circuit board 20 and the bonding area 11 can be greater than 3500 g / inch, such as 3600 g / inch, 3800 g / inch, or 4000 g / inch. The adhesive strength between the middle frame 30 and the flexible circuit board 20 is greater than 3000 g / inch and less than 3500 g / inch, such as 3100 g / inch, 3200 g / inch, or 3300 g / inch.

[0053] Combination Figure 2 and Figure 3 In some embodiments, to protect the bonding area 11, the flexible circuit board 20 includes a first plate 21, a second plate 22, and a bent plate 23 connecting the first plate 21 and the second plate 22. The bonding area 11 is located between the first plate 21 and the second plate 22, and the second plate 22 is located between the middle frame 30 and the bonding area 11.

[0054] The middle frame 30 typically serves as the outer casing of electronic devices, possessing a certain degree of strength and rigidity. When the electronic device is subjected to external forces such as collisions or compression, since the second plate 22 is located between the middle frame 30 and the bonding area 11, the middle frame 30 initially bears most of the external force. The second plate 22 further buffers and disperses the external force, significantly reducing the force transmitted to the bonding area 11 and effectively protecting the circuitry within the bonding area 11 from damage. Moreover, because the bonding area 11 is located between the first plate 21 and the second plate 22, with the second plate 22 covering the side of the bonding area 11 closest to the middle frame 30 and the first plate 21 covering the side of the bonding area 11 away from the middle frame 30, it effectively prevents the bonding area 11 from directly contacting other objects, further ensuring the safety of the bonding area 11 and extending its service life.

[0055] The bending plate 23 connects the first plate 21 and the second plate 22, forming a relatively stable overall structure. When the flexible circuit board 20 is subjected to external forces, the elastic deformation of the bending plate 23 can absorb and disperse stress, reducing the impact of local stress concentration on the bonding area 11. At the same time, the bending plate 23 can also limit the relative displacement of the first plate 21 and the second plate 22 to a certain extent, ensuring that the position of the bonding area 11 is relatively fixed, thereby improving the structural stability of the entire flexible circuit board 20.

[0056] The second board 22 is bonded to the middle frame 30, which provides a stable support platform for the flexible circuit board 20, allowing it to be securely installed within the middle frame 30 without easily loosening or shifting. During use of the electronic device, even if vibration or shaking occurs, the flexible circuit board 20 remains relatively stable, thus ensuring the reliability of the connection in the bonding area 11.

[0057] In some embodiments, the first plate 21, the second plate 22 and the first middle frame 31 are arranged along the second direction X, and the second plate 22 is bonded to the first middle frame 31.

[0058] Combination Figure 2 In some embodiments, in order to make full use of the space within the middle frame 10, the bending plate 23 is disposed at the end of the binding area 11 away from the bending area 13, so that the display layer 10 and the flexible circuit board 20 form a structure similar to two U-shaped pieces being inserted together. This achieves the stacked arrangement of the first plate 21, the binding area 11, the second plate 22, and the display area 12, which can reduce the space occupied by the display layer 10 and the flexible circuit board 20 in the second direction X. The space saved in the second direction X can be directly used to install a larger capacity battery, thereby increasing the battery capacity and improving the battery life of the display device. At the same time, it can also achieve a thinner and lighter design while ensuring the battery capacity, thus improving the user experience.

[0059] Combination Figure 2 and Figure 3 In some embodiments, to adequately protect the bonding area 11, an adhesive layer 24 is provided between the first plate 21 and the second plate 22 to fill the gap between them. Exemplarily, the adhesive layer 24 is composed of a first adhesive.

[0060] The adhesive layer 24 bonds the first plate 21 to the binding area 11 and the second plate 22 to the binding area 11. At the same time, it also bonds the areas of the first plate 21 and the second plate 22 that are not bonded to the binding area 11, so as to completely enclose the binding area 11 between the first plate 21 and the second plate 22. This makes the originally relatively independent first plate 21, second plate 22 and binding area 11 form a tightly integrated whole, which can better withstand external mechanical stress, such as vibration and impact, and prevent the binding area 11 from being damaged due to excessive local stress, thereby ensuring the safety of the binding area 11.

[0061] Furthermore, the adhesive layer 24 completely fixes the bonding area 11 between the first plate 21 and the second plate 22, preventing the bonding area 11 from shifting during use, so as to ensure that the bonding area 11 can work normally.

