A micro display panel and display device

Abstract

This utility model discloses a microdisplay panel, which includes a microdisplay chip, connecting lines, and a connector. The connecting line includes a main body, a first end, and a second end opposite to the first end. The first end is electrically connected to the microdisplay chip, and the second end is electrically connected to the connector. The connector includes a control module and an external interface, and is used for connecting to external compatible devices. This microdisplay panel modularizes the microdisplay chip, connecting lines, and other components, improving packaging flexibility.

Description

Technical Field

[0001] This utility model relates to the field of micro-display technology, and in particular to a micro-display panel and display device. Background Technology

[0002] Micro LED (Micro Light Emitting Diode) microdisplay chips are a novel LED structure obtained by thinning, miniaturizing, and arraying existing LED structures. They integrate arrayed micron-sized LED units onto an active addressable driver panel to achieve individual illumination and control of the LED units, thereby outputting the desired display image. Micro LED microdisplay panels formed by these chips can be applied to many products, including AR glasses.

[0003] However, in the packaging structure of traditional microdisplay panels, there are often large gaps between the components, which greatly reduces space utilization. At the same time, the packaging structure occupies a large area, making it difficult to apply in space-constrained scenarios. In addition, existing microdisplay panels are usually designed and manufactured as a whole, resulting in poor packaging flexibility. Utility Model Content

[0004] To address some or all of the problems in the prior art, this utility model provides a micro-display panel, comprising:

[0005] First substrate;

[0006] A microdisplay chip is disposed on the first surface of the first substrate;

[0007] A connecting wire, comprising a body, a first end, and a second end opposite to the first end, wherein the first end is electrically connected to the microdisplay chip; and

[0008] A connector electrically connected to the second end of the connecting line, the connector including a control module and an external interface for connecting to external compatible equipment.

[0009] Furthermore, the central axis of the microdisplay chip coincides with the central axis of the first substrate.

[0010] Furthermore, the central axis of the microdisplay chip coincides with the central axis of the connecting line.

[0011] Furthermore, the first end of the connecting line is disposed at the first edge of the first surface of the first substrate, wherein the first edge refers to the side edge close to the connector.

[0012] Furthermore, the size of the first substrate is greater than or equal to the size of the microdisplay chip.

[0013] Furthermore, the first substrate and the microdisplay chip are rectangular.

[0014] Furthermore, the width of the first end of the connecting line is less than the length of the first side of the first substrate, and not less than the length of the first side of the microdisplay chip.

[0015] Furthermore, the first side of the microdisplay chip is parallel to the edge of the first end of the connecting line, but with a gap between them.

[0016] Furthermore, the side length of the first substrate is 6.26 to 7.38 mm, and the length of the first side is 5.07 to 6.07 mm.

[0017] Furthermore, the second side of the microdisplay chip opposite to its first side has a first gap with the second side of the first substrate, wherein the first gap is 0.32 to 1.57 mm.

[0018] Furthermore, the side of the microdisplay chip has a second distance from the side of the first substrate, wherein the second distance is 0.63 to 0.99 mm, and wherein the side of the microdisplay chip refers to the two sides perpendicular to its first side.

[0019] Furthermore, the microdisplay chip is bonded to the surface of the first substrate using chip adhesive.

[0020] Furthermore, the chip adhesive includes die bonding adhesive or die bonding film.

[0021] Furthermore, the microdisplay chip includes a light-emitting area and a non-light-emitting area, wherein the non-light-emitting area includes at least one metal pad on the side near the connector, and the first end of the connecting line is electrically connected to the metal pad.

[0022] Furthermore, the shape of the light-emitting area is square, circular, rectangular, polygonal, or irregular.

[0023] Furthermore, the size of the light-emitting area of ​​the microdisplay chip is 2.64*2 mm.

[0024] Furthermore, the width of the main body of the connecting line is smaller than that of the first end of the connecting line, and the width of the second end of the connecting line is equal to the width of the main body of the connecting line; the connecting line is a flexible connecting line.

[0025] Furthermore, the main body of the connecting line and its first end have a transitional connection portion with a gradually changing width.

[0026] Furthermore, the width of the main body of the connecting line is 3.45 to 3.55 millimeters.

[0027] Furthermore, the thickness of the connecting wire is 0.11 to 0.18 mm.

[0028] Furthermore, the connecting line includes an FPC flexible flat cable.

[0029] Furthermore, the microdisplay chip is electrically connected to the first end of the FPC flexible flat cable via a bonding wire.

[0030] Furthermore, the bonding wire is a gold wire, aluminum wire, copper wire, or alloy wire.

