connector

Abstract

This disclosure provides a connector comprising: a first conductive layer disposed within a circuit board, the first conductive layer being in contact with a ground terminal of the circuit board; the first conductive layer extending from the front end face of the circuit board to the rear end face of the circuit board; the front end face being disposed near an upper terminal assembly and having a second conductive layer disposed thereon, in contact with the first conductive layer; the second conductive layer protruding from the front side of a housing; conductive foam being extruded between the second conductive layer and the inner side of the front housing; the front housing being electrically connected in sequence through the conductive foam, the second conductive layer, the first conductive layer, and the ground terminal of the circuit board to form a shielding loop for shielding signal interference between the upper terminal assembly and the lower terminal assembly; and a first shielding plate disposed between the upper connecting portion and the lower connecting portion, the first shielding plate being inserted into the circuit board and in contact with the first conductive layer; the first shielding plate being electrically connected to the ground terminal of the circuit board through the first conductive layer to form a shielding loop for shielding signal interference between the upper and lower protruding terminals of the upper connecting portion.

Description

Technical Field

[0001] This disclosure relates to the field of connector technology, and more particularly to an RJ45 connector. Background Technology

[0002] With the continuous development of network communication technology, multi-port RJ45 products, as key interface components in data transmission links, are widely used in switches, routers, servers, and various network terminal devices. Their performance directly affects the stability and transmission efficiency of the entire communication system.

[0003] Currently, mainstream multi-Ports RJ45 products on the market have significant limitations in performance standards, mainly focusing on meeting the characteristics of Category 5 (hereinafter referred to as CAT5) and below. The design specifications of these products in terms of transmission rate and anti-interference capability are no longer adequate for the high bandwidth and low latency requirements of modern high-speed networks. With the rapid popularization of technologies such as 5G communication, cloud computing, and big data, network data transmission rates are constantly increasing, placing higher demands on the performance of interface components. The market demand for Category 6A (hereinafter referred to as CAT6A) level multi-Ports RJ45 products is becoming increasingly prominent. However, multi-Ports RJ45 products that meet CAT6A characteristics are extremely scarce, failing to meet the application needs of high-speed communication scenarios. In high-speed signal transmission scenarios, crosstalk becomes a core bottleneck restricting the performance of multi-PortsRJ45 products. When multi-PortsRJ45 products are paired with 10G filters for high-speed signal communication, due to structural design flaws in existing products, intra-port crosstalk, near-end crosstalk (NEXT), and far-end crosstalk (FEXT) between ports become particularly prominent. This is mainly because insufficient isolation in the product design leads to severe electromagnetic interference between different ports and between signal lines within the same port. The interference signal is superimposed on the effective high-speed signal, causing serious problems such as packet loss and network outages during communication, greatly reducing communication quality and even affecting the normal operation of critical services. To address crosstalk issues, some existing products have attempted to implement isolation by adding a spacer, but the practical application results have been less than ideal. These products suffer from significant structural defects in their spacers; the spacers are often suspended, failing to connect effectively to the product's casing or to the motherboard's ground (GND). This results in an incomplete isolation path, hindering the spacer's electromagnetic shielding and isolation capabilities. Consequently, the crosstalk immunity remains insufficient, failing to meet the stringent requirements of low crosstalk for high-speed signal transmission and severely limiting the further application and development of multi-Ports RJ45 products in high-speed communication. Utility Model Content

[0004] In view of this, in order to solve the technical problem of signal crosstalk in existing multi-PortsRJ45 products, this disclosure provides a connector.

[0005] According to a first aspect of the present disclosure, a connector is provided, the connector including a front shell and a rear shell, a plastic shell having a mounting cavity located between the front shell and the rear shell, the mounting cavity being provided with a ferrule module, the ferrule module including an upper module, a lower module and a circuit board, the upper module including an upper terminal assembly, the lower module including a lower terminal assembly, the upper terminal assembly and the lower terminal assembly being correspondingly disposed on the upper side and the lower side of the front end of the circuit board; The circuit board has a first conductive layer inside, which is connected to the grounding terminal of the circuit board. The front end of the circuit board has a second conductive layer, which is connected to the first conductive layer. The first conductive layer of the circuit board is positioned between the upper terminal assembly and the lower terminal assembly. The second conductive layer of the circuit board protrudes from the front side of the housing. Conductive foam is extruded between the second conductive layer and the inner side of the front housing. The front housing is electrically connected to the grounding terminal of the circuit board in sequence through the conductive foam, the second conductive layer, and the first conductive layer.

[0006] In one alternative embodiment, the first conductive layer is constructed as a double-layer copper structure, wherein a dielectric layer is sandwiched within the double-layer copper structure.

[0007] In one alternative embodiment, the second conductive layer is fully bonded and laid along the front end face of the circuit board, and the first conductive layer is fully laid along the board surface of the circuit board, extending out of the front end face of the circuit board and connecting with the second conductive layer.

[0008] In one alternative embodiment, a gap is left between the second conductive layer and the inner side of the front shell, the normal thickness of the conductive foam is greater than the thickness of the gap, and the conductive foam is extruded into the gap.

[0009] In an optional embodiment, the upper module includes an upper connecting portion electrically connected to the upper terminal assembly, and the lower module includes a lower connecting portion electrically connected to the lower terminal assembly. The upper connecting portion and the lower connecting portion are disposed on the lower side of the rear end of the circuit board. A first shielding plate is sandwiched between the upper connecting portion and the lower connecting portion. The first shielding plate is inserted into the circuit board and connected to the first conductive layer. The first shielding plate is electrically connected to the ground terminal of the circuit board through the first conductive layer.