[0062] In some embodiments, since the adhesive strength of the adhesive layer 24 is greater than the adhesive strength between the middle frame 30 and the flexible circuit board 20, when disassembling the display module, the disassembly pull acts on the second plate 22 through the middle frame 30. Under the action of the disassembly pull, the middle frame 30 will separate from the flexible circuit board 20. However, the disassembly pull will not separate the second plate 22 from the bonding area 11, nor will it separate the second plate 21 from the first plate 21, nor will it separate the first plate 21 from the bonding area 11. In other words, the disassembly pull will not be applied to the binding area 11, ensuring the safety of the binding area 11 and effectively achieving the disassembly of the middle frame 30 and the display layer 10.

[0063] In some embodiments, the adhesive layer 24 can be a pressure-sensitive adhesive (such as an acrylic pressure-sensitive adhesive) or a foam adhesive, and the adhesive strength of the adhesive layer 24 can be greater than 3500 g / inch, such as 3600 g / inch, 3800 g / inch, or 4000 g / inch. The adhesive strength between the middle frame 30 and the second plate 22 is greater than 3000 g / inch and less than 3500 g / inch, such as 3100 g / inch, 3200 g / inch, or 3300 g / inch.

[0064] In some embodiments, in order to fully protect the binding area 11, the adhesive layer 24 covers the binding area 11 to achieve full adhesion between the binding area 11 and the first plate 21 and the second plate 22, so that the first plate 21 and the second plate 22 can fully protect the binding area 11 and ensure the safety of the binding area 11.

[0065] The adhesive layer 24 can form a continuous coating layer that can absorb mechanical impact and vibration energy from all directions. The coating layer can disperse the impact force, further ensuring the safety of the bonding area 11.

[0066] Combination Figure 2 In some embodiments, to protect the bending area 13, the display module further includes a protective layer 14. The protective layer 14 is bonded to the bending area 13 and the adhesive layer 24. For example, the protective layer 14 can be a protective adhesive, and the protective layer 14 is located on the end face of the bending area 13 opposite to the bending plate 23.

[0067] The protective layer 14 covers the end face of the bending area 13 away from the bending plate 23 to protect the bending area 13. The hard or elastic surface of the protective layer 14 can resist the impact of external sharp objects on the bending area 13 and the friction and wear of the bending area 13 during daily use. For example, when the display module is accidentally dropped, the protective layer 14 can preferentially absorb the impact energy to avoid direct damage to the bending area 13; at the same time, it can prevent scratches from being generated on the surface of the bending area 23 due to friction, maintain the structural integrity of the bending area 23, achieve impact resistance and scratch prevention, and ensure the safety of the bending area 13.

[0068] The protective layer 14 is bonded to the bending area 13 and the adhesive layer 24, which can further ensure the stability of the connection between the display area 10 and the flexible circuit board 20.

[0069] Combination Figure 3In some embodiments, in order to achieve sufficient protection for the bonding area 11, the second plate 22 is provided with a first receiving groove 221 to accommodate the bonding area 11. The groove wall of the first receiving groove 221 can protect the bonding area 11 and can effectively block the impact (such as falling, collision) or squeezing (such as equipment assembly pressure) from the side, so as to prevent the edge solder joints, lines or components of the bonding area 11 from breaking or falling off due to direct force, thus ensuring the safety of the bonding area 11.

[0070] Combination Figure 2 and Figure 3 In some embodiments, to achieve drive control, the display module further includes a driver chip 40. The driver chip 40 is disposed between the second board 22 and the bonding area 11, and the driver chip 40 is electrically connected to the bonding area 11 so that signal transmission can be performed between the driver chip 40 and the bonding area 11.

[0071] The direct adjacency design between the driver chip 40 and the bonding area 11 significantly shortens the signal transmission path, reduces the resistance, capacitance and inductance effects caused by traditional long-distance traces, and ensures the real-time performance and accuracy of display data (such as high-resolution images and videos).

[0072] The driver chip 40 is located between the second board 22 and the bonding area 11. The second board 22 can support the driver chip 40, ensuring the stability of the driver chip 40 installation and preventing the connection point between the driver chip 40 and the bonding area 11 from being broken by stress concentration or the circuit falling off.

[0073] The driver chip 40 is located between the second board 22 and the bonding area 11, realizing a "stacked" design. It can make full use of the space in the second direction X, reduce the occupation of the space in the first direction Z of the display module, reduce the bezel L value, meet the narrow bezel requirement, increase the proportion of the display area 12, and improve the user experience.

