Socket connection assembly

Abstract

The utility model provides a socket connecting assembly, including socket, connecting substrate and two metal connecting pieces. Socket includes body and two conductive pins, and two conductive pins respectively from the rear end of body along the first direction extension. The connecting substrate is adjacent to the rear end of the body, and is arranged in parallel with the second direction, and the second direction and the first direction are perpendicular to each other, wherein two conductive pins are electrically connected to the connecting substrate respectively. Two metal connecting pieces are electrically connected to two conductive pins through the connecting substrate respectively, wherein two metal connecting pieces extend along the surface or / and the side edge of the connecting substrate and protrude the bottom edge of the connecting substrate to form two connecting feet, and two connecting feet are assembled and inserted into two mounting holes on the mainboard along the second direction and form electrical connection.

Description

Technical Field

[0001] This utility model relates to a socket device, and more particularly to a socket connection assembly applied to a power input connection module. It utilizes a connecting substrate combined with metal connectors to connect the socket leads to the motherboard, allowing for a stable connection between the socket and the motherboard with minimal space occupation, and enabling automated production. At the same time, it also takes into account stress absorption during power cord insertion and removal, as well as the prevention of electrical interference. Background Technology

[0002] In modern daily life, many electronic devices require a power input module to transfer power to the motherboard. Traditional power input modules primarily consist of a socket, which connects to an external power supply plug. The socket's pins are electrically connected to the motherboard via connecting wires (flying wires) at the rear. The motherboard receives power through the socket and flying wires to supply power to the electronic devices. In traditional socket assemblies, the socket and motherboard are typically connected via connecting wires (flying wires).

[0003] Because the wiring and cable connections need to be soldered manually after the socket and motherboard are assembled and positioned, the traditional socket connection assembly structure is not conducive to automated production. On the other hand, considering the soldering points and cable routing, using wire connections requires some motherboard space, which is not conducive to the miniaturization of the power supply design.

[0004] In view of this, it is necessary to provide a socket connection assembly for power input connection modules, which uses a connection substrate combined with metal connectors to connect the socket leads to the motherboard, allowing a stable connection between the socket and the motherboard with minimal space occupation, and enabling automated production. At the same time, it also takes into account stress absorption during power cord plugging and unplugging and prevention of electrical interference, thus solving the defects of known technologies. Utility Model Content

[0005] The purpose of this utility model is to provide a socket connection assembly for a power input connection module. It uses a connection substrate combined with metal connectors to connect the socket leads to the motherboard, allowing a stable connection between the socket and the motherboard with minimal space occupation, and realizing automated production. At the same time, it also takes into account stress absorption during power cord plugging and unplugging and prevention of electrical interference.

[0006] Another objective of this invention is to provide a socket connection assembly for a power input connection module. The socket connection assembly is positioned between the motherboard and the external power cord. A connecting substrate and an integrally formed metal connector guide the rear leads of the socket to the motherboard, allowing the socket connection assembly to achieve a stable electrical connection with minimal space occupation. It also provides flexibility behind the connecting substrate, allowing for the utilization of excess space according to actual application needs. Since the conductive leads at the rear of the socket body are directly inserted into the connecting substrate and then guided by the metal connector attached to the connecting substrate, they are vertically inserted into the mounting holes on the motherboard. Therefore, the connecting substrate provides a flexible connection through the metal connector, and the metal connector allows for various bending structures to absorb the stress generated when the power cord is plugged into and unplugged, avoiding a rigid connection between the connecting substrate and the motherboard, which is beneficial for the reliability of plugging and unplugging. It also allows space behind the connecting substrate for installation or to avoid other structural components. Furthermore, to ensure personal and equipment safety, the socket also includes a metal frame fitted around the outer periphery of the front edge of the body. The metal frame may be designed to include a grounding portion. The grounding pin of the socket is directly inserted into the connecting substrate and electrically connected to the grounding hole on the top edge of the connecting substrate through the internal circuitry. This invention utilizes grounding screws to lock the connecting substrate to the grounding part of the metal frame via the grounding hole, eliminating the need for an additional shielding layer for the socket's grounding pin and avoiding unnecessary space occupation. In other words, the socket connection assembly of this invention occupies less space in the power input connection module, allowing for its adoption in subsequent high-density models, while still preserving space on the back of the connecting substrate to accommodate Y capacitors and meet electrical requirements. Of course, the metal frame can also be connected to the chassis, simultaneously achieving grounding. Furthermore, after assembling the socket's conductive and grounding pins, the connecting substrate, and the metal connectors, it can be automatically connected to the motherboard. The entire module can be pre-positioned with the motherboard using positioning pins, then connected to the motherboard with screws before wave soldering to ensure a reliable connection between the module and the motherboard. This invention uses metal connectors, such as copper sheets, to structure the electrical connections, such as live and neutral wires, between the motherboard and the connecting substrate. One of the two metal connectors extends along the side edge of the connecting substrate, ensuring that the minimum distance maintained between them meets the safety requirements for clearances and creepage distances, and is led downwards from the bottom edge of the connecting substrate to the motherboard. Additionally, the socket grounding pin is integrated into the metal frame from the top edge of the connecting substrate, further ensuring that the live, neutral, and ground connections all meet the safety requirements for clearances and creepage distances. Furthermore, since the electrical connections between the socket and the motherboard are achieved through structurally strong connecting substrates and metal connectors, combined with the soldering assembly process of the socket, metal connectors, connecting substrate, and motherboard, it facilitates automated production of the socket, metal connectors, connecting substrate, and motherboard assembly structure, simplifying the assembly process, reducing production costs, and thus enhancing product competitiveness.