[0010] In one optional embodiment, the top of the first shielding plate has a insert structure, and the circuit board is provided with a corresponding socket structure. The insert structure matches and is inserted into the socket structure and is connected to the first conductive layer.

[0011] In an optional embodiment, the first shielding plate covers the large area between the upper connecting portion and the lower connecting portion along the vertical direction.

[0012] In one optional embodiment, the mounting cavity has several arranged side by side, and a second shielding plate is inserted between two adjacent mounting cavities in the housing. The second shielding plate is positioned between two adjacent insert modules, and the front end of the second shielding plate abuts against the conductive foam.

[0013] In one alternative embodiment, a connecting arm extends from the front end of the second shielding plate, and the end face of the connecting arm is bent to form a contact portion, through which the second shielding plate abuts against the conductive foam.

[0014] In one alternative embodiment, the second shielding plate has a main body portion, the main body portion being constructed as a large surface area, the connecting arm being formed by the front end of the main body portion protruding forward, the connecting arm and the main body portion being integrally constructed as a convex structure, and the second shielding plate being interfering and secured to the rubber shell through the peripheral edge of the main body portion.

[0015] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects: In the embodiments of this disclosure, the connector includes a front shell and a rear shell, and a plastic shell with a mounting cavity and a slot is located between the front shell and the rear shell. The mounting cavity is provided with a ferrule module. The ferrule module includes an upper module, a lower module and a circuit board. The upper module includes an upper terminal assembly and the lower module includes a lower terminal assembly. The upper terminal assembly and the lower terminal assembly are correspondingly disposed on the upper and lower sides of the front end of the circuit board.

[0016] To shield signal interference between the upper and lower terminal assemblies, a shielding loop electrically connected to the circuit board's ground terminal is formed between the front housing and the circuit board. Specifically, a first conductive layer is disposed inside the circuit board, contacting the circuit board's ground terminal and positioned between the upper and lower terminal assemblies. A second conductive layer is laid on the front surface of the circuit board, connected to the first conductive layer. The first conductive layer of the circuit board is positioned between the upper and lower terminal assemblies and protrudes from the front side of the housing. Conductive foam is extruded between the second conductive layer and the inner surface of the front housing. Thus, the front housing is electrically connected to the circuit board's ground terminal sequentially through the conductive foam, the second conductive layer, and the first conductive layer, forming a shielding loop for shielding signal interference between the upper and lower terminal assemblies.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] One or more embodiments are illustrated by way of example with the corresponding pictures in the accompanying drawings. These illustrative descriptions do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the scale presented in the drawings is only one embodiment, and other embodiments are not necessarily implemented to scale.

[0021] Figure 1 This is a schematic diagram of the overall assembly structure of the connector provided in an embodiment of this application; Figure 2 This is an exploded view of the connector provided in an embodiment of this application; Figure 3 A schematic diagram illustrating the interaction structure between the first shielding plate, circuit board, conductive foam, and front shell provided in an embodiment of this application; Figure 4 A schematic diagram illustrating the interaction structure between the second shielding plate, conductive foam, and front shell provided in an embodiment of this application; Figure 5This is an exploded structural diagram of the ferrule module provided in the embodiments of this application.

[0022] Explanation of reference numerals in the attached figures: 1. Front shell; 2. Rear shell; 3. Plastic shell; 31. Mounting cavity; 4. Insert module; 41. Upper module; 42. Lower module; 411. Circuit board; 411A. Double-layer copper structure; 411B. Dielectric layer; 411C. Insertion structure; 412. Upper terminal assembly; 413. Upper connecting part; 421. Lower connecting part; 422. Lower terminal assembly; 5. First conductive layer; 6. Second conductive layer; 7. Conductive foam; 8. First shielding plate; 81. Insert structure; 9. Second shielding plate; 91. Connecting arm; 91A. Contact part; 92. Main body. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0025] For ease of description, spatial relative terms may be used in this text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptions used in this text have been explained accordingly.

[0026] In order to solve the technical problems in the prior art, reference is made to... Figures 1-5 This disclosure provides a connector.

[0027] In this embodiment of the present disclosure, the connector includes a front shell 1 and a rear shell 2, and a plastic shell 3 with a mounting cavity 31 located between the front shell 1 and the rear shell 2. The mounting cavity 31 is provided with a ferrule module 4. The ferrule module 4 includes an upper module 41, a lower module 42, and a circuit board 411. The upper module 41 includes an upper terminal assembly 412, and the lower module 42 includes a lower terminal assembly 422. The upper terminal assembly 412 and the lower terminal assembly 422 are correspondingly disposed on the upper and lower sides of the front end of the circuit board 411. The circuit board 411 has a first conductive layer 5 inside, which is connected to the ground terminal of the circuit board. The front end face of the circuit board 411 has a second conductive layer 6, which is connected to the first conductive layer 5. The first conductive layer 5 of the circuit board 411 is positioned between the upper terminal assembly 412 and the lower terminal assembly 422. The second conductive layer 6 of the circuit board 411 protrudes from the front side of the housing 3. Conductive foam 7 is squeezed between the second conductive layer 6 and the inner side of the front housing 1. The front housing 1 is electrically connected to the ground terminal of the circuit board in sequence through the conductive foam 7, the second conductive layer 6, and the first conductive layer 5 to form a shielding loop for shielding signal interference between the upper terminal assembly 412 and the lower terminal assembly 422.