[0031] Furthermore, the microdisplay panel also includes a second substrate, the connector is disposed on the second substrate, the second end of the connecting line is disposed inside the second substrate and electrically connected to the connector, the second substrate has a through hole, the connector control module is disposed on the first surface of the second substrate, and its external interface passes through the through hole and is fixed to a second surface of the second substrate opposite to its first surface, wherein the first surface refers to the surface on the same side as the light-emitting side of the microdisplay chip. Furthermore, the size of the second substrate is smaller than the size of the first substrate and larger than the size of the connector.

[0032] Furthermore, the central axis of the connector coincides with the central axis of the second substrate.

[0033] Furthermore, the central axis of the connector coincides with the central axis of the connecting line.

[0034] Furthermore, the connector and the second substrate are rectangular in shape.

[0035] Furthermore, the width of the second end of the connecting line is less than the length of the first side of the second substrate and not greater than the length of the first side of the connector, wherein the first side refers to the side closer to the microdisplay chip.

[0036] Furthermore, the first side of the connector has a third distance from the first side of the second substrate, wherein the third distance is 0.12 to 0.5 mm.

[0037] Furthermore, the second side of the connector opposite to its first side has a fourth spacing with the second side of the second substrate, wherein the fourth spacing is 0.12 to 0.5 mm.

[0038] Furthermore, the distance between the side of the connector and the side of the second substrate has a fifth spacing, wherein the fifth spacing is 0.15 to 1.0 mm, and wherein the side of the connector refers to the two sides perpendicular to its first side.

[0039] Furthermore, the direction of the external interface is parallel to the main body of the connecting line.

[0040] Furthermore, the external interface includes gold fingers, metal contacts, pins, or metal plates.

[0041] Furthermore, the external interface supports MIPI or QSPI communication protocols.

[0042] Furthermore, the thickness of the first substrate is 0.27 to 0.33 mm, and the thickness of the second substrate is 0.3 to 0.53 mm.

[0043] Furthermore, the first substrate and / or the second substrate are copper substrates, Invar steel substrates, or ceramic substrates.

[0044] Furthermore, the packaging structure also includes:

[0045] A light-transmitting protective layer is disposed on the light-emitting side of the microdisplay chip and at least covers the light-emitting area.

[0046] Furthermore, each side of the light-transmitting protective layer does not extend beyond the edge of the microdisplay chip.

[0047] Furthermore, the material of the light-transmitting protective layer is glass, silicon dioxide, or magnesium fluoride.

[0048] Furthermore, the light-transmitting protective layer is bonded to the surface of the microdisplay chip using adhesive.

[0049] Furthermore, there is a gap between the light-transmitting protective layer and the microdisplay chip.

[0050] Furthermore, the packaging structure also includes:

[0051] A protective adhesive is applied at the edge of the light-transmitting protective layer, surrounding the light-emitting area.

[0052] Furthermore, the protective adhesive is made of an opaque material.

[0053] Furthermore, the shape of the protective adhesive is adapted to the light-emitting area.

[0054] Furthermore, the packaging structure also includes:

[0055] A bonding wire protective adhesive is disposed at the first end of the first substrate and covers the bonding wire.

[0056] Furthermore, the width of the bonding wire protective adhesive is equal to the width of the first end of the connecting wire.

[0057] Furthermore, the surface of the bonding wire protective adhesive is not lower than the surface of the microdisplay chip.

[0058] Furthermore, the surface of the bonding wire protective adhesive is not higher than the surface of the light-transmitting protective layer.

[0059] Furthermore, the bonding wire protective adhesive is made of epoxy resin, silicone, or ethylene-vinyl acetate copolymer and polyimide.

[0060] Based on the microdisplay panel described above, a second aspect of this utility model provides a display device that includes the microdisplay panel described above.

[0061] This utility model provides a micro-display panel and display device, which modularly designs components such as the micro-display chip, connector, and substrate, improving packaging flexibility and facilitating replacement and maintenance. The micro-display chip and connector are electrically connected via FPC flexible flat cables, effectively improving space utilization. Attached Figure Description

[0062] To further illustrate the above and other advantages and features of the various embodiments of the present invention, a more specific description of the various embodiments of the present invention will be presented with reference to the accompanying drawings. It is understood that these drawings depict only typical embodiments of the present invention and are therefore not intended to limit its scope. In the drawings, for clarity, the same or corresponding parts will be indicated by the same or similar reference numerals.

[0063] Figure 1 This diagram illustrates the structure of a micro-display panel according to an embodiment of the present invention.

[0064] Figure 2 This is a schematic front view of a micro-display panel according to an embodiment of the present invention;

[0065] Figure 3 This diagram shows a cross-sectional view of a micro-display panel along line AA according to an embodiment of the present invention.

[0066] Figure 4 This diagram shows a cross-sectional view of a micro-display panel along line AA, according to yet another embodiment of the present invention.

