A microstrip thin-film coupler with a coupling structure
Patent Information
- Application Number
- CN202522239171.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-23
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2035-10-23
AI Technical Summary
[0021]本实用新型提供了一种耦合结构的微带薄膜耦合器,在介质基板上,采用多节平行耦合线级联的结构。第二线段和第三线段上通过增加锯齿带线,从而增大第二线段和第三线段在信号耦合过程中的作用占比,并通过调节锯齿带线的长度、宽度以及相邻锯齿带线的间距和总数量等,最终实现耦合过程的最优平衡,提高耦合平坦度。通过对传统微带薄膜耦合器的耦合结构改进,可以使耦合器的耦合平坦度提高0.1dB以上。
Smart Images

Figure CN224708957U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of coupler design technology, and specifically to a microstrip thin-film coupler with a coupling structure. Background Technology
[0002] Microstrip thin-film couplers are passive devices widely used in modern communication and microwave circuits. They offer advantages such as wide bandwidth, small size, and high directivity, perfectly aligning with the future trend of highly integrated electronic components. Microstrip thin-film couplers typically use alumina or aluminum nitride as the dielectric substrate and employ high-precision metal thin-film fabrication processes to fabricate the circuit layers.
[0003] Microstrip thin-film couplers, with their wide bandwidth, small size, and high directivity, offer significant advantages for signal amplitude modulation in microwave circuits. A typical microstrip thin-film coupler circuit is shown below. Figure 1 As shown, in Figure 1 In a traditional microstrip thin-film coupler, after the signal passes through the a-th transmission line, it is mainly transmitted to the coupling end through the coupling between the b-th transmission lines, and finally output to the through end through the c-th transmission line.
[0004] Traditional microstrip thin-film couplers, used as signal amplitude modulation components, require extremely high precision in signal amplitude modulation during practical applications in microwave circuits, which necessitates high coupling flatness. Achieving high flatness performance has always been a key focus and challenge in the structural design of microstrip thin-film couplers. Therefore, developing a novel coupling structure that not only possesses wide bandwidth, small size, and high directivity but also high flatness is of great significance. Utility Model Content
[0005] To address the shortcomings of existing technologies, this invention aims to provide a microstrip thin-film coupler with a coupling structure. By adding a sawtooth strip to the coupling transmission line and adjusting the matching, the coupling process of the transmitted signal can be made more uniform, thereby improving the coupling flatness of the microstrip thin-film coupler.
[0006] This utility model is achieved through the following technical solution:
[0007] A microstrip thin-film coupler with a coupling structure, comprising:
[0008] Two thin film microstrips are arranged opposite each other on a dielectric substrate. The thin film microstrips include a first line segment located in the middle, and a second line segment and a third line segment respectively connected to the two ends of the first line segment and arranged in the same direction.
[0009] The two first line segments have opposing first sawtooth lines, the two second line segments have opposing second sawtooth lines, and the two third line segments have opposing third sawtooth lines; the first sawtooth lines, the second sawtooth lines, and the third sawtooth lines each have a number of outwardly protruding sawtooths along their own length direction.
[0010] Compared to existing technologies, achieving high flatness performance has always been a key and challenging issue in the structural design of traditional microstrip thin-film couplers. This invention provides a microstrip thin-film coupler with a new coupling structure. By adding serrated lines to the coupling transmission line for matching adjustment, the coupling process of the transmitted signal can be made more uniform, thereby improving the coupling flatness of the microstrip thin-film coupler. Specifically, based on the traditional microstrip thin-film coupler, additional serrated lines are added. For example, in the circuit of a traditional microstrip thin-film coupler, there are two opposing thin-film microstrips. The first segment in the middle of the two microstrips, i.e., the two closest segments, has opposing first serrated lines. At both ends of the first segment, there are parallel second and third segments. This invention adds second and third serrated lines to the second and third segments, respectively. By selectively adding serrated lines to the transmission line, the coupling flatness of the coupler can be improved to a certain extent, and the length of the transmission line can be shortened, reducing the size of the coupler and lowering manufacturing costs. Therefore, this solution aims to overcome the low coupling flatness of traditional microstrip thin-film couplers. This solution employs a cascaded structure of multiple parallel coupling lines on a dielectric substrate. By adding serrated lines to the second and third segments, the role of these segments in the signal coupling process is increased. Furthermore, by adjusting the length, width, spacing, and total number of serrated lines, an optimal balance in the coupling process is achieved, thus improving coupling flatness. This improvement in the coupling structure of traditional microstrip thin-film couplers can increase the coupling flatness by more than 0.1 dB.
[0011] Further optimization involves the shape of the serrations on the first serrated strip line being triangular.