[0007] To achieve the aforementioned objectives, this utility model provides a socket connection assembly, including a socket, a connecting base plate, and two metal connectors. The socket includes a body and two conductive pins, each extending from the rear end of the body along a first direction. The connecting base plate is disposed adjacent to the rear end of the body and parallel to a second direction, which is perpendicular to the first direction. The two conductive pins are electrically connected to the connecting base plate. The two metal connectors are electrically connected to the two conductive pins via the connecting base plate. The two metal connectors extend along the surface and / or side edge of the connecting base plate and protrude from the bottom edge of the connecting base plate to form two connecting pins. The two connecting pins mate with two mounting holes on the motherboard along the second direction and form an electrical connection with the internal circuitry of the motherboard.

[0008] In one embodiment, the socket connection assembly further includes a metal frame, wherein the metal frame is fitted around the outer periphery of the body.

[0009] In one embodiment, the socket includes a locking protrusion disposed on the outer periphery of the body, and the metal frame includes a locking groove that is spatially opposite to the locking protrusion. The body is fixed to the metal frame by the engagement of the locking protrusion and the locking groove.

[0010] In one embodiment, the socket further includes a grounding pin extending from the rear end of the body along a first direction and partially penetrating the connecting substrate. The connecting substrate includes a grounding through hole adjacent to the top edge of the connecting substrate and is electrically connected to the grounding pin via in-board wiring.

[0011] In one embodiment, the socket connection assembly further includes a grounding screw, which secures the connection substrate to the grounding portion of the metal frame through a grounding through-hole in the connection substrate.

[0012] In one embodiment, two conductive pins, a ground pin, and two metal connectors are electrically connected to the internal circuitry of the connecting substrate through a single reflow soldering process.

[0013] In one embodiment, the socket connection assembly further includes a socket arranged along a third direction and symmetrically arranged with each other, wherein the third direction is perpendicular to the first direction and the second direction, the grounding pins of the two sockets are arranged adjacent to each other, and are electrically connected through the internal wiring of the connection substrate.

[0014] In one embodiment, one of the two metal connectors of the two sockets extends along two opposite side edges of the connecting substrate.

[0015] In one embodiment, both conductive pins and the grounding pin are flat pins and are arranged parallel to the first direction, wherein the grounding pin is arranged relative to the two conductive pins along a third direction, and the third direction is perpendicular to the first direction and the second direction.

[0016] In one embodiment, the metal frame includes a pair of first fixing holes adjacent to two opposite ends of the bottom edge, wherein the motherboard includes a pair of second fixing holes adjacent to the front edge of the motherboard and spatially opposite to the pair of first fixing holes of the metal frame, wherein a pair of screws respectively pass through the pair of first fixing holes and the pair of second fixing holes to fix the motherboard to the metal frame.

[0017] In one embodiment, the metal frame further includes a positioning pin disposed between the pair of first fixing holes, and the main board further includes a positioning hole disposed between the pair of second fixing holes, wherein the positioning pin and the positioning hole engage with each other, so that the pair of first fixing holes and the pair of second fixing holes are aligned with each other.

[0018] In one embodiment, the socket connection assembly is applied to the power input connection module and fixed to the front edge of the housing. The motherboard is housed inside the housing. The metal frame of the socket connection assembly is fixed to the housing. The connection substrate is inserted into the motherboard through two metal connectors.

[0019] In one embodiment, the power input connection module further includes a handle, which is disposed on the front edge of the housing via a metal frame and adjacent to one side of the socket.

[0020] In one embodiment, the connecting substrate includes a first surface and a second surface, the first surface and the second surface being opposite to each other in a first direction, the first surface facing the rear end of the socket, two conductive pins passing through the second surface from the first surface, and two fixing pins of two metal connectors passing through the second surface from the first surface.