[0067] Figure 5 This diagram shows a front view of a micro-display panel according to another embodiment of the present invention; and

[0068] Figure 6 This is a schematic rear view of a micro-display panel according to an embodiment of the present invention. Detailed Implementation

[0069] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that the components in the drawings may be shown exaggeratedly for illustrative purposes and are not necessarily to scale. In the drawings, the same reference numerals are used for components that are identical or have the same function.

[0070] In this invention, unless otherwise specified, "arranged on," "arranged above," and "arranged on top of" do not exclude the possibility of an intermediate element between them. Furthermore, "arranged on or above" merely indicates the relative positional relationship between two components, and in certain cases, such as when the product orientation is reversed, it can also be converted to "arranged below or under," and vice versa.

[0071] In this utility model, the various embodiments are merely intended to illustrate the solution of this utility model and should not be construed as limiting.

[0072] In this utility model, unless otherwise specified, the quantifiers “one” and “one” do not exclude scenarios involving multiple elements.

[0073] It should also be noted that in the embodiments of this utility model, only a portion of the parts or components may be shown for clarity and simplicity. However, those skilled in the art will understand that, under the teachings of this utility model, the required parts or components can be added according to the specific scenario.

[0074] It should also be noted that within the scope of this utility model, the terms "same," "equal," and "equal to" do not mean that the two values ​​are absolutely equal, but rather allow for a certain reasonable error. That is to say, the terms also cover "substantially the same," "substantially equal," and "substantially equal to." Similarly, in this utility model, the terms indicating direction, such as "perpendicular to" and "parallel to," also cover the meaning of "substantially perpendicular to" and "substantially parallel to."

[0075] In this invention, the first surface of each device and module refers to the surface on the same side as the light-emitting side of the microdisplay chip, and the second surface is the surface on the side opposite to the first surface.

[0076] To improve space utilization, this utility model provides a micro-display panel. The technical solution of this utility model will be further described below with reference to the accompanying drawings of the embodiments.

[0077] Figure 1 This diagram illustrates the structure of a micro-display panel according to one embodiment of the present invention. Figure 1As shown, a microdisplay panel includes a first substrate 101, a microdisplay chip 102, connecting lines 103, and a connector 104. The microdisplay chip 102 is disposed on the surface of the first substrate 101 and is electrically connected to the connector 104 via the connecting lines 103. The connector 104 can be used to connect to external compatible devices. For example... Figure 1 As shown, the connecting line 103 includes a first end, a body, and a second end opposite to the first end. The microdisplay chip 102 is electrically connected to the first end of the connecting line 103, and the connector 104 is electrically connected to the second end of the connecting line 103. In some embodiments, the first end of the connecting line 103 is disposed at a first edge of a first surface of a first substrate 101, wherein the first edge refers to the edge of the substrate closer to the connector 104.

[0078] Figure 2 This diagram shows a front view of a micro-display panel according to an embodiment of the present invention. Figure 2 As shown, in some embodiments, the central axis of the microdisplay chip 102 coincides with the central axis of the first substrate 101, and the central axis of the microdisplay chip 102 also coincides with the central axis of the first end of the connecting line 103. In some embodiments, the size of the first substrate 101 is larger than the size of the microdisplay chip 102. The shapes of the first substrate 101 and the microdisplay chip 102 are not limited, and can be circular, rectangular, polygonal, or irregular shapes. In the embodiment shown in the figure, both the first substrate 101 and the microdisplay chip 102 are rectangular. The size of the microdisplay chip 102 is smaller than that of the first substrate 101, that is, in some embodiments, there is a certain distance between each side of the microdisplay chip 102 and each side of the first substrate 101. Specifically, there is a first distance between the second side of the microdisplay chip 102 and the second side of the first substrate 101. There is a second distance between the side of the microdisplay chip 102 and the side of the first substrate 101. The size of the first substrate 101 should not be too large. While ensuring display quality, the package size should be as small as possible to improve product layout compactness. Based on this, in some embodiments, the side length of the first substrate 101 is 6.26 to 7.38 mm, the length of the first and second sides is 5.07 to 6.07 mm, the first pitch is 0.32 to 1.57 mm, and the second pitch is 0.63 to 0.99 mm. The second side of the first substrate 101 and the microdisplay chip 102 refers to the side perpendicular to the central axis and close to the connector 104, while the first side refers to the side opposite to the second side, and the side refers to the two sides perpendicular to its first and second sides.

[0079] In some embodiments, the width of the first end of the connecting line 103 is less than the length of the first side of the first substrate 101, but not less than the length of the first side of the microdisplay chip 102. In some embodiments, the first side of the microdisplay chip 102 is parallel to the edge of the first end of the connecting line 103, but with a gap between them.