[0012] Further optimization involves another type of sawtooth shape on the first sawtooth strip, where the sawtooth of the first sawtooth strip is square.
[0013] In a further optimization, the serrations of the two first serrated lines are staggered in the opposite direction.
[0014] Further optimization involves the shape of the serrations on the second and third serrated lines, where the serrations on both lines are square.
[0015] Further optimization involves the shape of the serrations on the second and third serrated lines, where the serrations on both lines are triangular.
[0016] With further optimization, the serrations of the second serrated band are aligned one-to-one.
[0017] In a further optimization, the serrations of the third serrated band are aligned one-to-one.
[0018] In a further optimization, one of the thin-film microstrips has an input terminal and a through terminal at its two ends, both of which are connected to an external circuit via gold wire bonding.
[0019] In a further optimization, the other thin-film microstrip has a coupling end and an isolation end at its two ends, both of which are connected to an external circuit via gold wire bonding.
[0020] Compared with the prior art, this utility model has the following advantages and beneficial effects:
[0021] This invention provides a microstrip thin-film coupler with a coupling structure employing a cascaded structure of multiple parallel coupling lines on a dielectric substrate. By adding serrated lines to the second and third lines, the role of the second and third lines in the signal coupling process is increased. Furthermore, by adjusting the length, width, spacing, and total number of serrated lines, an optimal balance in the coupling process is achieved, improving coupling flatness. This improvement in the coupling structure of traditional microstrip thin-film couplers can increase the coupling flatness by more than 0.1 dB. Attached Figure Description
[0022] The accompanying drawings, which are included to provide a further understanding of the embodiments of the present invention and form part of this application, do not constitute a limitation thereof. In the drawings:
[0023] Figure 1 This is a circuit diagram of a traditional microstrip thin-film coupler in the prior art;
[0024] Figure 2 A circuit diagram of the microstrip thin-film coupler provided by this utility model.
[0025] The attached diagram shows the markings and corresponding component names:
[0026] 1-Thin film microstrip, 101-First segment, 102-Second segment, 103-Third segment. Detailed Implementation
[0027] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to those skilled in the art that these specific details are not necessary to implement the present invention. In other embodiments, well-known structures, circuits, materials, or methods are not specifically described in order to avoid obscuring the present invention.
[0028] Throughout this specification, references to "an embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in connection with that embodiment or example is included in at least one embodiment of the present invention. Therefore, the phrases "an embodiment," "an example," "an example," or "an example" appearing in various places throughout the specification do not necessarily refer to the same embodiment or example. Furthermore, specific features, structures, or characteristics can be combined in one or more embodiments or examples in any suitable combination and / or sub-combination. Moreover, those skilled in the art will understand that the illustrations provided herein are for illustrative purposes and are not necessarily drawn to scale. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0029] In the description of this utility model, the terms "front", "rear", "left", "right", "up", "down", "vertical", "horizontal", "high", "low", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this utility model.
[0030] Example 1: This Example 1 provides a microstrip thin-film coupler with a coupling structure, such as... Figure 2 As shown, it includes:
[0031] Two thin film microstrips 1 are arranged opposite each other on a dielectric substrate. The thin film microstrips 1 include a first line segment 101 located in the middle, and a second line segment 102 and a third line segment 103 respectively connected to the two ends of the first line segment 101 and arranged in the same direction.
[0032] The two first line segments 101 have opposing first sawtooth lines, the two second line segments 102 have opposing second sawtooth lines, and the two third line segments 103 have opposing third sawtooth lines; the first sawtooth lines, the second sawtooth lines, and the third sawtooth lines each have a number of outwardly protruding sawtooths along their own length direction.
[0033] Compared to existing technologies, achieving high flatness performance has always been a key and challenging issue in the structural design of traditional microstrip thin-film couplers. This invention provides a microstrip thin-film coupler with a coupling structure. By adding a sawtooth strip to the coupling transmission line and adjusting the matching, the coupling process of the transmitted signal can be made more uniform, thereby improving the coupling flatness of the microstrip thin-film coupler. In this specific solution, a sawtooth strip is added to the traditional microstrip thin-film coupler. For example, in a traditional microstrip thin-film coupler circuit, there are two opposing thin-film microstripes 1. The two closest segments 101 in the middle of the two microstripes 1 each have opposing first sawtooth strips. At both ends of the first segment 101, there are parallel second segments 102 and third segments 103. This solution adds second and third sawtooth strips to the second and third segments 102 and 103, respectively. By selectively adding sawtooth strips to the transmission lines, the coupling flatness of the coupler can be improved, and the length of the transmission lines can be shortened, reducing the size of the coupler and lowering manufacturing costs. Therefore, this solution aims to overcome the low coupling flatness of traditional microstrip thin-film couplers. This solution uses a cascaded structure of multiple parallel coupling lines on the dielectric substrate. By adding serrated strips to the second segment 102 and the third segment 103, the role of the second segment 102 and the third segment 103 in the signal coupling process is increased. Furthermore, by adjusting the length, width, spacing, and total number of adjacent serrated strips, an optimal balance in the coupling process is achieved, improving coupling flatness. This improvement in the coupling structure of a traditional microstrip thin-film coupler can increase the coupling flatness by more than 0.1 dB.