[0021] In one embodiment, the connecting substrate further includes a pair of first through holes and a pair of second through holes, wherein two conductive pins are spatially opposite to the pair of first through holes, pass through the pair of first through holes along a first direction and form an electrical connection with the connecting substrate, and two fixing pins of two metal connectors are spatially opposite to the pair of second through holes, pass through the pair of second through holes along a first direction and form an electrical connection with the internal circuitry of the connecting substrate.

[0022] In one embodiment, the spacing between the first through holes is smaller than the spacing between the second through holes.

[0023] In one embodiment, the socket further includes a grounding pin extending from the rear end of the body along a first direction and partially penetrating a third through hole in the connecting substrate. The connecting substrate includes a grounding through hole adjacent to the top edge of the connecting substrate and electrically connected to the grounding pin via in-board wiring. The distance between the grounding through hole and the third through hole is less than the distance between the grounding through hole and the pair of first through holes or the pair of second through holes.

[0024] In one embodiment, the connecting substrate further includes surface-mount electronic devices disposed on the second side.

[0025] In one embodiment, the motherboard extends along a first direction, and two mounting holes are arranged along a third direction and spaced apart from each other, with the third direction perpendicular to the first and second directions.

[0026] In one embodiment, the two connecting pins of the two metal connectors are electrically connected to the internal circuitry of the motherboard via wave soldering.

[0027] In one embodiment, two conductive pins are arranged along a second direction and are both flat pins. Two connecting pins are arranged along a third direction on the bottom edge of the connecting substrate. The third direction is perpendicular to the first and second directions.

[0028] In one embodiment, the two metal connectors are each integrally formed from copper sheets.

[0029] The beneficial effects of this utility model are that its embodiments provide a socket connection assembly applicable to, for example, a power input connection module, to solve the connection problem between the socket and the motherboard. By using a connecting substrate combined with metal connectors to overlap the socket leads to the motherboard, this utility model's socket connection assembly achieves a stable connection between the socket and the motherboard with minimal space occupation, and enables automated production. It also takes into account stress absorption during power cord insertion and removal, as well as the prevention of electrical interference. In addition to solving the problem of stable connection, it also optimizes overall space utilization. Attached Figure Description

[0030] The following detailed description of the present invention and the schematic diagrams of the embodiments are intended to enable those skilled in the art to fully understand the above content, and are not intended to limit the present invention.

[0031] Figure 1 This is a perspective structural diagram of the socket connection assembly of the preferred embodiment of the present invention applied to a power input connection module.

[0032] Figure 2 This invention discloses an internal structural diagram of the socket connection assembly applied to a power input connection module according to a preferred embodiment of the present invention.

[0033] Figure 3 This is an exploded view of the motherboard corresponding to the socket connection assembly of the preferred embodiment of the present invention.

[0034] Figure 4 This is an exploded view of the socket connection assembly corresponding to the motherboard in a preferred embodiment of the present invention from another perspective.

[0035] Figure 5 This is an exploded view of the socket connection assembly of a preferred embodiment of the present invention.

[0036] Figure 6This invention discloses a dimensional relationship diagram of the connecting substrate relative to the two metal connectors in the socket connection assembly of a preferred embodiment of the present invention. Detailed Implementation

[0037] Some typical embodiments embodying the features and advantages of this utility model will be described in detail in the following description. It should be understood that this utility model can have various variations in different ways, all of which do not depart from the scope of this utility model, and the descriptions and drawings herein are for illustrative purposes only and not for limiting the utility model. For example, if the following description of a first feature disposed on or above a second feature indicates that it includes embodiments where the first and second features are in direct contact, and also includes embodiments where additional features may be disposed between the first and second features, so that the first and second features may not be in direct contact. Furthermore, different embodiments in this disclosure may use repeated reference numerals and / or markings. These repetitions are for simplification and clarity and are not intended to limit the relationships between the various embodiments and / or the described appearance structures. Moreover, to facilitate the description of the relationship between one component or feature and another (plural) component or feature in the drawings, spatially related terms such as "top," "bottom," "front," "back," and similar terms may be used. In addition to the orientations shown in the accompanying drawings, spatially relevant terms are used to cover different orientations of the device in use or operation. The device may also be otherwise positioned (e.g., rotated 90 degrees or located in other orientations), and the descriptions of the spatially relevant terms used will be interpreted accordingly. Furthermore, when a component is referred to as "connected to" or "coupled to" another component, it may be directly connected to or coupled to the other component, or there may be intervening components. Although the numerical ranges and parameters of the broad scope of this disclosure are approximate, values ​​are stated as precisely as possible in specific examples. Additionally, it is understood that while terms such as "first," "second," etc., may be used in the claims to describe different components, these components should not be limited by these terms, and the components described accordingly in the embodiments are represented by different component symbols. These terms are used to distinguish different components. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the embodiments. The term "and / or" as thus used includes any or all combinations of one or more of the related listed items.

