Laser cooling devices, lasers and laser processing equipment

Abstract

This utility model belongs to the field of laser technology and discloses a laser cooling device, a laser, and laser processing equipment. The laser cooling device includes a liquid cooling plate assembly and a liquid cooling radiator assembly. The liquid cooling plate assembly is configured to be thermally connected to a first heat source of the laser for cooling the first heat source, which includes a pump source. The liquid cooling radiator assembly includes a liquid cooling radiator, which is configured to be thermally connected to a second heat source of the laser for cooling the second heat source, which includes an optical fiber disk. Coolant circulates between the liquid cooling plate assembly and the liquid cooling radiator. This laser cooling device can reduce the heat dissipation pressure of the liquid cooling plate assembly, achieve separate heat dissipation for the pump source and the optical fiber disk, and eliminate the need for a traditional chiller unit. It has the effects of reducing costs, reducing size, and eliminating additional connecting pipelines.

Description

Technical Field

[0001] This utility model relates to the field of laser technology, and in particular to a laser cooling device, a laser, and laser processing equipment. Background Technology

[0002] Currently, laser cooling on the market comes in two forms: liquid cooling and air cooling. The disadvantages of liquid cooling are that it requires an additional chiller unit, which is costly, bulky, and requires additional external piping. In addition, when using liquid cooling, the fiber optic disk and pump source, among other heat dissipation components, are usually mounted on the same liquid cooling plate. This method can lead to excessive heat concentration, causing excessive heat dissipation pressure on the liquid cooling plate.

[0003] Therefore, there is an urgent need to propose a laser cooling device and laser system to solve the above-mentioned technical problems. Utility Model Content

[0004] The first objective of this invention is to provide a laser cooling device that can reduce the heat dissipation pressure of the liquid cooling plate assembly, enable separate heat dissipation for the pump source and fiber disk, and eliminate the need for a traditional chiller unit. This device reduces costs, decreases size, and eliminates the need for additional connecting pipes.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] Laser cooling device, including:

[0007] A liquid cooling plate assembly is configured to be thermally connected to a first heat source of the laser and to cool the first heat source, which includes a pump source.

[0008] A liquid cooling radiator assembly includes a liquid cooling radiator configured to be thermally connected to a second heat source of the laser and used to cool the second heat source, which includes an optical fiber disk. Coolant circulates between the liquid cooling plate assembly and the liquid cooling radiator.

[0009] Optionally, the liquid cooling radiator includes a first main pipe, a second main pipe, a liquid inlet, a liquid outlet, multiple heat exchange tubes, and multiple fins, with fins provided between each pair of adjacent heat exchange tubes;

[0010] The liquid inlet is located on the first main pipe, and the liquid outlet is located on the second main pipe. The two ends of the heat exchange tube are connected to the first main pipe and the second main pipe, respectively.

[0011] Alternatively, both the inlet and outlet are located on the first main pipe. The first main pipe is equipped with a baffle plate, which divides the interior of the first main pipe into an inlet chamber and an outlet chamber. The inlet chamber is connected to the inlet, and the outlet chamber is connected to the outlet. The two ends of some heat exchange tubes are connected to the inlet chamber and the second main pipe, respectively, and the two ends of the remaining heat exchange tubes are connected to the outlet chamber and the second main pipe, respectively.

[0012] Optionally, the first manifold is configured to be thermally connected to the second heat source;

[0013] And / or, the second manifold is configured to be thermally connected to the second heat source;

[0014] And / or, of the plurality of heat exchange tubes, at least one of the outermost heat exchange tubes is configured to be thermally connected to a second heat source.

[0015] Optionally, among the multiple heat exchange tubes, at least one of the outermost heat exchange tubes is configured to be thermally connected to the second heat source. The heat exchange tube thermally connected to the second heat source is the first heat exchange tube, and the remaining heat exchange tubes are the second heat exchange tubes. The flow rate of the coolant in the first heat exchange tube is A, and the flow rate of the coolant in the second heat exchange tube is B, wherein A is greater than B.