[0080] Figure 3 This diagram shows a cross-sectional view along line AA of a micro-display panel according to an embodiment of the present invention. Figure 3 As shown, in some embodiments, the microdisplay chip 102 is bonded to the first surface of the first substrate 101 by means such as chip adhesive 105. The chip adhesive 105 may be, for example, a die-bonding adhesive or a die-bonding film. The microdisplay chip 102 includes a light-emitting region 121 and a non-light-emitting region, which are formed on a driving backplane, with the non-light-emitting region surrounding the light-emitting region 121. In some embodiments, the shape of the light-emitting region 121 is square, circular, rectangular, polygonal, or irregular.

[0081] The light-emitting region 121 includes a micro-LED array, which comprises multiple micro-LEDs, each of which forms at least a portion of a pixel element on the microdisplay chip. The micro-LED structures are formed in an array within the microdisplay chip, with resolutions such as 720*480, 640*480, 1920*1080, 1280*720, 2K, or 4K. The diameter of the micro-LED structures is in the nanometer range, for example, 20nm to 100nm. In some embodiments, the spacing of the micro-LED array, i.e., the minimum center-to-center distance between the micro-LEDs, can be between approximately 2 micrometers and approximately 50 micrometers. In some embodiments, the number of pixels on the micro-LED chip can be between thousands and millions. In some embodiments, the size of the light-emitting region of the microdisplay chip is 2.64*2 millimeters.

[0082] In some embodiments, the micro-LED array may include a single-layer micro-LED structure. In some embodiments, the micro-LED array may include a multi-layer vertically stacked micro-LED structure.

[0083] In some embodiments, a driving backplane may be electrically connected to each microLED in the microLED array via a separate metal interconnect. In some embodiments, each microLED may be electrically controlled individually by the driving backplane. In some embodiments, the driving backplane may be electrically connected to the electrodes of the microLED chip via a metal interconnect. In some embodiments, a dielectric layer may be formed in the gaps between the microLEDs. In some embodiments, a dielectric layer may also be formed in the gaps between the interconnects.

[0084] In some embodiments, each micro-LED in the micro-LED array may include a light-emitting mesa. In some embodiments, the light-emitting mesa may include, from bottom to top, a first type epitaxial layer, a light-emitting layer, and a second type epitaxial layer. That is, in the three-layer structure, the first type epitaxial layer is closest to the driving backplane; the light-emitting layer is located above the first type epitaxial layer and further away from the driving backplane; and the second type epitaxial layer is located above the light-emitting layer and furthest away from the driving backplane. In some embodiments, the light-emitting layer is formed of multiple stacked quantum well layers, particularly superlattice stacked quantum well layers. Preferably, the superlattice stacked quantum well layers include multiple pairs of quantum well layers stacked with quantum barrier layers. In some embodiments, the quantum well layers are InGaN / GaN multiple quantum well layers, InGaN / AlGaN multiple quantum well layers, or InGaAs / AlGaAs multiple quantum well layers. In some embodiments, the light-emitting layer further includes an electron blocking layer disposed on a first side of the light-emitting layer, wherein the first side refers to the side along which electrons migrate out of the light-emitting layer.

[0085] In some embodiments, the first type of epitaxial layer is a semiconductor material having a first conductivity type and includes multiple semiconductor layers. The primary substrate material of the first type of epitaxial layer may be, but is not limited to, Ga, N, As, P, In, and includes, but is not limited to, waveguide layers, confinement layers, transition layers, and window layers; furthermore, an ohmic contact layer may be formed below the window layer. In some embodiments, the second type of epitaxial layer is a semiconductor material having a second conductivity type and includes multiple semiconductor layers. The primary substrate material of the second type of epitaxial layer may be, but is not limited to, composed of at least two or more elements selected from Ga, N, As, P, In, and Al. Furthermore, the first type of epitaxial layer may, from top to bottom, include, but is not limited to, a confinement layer and a waveguide layer; furthermore, in some embodiments, an ohmic contact layer may be formed on the confinement layer. In some embodiments, the first type of epitaxial layer is an N-type GaN layer or an N-type AlGaN layer, and the second type of epitaxial layer is a P-type GaN layer or a P-type AlGaN layer. That is, the material of the second type of epitaxial layer can be a material layer of a second conductivity type comprising at least two or more elements of Ga, N, As, Al, In, and P, and the first type of epitaxial layer can be a material layer of a first conductivity type comprising at least two or more elements of Ga, N, As, Al, In, and P. In some embodiments, the first type of epitaxial layer can also be a P-type GaN layer or a P-type AlGaN layer, and the second type of epitaxial layer can be an N-type GaN layer or an N-type AlGaN layer. In embodiments of this invention, the light-emitting mesa is stepped or trapezoidal.