[0038] Figure 1 This is a perspective structural diagram of the socket connection assembly of the preferred embodiment of the present invention applied to a power input connection module. Figure 2 This invention discloses an internal structural diagram of the socket connection assembly applied to a power input connection module according to a preferred embodiment of the present invention. Figure 3 and Figure 4This is an exploded view of the motherboard corresponding to the socket connection assembly of the preferred embodiment of the present invention. Figure 5 This is an exploded view of the socket connection assembly according to a preferred embodiment of the present invention. In this embodiment, the present invention provides a socket connection assembly 1 applied to a power input connection module 2. The socket connection assembly 1 is structured between the main board 90 of the power input connection module 2 and an external power cord (not shown). Mains power is supplied through the socket connection assembly 1, converted by the main board 90, and then supplied to the power-consuming device. In this embodiment, the socket connection assembly 1 includes a socket 10, a connecting substrate 20, and two metal connectors 30 and 40. The socket 10 includes a body 11 and two conductive pins 12 and 13, which extend from the rear end of the body 11 along a first direction (i.e., the reverse X-axis direction). The connecting substrate 20 is adjacent to the rear end of the body 11 and is arranged parallel to a second direction (i.e., the reverse Z-axis direction), which is perpendicular to the first direction. In this embodiment, the two conductive pins 12 and 13 are respectively inserted into the connecting substrate 20. Two metal connectors 30 and 40 are electrically connected to two conductive pins 12 and 13 respectively through the internal circuitry of the connecting substrate 20. Metal connector 30 extends along the surface and side edge of the connecting substrate 20 and protrudes beyond the bottom edge of the connecting substrate 20 to form a connecting pin 31. Metal connector 40 extends along the surface of the connecting substrate 20 and protrudes beyond the bottom edge of the connecting substrate 20 to form a connecting pin 41. In this embodiment, the main board 90 extends along a first direction (i.e., the reverse X-axis direction), and two mounting holes 91 and 92 are arranged along a third direction (i.e., the Y-axis direction) and spaced apart from each other. The third direction is perpendicular to the first and second directions. In this embodiment, the two connecting pins 31 and 41 are fitted into the two mounting holes 91 and 92 on the main board 90 along a second direction (i.e., the reverse Z-axis direction) and form an electrical connection with the internal circuitry of the main board 90. The conductive pins 12 and 13 at the rear of the socket 10 are connected to the main board 90 via the connecting substrate 20 and the integrally formed metal connectors 30 and 40. This allows the socket connection assembly 1 of this invention to achieve a stable electrical connection with minimal space occupation and enables automated production. Furthermore, since the conductive pins 12 and 13 at the rear of the socket 10 body 11 are directly inserted into the connecting substrate 20 and then connected via the metal connectors 30 and 40 attached to the connecting substrate 20, and the connecting pins 31 and 41 are vertically inserted into the mounting holes 91 and 92 of the main board 90, the connecting substrate 20 provides a flexible connection through the metal connectors 30 and 40. The metal connectors 30 and 40 allow for various bending structures to absorb the stress generated when the power cord is plugged into and unplugged from the socket 10, avoiding a rigid connection between the connecting substrate 20 and the main board 90. This improves the reliability of plugging and unplugging, while also allowing space behind the connecting substrate 20 for installing or avoiding other structural components.

[0039] It should be noted that, in this embodiment, the two conductive pins 12 and 13 are arranged along the second direction (i.e., the reverse Z-axis direction), and are respectively the neutral wire conductive pin and the line / live wire conductive pin. They have similar structures and there is no specific arrangement restriction, allowing for alternating use, and both are flat pins. In this embodiment, the connecting substrate 20 includes a first surface 201 and a second surface 202. The first surface 201 and the second surface 202 are opposite to each other in the first direction (i.e., the reverse X-axis direction). The first surface 201 faces the rear end of the socket 10, and the two conductive pins 12 and 13 pass through the second surface 202 from the first surface 201. In addition, the socket 10 also includes a grounding pin 14 extending from the rear end of the body 11 along the first direction (i.e., the reverse X-axis direction) and partially penetrating the connecting substrate 20. The connecting substrate 20 includes a grounding through-hole 25, which is adjacent to the top edge of the connecting substrate 20 and electrically connected to the grounding pin 14 through an internal circuit (not shown) for subsequent grounding connection.