[0028] In order to shield the signal interference between the upper terminal assembly 412 and the lower terminal assembly 422, a shielded loop electrically connected to the ground terminal is formed between the front shell 1 and the circuit board 411. Specifically, a first conductive layer 5 is laid inside the circuit board 411 and is connected to the ground terminal of the circuit board. A second conductive layer 6 is laid on the front end face of the circuit board 411 and is connected to the first conductive layer 5. The first conductive layer 5 of the circuit board 411 is positioned between the upper terminal assembly 412 and the lower terminal assembly 422, that is, the first conductive layer 5... Layer 5 extends from the front end face of circuit board 411 to the rear end face of circuit board 411. The front end face is located near the upper terminal assembly 412. At the same time, the second conductive layer 6 of circuit board 411 protrudes from the front side of the housing 3. Conductive foam 7 is squeezed between the second conductive layer 6 and the inner side of the front housing 1. In this way, the front housing 1 is electrically connected to the ground terminal of circuit board 411 in sequence through conductive foam 7, second conductive layer 6, and first conductive layer 5 to form a shielding loop for shielding signal interference between the upper terminal assembly 412 and the lower terminal assembly 422.

[0029] Specifically, the connector described in this disclosure adopts a composite architecture consisting of a housing, an insulating support, a conductive connection module, and a shielding reinforcement. Its core components include a housing assembly, an insulating support, a multi-layer conductive terminal assembly, a circuit board 411 with integrated shielding function, and conductive connectors. The housing assembly includes a front housing and a rear housing arranged opposite to each other, which form a closed mounting space through the insulating support (corresponding to the plastic shell 3). The insulating support has a mounting cavity 31 inside for accommodating the multi-layer conductive terminal assembly.

[0030] Specifically, the circuit board 411 with integrated shielding function is the core shielding carrier. It has a main conductive shielding layer (corresponding to the first conductive layer 5) inside. The main conductive shielding layer extends continuously along the axial direction of the circuit board 411 (from the front end face to the rear end face) and is directly connected to the grounding terminal of the circuit board. The front end face of the circuit board 411 has a front conductive shielding layer - the second conductive layer 6. The front conductive shielding layer (the second conductive layer 6) is electrically connected to the main conductive shielding layer (the first conductive layer 5) and partially protrudes from the front side of the insulating carrier. The front shell and the front conductive shielding layer are pressed together by an elastic conductive connector (corresponding to the conductive foam 7) to form a conductive path between the shell assembly and the shielding layer of the circuit board 411.

[0031] In summary, a cross-layer shielding effect is formed between the upper terminal assembly 412 and the lower terminal assembly 422. Through the closed shielding loop formed by the housing assembly, the elastic conductive connector, the front conductive shielding layer, the main conductive shielding layer, and the grounding terminal of the circuit board 411, signal isolation between the upper terminal assembly 412 and the lower terminal assembly 422 is achieved. Specifically, the front housing acts as the external shielding carrier, maintaining tight conductive contact with the front conductive shielding layer of the circuit board 411 via the elastic conductive connector. The front conductive shielding layer, utilizing the axial extension characteristics of the main conductive shielding layer, forms a low-impedance path with the grounding terminal. This allows electromagnetic interference generated during signal transmission between the upper terminal assembly 412 and the lower terminal assembly 422 to be guided to the grounding terminal through this loop, effectively blocking the propagation path of cross-layer interference signals.

[0032] Considering the specific structural scheme of the first conductive layer 5, in the connector scheme provided in the embodiments of this application, the first conductive layer 5 is constructed as a double-layer copper structure 411A, and a dielectric layer 411B is sandwiched inside the double-layer copper structure 411A.

[0033] Thus, based on the aforementioned multi-path grounding shielding loop, this application further enhances the overall performance of the shielding system by constructing the first conductive layer 5 as a double-layer copper structure 411A (with a dielectric layer 411B sandwiched between the two copper layers). Specifically, the double-layer copper structure 411A serves as the core carrier of the main conductive shielding layer, exhibiting higher conductivity continuity and electromagnetic reflection efficiency compared to a single-layer conductive structure. The two copper layers achieve physical isolation through the dielectric layer 411B while maintaining the integrity of the overall conductive path. When signals are transmitted between the upper terminal assembly 412 and the lower terminal assembly 422, the generated electromagnetic interference penetrates into the circuit board 411. The first copper layer can initially reflect and absorb the interference signal. Residual interference signals that are not completely blocked are reflected and shielded again by the second copper layer after passing through the dielectric layer 411B, forming a double barrier effect. This layered shielding scheme significantly reduces the probability of interference signals penetrating the conductive layer, especially its blocking effect on high-frequency signal interference, effectively enhancing the signal isolation between the upper terminal assembly 412 and the lower terminal assembly 422. Furthermore, the clamping arrangement of the dielectric layer 411B allows for adjustment of the equivalent impedance of the double-layer copper structure 411A, resulting in better impedance matching with the ground terminal of the circuit board 411 and other conductive layers (the second conductive layer 6 and the subsequent first shielding plate 8). During signal transmission, impedance mismatch can easily lead to signal reflection and energy loss. By adjusting the dielectric constant of the dielectric layer 411B, the impedance characteristics of the double-layer copper structure 411A can form a continuous low-impedance path with the conductive foam 7 and other conductive layers in the shielding circuit, reducing signal attenuation and secondary radiation of interference signals in the shielding circuit. Simultaneously, the high conductivity of the double-layer copper structure 411A ensures a low resistance value in the shielding circuit, allowing interference signals to quickly pass through the first conductive layer 5 to the ground terminal, thus improving the shielding response speed.