[0086] In some embodiments, a top conductive layer may be formed on the top surface of the micro-LED array. In some embodiments, the top conductive layer may be shared by all the micro-LEDs in the micro-LED array. In some embodiments, the top conductive layer is disposed above the micro-LED array and contacts and covers the top of each light-emitting mesa, making electrical contact with the second type epitaxial layer of the light-emitting mesa, so as to connect the second type epitaxial layers of each light-emitting mesa in series. In some embodiments, the top conductive layer is a transparent conductive layer.

[0087] In some embodiments, the micro-LED array further includes a passivation barrier layer. The passivation barrier layer covers the surface and sides of the light-emitting mesa, but exposes at least a portion of the surface of the second type epitaxial layer, and a top conductive layer is disposed on the surface of the passivation barrier layer. In some embodiments, the passivation barrier layer may be formed by CVD deposition of SiO2 or ALD deposition of Al2O3 film to effectively reduce chip leakage current. In some embodiments, the passivation barrier layer only covers the sides of the light-emitting mesa, not the top surface, and the highest point of the passivation barrier layer is flush with the top surface of the light-emitting mesa. In these embodiments, the continuous top conductive layer covering the top of the light-emitting mesa is horizontal or substantially horizontal. In some embodiments of this invention, the passivation barrier layer not only covers the sides of the light-emitting mesa but also covers the top edge portion of the light-emitting mesa, resulting in a protrusion at the top edge of the light-emitting mesa, thereby causing the continuous top conductive layer covering it to also form a protrusion at the top edge of the light-emitting mesa.

[0088] As previously described, there are partitions between the pixels formed by each light-emitting mesa, and a second electrode is disposed at each partition, with the second electrode located on the surface of the top conductive layer. In some embodiments, the second electrode is a ring-shaped reflective electrode, disposed around the light-emitting mesa, formed by magnetron sputtering or vapor deposition, and its material can be, for example, Al or Al alloy metal for the sidewall reflective mirror, and the electrode stack metal can be Ni, Al, Ti, Ni, Pt, Au, or other metal materials. In some embodiments, the second electrodes are interconnected. In some embodiments of this invention, a deep trench is provided at the partition between two adjacent light-emitting mesa, the deep trench penetrating the micro-light-emitting diode array, and the second electrode is disposed at the deep trench. In some embodiments, a deep trench is not provided at the partition between two adjacent light-emitting mesa, but a passivation isolation layer and a top conductive layer are directly formed. Therefore, the surface of the top conductive layer between two adjacent light-emitting mesa is a horizontal or substantially horizontal plane, where the second electrode is formed, and its morphological interface is trapezoidal or approximately trapezoidal. This trapezoid can be either a regular trapezoid or an inverted trapezoid, and the surface of the second electrode is not higher than the highest point of the continuous top conductive layer.

[0089] In some embodiments, the micro-LED array is bonded to a driving backplane via a metal bonding layer and electrically connected to IC copper pillars on the driving backplane. In some embodiments, the IC copper pillars include a first IC copper pillar and a second IC copper pillar, wherein the first IC copper pillar is electrically connected to a first epitaxial layer of the light-emitting mesa. The second IC copper pillar is electrically connected to a first electrode. In some embodiments, the polarity of the first electrode is opposite to that of the second electrode. In some embodiments, each semiconductor light-emitting module has a common first electrode. The first electrode may be, for example, a P-electrode or an anode electrode, and the second electrode may be an electrode with the opposite polarity to the first electrode, such as an N-electrode or a cathode electrode. In some embodiments, the first and second electrodes and their connecting components may be made of materials such as graphene, ITO, aluminum-doped zinc oxide (AZO), or fluorine-doped tin oxide (FTO), or any combination of the above materials. In some examples, the first and second electrodes and their connecting components may be made of non-transparent or transparent conductive materials, such as indium tin oxide (ITO).

[0090] In some embodiments, the light-emitting region further includes a microlens array. The microlens array is disposed above the micro-light-emitting diode array, wherein at least one microlens is disposed on the surface of the conductive layer on top of the micro-light-emitting diode, and the horizontal profile of the microlens is larger than the maximum horizontal profile of the micro-light-emitting diode. The microlenses are mainly used to converge and / or collimate light rays; for example, the focal point of the microlens can be located in the light-emitting mesa of the micro-light-emitting diode by adjusting parameters such as the thickness and curvature of the microlens. In some embodiments, the microlenses of the microlens array correspond one-to-one with the light-emitting mesa.

[0091] In some embodiments, the non-light-emitting region includes a metal layer that sequentially comprises a continuous metal region and a plurality of metal pads in the direction from the light-emitting region toward the chip edge. The continuous metal region is connected to the light-emitting region 121, and the plurality of metal pads form a one-dimensional or two-dimensional array in each direction around the continuous metal region. In some embodiments, the metal pads are disposed at the first edge of the microdisplay chip 102 and are used for wire bonding; that is, the metal pads are electrically connected to the first end of the connecting line 103 via bonding wires 106. The bonding wires 106 may be, for example, gold wires, aluminum wires, copper wires, or alloy wires.