[0016] Optionally, the first main pipe is configured to be thermally connected to the second heat source, and the inner wall of the first main pipe is provided with a first heat exchange enhancement structure;

[0017] And / or, the second manifold is configured to be thermally connected to the second heat source, and the inner wall of the second manifold is provided with a second heat exchange enhancement structure.

[0018] Optionally, the liquid cooling radiator assembly also includes a fan, with the exhaust or intake side of the fan facing the liquid cooling radiator.

[0019] Optionally, the laser cooling device also includes a circulation pump, through which coolant circulates between the liquid cooling plate assembly and the liquid cooling radiator. The duty cycle of the circulation pump is adjustable, and the duty cycle of the fan is also adjustable.

[0020] Optionally, the liquid cooling radiator also includes several heat dissipation fins, which are inserted between the first main pipe and the second main pipe, and are configured to be thermally connected to the fiber optic disk.

[0021] The second objective of this invention is to provide a laser with a liquid cooling plate assembly that has low heat dissipation pressure, enables separate heat dissipation for the pump source and fiber disk, and has low cost and small size.

[0022] To achieve this objective, the present invention adopts the following technical solution:

[0023] A laser includes a first heat source, a second heat source, and the aforementioned laser cooling device. The first heat source includes a pump source, and the second heat source includes an optical fiber disk. The first heat source is thermally connected to a liquid cooling plate assembly, and the second heat source is thermally connected to a liquid cooling radiator.

[0024] The third objective of this invention is to provide a laser processing device with a liquid cooling plate assembly that has low heat dissipation pressure, enables separate heat dissipation for the pump source and fiber disk, and has low cost and small size.

[0025] To achieve this objective, the present invention adopts the following technical solution:

[0026] Laser processing equipment, including the lasers mentioned above.

[0027] The beneficial effects of this utility model are:

[0028] The laser cooling device provided by this utility model includes a liquid cooling plate assembly and a liquid cooling radiator assembly. The liquid cooling plate assembly is thermally connected to a first heat source of the laser to cool the first heat source, which includes a pump source. The liquid cooling radiator of the liquid cooling radiator assembly is thermally connected to a second heat source of the laser to cool the second heat source, which includes an optical fiber disk. The liquid cooling plate assembly and the liquid cooling radiator respectively cool the pump source and the optical fiber disk, thereby reducing the heat dissipation pressure of the liquid cooling plate assembly.

[0029] On the other hand, the pump source and the fiber disk are cooled by liquid cooling plate assembly and liquid cooling radiator respectively, which can be used to control the temperature of the pump source and the fiber disk respectively. This is beneficial to achieve precise temperature control of the pump source and the fiber disk, and to improve the stability of laser output.

[0030] On the other hand, after absorbing heat from the first heat source in the liquid-cooled plate assembly, the coolant enters the heat exchange tubes of the liquid-cooled radiator and flows within them. The fins of the liquid-cooled radiator absorb heat from the coolant in the heat exchange tubes and transfer this heat to the surrounding environment, thereby cooling the coolant. It is evident that this laser cooling device eliminates the need for a traditional chiller unit, resulting in reduced costs, smaller size, and the elimination of additional connecting pipes. This further facilitates the stacking of related laser components, promoting the integration and miniaturization of the laser. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the laser system provided in Embodiment 1 of this utility model;

[0032] Figure 2 This is a schematic diagram of the laser cooling device provided in Embodiment 1 of this utility model;

[0033] Figure 3 This is a partial enlarged view of the liquid cooling radiator provided in Embodiment 1 of this utility model;

[0034] Figure 4 This is a schematic diagram of the liquid cooling radiator provided in Embodiment 1 of this utility model;

[0035] Figure 5 This is a schematic diagram of the structure of the first heat exchange tube provided in Embodiment 1 of this utility model;

[0036] Figure 6This is a partially enlarged structural schematic diagram of the first main pipe provided in Embodiment 1 of this utility model;

[0037] Figure 7 This is a schematic diagram of the laser cooling device provided in Embodiment 1 of this utility model;

[0038] Figure 8 This is a schematic diagram of the liquid cooling radiator provided in Embodiment 2 of this utility model;

[0039] Figure 9 This is a schematic diagram of the liquid cooling radiator provided in Embodiment 3 of this utility model;

[0040] Figure 10 yes Figure 9 Enlarged view of a section at point A in the middle;

[0041] Figure 11 This is a schematic diagram of the assembly structure of the heat dissipation fins and optical fiber disk provided in Embodiment 3 of this utility model.