[0040] In this embodiment, the socket connection assembly 1 may further include a metal frame 50, which is sleeved on the outer periphery 110 of the body 11. It should be noted that the socket connection assembly 1 is mounted on the front end of the housing 80. The socket connection assembly 1 is fixed to the top plate, bottom plate, and side plates of the housing 80 via the metal frame 50. The metal frame 50 can be considered part of the housing 80. However, this invention is not limited thereto. In this embodiment, the socket 10 includes a locking protrusion 15 disposed on the outer periphery 110 of the body 11, and the metal frame 50 includes a locking groove 51 spatially opposite to the locking protrusion 15. The body 11 can be fixed to the metal frame 50 by the engagement of the locking protrusion 15 and the locking groove 51. On the other hand, the socket connection assembly 1 also includes a grounding screw 60. The grounding screw 60 is, for example, an M4 grounding screw, which can lock the connecting substrate 20 to the grounding portion 52 of the metal frame 50 through the grounding through hole 25 of the connecting substrate 20. This invention utilizes a grounding screw 60 to secure the connecting substrate 20 to the grounding portion 52 of the metal frame 50 via the grounding through hole 25. This eliminates the need for an additional grounding shielding layer or a flying wire to the motherboard for grounding shielding on the grounding pin 14 of the socket 10. The metal frame 50 can be directly connected to the grounding portion 52, achieving a grounding effect and avoiding unnecessary space occupation. Of course, the metal frame 50 can also be connected to the housing 80 for simultaneous grounding. This invention is not limited to these limitations.

[0041] In this embodiment, the socket connection assembly 1 further includes, for example, two sockets 10, arranged along a third direction (i.e., the Y-axis direction) and symmetrically arranged to each other. The third direction is perpendicular to the first and second directions. The grounding pins 14 of the two sockets 10 are arranged adjacent to each other and electrically connected to the same grounding through-hole 25 via onboard wiring (not shown) of a single connecting substrate 20. Grounding protection is achieved by securing them to the metal frame 50 with grounding screws 60. In this embodiment, the conductive pins 12 and 13 and the grounding pin 14 are all flat pins and are arranged parallel to the first direction (i.e., against the X-axis direction). Furthermore, the grounding pin 14 is arranged relative to the combination of the two conductive pins 12 and 13 along a third direction (i.e., the Y-axis direction), which is perpendicular to the first and second directions. In this embodiment, the first surface 201 of the connecting substrate 20 faces the rear ends of the two sockets 10, and the conductive pins 12 and 13 pass through the second surface 202 from the first surface 201. In this embodiment, both metal connectors 30 and 40 extend along the surface of the first surface 201 of the connecting substrate 20. The metal connector 30 extends along the side edge of the connecting substrate 20 and protrudes from the bottom edge of the connecting substrate 20 to form a connecting foot 31. Furthermore, the fixing feet 32 ​​of the metal connector 30 and the fixing feet 42 of the metal connector 40 also extend through the second surface 202 from the first surface 201.

[0042] In this embodiment, the metal frame 50 includes a pair of first fixing holes 53, which are adjacent to two opposite ends of the bottom edge. In this embodiment, the motherboard 90 includes a pair of second fixing holes 93, adjacent to the front edge of the motherboard 90, spatially opposite to the pair of first fixing holes 53 of the metal frame 50. A pair of M2.5 screws 95 secure the motherboard 90 to the metal frame 50 through the pair of first fixing holes 53 and the pair of second fixing holes 93, respectively. In this embodiment, the metal frame 50 also includes a positioning pin 54 disposed between the pair of first fixing holes 53. The motherboard 90 also includes a positioning hole 94 disposed between the pair of second fixing holes 93. In this embodiment, the positioning pin 54 and the positioning hole 94 engage with each other, allowing the pair of first fixing holes 53 and the pair of second fixing holes 93 to be aligned, facilitating subsequent assembly with screws 95. Of course, this invention is not limited to these embodiments. It should be noted that, in this embodiment, after the conductive pins 12, 13 and grounding pin 14 of the socket 10, the connecting substrate 20 and the metal connectors 30, 40 are assembled through a single reflow soldering process, they can be plugged into the motherboard 90 through automated production. The entire module can be pre-positioned with the positioning pins 54 and the positioning holes 94 of the motherboard 90. After the socket connection assembly 1 is connected to the motherboard 90 by screws 95, the connecting pins 31, 41 of the metal connectors 30, 40 are then electrically connected to the internal circuitry of the motherboard 90 through wave soldering, thus ensuring a reliable connection between the socket connection assembly 1 and the motherboard 90.

