A 1-to-8 power divider suitable for L-band antennas

Abstract

This application relates to the field of power divider technology, and particularly to an 8-to-1 power divider suitable for L-band antennas, comprising: a substrate, on which a first-stage power divider network, a second-stage power divider network, and a third-stage power divider network are cascaded in sequence. The first-stage power divider network splits the input signal into two paths, the second-stage power divider network splits the output signal of the first-stage power divider network into four paths, and the third-stage power divider network splits the output signal of the second-stage power divider network into eight paths. The input terminal of the first-stage power divider network is located on one long side of the substrate, and seven of the eight output terminals of the third-stage power divider network are located on the other long side of the substrate, with the remaining output terminal located on one short side of the substrate. This arrangement also ensures that the eight output signals have phase consistency when they reach their respective ports, thereby guaranteeing the beam pointing accuracy of the antenna array, suppressing the rise of sidelobe levels, and improving the performance of the entire system.

Description

Technical Field

[0001] This application relates to the field of power divider technology, and in particular to a 1-to-8 power divider suitable for L-band antennas. Background Technology

[0002] Power dividers are key passive components in radio frequency and microwave systems. Their function is to distribute a single input signal into multiple output signals according to specific amplitude and phase relationships, or to combine multiple signals into a single output signal. With the rapid development of modern wireless communication, radar, and satellite navigation systems, the demand for multi-channel, high-performance antenna arrays is increasing. In particular, L-band systems, such as GPS, BeiDou satellite navigation, and aerospace communications, are widely used due to their good penetration and moderate antenna size. However, these L-band antenna systems often require driving antenna arrays, and traditional antenna arrays cannot be well adapted to L-band antenna systems, often resulting in poor phase consistency and phase delay. This affects the beam pointing accuracy and sidelobe level of the antenna array, reducing system performance. Utility Model Content

[0003] This application aims to at least partially address one of the aforementioned technical problems in the prior art. To this end, embodiments of this application provide a 1-to-8 power divider suitable for L-band antennas, which can achieve better compatibility with L-band antenna systems and better phase consistency.

[0004] A 1-to-8 power divider suitable for L-band antennas includes: a substrate, on which a first-stage power divider network, a second-stage power divider network, and a third-stage power divider network are cascaded in sequence. The first-stage power divider network is used to divide the input signal into two paths. The second-stage power divider network is used to divide the output signal of the first-stage power divider network into four paths. The third-stage power divider network is used to divide the output signal of the second-stage power divider network into eight paths. The input terminal of the first-stage power divider network is located on one long side of the substrate. Seven of the eight output terminals of the third-stage power divider network are located on the other long side of the substrate, and the remaining output terminal is located on one short side of the substrate.

[0005] In an optional or preferred embodiment, one primary power divider network is provided, two secondary power divider networks are provided, and four tertiary power divider networks are provided. The primary, secondary, and tertiary power divider networks are all of a 1-to-2 splitter structure.

[0006] In optional or preferred embodiments, the first-level power divider network, the second-level power divider network, and the third-level power divider network are all copper-clad lines disposed on the substrate.

[0007] In optional or preferred embodiments, the copper thickness of the first-level power divider network, the second-level power divider network, and the third-level power divider network is all 0.035 mm.

[0008] In an optional or preferred embodiment, the substrate is an Arlon AD255A type substrate.

[0009] Based on the above technical solution, the embodiments of this application have at least the following beneficial effects: When the input signal enters the power divider, it first undergoes a one-to-two equal power distribution through a first-level power divider network to obtain two radio frequency signals with the same amplitude and phase. The second-level power divider network also adopts a one-to-two form, thereby outputting four equal amplitude signals at this layer. Each signal from the second-level power divider network is then input to the corresponding third-level power divider network. After passing through the third-level power divider network, the input signal is distributed into eight independent output signals. Seven of the eight output terminals of the third-level power divider network are located on the other long side of the substrate, and the remaining output terminal is located on one short side of the substrate. This asymmetrical layout allows the power divider of this application to be adapted to the structure of the L-band antenna array. In practical applications, this layout can more flexibly adapt to the spatial arrangement of antenna array elements. Especially when the power divider needs to be installed in a specific position of the antenna array or needs to bypass other components, the output end on the short side provides valuable wiring flexibility. This setting can also ensure that the eight output signals have phase consistency when they arrive at their respective ports, thereby ensuring the beam pointing accuracy of the antenna array, suppressing the rise of sidelobe levels, and improving the performance of the entire system. Attached Figure Description

[0010] The present application will be further described below with reference to the accompanying drawings and embodiments; Figure 1 This is a schematic diagram of the 1-to-8 power divider that uses an L-band antenna in this application.

[0011] Figure label: 100 - Level 1 power divider network; 200 - Level 2 power divider network; 300 - Level 3 power divider network; 400 - Substrate. Detailed Implementation

[0012] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0013] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0014] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0015] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0016] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0017] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0018] Power dividers are key passive components in radio frequency and microwave systems. Their function is to distribute a single input signal into multiple output signals according to specific amplitude and phase relationships, or to combine multiple signals into a single output. With the rapid development of modern wireless communication, radar, and satellite navigation systems, the demand for multi-channel, high-performance antenna arrays is increasing. In particular, L-band systems, such as GPS, BeiDou satellite navigation, and aerospace communications, are widely used due to their good penetration and moderate antenna size. However, these L-band antenna systems often require driving antenna arrays, and traditional antenna arrays cannot be well adapted to L-band antenna systems, often resulting in poor phase consistency and phase delay. This affects the beam pointing accuracy and sidelobe level of the antenna array, reducing system performance.