[0074] Combination Figure 2 and Figure 3 In some embodiments, the second plate 22 is provided with a second receiving groove 222 communicating with the first receiving groove 221. The driver chip 40 is disposed in the second receiving groove 222, and the second receiving groove 222 accommodates the driver chip 40 to ensure the safety of the driver chip 40. At the same time, the groove wall of the second receiving groove 222 can protect the driver chip 40, effectively blocking the impact from lateral external forces (such as drops, collisions) or squeezing (such as assembly pressure), preventing the edge solder joints, lines or components of the driver chip 40 from breaking or falling off due to direct force, thus ensuring the safety of the driver chip 40.

[0075] In related technologies, after the flexible circuit board 20 is bonded to the display layer 10, it is then fixed to the buffer protective layer. During the process of fixing the flexible circuit board 20 to the buffer protective layer, the flexible circuit board 20 needs to extend first along the first direction Z and then along the second direction X. This results in the flexible circuit board 20 occupying a large area of ​​the overall battery space, preventing further expansion of the battery capacity.

[0076] Combination Figure 2 and Figure 3 In some embodiments, to protect the display area 12, the display module further includes a buffer protective layer 50. The buffer protective layer 50 is disposed between the first plate 21 and the display area 12 and is bonded to the first plate 21. The buffer protective layer 50 can effectively absorb external impact energy, reduce the risk of cracks or breakage of the display area 12 due to impact, and ensure the safety of the display area 12.

[0077] Since the first plate 21 is connected to the second plate 22 through the bending plate 23, the first plate 21 can be directly bonded to the buffer protective layer 50 without the first plate 21 extending along the first direction Z and then along the second direction X. This ensures that the first plate 21, the second plate 22, and the bending plate 23 do not occupy the battery space of the whole device, so that there is enough space in the middle frame 30 to accommodate a larger capacity battery, thereby increasing the battery capacity, improving the battery life of the display device, and improving the user experience.

[0078] In some embodiments, in order to ensure the safety of the display layer 10, the bonding strength between the buffer protective layer 50 and the first plate 21 is greater than the bonding strength between the middle frame 30 and the second plate 22.

[0079] In some embodiments, a display layer back film 15 is provided between the buffer protective layer 50 and the display area 12. The display layer back film 15 can absorb external impact energy and ensure the safety of the display area 12.

[0080] When disassembling the display module, a disassembly pull force is applied to the middle frame 30. The disassembly pull force acts on the flexible circuit board 20 through the middle frame 30. There are two transmission paths of the disassembly pull force on the flexible circuit board 20: First, middle frame 30 → second board 22 → first board 21 → buffer protective layer 50; Second, middle frame 14 → second board 22 → bonding area 11 → first board 21 → buffer protective layer 50. Because the bonding strength between the buffer protective layer 50 and the first plate 21 is greater than the bonding strength between the middle frame 30 and the second plate 22, the middle frame 30 will separate from the flexible circuit board 20 under the action of disassembly pulling force. However, the disassembly pulling force will not separate the second plate 22 from the bonding area 11, nor will it separate the second plate 21 from the first plate 21, nor will it separate the first plate 21 from the bonding area 11, nor will it separate the second plate 22 from the buffer protective layer 50. In other words, the disassembly pulling force will not act on the bonding area 11 and the display area 12, ensuring the safety of the bonding area 11 and the display area 12, and effectively realizing the effective disassembly of the middle frame 30 and the display layer 10.

[0081] In some embodiments, the bonding strength between the buffer layer 50 and the first plate 21 can be greater than 3500 g / inch, such as 3600 g / inch, 3800 g / inch, or 4000 g / inch. Exemplarily, the buffer layer 50 can be bonded to the first plate 21 using a second adhesive 110.

[0082] Figure 4 for Figure 1 A schematic diagram of the flexible circuit board of the display module in its unfolded state; Figure 5 for Figure 1 A schematic diagram of the flexible circuit board of the display module in a bent state. (Combined with...) Figure 4 and Figure 5 In some embodiments, to enable signal transmission between the bonding area 11 and the flexible circuit board 20, the bonding area 11 has a first mating area 111, and one of the first board 21 and the second board 22 has a second mating area 223. The first mating area 111 and the second mating area 223 are electrically connected. Exemplarily, the first mating area 111 and the second mating area 223 can be gold fingers, copper foil pads, or ACF (Anisotropic Conductive Film).

[0083] The electrical connection between the first docking area 111 and the second docking area 223 enables signal transmission between the bonding area 11 and the flexible circuit board 20.