[0092] like Figure 3 As shown, in some embodiments, to prevent damage to the bonding wire 106, a bonding wire protective adhesive 161 is also provided, which is disposed at the first end of the first substrate 101 and covers the bonding wire 106. Figure 3As shown, in some embodiments, a portion of the bonding wire protective adhesive 161 is located on the surface of the microdisplay chip 102, and a portion is located on the surface of the first end of the connecting line 103. Furthermore, in some embodiments, a gap exists between the microdisplay chip 102 and the first end of the connecting line 103; therefore, a portion of the bonding wire protective adhesive 161 is also located on the first substrate 101. In some embodiments, the width of the bonding wire protective adhesive 161 is equal to the width of the first end of the connecting line 103, and the surface of the bonding wire protective adhesive 161 is not lower than the surface of the microdisplay chip 102. In some embodiments, the distance between the edge of the bonding wire protective adhesive 161 and the side edge of the first substrate 101 is 0.34 to 0.64 mm. In some embodiments, the bonding wire protective adhesive 161 may be, for example, epoxy resin, silicone, ethylene-vinyl acetate copolymer, or polyimide.

[0093] To better protect the active area of ​​the microdisplay chip 102, namely its light-emitting area 121, from external damage, such as... Figure 3 As shown, in some embodiments, a light-transmitting protective layer 107 is further disposed above the microdisplay chip 102. The light-transmitting protective layer 107 is disposed above the light-emitting side of the microdisplay chip 102 and at least covers the light-emitting area 121. In some embodiments, the size of the light-transmitting protective layer 107 is smaller than that of the non-display chip 102, that is, each side of the light-transmitting protective layer 107 does not extend beyond the edge of the microdisplay chip 102. In some embodiments, the material of the light-transmitting protective layer 107 is a transparent material such as glass, silicon dioxide, or magnesium fluoride. Based on this, the light-transmitting protective layer 107 is bonded to the surface of the microdisplay chip 102 by an adhesive 171. In some embodiments, there is a gap between the light-transmitting protective layer 107 and the microdisplay chip 102. Based on this, in some embodiments, the adhesive 171 further contains solid particles, which can provide support for the light-transmitting protective layer 107 after the adhesive 171 is cured. In some embodiments, when a light-transmitting protective layer 107 is provided, the surface of the bonding wire protective adhesive 161 is flush with or lower than the surface of the light-transmitting protective layer 107.

[0094] To protect the edges of the light-transmitting protective layer 107 and prevent reflections in the non-light-emitting area 122, thus avoiding ghosting in the final image, in some embodiments, a protective adhesive 172 is provided at the edges of the light-transmitting protective layer 107, such as... Figure 1 As shown, the protective adhesive 172 is shaped to fit the light-emitting area 121 and is disposed around the light-emitting area 121. It is made of an opaque material, such as photoresist, gray adhesive, inorganic anti-reflective material, or black inorganic material. In some embodiments, the side width of the protective adhesive is 0.52 to 0.58 mm, and the width of its second side is 0.62 to 0.68 mm. Figure 4This diagram shows a cross-sectional view of a micro-display panel along line AA, according to yet another embodiment of the present invention. Figure 4 The micro display panel shown is Figure 3 The difference in the microdisplay panel shown is that it does not have a light-transmitting protective layer. Therefore, to prevent reflections from the non-light-emitting area 122, the protective adhesive 172 is directly formed on the surface of the microdisplay chip 102, as shown in the front view. Figure 5 As shown.

[0095] Back Figure 1 and Figure 2 In some embodiments, the width of the main body of the connecting line 103 is smaller than that of its first end, and the width of its second end is equal to the width of the main body. In some embodiments, the width of the main body of the connecting line 103 is 3.45 to 3.55 mm. Furthermore, in some embodiments, the main body of the connecting line 103 has a gradually changing width transition connection between it and its first end, which helps to alleviate stress concentration and improve the reliability of the package. In some embodiments, the connecting line 103 is a flexible connecting line, which can be bent and folded according to the spatial shape, allowing the micro-display panel to better adapt to complex spatial environments, achieve a compact layout, and effectively save space. In some embodiments, the connecting line 103 is an FPC flexible flat cable, which can be bent as needed, improving the space utilization rate inside the package. In some embodiments, the thickness of the FPC flexible flat cable is 0.11 to 0.18 mm.