[0042] In the picture:

[0043] 10. First heat source; 11. Pump source; 20. Second heat source; 21. Fiber optic disk;

[0044] 100. Liquid cooling plate assembly; 110. Liquid cooling plate; 200. Liquid cooling radiator assembly; 210. Liquid cooling radiator; 211. First main pipe; 2111. First heat exchange reinforcement structure; 212. Second main pipe; 213. Liquid inlet; 214. Liquid outlet; 215. Heat exchange tube; 2151. First heat exchange tube; 2151a. Rib; 2151b. Coolant channel; 2152. Second heat exchange tube; 216. Fins; 220. Fan; 230. Protective plate; 240. Heat dissipation fins; 300. Circulation pump. Detailed Implementation

[0045] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0046] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0047] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0048] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0049] Example 1

[0050] This embodiment provides a laser cooling device that reduces the heat dissipation pressure of the liquid cooling plate assembly and eliminates the need for a traditional chiller unit, resulting in lower costs, smaller size, and the elimination of additional connecting pipelines. This laser cooling device is suitable for various types of lasers, including fiber lasers and semiconductor lasers.

[0051] Specifically, such as Figures 1 to 3 As shown, the laser cooling device includes a liquid-cooled plate assembly 100 and a liquid-cooled radiator assembly 200. The liquid-cooled plate assembly 100 is configured to be thermally connected to a first heat source 10 of the laser and is used to cool the first heat source 10, which includes a pump source 11. The liquid-cooled radiator assembly 200 includes a liquid-cooled radiator 210, which is configured to be thermally connected to a second heat source 20 of the laser and is used to cool the second heat source 20, which includes an fiber optic disk 21. Coolant circulates between the liquid-cooled plate assembly 100 and the liquid-cooled radiator 210.

[0052] The laser cooling device provided in this embodiment uses a liquid cooling plate assembly 100 and a liquid cooling radiator 210 to cool the first heat source 10 and the second heat source 20 respectively, thereby reducing the heat dissipation pressure of the liquid cooling plate assembly 100.

[0053] On the other hand, the pump source 11 and the fiber disk 21 are cooled by the liquid cooling plate assembly 100 and the liquid cooling radiator 210, respectively. Thus, the pump source 11 and the fiber disk 21 can be temperature controlled by the liquid cooling plate assembly 100 and the liquid cooling radiator 210, which is conducive to achieving precise temperature control of the pump source 11 and the fiber disk 21 and improving the stability of laser output.

[0054] On the other hand, compared with the fiber disk 21, the pump source 11 is smaller in size. Using the liquid cooling plate assembly 100 and the liquid cooling radiator 210 to cool the pump source and the fiber disk 21 respectively helps to reduce the size and weight of the liquid cooling plate assembly 100, thereby reducing the overall size and weight of the laser cooling device, which is beneficial to the integration and miniaturization of the laser.

[0055] Finally, after absorbing heat from the first heat source 10 in the liquid cooling plate assembly 100, the coolant enters the heat exchange tube 215 of the liquid cooling radiator 210 and flows within it. The fins 216 of the liquid cooling radiator 210 absorb heat from the coolant in the heat exchange tube 215 and transfer this heat to the environment surrounding the liquid cooling radiator 210, thereby achieving cooling of the coolant. It is evident that this laser cooling device eliminates the need for a traditional chiller unit, resulting in reduced costs, smaller size, and the elimination of additional connecting pipes. This further facilitates the stacking of related laser components, promoting the integration and miniaturization of the laser.