[0034] Furthermore, the composite structure of the double-layer copper structure 411A sandwiching the dielectric layer 411B gives the first conductive layer 5 higher structural strength and resistance to deformation. During connector assembly, such as the pressing fit between the front shell 1 and the housing 3, and the insertion and removal operations of the terminal modules, the circuit board 411 is susceptible to mechanical stress. The double-layer copper structure 411A, through the buffering effect of the dielectric layer 411B, can reduce the risk of cracking or detachment of the copper layer, ensuring that the continuity of the main conductive shielding layer is not affected by mechanical damage. In addition, this structure has stronger resistance to environmental factors. The dielectric layer 411B can reduce the stress concentration of the copper layer caused by thermal expansion and contraction, maintain stable contact between the shielding layer and each conductive component, and ensure the long-term effective operation of the shielding circuit under complex working conditions.

[0035] In addition, the first conductive layer 5, as the core hub connecting the front shielding circuit (front shell 1 - conductive foam 7 - second conductive layer 6) and the connecting shielding circuit (subsequent first shielding plate 8), utilizes the high conductivity of its double-layer copper structure 411A to efficiently converge and guide interference signals from each branch shielding circuit to the grounding terminal. The front electromagnetic interference captured by the front shielding circuit and the intra-layer crosstalk signals blocked by the connecting shielding circuit are all rapidly conducted to the grounding terminal through the double-layer copper structure 411A, avoiding the problem of interference signal retention caused by excessively high resistance of a single conductive layer. Simultaneously, the large-area coverage of the double-layer copper structure 411A (extending from the front surface A of the circuit board 411 to the rear surface B) ensures the shortest signal transmission path for each shielding node, further reducing energy loss of interference signals during transmission.

[0036] Considering the specific structural scheme in which the first conductive layer 5 and the second conductive layer 6 are formed on the circuit board 411, in the connector scheme provided in this application embodiment, the second conductive layer 6 is fully bonded and laid along the front end surface of the circuit board 411, the first conductive layer 5 is fully laid along the board surface of the circuit board 411, and the first conductive layer 5 extends out of the front end surface of the circuit board 411 and connects with the second conductive layer 6.

[0037] Thus, by fully bonding the second conductive layer 6 along the front surface A of the circuit board 411, the front-end protection performance and signal anti-interference capability of the shielding system are further improved, and a complete shielding coverage of the front area of ​​the circuit board 411 is achieved. Since the front surface of the circuit board 411 is located close to the upper terminal assembly 412, this area is the initial interaction zone for signal transmission between the upper terminal assembly 412 and the lower terminal assembly 422, and is prone to high-frequency signal radiation and electromagnetic interference. The fully bonded second conductive layer 6 can transform the entire front surface into a shielding interface, forming a planar barrier against outward radiated interference signals generated at the front end between the upper terminal assembly 412 and the lower terminal assembly 422. Furthermore, the fully bonded structure of the second conductive layer 6 allows the portion of the front surface A of the circuit board 411 protruding from the front of the housing 3 to form a continuous and complete conductive plane, enabling large-area uniform compression contact between this plane and the conductive foam 7 between the inner surface of the front housing 1. Meanwhile, the second conductive layer 6, which is fully laid across the entire area, forms a conductive convergence surface in the front end region, which can efficiently gather and guide the electromagnetic interference transmitted by the front shell 1 through the conductive foam 7 and the interference signals generated by the front end surface A itself to the first conductive layer 5.

[0038] Meanwhile, by laying the first conductive layer 5 across the entire surface of the circuit board 411 and extending it to connect the front end of the circuit board 411 with the second conductive layer 6, a full-area conductive path combining the shielding system's board layer and front end is further constructed. This not only strengthens the electromagnetic protection capability of the core area of ​​the circuit board 411 but also achieves seamless connection between the board layer shielding and the front end shielding, effectively solving the problems of interference leakage and circuit breakage that are prone to occur in traditional segmented conductive layers.

[0039] Since the board surface of circuit board 411 is the carrier for component layout, signal routing, and core signal transmission between upper terminal assembly 412 and lower terminal assembly 422, this area not only contains a large number of active components that are prone to electromagnetic radiation, but also undertakes the key function of signal relay between the two terminal assemblies, making it a major source of electromagnetic interference and a sensitive receiving area. The first conductive layer 5, which is laid across the entire board surface, can transform the entire board surface into a uniform and continuous shielding barrier. Firstly, it can block external electromagnetic interference from intruding into sensitive circuits within the board surface, such as signal transmission lines and active components. Secondly, it can suppress high-frequency signals radiated outward from components within the board surface, achieving bidirectional shielding protection for the core signal transmission area and significantly reducing the risk of crosstalk between upper terminal assembly 412 and lower terminal assembly 422 caused by board surface interference.

[0040] Furthermore, the design of the first conductive layer 5 extending from the front end of the circuit board 411 and connecting with the second conductive layer 6 creates a seamless conductive connection between the board-level shielding structure and the front end shielding structure. The second conductive layer 6 needs to be pressed into contact with the conductive foam 7 on the inner side of the front shell 1, thereby conducting through the first conductive layer 5 to the ground terminal of the circuit board. This direct connection completely eliminates the gap between the board layer and the front end, preventing interference signals from leaking or intruding through the gap. Simultaneously, this extended connection also ensures the low impedance characteristics of the shielding circuit.