[0034] In this embodiment, the teeth of the two first sawtooth strips are misaligned in the opposite direction.
[0035] In this embodiment, the serrations of the second serrated band are aligned one-to-one.
[0036] In this embodiment, the serrations of the third serrated band are aligned one-to-one.
[0037] In this embodiment, one of the thin-film microstrips 1 has an input terminal and a through terminal at its two ends, and both the input terminal and the through terminal are connected to an external circuit by gold wire bonding.
[0038] In this embodiment, the two ends of another thin-film microstrip 1 are a coupling end and an isolation end, respectively, and both the coupling end and the isolation end are connected to an external circuit by gold wire bonding.
[0039] Example 2: This Example 2 is a further optimization based on Example 1, and provides a shape of the saw teeth on the first saw tooth strip, which is set as follows: the saw teeth of the first saw tooth strip are triangular.
[0040] Example 3: This Example 3 is a further optimization based on Example 1, providing another shape of the saw teeth on the first sawtooth strip, wherein the saw teeth of the first sawtooth strip are square.
[0041] Example 4: This example 4 is a further optimization based on example 1, and provides a shape of the serrations on the second serrated strip and the third serrated strip, wherein the serrations on the second serrated strip and the third serrated strip are both square.
[0042] Example 5: This example 5 is a further optimization based on example 1, providing another shape of the serrations on the second and third serrated lines, where the serrations on both the second and third serrated lines are triangular in shape.
[0043] In summary, the above scheme overcomes the low coupling flatness of traditional microstrip thin-film couplers by employing a cascaded structure of multiple parallel coupling lines on the dielectric substrate. By adding serrated lines to the second and third segments 102 and 103, the role of these segments in the signal coupling process is increased. Furthermore, by adjusting the length, width, spacing, and total number of these serrated lines, an optimal balance in the coupling process is achieved, improving coupling flatness. This improvement in the coupling structure of traditional microstrip thin-film couplers can increase coupling flatness by more than 0.1 dB.
[0044] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.
Claims
1. A microstrip thin-film coupler with a coupling structure, characterized in that, include: Two thin film microstrips (1) are arranged opposite each other on a dielectric substrate. The thin film microstrips (1) include a first line segment (101) located in the middle, and a second line segment (102) and a third line segment (103) respectively connected to the two ends of the first line segment (101) and arranged in the same direction. The two first line segments (101) have opposing first sawtooth lines, the two second line segments (102) have opposing second sawtooth lines, and the two third line segments (103) have opposing third sawtooth lines; the first sawtooth lines, the second sawtooth lines and the third sawtooth lines each have a number of outwardly protruding sawtooths along their own length direction.
2. The microstrip thin-film coupler with a coupling structure according to claim 1, characterized in that, The first sawtooth strip has triangular teeth.
3. A microstrip thin-film coupler with a coupling structure according to claim 1, characterized in that, The first sawtooth strip has square-shaped teeth.
4. A microstrip thin-film coupler with a coupling structure according to claim 1, characterized in that, The two first saw teeth are misaligned in the opposite direction.
5. A microstrip thin-film coupler with a coupling structure according to claim 1, characterized in that, The serrations of the second and third serrations are both square.
6. A microstrip thin-film coupler with a coupling structure according to claim 1, characterized in that, The serrations of the second and third serrations are both triangular in shape.
7. A microstrip thin-film coupler with a coupling structure according to claim 1, characterized in that, The saw teeth of the second sawtooth band are aligned one-to-one.
8. A microstrip thin-film coupler with a coupling structure according to claim 1, characterized in that, The serrations of the third serrated band are aligned one-to-one.
9. A microstrip thin-film coupler with a coupling structure according to claim 1, characterized in that, One of the thin-film microstrips (1) has an input terminal and a through terminal at its two ends, and both the input terminal and the through terminal are connected to an external circuit by gold wire bonding.
10. A microstrip thin-film coupler with a coupling structure according to claim 9, characterized in that, The other thin-film microstrip (1) has a coupling end and an isolation end at its two ends, respectively, and both the coupling end and the isolation end are connected to the external circuit by gold wire bonding.