[0056] Furthermore, the liquid cooling plate assembly 100 includes a liquid cooling plate 110, and coolant circulates between the liquid cooling plate 110 and the liquid cooling radiator 210. The number of liquid cooling plates 110 can be one, two, or more. When there is only one liquid cooling plate 110, the number of first heat sources 10 can be one or more, and all first heat sources 10 are thermally connected to the liquid cooling plate 110. When there are two or more liquid cooling plates 110, it can accommodate multiple first heat sources 10; that is, multiple liquid cooling plates 110 can be associated one-to-one with multiple first heat sources 10, with each liquid cooling plate 110 thermally connected to a corresponding first heat source 10, or several of the multiple first heat sources 10 can be thermally connected to the same liquid cooling plate 110.

[0057] It should be noted that when there are multiple liquid cooling plates 110, the multiple liquid cooling plates 110 can be connected in parallel or in series so that the coolant can circulate between the multiple liquid cooling plates 110.

[0058] In practical applications, the liquid cooling plate 110 can be made of copper, aluminum or other high thermal conductivity metal materials.

[0059] like Figure 1 and Figure 2 As shown, in this embodiment, there are two liquid cooling plates 110, and the two liquid cooling plates 110 are connected in parallel.

[0060] Furthermore, the laser cooling device also includes a circulation pump 300, through which the coolant circulates between the liquid cooling plate assembly 100 and the liquid cooling radiator 210. Specifically, the liquid cooling radiator 210 is provided with an inlet 213 and an outlet 214, and the liquid cooling plate 110 is provided with an inlet end and an outlet end. The inlet of the circulation pump 300 is connected to the outlet 214, the outlet of the circulation pump 300 is connected to the inlet end, and the outlet end is connected to the inlet 213; or, the inlet of the circulation pump 300 is connected to the outlet end, the outlet of the circulation pump 300 is connected to the inlet 213, and the outlet 214 is connected to the inlet end.

[0061] In practical applications, the type and capacity of the circulation pump 300 can be selected based on the actual heat dissipation of the first heat source 10 and the second heat source 20. Furthermore, the circulation pump 300 can be connected to the liquid cooling radiator 210 to achieve integration between the circulation pump 300 and the liquid cooling radiator 210. Alternatively, the circulation pump 300 can be installed in a location other than the liquid cooling radiator 210, depending on the actual installation conditions.

[0062] Optionally, the liquid cooling plate 110 may have internal structures such as microchannels, heat dissipation teeth or pin ribs to increase the heat exchange area with the coolant, thereby improving the heat exchange capacity of the liquid cooling plate 110.

[0063] Optionally, such as Figure 3 and Figure 4 As shown, the liquid cooling radiator 210 includes a first main pipe 211, a second main pipe 212, a liquid inlet 213, a liquid outlet 214, multiple heat exchange tubes 215, and multiple fins 216. The multiple heat exchange tubes 215 are distributed sequentially in the same direction, and fins 216 are provided between each pair of adjacent heat exchange tubes 215. The liquid inlet 213 is located on the first main pipe 211, and the liquid outlet 214 is located on the second main pipe 212. The two ends of the heat exchange tubes 215 are connected to the first main pipe 211 and the second main pipe 212, respectively. Coolant enters the first main pipe 211 through the liquid inlet 213, and then enters each heat exchange tube 215. In the heat exchange tubes 215, heat is transferred to the external environment through the fins 216, and then the coolant is discharged from the liquid cooling radiator 210 sequentially through the second main pipe 212 and the liquid outlet 214.

[0064] In other embodiments, the liquid inlet 213 and the liquid outlet 214 can be located at any position of the first main pipe 211 and the second main pipe 212, as long as it does not affect the connection between the second heat source 20 and the liquid cooling radiator 210.

[0065] In practical applications, the first main pipe 211, the second main pipe 212, the heat exchange tube 215, and the fins 216 can all be made of aluminum, copper, or other metal materials with high thermal conductivity.