[0043] In this embodiment, the connecting substrate 20 further includes a pair of first through holes 22, 23 and a pair of second through holes 26, 27. Two conductive leads 12, 13 are spatially opposite to the pair of first through holes 22, 23, passing through them along a first direction (i.e., the reverse X-axis direction) and forming an electrical connection with the internal circuitry of the connecting substrate 20. Two fixing leads 32, 42 of two metal connectors 30, 40 are spatially opposite to the pair of second through holes 26, 27, passing through them along a first direction (i.e., the reverse X-axis direction) and forming an electrical connection with the internal circuitry of the connecting substrate 20. In this embodiment, the metal connectors 30, 40 are, for example, made of copper sheets. Each metal connector 30, 40 is integrally formed, and the fixing leads 32, 42 of the metal connectors 30, 40 pass through the pair of first through holes 22, 23 of the connecting substrate 20 and form an electrical connection through welding. The spacing D1 between the pair of first through holes 22 and 23 is the same as the spacing between the two corresponding conductive pins 12 and 13. Preferably, the spacing D1 between the pair of first through holes 22 and 23 is smaller than the spacing between the pair of second through holes 26 and 27, ensuring that the minimum distance maintained between the two metal connectors 30 and 40 meets the safety requirements for electrical clearance and creepage distance, and is conducted downward from the bottom edge of the connecting substrate 20 to the main board 90. In this embodiment, the spacing D2 between the two corresponding connecting pins 31 and 41 is greater than or equal to the spacing D1 between the pair of first through holes 22 and 23. Of course, this utility model is not limited to this.

[0044] In this embodiment, the grounding pin 14 of the socket 10 extends from the rear end of the body 11 along a first direction (i.e., the reverse X-axis direction) and partially penetrates the third through hole 24 of the connecting substrate 20. The connecting substrate 20 includes a grounding through hole 25, which is adjacent to the top edge of the connecting substrate 20. The grounding through hole 25 is electrically connected to the grounding pin 14 through an internal circuit (not shown). The distance D3 between the grounding through hole 25 and the third through hole 24 is less than the distance between the grounding through hole 25 and the pair of first through holes 22, 23 or the pair of second through holes 26, 27. This facilitates the integration of the grounding pin 14 of the socket 10 from the top edge of the connecting substrate 20 into the metal frame 50, and further ensures that the electrical connections of the live wire, neutral wire, and ground all meet the safety requirements for electrical clearance and creepage distance, while avoiding electrical EMI / RFI interference caused by wire crossing. Furthermore, the symmetrical arrangement of the two sockets 10 makes it easier for the connecting substrate 20 to achieve the above-mentioned grounding structure with minimal footprint.

[0045] As can be seen from the above, conductive pins 12 and 13 and grounding pin 14 are all connected to the internal circuitry of the connecting substrate 20 by soldering to form an electrical connection. In addition, the integrally formed metal connectors 30 and 40 are also connected to the connecting substrate 20 by soldering. The metal connectors 30 and 40 extend along the side edge and / or the surface of the first surface 201 of the connecting substrate 20 to the bottom edge of the connecting substrate 20, protruding the connecting pins 31 and 41, and are inserted into the motherboard 90. This can achieve a stable electrical connection with a short path, and also provide spatial freedom behind the second surface 202 of the connecting substrate 20. It can avoid other components on the motherboard 90 according to the actual application requirements and does not occupy extra space.

[0046] In this embodiment, since the electrical connection between the socket 10 and the motherboard 90 is achieved through the structurally strong connecting substrate 20 and metal connectors 30 and 40, combined with the welding assembly process of the socket 10, connecting substrate 20 and motherboard 90, it is more conducive to realizing the assembly structure of the socket 10, connecting substrate 20, metal connectors 30 and 40 and motherboard 90 in an automated production manner, simplifying the assembly process and reducing production costs.

[0047] On the other hand, in this embodiment, the socket connection assembly 1 is applied to the power input connection module 2 and fixed to the front edge of the housing 80. The motherboard 90 is housed within the housing 80, and the metal frame 50 of the socket connection assembly 1 is fixed to the housing 80. The connection substrate 20 is inserted into the motherboard 90 via two metal connectors 30 and 40. Because the socket connection assembly 1 of this invention occupies little space in the power input connection module 2, it can be easily adopted in subsequent models with higher density, while still preserving the rear space of the second surface 202 of the connection substrate 20. In this embodiment, the connection substrate 20 also includes surface-mount electronic devices 21 or other Y capacitors disposed on the second surface 202 to achieve short-distance connection to conductive pins 12, 13 or ground pin 14. This invention is not limited thereto.

[0048] In this embodiment, the power input connection module 2 further includes a handle 81, which is mounted on the front edge of the housing 80 via a metal frame 50 and adjacent to one side of the socket 10, to facilitate the installation and removal of the power input connection module 2. Additionally, the power input connection module 2 may also include a latch 82, mounted on the side of the housing 80 and adjacent to the socket connection assembly 1. Because the socket connection assembly 1 occupies little space in the power input connection module 2, it is not affected by the arrangement of other components. Of course, this invention is not limited to these limitations, and further details will not be provided.