[0041] Furthermore, the structure of the first conductive layer 5, which is laid across the entire board surface, forms a conductive busbar covering the entire area of ​​the circuit board 411. This busbar not only gathers electromagnetic interference generated in various areas within the board layer, but also receives interference signals from the connection portion of the first shielding plate 8. Through the connection path extending to the front end, it concentrates and guides multi-source interference to the second conductive layer 6 and the front shielding structure, achieving a highly efficient shielding mode that combines multiple interference sources with single-path guidance, further enhancing the connector's anti-interference stability in high-speed signal transmission scenarios.

[0042] Considering the specific installation scheme between the second conductive layer 6, the conductive foam 7 and the outer shell, in the connector scheme provided in this application embodiment, a gap is left between the second conductive layer 6 and the inner side of the front shell 1, the normal thickness of the conductive foam 7 is greater than the thickness of the gap, and the conductive foam 7 is squeezed and disposed in the gap.

[0043] Thus, the structural design, which involves a pre-existing gap between the second conductive layer 6 and the inner surface of the front shell 1, and a conductive foam 7 with a normal thickness greater than the gap size and installed through compression, further optimizes the conductive connection reliability and shielding effect stability of the front-end shielding circuit. Firstly, the pre-existing gap between the second conductive layer 6 and the inner surface of the front shell 1, with the conductive foam 7 having a normal thickness greater than this gap, allows the conductive foam 7 to undergo elastic deformation under compression within this gap after connector assembly. This ensures a tight fit between the second conductive layer 6 and the inner surface of the front shell 1, eliminating contact gaps caused by machining tolerances or assembly errors. This interference fit design allows the conductive foam 7 to form multi-point surface contact with the two contact surfaces, effectively reducing contact impedance compared to gapless rigid contact. Secondly, the elastic deformation characteristics of the conductive foam 7 can dynamically compensate for relative displacement caused by vibration and temperature changes during connector use. When the connector is affected by vibration or thermal expansion and contraction, the gap between the second conductive layer 6 and the inner surface of the front shell 1 may fluctuate. However, the interference-fit conductive foam 7 can maintain a tight fit with the two contact surfaces through its own elasticity, preventing momentary open circuits or impedance changes in the shielding circuit. Furthermore, the interference-extruded conductive foam 7 can fill the microscopic unevenness of the contact surface, reducing contact problems caused by surface roughness and forming a continuous conductive path between the front shell 1, the conductive foam 7, and the second conductive layer 6. This reliable connection ensures efficient conduction of electromagnetic interference by the front shielding circuit, preventing interference signals from radiating or reflecting at the contact breakpoint, further improving the integrity of signal transmission. At the same time, the reserved gap and interference-extruded design reduce the requirements for component machining precision. During assembly, it is not necessary to precisely align the second conductive layer 6 with the inner side of the front shell 1. The elastic deformation of the conductive foam 7 can automatically adapt to assembly deviations, reducing assembly and debugging time. In addition, the extrusion installation method of the conductive foam 7 facilitates automated assembly and is suitable for mass production. In addition, the second conductive layer 6 protrudes from the front side of the housing 3. If it is in rigid contact with the front shell 1, the impact force during assembly may cause the front end of the circuit board 411 or the second conductive layer 6 to crack or fall off. The reserved gap, combined with the design of the elastic conductive foam 7, can absorb the impact force during the assembly process through the deformation of the conductive foam 7, and avoid stress concentration causing mechanical damage to the circuit board 411 and the conductive layer.

[0044] In summary, the gap reservation and interference fit design between the second conductive layer 6, conductive foam 7 and the front shell 1 further consolidate the stability of the front shielding circuit by optimizing contact reliability, compensating for dynamic displacement, enhancing anti-interference ability, simplifying assembly process and protecting structural integrity. Together with the full-area laying of the second conductive layer 6 and the double-layer copper structure 411A of the first conductive layer 5, the shielding performance of the connector is fully guaranteed under complex working conditions.

[0045] Considering practical application scenarios, in the upper module 41, the upper terminal assembly 412 is generally electrically connected to the upper connecting part 413, and in the lower module 42, the lower terminal assembly 422 is generally connected to the lower connecting part 421. Considering the signal shielding scheme between the upper connecting part 413 and the lower connecting part 421, in the connector provided in this embodiment, the upper module 41 includes an upper connecting part 413 electrically connected to the upper terminal assembly 412, and the lower module 42 includes a lower connecting part 421 electrically connected to the lower terminal assembly 422. The upper connecting part 413 and the lower connecting part 421 are located on the lower side of the rear end of the circuit board 411. A first shielding plate 8 is sandwiched between the upper connecting part 413 and the lower connecting part 421. The first shielding plate 8 is inserted into the circuit board 411 and connected to the first conductive layer 5. The first shielding plate 8 is electrically connected to the ground terminal of the circuit board through the first conductive layer 5.

[0046] That is, based on the aforementioned signal shielding scheme between the upper terminal assembly 412 and the lower terminal assembly 422, in order to simultaneously shield the signal interference between the upper and lower protruding terminals of the upper connecting part 413, a shielding loop electrically connected to the ground terminal of the circuit board is formed between the circuit board 411 and the gap between the upper connecting part 413 and the lower connecting part 421. In other words, the first shielding plate 8 is inserted into the circuit board 411 and connected to the main conductive shielding layer (that is, the first conductive layer 5), forming a shielding reinforcement structure in the connecting part area.