[0084] Figure 6 for Figure 1 A schematic diagram showing the display layer of the central display module in a bent state. (Combined with...) Figure 4 , Figure 5 and Figure 6In some embodiments, the first plate 21 is first bonded to the binding area 11. After the bent plate 23 is complete, the second mating area 223 on the second plate 22 is bonded to the first mating area 111 of the binding area 11 to achieve circuit conduction. The second plate 22 is then bonded to the binding area 11. Then, the bending area 13 is bent to bond the first plate 21 to the buffer protective layer 50, and the first plate 21 is bonded to the second plate 22.

[0085] Combination Figure 1 , Figure 2 and Figure 3 In some embodiments, to achieve the narrow bezel requirement, the display module further includes a display cover plate 60. The display cover plate 60 is disposed on the side of the display area 12 away from the binding area 11. The middle frame 30 has a plane, and the display cover plate 60 is connected to the plane. For example, the second middle frame 32 has a plane.

[0086] Since the display cover 60 is directly mounted on the plane, it is understandable that the middle frame 30 has no supporting structure and no reserved space for adhesive application. This allows for a reduction in the thickness of the middle frame 30, thereby reducing the width of the bezel and meeting the requirement for a narrow bezel. This increases the proportion of the display area 12 and improves the user experience.

[0087] Combination Figure 2 and Figure 3 In some embodiments, to form a complete display module, the display module further includes an optically transparent adhesive 70 and a polarizing film layer 80. The optically transparent adhesive 70 is disposed between the display cover plate 60 and the polarizing film layer 80, and the polarizing film layer 80 is disposed between the display area 12 and the optically transparent adhesive 70.

[0088] In some embodiments, the protective layer 14 is bonded to the polarizer layer 80, which can ensure the stability of the display area 10 during installation.

[0089] Combination Figure 1 , Figure 2 and Figure 3 In some embodiments, a display cover ink 90 is provided between the display cover plate 60 and the optically transparent adhesive 70 to form an opaque layer, blocking internal light leakage at the interface between the optically transparent adhesive 70 and the display cover plate 60.

[0090] Based on the same inventive concept, this application also proposes a display device that uses the aforementioned display module. The specific structure of the display module is as described in the above embodiments. Since the display module uses all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated here.

[0091] It should be understood that the display device can be an OLED (Organic Light-Emitting Diode) display or other display device, as well as any product or component with display function, such as a television, digital camera, mobile phone, or tablet computer, which includes such display devices.

[0092] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0093] In the description of this utility model, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0094] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0095] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0096] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A display module, characterized by include: The display layer includes a binding area, a display area, and a bend area connecting the binding area and the display area; The flexible circuit board is electrically connected to the bonding area; The middle frame is connected to the flexible circuit board; The flexible circuit board is at least partially disposed between the middle frame and the bonding area.

2. The display module according to claim 1, characterized in that, The flexible circuit board is bonded to the bonding area, and the middle frame is bonded to the flexible circuit board; The bonding strength between the flexible circuit board and the bonding area is greater than the bonding strength between the middle frame and the flexible circuit board.

3. The display module according to claim 1, characterized in that, The flexible circuit board includes a first board, a second board, and a bent board connecting the first board and the second board; The binding area is located between the first plate and the second plate, and the second plate is located between the middle frame and the binding area.

4. The display module according to claim 3, characterized in that, The bending plate is located at the end of the binding area away from the bending area.

5. The display module according to claim 3, characterized in that, An adhesive layer is provided between the first plate and the second plate to fill the gap between them.

6. The display module according to claim 5, characterized in that, The adhesive layer covers the bonding area.

7. The display module according to claim 5, characterized in that, The display module also includes: A protective layer is bonded to the bending area and the adhesive layer.

8. The display module according to claim 3, characterized in that, The second plate is provided with a first receiving groove to accommodate the binding area.

9. The display module according to claim 3, characterized in that, The display module also includes: A driver chip is disposed between the second board and the bonding area, and the driver chip is electrically connected to the bonding area.

10. The display module according to claim 3, characterized in that, The display module also includes: A buffer protective layer is disposed between the first plate and the display area and is bonded to the first plate.

11. The display module according to claim 10, characterized in that, The bonding strength between the buffer protective layer and the first plate is greater than the bonding strength between the middle frame and the second plate.

12. The display module according to claim 3, characterized in that, The binding area has a first docking area, and one of the first plate and the second plate has a second docking area; The first docking area and the second docking area are electrically connected.

13. The display module according to any one of claims 1-12, characterized in that, The display module also includes: A display cover plate is located on the side of the display area away from the binding area; The middle frame has a plane, and the display cover is connected to the plane.

14. A display device, characterized in that, Includes the display module as described in any one of claims 1-13.

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