[0049] In summary, this utility model provides a socket connection assembly for a power input connection module. It utilizes a connecting substrate combined with a metal connector to connect the socket leads to the motherboard, allowing for a stable connection between the socket and the motherboard with minimal space requirements. This enables automated production while also absorbing stress during power cord insertion and removal and preventing electrical interference. The socket connection assembly is positioned between the motherboard and the external power cord. The connecting substrate and the integrally formed metal connector guide the rear leads of the socket to the motherboard, enabling this socket connection assembly to achieve a stable electrical connection with minimal space requirements. It also provides flexibility for the rear of the connecting substrate, allowing for the utilization of excess space as needed. The conductive leads at the rear of the socket body are directly inserted into the connecting substrate, then guided by the metal connector attached to the connecting substrate, and vertically inserted into the mounting holes on the motherboard. Therefore, the connecting substrate provides a flexible connection through metal connectors, which allow for various bending structures to absorb the stress generated when the power cord is plugged into and unplugged from the socket. This avoids a rigid connection between the connecting substrate and the motherboard, improving the reliability of plugging and unplugging. It also allows space behind the connecting substrate for installation or to avoid other components. On the other hand, to ensure personal and equipment safety, the socket also includes a metal frame fitted around the outer periphery of the front edge of the body. The metal frame can be designed to include a grounding part. The grounding pin of the socket is directly inserted into the connecting substrate and electrically connected to the grounding hole on the top edge of the connecting substrate through internal wiring. This invention uses grounding screws to lock the connecting substrate to the grounding part of the metal frame through the grounding hole, eliminating the need for an additional shielding layer for grounding the socket's grounding pin and avoiding unnecessary space occupation. In other words, this invention's socket connection assembly occupies little space in the power input connection module, allowing for its adoption in subsequent high-density models, while still preserving space on the back of the connecting substrate to allow for the placement of Y capacitors to meet electrical requirements. Of course, the metal frame can also be connected to the chassis, simultaneously achieving grounding applications. Furthermore, after the socket's conductive and grounding pins, the connecting substrate, and the metal connectors are assembled, they can be plugged into the motherboard through automated production. The entire module can be pre-positioned with the motherboard using locating pins, and then connected to the motherboard with screws before wave soldering to ensure a reliable connection between the module and the motherboard. This invention uses, for example, copper sheet metal connectors to structure the electrical connection between the motherboard and the connecting substrate, such as the live wire and neutral wire. One of the two metal connectors extends along the side edge of the connecting substrate, ensuring that the minimum distance maintained between them meets the safety requirements for electrical clearance and creepage distance, and is led downwards from the bottom edge of the connecting substrate to the motherboard. In addition, the socket's grounding pin is integrated into the metal frame from the top edge of the connecting substrate, further ensuring that the live wire, neutral wire, and grounding electrical connections all meet the safety requirements for electrical clearance and creepage distance.On the other hand, since the electrical connection between the socket and the motherboard is achieved through a structurally strong connecting substrate and metal connectors, the welding assembly process of the socket, metal connectors, connecting substrate and motherboard is more conducive to realizing the assembly structure of the socket, metal connectors, connecting substrate and motherboard in an automated production method, simplifying the assembly process, reducing production costs, and thus enhancing the competitiveness of the product.

[0050] This utility model may be modified in various ways by those skilled in the art, but all such modifications shall not depart from the protection sought by the appended claims.

Claims

1. A socket connection assembly, characterized in that, include: A socket includes a body and two conductive pins, the two conductive pins extending from the rear end of the body along a first direction. A connecting substrate is disposed adjacent to the rear end of the body and parallel to a second direction, which is perpendicular to the first direction, wherein the two conductive pins are respectively inserted into the connecting substrate; and Two metal connectors are electrically connected to the two conductive pins through the internal circuitry of the connecting substrate. The two metal connectors extend along the surface and / or side edge of the connecting substrate and protrude from the bottom edge of the connecting substrate to form two connecting pins. The two connecting pins are assembled and inserted into two mounting holes on a motherboard along the second direction, and form an electrical connection with the internal circuitry of the motherboard.

2. The socket connection assembly as described in claim 1, characterized in that, It also includes a metal frame, which is fitted around the outer periphery of the body.

3. The socket connection assembly as described in claim 2, characterized in that, The socket includes a locking protrusion disposed on the outer periphery of the body, and the metal frame includes a locking groove that is spatially opposite to the locking protrusion. The body is fixed to the metal frame by the engagement of the locking protrusion and the locking groove.

4. The socket connection assembly as described in claim 2, characterized in that, The socket also includes a grounding pin that extends from the rear end of the body along the first direction and partially penetrates the connecting substrate. The connecting substrate includes a grounding through hole adjacent to the top edge of the connecting substrate and is electrically connected to the grounding pin via an internal circuit.