[0047] In conjunction with the aforementioned solutions, this disclosure achieves efficient suppression of signal interference in multiple areas within the connector by constructing a multi-path grounding shielding loop, significantly improving the stability and reliability of signal transmission. Its core shielding principle is based on the full coverage of the conductive shielding layer and the low-resistance connection of the grounding path. Regarding the in-layer shielding effect in the connection area, the first shielding plate 8, acting as an intervening conductive shielding layer, forms a local shielding loop with the circuit board grounding terminal through the first conductive layer 5, which acts as the main conductive shielding layer, thus resolving the signal crosstalk problem between the rear-end connection and matching connection between the upper terminal assembly 412 and the lower terminal assembly 422. The first shielding plate 8 is inserted into the connection gap and directly connected to the first conductive layer 5. The grounding path of the first conductive layer 5 diverts interference signals from the connection area to the grounding terminal, forming a directional shielding barrier for high-density connection areas, preventing signal interference caused by excessively close distance between the protruding terminals of the upper and lower connection parts.

[0048] Considering the connection structure scheme between the first shielding plate 8 and the circuit board 411, in the connector scheme provided in this application embodiment, the top of the first shielding plate 8 has a insert structure 81, and the circuit board 411 is correspondingly provided with a socket structure 411C. The insert structure 81 and the socket structure 411C are matched and inserted, and connected to the first conductive layer 5.

[0049] In this way, by setting the insert structure 81 on the top surface of the first shielding plate 8 and the corresponding socket structure 411C on the circuit board 411 to achieve a matching and mating connection, the conductivity continuity and structural stability of the shielding circuit of the connection part are further enhanced. First, the first shielding plate 8 forms a connection method that integrates mechanical fixation and electrical connection through the matching and mating of the insert structure 81 and the socket structure 411C of the circuit board 411. The tight fit between the insert and the socket ensures direct contact between the first shielding plate 8 and the first conductive layer 5 inside the circuit board 411. Compared with the traditional pasting or soldering method, this effectively reduces contact resistance and avoids impedance increase problems caused by loose connection. In addition, the mating structure of the insert and the socket forms a rigid fixation through mechanical interlocking, making the first shielding plate 8 less prone to displacement or detachment due to external forces such as vibration and impact during the use of the connector. This structural setting is particularly suitable for scenarios with frequent mechanical stress and can maintain the shielding position accuracy of the first shielding plate 8 between the upper connection part 413 and the lower connection part 421 for a long time. In addition, the tight insertion of the insert and the socket ensures full contact between the first shielding plate 8 and the first conductive layer 5, enabling the first shielding plate 8 to efficiently receive interference signals between the upper and lower connecting parts 421 and quickly guide them to the grounding terminal through the first conductive layer 5.

[0050] Compared to partial contact connections, this structure increases the conductive contact area, improves the efficiency of interference signal diversion, and further reduces signal crosstalk between the upper and lower protruding terminals of the upper connection part 413. In addition, the mating structure of the insert and socket has strong assembly guidance; during connector assembly, the insert can be precisely positioned along the socket without complex alignment adjustments.

[0051] Compared to connection methods such as welding that require specialized equipment, this structure reduces reliance on operator skills. Simultaneously, the insertion structure of the insert and socket has a certain elastic deformation space. Under high and low temperature cycling environments, it can compensate for the difference in thermal expansion and contraction between the first shielding plate 8 and the circuit board 411 through minute structural deformation, avoiding loosening or breakage of the connection due to differences in material expansion coefficients, thereby ensuring the continuity of the shielding circuit under extreme temperatures.

[0052] In summary, the plug-in and socket matching structure of the first shielding plate 8 and the circuit board 411 further improves the performance of the shielding circuit of the connection part by enhancing the reliability of electrical connection, strengthening structural stability, optimizing shielding effectiveness, simplifying assembly process and adapting to environmental changes.

[0053] Considering the specific structural scheme of the first shielding plate 8, in the connector scheme provided in this application embodiment, the first shielding plate 8 is covered in the large area between the upper connecting part 413 and the lower connecting part 421 along the vertical direction.

[0054] For example, the first shielding plate 8 may be sandwiched between the upper connecting part 413 and the lower connecting part 421.

[0055] In this way, the first shielding plate 8 forms a full coverage of the main signal coupling area between the upper and lower connecting parts 421 along the vertical direction, constructing a continuous shielding barrier system that penetrates the gap. This upgrades the discrete protection of traditional local shielding to holistic electromagnetic isolation, physically blocking the spatial propagation path of interference signals and significantly reducing the probability of signal coupling. At the same time, the large-area coverage structure and the plug-in conductive connection of the circuit board 411 form a matched application, allowing the large area to quickly gather the surrounding electromagnetic interference energy. Combined with the low-resistance conduction path of the grounding system, it achieves centralized grounding release, upgrading the shielding circuit from single-point conduction to an integrated system of full-area collection and low-resistance diversion, enhancing the directional conduction capability of interference signals.