[0096] like Figure 1 and Figure 2 As shown, connector 104 is disposed on the second substrate 108, and includes control module 141 and external interface 142. Control module 141 is used to realize communication control between micro display chip 102 and external device, and external interface 142 is used to connect with external compatible devices. Figure 6 This diagram shows a rear view of a micro-display panel according to one embodiment of the present invention. Figure 6 As shown, a through hole is provided on the second substrate 108, the control module 141 is disposed on the first surface of the second substrate 108, and the external interface 142 passes through the through hole and is fixed to the second surface of the second substrate 108 opposite to its first surface. Figure 5 As shown, the external interface 142 is oriented parallel to the main body of the connecting cable 103. In some embodiments, the external interface 142 may include gold fingers, metal contacts, pins, or metal tabs. In some embodiments, the external interface 142 supports MIPI or QSPI transmission protocols.

[0097] like Figure 1 and Figure 2As shown, the size of the second substrate 108 is smaller than that of the first substrate 101, but larger than that of the connector 104. Simultaneously, the central axis of the connector 104 coincides with the central axis of the second substrate 108, and also with the central axis of the second end of the connecting line 103. In some embodiments, the side length of the second substrate 108 is 5.4 to 6.1 mm, and the side lengths perpendicular to the side are 3.9 to 5.2 mm.

[0098] In some embodiments, the connector 104 and the second substrate 108 are rectangular in shape. The width of the second end of the connecting line 103 is less than the length of the first side of the second substrate 108 and not greater than the length of the first side of the connector 104, wherein the first side refers to the side closer to the microdisplay chip 102. In some embodiments, the size of the connector 104 is smaller than that of the second substrate 108, i.e., the first side of the connector 104 and the first side of the second substrate 108 have a third spacing, wherein the third spacing is 0.12 to 0.5 mm. The second side of the connector 104 opposite to its first side and the second side of the second substrate 108 have a fourth spacing, wherein the fourth spacing is 0.12 to 0.5 mm, and the distance between the side of the connector 104 and the side of the second substrate 108 has a fifth spacing, wherein the fifth spacing is 0.15 to 1.0 mm, wherein the side of the connector refers to the two sides perpendicular to its first side.

[0099] In some embodiments, the first substrate 101 and / or the second substrate 108 are copper substrates, Invar steel substrates, or ceramic substrates, etc., the thickness of the first substrate 101 is 0.27 to 0.33 mm, and the thickness of the second substrate 108 is 0.3 to 0.53 mm.

[0100] In some embodiments, at least one through-hole for heat dissipation may be provided on the first substrate 101, the second substrate 108, and the connector 104. The through-hole may include multiple through-holes, which may be located, for example, on the central axis of the first substrate 101 and / or the second substrate 108, or symmetrically distributed with respect to its central axis, or located on the housing of the connector. In some embodiments, the through-hole is circular, and its diameter is 1 to 1.05 mm.

[0101] This utility model also provides a display device, which includes the micro display panel as described above.

[0102] Although various embodiments of the present invention have been described above, it should be understood that they are presented by way of example only and not as limitations. It will be apparent to those skilled in the art that various combinations, modifications, and alterations can be made without departing from the spirit and scope of the present invention. Therefore, the breadth and scope of the present invention disclosed herein should not be limited by the exemplary embodiments disclosed above, but should be defined solely by the appended claims and their equivalents.

Claims

1. A micro-display panel, characterized in that, include: Micro display chip; A connecting line includes a body, a first end, and a second end opposite to the first end, wherein the first end is electrically connected to the microdisplay chip; as well as A connector electrically connected to the second end of the connecting line, the connector including a control module and an external interface, the connector being configured to connect to external compatible devices.

2. The micro-display panel as described in claim 1, characterized in that, It also includes a first substrate, wherein the microdisplay chip is disposed on the surface of the first substrate, and the central axis of the microdisplay chip coincides with the central axis of the first substrate, and the central axis of the microdisplay chip coincides with the central axis of the first end of the connecting line.

3. The micro-display panel as described in claim 2, characterized in that, The first end of the connecting line is disposed at the first edge of the first surface of the first substrate, wherein the first edge refers to the edge near the connector, and the first edge of the microdisplay chip is parallel to the edge of the first end of the connecting line but with a gap.

4. The micro-display panel as described in claim 2, characterized in that, The size of the first substrate is greater than or equal to the size of the microdisplay chip.

5. The micro-display panel as described in claim 2, characterized in that, The first substrate and the microdisplay chip are rectangular. The side length of the first substrate is 6.26 to 7.38 mm, and the length of the first side is 5.07 to 6.07 mm. The second side of the microdisplay chip opposite to its first side has a first gap with the second side of the first substrate, wherein the first gap is 0.32 to 1.57 mm. The side of the microdisplay chip has a second gap with the side of the first substrate, wherein the second gap is 0.63 to 0.99 mm. The side of the microdisplay chip refers to the two sides perpendicular to its first side.

6. The micro-display panel as described in claim 5, characterized in that, The width of the first end of the connecting line is less than the length of the first side of the first substrate and not less than the length of the first side of the microdisplay chip, wherein the connecting line is a flexible connecting line.