5. The socket connection assembly as described in claim 4, characterized in that, It also includes a grounding screw, which secures the connecting substrate to a grounding portion of the metal frame through the grounding through-hole of the connecting substrate.

6. The socket connection assembly as described in claim 4, characterized in that, The two conductive pins, the grounding pin, and the two metal connectors are electrically connected to the internal circuitry of the connector substrate through a single reflow soldering process.

7. The socket connection assembly as described in any one of claims 4, 5, or 6, characterized in that, The socket connection assembly also includes a socket. The two sockets are arranged along a third direction and are symmetrically arranged with each other. The third direction is perpendicular to the first direction and the second direction. The grounding pins of the two sockets are arranged adjacent to each other and are electrically connected through the internal circuitry of the connection substrate.

8. The socket connection assembly as described in claim 7, characterized in that, One of the two metal connectors of the two sockets extends along two opposite side edges of the connecting base plate.

9. The socket connection assembly as described in claim 4, characterized in that, Both conductive pins and the grounding pin are flat pins and are arranged parallel to the first direction. The grounding pin is arranged relative to the two conductive pins along a third direction, which is perpendicular to the first direction and the second direction.

10. The socket connection assembly as claimed in claim 2, characterized in that, The metal frame includes a pair of first fixing holes adjacent to two opposite ends of the bottom edge. The motherboard includes a pair of second fixing holes adjacent to the front edge of the motherboard and spatially opposite to the pair of first fixing holes of the metal frame. A pair of screws respectively pass through the pair of first fixing holes and the pair of second fixing holes to fix the motherboard to the metal frame.

11. The socket connection assembly as claimed in claim 10, characterized in that, The metal frame also includes a positioning pin disposed between the pair of first fixing holes, and the motherboard also includes a positioning hole disposed between the pair of second fixing holes, wherein the positioning pin and the positioning hole engage with each other, so that the pair of first fixing holes and the pair of second fixing holes are aligned with each other.

12. The socket connection assembly as claimed in claim 2, characterized in that, The socket connection assembly is applied to a power input connection module and is fixed to the front edge of a housing. The motherboard is housed in the housing. The metal frame of the socket connection assembly is fixed to the housing. The connection board is inserted into the motherboard through the two metal connectors.

13. The socket connection assembly as described in claim 12, characterized in that, The power input connection module also includes a handle, which is mounted on the front edge of the housing via the metal frame and adjacent to one side of the socket.

14. The socket connection assembly as claimed in claim 1, characterized in that, The connecting substrate includes a first surface and a second surface, which are opposite to each other in the first direction. The first surface faces the rear end of the socket. The two conductive pins pass through the second surface from the first surface, and the two fixing pins of the two metal connectors pass through the second surface from the first surface.

15. The socket connection assembly as claimed in claim 14, characterized in that, The connecting substrate also includes a pair of first through holes and a pair of second through holes, wherein the two conductive pins are spatially opposite to the pair of first through holes, pass through the pair of first through holes along the first direction and form an electrical connection with the connecting substrate, and the two fixing pins of the two metal connectors are spatially opposite to the pair of second through holes, pass through the pair of second through holes along the first direction and form an electrical connection with the internal circuitry of the connecting substrate.

16. The socket connection assembly as claimed in claim 15, characterized in that, The spacing between the first through holes is less than the spacing between the second through holes.

17. The socket connection assembly as claimed in claim 15, characterized in that, The socket further includes a grounding pin extending from the rear end of the body along the first direction and partially penetrating a third through hole in the connecting substrate. The connecting substrate includes a grounding through hole adjacent to the top edge of the connecting substrate and electrically connected to the grounding pin via an internal circuit. The distance between the grounding through hole and the third through hole is less than the distance between the grounding through hole and the pair of first through holes or the pair of second through holes.

18. The socket connection assembly as claimed in claim 14, characterized in that, The connection substrate also includes a surface-mount electronic device disposed on the second surface.

19. The socket connection assembly as claimed in claim 1, characterized in that, The motherboard extends along the first direction, and the two mounting holes are arranged along a third direction and spaced apart from each other. The third direction is perpendicular to the first direction and the second direction.

20. The socket connection assembly as claimed in claim 1, characterized in that, The two connecting pins of the two metal connectors are electrically connected to the internal circuitry of the motherboard through a wave soldering process.

21. The socket connection assembly as claimed in claim 1, characterized in that, The two conductive pins are arranged along the second direction and are both flat pins. The two connecting pins are arranged along a third direction on the bottom edge of the connecting substrate. The third direction is perpendicular to the first direction and the second direction.

22. The socket connection assembly as claimed in claim 1, characterized in that, The two metal connectors are each integrally formed from a copper sheet.

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