[0056] Considering the structural scheme in which the second shielding plate 9 forms a signal shield between two adjacent slots 32 of the housing 3, in the connector scheme provided in this application embodiment, the mounting cavity 31 has several arranged side by side, the second shielding plate 9 is inserted between two adjacent mounting cavities 31 in the housing 3, the second shielding plate 9 is blocked between two adjacent core modules 4, and the front end of the second shielding plate 9 abuts against the conductive foam 7.

[0057] Thus, the mounting cavities 31 have several arranged side by side, which can adapt to the needs of multi-port signal transmission. The second shielding plate 9 inserted between two adjacent mounting cavities 31 in the housing 3 can directly block the space between two adjacent ferrule modules 4. In this way, a vertical shielding barrier is constructed from a physical structure, blocking the lateral electromagnetic interference generated by adjacent ferrule modules 4 during signal transmission, such as near-end crosstalk (NEXT) and far-end crosstalk (FEXT) between ports, and avoiding interference coupling problems caused by the close spacing of ferrule modules 4 when transmitting multiple ports in parallel. At the same time, the front end of the second shielding plate 9 is connected to the conductive The foam 7 is not isolated; rather, it can be connected to the overall shielding circuit of the connector through the conductive foam 7. Combined with the aforementioned scheme, the front shell 1 is electrically connected to the grounding terminal of the circuit board in sequence through the conductive foam 7, the second conductive layer 6, and the first conductive layer 5. The second shielding plate 9 can conduct the interference signal intercepted between adjacent ferrule modules 4 to the conductive foam 7 through contact with it, and then efficiently guide it to the grounding terminal of the circuit board through the aforementioned shielding circuit, thereby realizing the directional release of the interference signal. This upgrades the second shielding plate 9 from a single physical barrier to a dual shielding structure that combines barrier and current diversion.

[0058] Considering the specific connection scheme between the second shielding plate 9 and the conductive foam 7, in the connector scheme provided in the embodiment of this application, a connecting arm 91 extends from the front end of the second shielding plate 9, and the end face of the connecting arm 91 is bent to form a contact portion 91A. The second shielding plate 9 abuts against the conductive foam 7 through the contact portion 91A.

[0059] Thus, a connecting arm 91 extends from the front end of the second shielding plate 9. This connecting arm 91 can adapt to the compact space of the adjacent mounting cavities 31 inside the housing 3, ensuring that the second shielding plate 9 can achieve precise alignment with the conductive foam 7 without interfering with other components. At the same time, the end face of the connecting arm 91 is bent into a contact part 91A. The bent structure increases the contact area with the conductive foam 7 and can adapt to the compression deformation characteristics of the conductive foam 7 through its own shape, ensuring that the two are always tightly fitted and effectively reducing contact resistance. On this basis, the second shielding plate 9 abuts against the conductive foam 7 through the contact part 91A, which can stably conduct the electromagnetic interference signals intercepted between adjacent ferrule modules 4 to the conductive foam 7, and further integrate into the overall shielding circuit of the front housing 1, conductive foam 7, second conductive layer 6, first conductive layer 5, and circuit board grounding terminal, so that the interference signal is efficiently guided to the grounding terminal, avoiding interference leakage problems caused by poor contact between the second shielding plate 9 and conductive foam 7, and further strengthening the signal isolation effect between adjacent mounting cavities 31.

[0060] Considering the specific structural scheme of the second shielding plate 9, in the connector scheme provided in this application embodiment, the second shielding plate 9 has a main body 92, the main body 92 is constructed as a large area, the connecting arm 91 is formed by the front end of the main body 92 protruding forward, the connecting arm 91 and the main body 92 are integrally constructed as a convex structure, and the second shielding plate 9 is fixed to the plastic shell 3 by interference through the peripheral edge of the main body 92.

[0061] Thus, the second shielding plate 9 has a main body 92 with a large surface area, which can fully cover the gap between two adjacent mounting cavities 31 in the housing 3, forming a through-type large-area shielding barrier. This barrier can effectively intercept electromagnetic interference generated by adjacent ferrule modules 4 during high-speed signal transmission, such as crosstalk between ports, and prevent interference signals from propagating through the gap between adjacent mounting cavities. The connecting arm 91, with its convex integral structure formed by the forward extension of the front end of the main body 92, can precisely extend the connecting arm 91 to the position corresponding to the conductive foam 7, ensuring that the contact portion 91A of its end face is stably abutted against the conductive foam 7, realizing reliable conduction between the second shielding plate 9 and the front shielding circuit. This shielding circuit consists of the front housing 1, the conductive foam 7, and the second conductive layer. 6. The shielding circuit formed by the first conductive layer 5 and the grounding terminal of the circuit board can also avoid interference between the connecting arm 91 and components such as the housing 3 and the ferrule module 4 through the spatial layout of the convex structure, adapting to the compact assembly space inside the connector; at the same time, the second shielding plate 9 is fixed by interference between the peripheral edge of the main body 92 and the housing 3, achieving stable installation without additional fasteners. This not only simplifies the assembly process, but also prevents the second shielding plate 9 from shifting or loosening due to vibration, temperature changes, and other factors during the use of the connector. This ensures that the large shielding area of ​​the main body 92 is always accurately aligned with the gap between adjacent mounting cavities, and that the contact between the connecting arm 91 and the conductive foam 7 is always reliable, thereby ensuring that the second shielding plate 9 can stably perform its shielding and interference diversion functions for a long time.

[0062] Embodiments of this disclosure also provide a multi-port signal transmission device, including the connector described above.