7. The micro-display panel as described in claim 2, characterized in that, The microdisplay chip is bonded to the surface of the first substrate by a chip adhesive, wherein the chip adhesive includes die bond adhesive or die bond film.

8. The micro-display panel as described in claim 1, characterized in that, The microdisplay chip includes a light-emitting area and a non-light-emitting area. The non-light-emitting area near the connector includes at least one metal pad. A first end of the connecting wire is electrically connected to the metal pad. The light-emitting area can be square, circular, rectangular, or polygonal in shape. The size of the light-emitting area of ​​the microdisplay chip is 2.

64. 2 millimeters.

9. The micro-display panel as claimed in claim 1, characterized in that, The width of the main body of the connecting line is smaller than that of the first end of the connecting line, and the width of the second end of the connecting line is equal to the width of the main body of the connecting line. There is a transition connection portion with gradually changing width between the main body of the connecting line and its first end, and the width of the main body of the connecting line is 3.45 to 3.55 mm.

10. The micro-display panel as claimed in claim 1, characterized in that, The connecting cable includes an FPC flexible flat cable, and the thickness of the connecting cable is 0.11 to 0.18 mm.

11. The micro-display panel as claimed in claim 1, characterized in that, The microdisplay chip is electrically connected to the first end of the connecting wire via a bonding wire, wherein the bonding wire is a gold wire, aluminum wire, copper wire, or alloy wire.

12. The micro-display panel as claimed in claim 2, characterized in that, It also includes a second substrate, the connector is disposed on the second substrate, the second end of the connecting line is disposed inside the second substrate and electrically connected to the connector, the second substrate is provided with a through hole, the control module of the connector is disposed on the first surface of the second substrate, and its external interface passes through the through hole and is fixed to the second surface of the second substrate relative to its first surface, wherein the first surface refers to the surface on the same side as the light-emitting side of the microdisplay chip, and the direction of the external interface is parallel to the main body of the connecting line.

13. The microdisplay panel as described in claim 12, characterized in that, The size of the second substrate is smaller than the size of the first substrate, but larger than the size of the connector; The central axis of the connector coincides with the central axis of the second substrate and also with the central axis of the connecting line.

14. The microdisplay panel as claimed in claim 12, characterized in that, The connector and the second substrate are rectangular in shape. The first side of the connector and the first side of the second substrate have a third distance, wherein the third distance is 0.12 to 0.5 mm. The second side of the connector opposite to its first side and the second side of the second substrate have a fourth distance, wherein the fourth distance is 0.12 to 0.5 mm. The distance between the side of the connector and the side of the second substrate has a fifth distance, wherein the fifth distance is 0.15 to 1.0 mm. The side of the connector refers to the two sides perpendicular to its first side.

15. The microdisplay panel as claimed in claim 14, characterized in that, The width of the second end of the connecting line is less than the length of the first side of the second substrate and not greater than the length of the first side of the connector, wherein the first side refers to the side closer to the microdisplay chip.

16. The micro-display panel as claimed in claim 1, characterized in that, The external interface includes gold fingers, metal contacts, pins, or metal plates, wherein the external interface supports MIPI or QSPI communication protocols.

17. The microdisplay panel as claimed in claim 12, characterized in that, The first substrate and / or the second substrate are copper substrates, Invar steel substrates or ceramic substrates, and the thickness of the first substrate is 0.27 to 0.33 mm, and the thickness of the second substrate is 0.3 to 0.53 mm.

18. The microdisplay panel as claimed in claim 14, characterized in that, Also includes: A light-transmitting protective layer is disposed on the light-emitting side of the microdisplay chip and at least covers the light-emitting area of ​​the microdisplay chip. The light-transmitting protective layer is bonded to the surface of the microdisplay chip by adhesive, but there is a gap between the light-transmitting protective layer and the microdisplay chip, and each side of the light-transmitting protective layer does not extend beyond the edge of the microdisplay chip. The material of the light-transmitting protective layer is glass, silicon dioxide or magnesium fluoride. A protective adhesive is disposed at the edge of the light-transmitting protective layer and surrounding the light-emitting area. The shape of the protective adhesive is adapted to the light-emitting area, and its material is an opaque material. as well as A bonding wire protective adhesive is disposed at the first end of the first substrate and covers the bonding wire. The width of the bonding wire protective adhesive is equal to the width of the first end of the connecting wire, and the surface of the bonding wire protective adhesive is not lower than the surface of the microdisplay chip and not higher than the surface of the light-transmitting protective layer. The bonding wire protective adhesive is made of epoxy resin, silicone, or ethylene-vinyl acetate copolymer and polyimide.

19. A display device, characterized in that, Including the microdisplay panel as described in any one of claims 1 to 18.

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