[0019] Reference Figure 1 This application provides a 1-to-8 power divider suitable for L-band antennas, comprising: a substrate 400, on which a first-stage power divider network 100, a second-stage power divider network 200, and a third-stage power divider network 300 are cascaded in sequence. The first-stage power divider network 100 is used to divide the input signal into two paths, the second-stage power divider network 200 is used to divide the output signal of the first-stage power divider network into four paths, and the third-stage power divider network 300 is used to divide the output signal of the second-stage power divider network 200 into eight paths. The input terminal of the first-stage power divider network 100 is located on one long side of the substrate 400, and the input terminal is connected to an external signal source through an RF input port. Seven of the eight output terminals of the third-stage power divider network 300 are located on the other long side of the substrate 400, and the remaining one output terminal is located on one short side of the substrate 400.

[0020] The first-level power divider network 100, the second-level power divider network 200, and the third-level power divider network 300 in this application all adopt a one-to-two structure. This modular design ensures the regularity and scalability of signal distribution from single-channel to multi-channel.

[0021] The RF input signal first enters the input terminal of the first-stage power divider network located on the long side of substrate 400. After entering the power divider, the first-stage power divider network first achieves equal power distribution (one-to-two), resulting in two RF signals with the same amplitude and phase. This first-stage power divider network can adopt a microstrip one-to-two power divider structure, achieving low reflection coefficient and good isolation through reasonable linewidth and impedance matching section design. The two output terminals of the first-stage power divider network are connected to the input terminals of the second-stage power divider network 200. The second-stage power divider network 200 also adopts a one-to-two form, and the output terminals of each network can achieve further uniform signal distribution, thus outputting four equal-amplitude signals at this layer. By introducing a symmetrically distributed microstrip line structure in the second-stage power divider network 200, the phase consistency of each output signal can be effectively maintained, and coupling interference can be reduced. Each signal from the second-stage power divider network 200 is then input to the corresponding third-stage power divider network 300. The three-stage power divider network 300 is also a 1-to-2 microstrip power divider structure. Its design maintains the same impedance characteristics and transmission constant as the previous two stages, thereby ensuring the continuity and matching of the entire power divider link. After passing through the three-stage power divider network 300, the input signal is distributed into eight independent output signals.

[0022] In terms of output terminal arrangement, seven of the eight output terminals of the three-stage power divider network 300 are located on the other long side of the substrate 400, and the remaining output terminal is located on one short side of the substrate 400. Specifically, in the embodiments of this application, seven of the eight output terminals are located on the upper long side of the substrate 400, and the remaining output terminal is located in the middle of the right short side of the substrate 400. This asymmetrical layout allows the power divider of this application to be adapted to the structure of the L-band antenna array.

[0023] In practical applications, this layout offers greater flexibility in adapting to the spatial arrangement of antenna elements. This is particularly beneficial when the power divider needs to be installed in a specific location on the antenna array or bypass other components, as the outputs on the shorter side provide valuable wiring flexibility. More importantly, this configuration ensures phase consistency of the eight output signals arriving at their respective ports, thereby guaranteeing the beam pointing accuracy of the antenna array, suppressing sidelobe level rise, and improving the overall system performance.

[0024] In terms of specific structure, one primary power divider network is set up, two secondary power divider networks (200) are set up, and four tertiary power divider networks (300) are set up. Each level of power divider network is a 1-to-2 structure. This hierarchical structure forms a step-by-step distribution system during the signal distribution process, achieving a total output of 1 to 8 through equal power distribution at each level.

[0025] In addition, the copper thickness of each power divider network is 0.035 mm.

[0026] In terms of manufacturing, the substrate 400 is preferably made of Arlon AD255A material. The substrate 400 is typically rectangular in shape, providing a regular platform for the layout of the power divider network.

[0027] The primary, secondary, and tertiary power distribution networks 300 are all fabricated on the surface of the Arlon AD255A substrate 400 using copper-clad lines of a specific thickness. These copper-clad lines constitute microstrip lines that enable power distribution and are formed on the surface of the substrate 400 using microstrip fabrication technology.

[0028] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application.

Claims

1. A 1-to-8 power divider suitable for L-band antennas, characterized in that, include: A substrate is provided with a first-stage power divider network, a second-stage power divider network, and a third-stage power divider network cascaded on the substrate. The first-stage power divider network is used to split the input signal into two paths. The second-stage power divider network is used to split the output signal of the first-stage power divider network into four paths. The third-stage power divider network is used to split the output signal of the second-stage power divider network into eight paths. The input terminal of the first-stage power divider network is located on one long side of the substrate. Seven of the eight output terminals of the third-stage power divider network are located on the other long side of the substrate, and the remaining output terminal is located on one short side of the substrate.

2. The 1-to-8 power divider applicable to L-band antennas according to claim 1, characterized in that: One primary power divider network is configured, two secondary power divider networks are configured, and four tertiary power divider networks are configured. All three power divider networks are configured as a 1-to-2 splitter structure.

3. The 1-to-8 power divider applicable to L-band antennas according to claim 1, characterized in that: The primary power divider network, the secondary power divider network, and the tertiary power divider network are all copper-clad lines disposed on the substrate.

4. The 1-to-8 power divider applicable to L-band antennas according to claim 3, characterized in that: The copper thickness of the first-level power divider network, the second-level power divider network, and the third-level power divider network is all 0.035 mm.

5. The 1-to-8 power divider applicable to L-band antennas according to any one of claims 1 to 4, characterized in that: The substrate used is the Arlon AD255A type substrate.

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