[0063] The multi-port signal transmission device provided in this disclosure significantly improves signal stability and anti-interference capability in multi-channel parallel transmission scenarios by integrating the aforementioned optimized connector design. The connectors at each port utilize multiple designs, including full-area shielding of the first conductive layer 5, tight fit between the second conductive layer 6 and conductive foam 7, isolation at the connection points of the first shielding plate 8, and shielding between the second shielding plates 9, to construct a three-dimensional shielding network covering the entire signal transmission path. This effectively suppresses signal crosstalk within and between ports, enabling the device to maintain a low bit error rate signal transmission state even with a high-density port layout. Meanwhile, the optimized layout and reliable connection design of each conductive layer in the connector provide strong support for the miniaturization and integration of multi-port signal transmission equipment. The convex structure of the second shielding plate 9 and the mating connection of the first shielding plate 8 enhance shielding performance while achieving a compact spatial layout, enabling the equipment to integrate more ports within a limited volume.

[0064] The product provided in this application embodiment can meet the relevant characteristic requirements of Category 6A for multi-port products. It adds a double-layer isolation ground plane on the upper and lower PORT PCBs, ensuring this ground plane contacts the metal casing and includes a spacer between the upper and lower port terminals, connecting this ground plane to the double-layer isolation ground plane on the PCB. Furthermore, since the PCBs are designed with an even number of layers, a double-layer copper pour is used. This double-layer copper pour is a core method for balancing electrical performance, heat dissipation, and mechanical reliability in double-layer circuit board design. Essentially, it constructs a virtual ground or power plane by connecting large areas of copper foil and vias between the top and bottom layers. The double-layer copper pour ensures that the distance between the upper and lower PCB layers and the intermediate GND (ground plane) is the same, resulting in better shielding. The copper pour extends to the front end of the PCB to contact the conductive foam 7. Additionally, vias are provided around the perimeter of the PCB to achieve equipotentiality between the upper and lower ground layers. However, to simultaneously meet the voltage withstand requirements between signal lines and ground, the vias and signal lines need to be spaced apart, as too many vias cannot be placed around the perimeter. In addition, left and right partitions are added between two adjacent card slots 32, and these partitions are made to contact the iron shell to increase the anti-crosstalk characteristics between ports.

[0065] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0066] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0067] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A connector, characterized in that: The device includes a front shell and a rear shell, and a plastic shell with a mounting cavity located between the front shell and the rear shell. The mounting cavity is provided with a ferrule module. The ferrule module includes an upper module, a lower module, and a circuit board. The upper module includes an upper terminal assembly, and the lower module includes a lower terminal assembly. The upper terminal assembly and the lower terminal assembly are correspondingly disposed on the upper and lower sides of the front end of the circuit board. The circuit board has a first conductive layer inside, which is connected to the grounding terminal of the circuit board. The front end of the circuit board has a second conductive layer, which is connected to the first conductive layer. The first conductive layer of the circuit board is positioned between the upper terminal assembly and the lower terminal assembly. The second conductive layer of the circuit board protrudes from the front side of the housing. Conductive foam is extruded between the second conductive layer and the inner side of the front housing. The front housing is electrically connected to the grounding terminal of the circuit board in sequence through the conductive foam, the second conductive layer, and the first conductive layer.

2. The connector according to claim 1, characterized in that, The first conductive layer is constructed as a double-layer copper structure, with a dielectric layer sandwiched within the double-layer copper structure.

3. The connector according to claim 1, characterized in that, The second conductive layer is fully bonded and laid along the front end face of the circuit board, and the first conductive layer is fully laid along the board surface of the circuit board. The first conductive layer extends out of the front end face of the circuit board and connects with the second conductive layer.

4. The connector according to claim 1, characterized in that, A gap is left between the second conductive layer and the inner side of the front shell. The normal thickness of the conductive foam is greater than the thickness of the gap, and the conductive foam is squeezed into the gap.

5. The connector according to claim 1, characterized in that, The upper module includes an upper connecting portion electrically connected to the upper terminal assembly, and the lower module includes a lower connecting portion electrically connected to the lower terminal assembly. The upper connecting portion and the lower connecting portion are located on the lower side of the rear end of the circuit board. A first shielding plate is sandwiched between the upper connecting portion and the lower connecting portion. The first shielding plate is inserted into the circuit board and connected to the first conductive layer. The first shielding plate is electrically connected to the ground terminal of the circuit board through the first conductive layer.

6. The connector according to claim 5, characterized in that, The first shielding plate has a protruding insert structure at its top, and the circuit board has a corresponding socket structure. The insert structure matches and inserts into the socket structure and is connected to the first conductive layer.

7. The connector according to claim 5, characterized in that, The first shielding plate is applied along the vertical direction to the large area between the upper connecting part and the lower connecting part.

8. The connector according to claim 1, characterized in that, The mounting cavity has several arranged side by side. A second shielding plate is inserted between two adjacent mounting cavities in the housing. The second shielding plate is positioned between two adjacent insert modules, and the front end of the second shielding plate abuts against the conductive foam.

9. The connector according to claim 8, characterized in that, The second shielding plate has a connecting arm extending from its front end. The end face of the connecting arm is bent to form a contact portion, through which the second shielding plate abuts against the conductive foam.

10. The connector according to claim 9, characterized in that, The second shielding plate has a main body, which is a large surface area. The connecting arm extends forward from the front end of the main body. The connecting arm and the main body are integrally convex. The second shielding plate is fixed to the plastic shell by interference through the peripheral edge of the main body.

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