[0066] Optionally, the outermost heat exchanger 215 of the first main pipe 211, the second main pipe 212, and the plurality of heat exchanger tubes 215 is thermally connected to the second heat source 20. Specifically, the second heat source 20 may include a plurality of fiber optic disks 21, and the outermost heat exchanger 215 of the first main pipe 211, the second main pipe 212, and the plurality of heat exchanger tubes 215 is thermally connected to different fiber optic disks 21. Alternatively, the second heat source 20 may include fiber optic disks 21, a power supply, and other heating elements (not shown in the figure), and the outermost heat exchanger 215 of the first main pipe 211, the second main pipe 212, and the plurality of heat exchanger tubes 215 is thermally connected to the aforementioned different heating elements. This allows the liquid cooling radiator 210 to cool the heating elements of multiple lasers, improving the integration and compactness of the laser cooling device.

[0067] In another embodiment, only the first main pipe 211 may be thermally connected to the second heat source 20, and / or only the second main pipe 212 may be thermally connected to the second heat source 20, and / or only one or two of the outermost heat exchange pipes 215 among the plurality of heat exchange pipes 215 may be thermally connected to the second heat source 20.

[0068] Furthermore, among the multiple heat exchange tubes 215, at least one of the outermost heat exchange tubes 215 is configured to be thermally connected to the second heat source 20. The heat exchange tube 215 thermally connected to the second heat source 20 is the first heat exchange tube 2151, and the remaining heat exchange tubes 215 are all second heat exchange tubes 2152. The flow rate of the coolant in the first heat exchange tube 2151 is A, and the flow rate of the coolant in the second heat exchange tube 2152 is B, where A is greater than B. The flow rate of the coolant in the first heat exchange tube 2151 is greater than the flow rate of the coolant in the second heat exchange tube 2152, thereby increasing the heat conduction between the coolant in the first heat exchange tube 2151 and the second heat source 20, and improving the heat dissipation effect of the second heat source 20 thermally connected to the first heat exchange tube 2151.

[0069] In this embodiment, the two outermost heat exchange tubes 215 of the plurality of heat exchange tubes 215 are both first heat exchange tubes 2151, that is, there are two first heat exchange tubes 2151. Of course, in other embodiments, one of the two outermost heat exchange tubes 215 of the plurality of heat exchange tubes 215 can be the first heat exchange tube 2151, that is, there is one first heat exchange tube 2151.

[0070] Furthermore, such as Figure 5As shown, a plurality of baffles 2151a are provided at intervals inside the first heat exchange tube 2151. The baffles 2151a divide the interior of the first heat exchange tube 2151 into a plurality of coolant channels 2151b. The extension direction of the coolant channels 2151b is the same as the extension direction of the first heat exchange tube 2151, so that the first heat exchange tube 2151 is formed into a harmonica tube structure, thereby increasing the coolant flow rate inside the first heat exchange tube 2151.

[0071] In another embodiment, the cross-sectional area of ​​the first heat exchange tube 2151 is larger than the cross-sectional area of ​​the second heat exchange tube 2152, so that the coolant flow rate in the first heat exchange tube 2151 is greater than the coolant flow rate in the second heat exchange tube 2152.

[0072] Optionally, such as Figure 6 As shown, the first main pipe 211 is configured to be thermally connected to the second heat source 20. The inner wall of the first main pipe 211 is provided with a first heat exchange reinforcement structure 2111 to increase the heat exchange area between the first main pipe 211 and the coolant, thereby improving the cooling effect on the second heat source 20, which is thermally connected to the first main pipe 211. The second main pipe 212 is configured to be thermally connected to the second heat source 20. The inner wall of the second main pipe 212 is provided with a second heat exchange reinforcement structure (not shown in the figure) to increase the heat exchange area between the second main pipe 212 and the coolant, thereby improving the cooling effect on the second heat source 20, which is thermally connected to the second main pipe 212. On the other hand, as... Figure 4 As shown, in this embodiment, the second main pipe 212 is located above the first main pipe 211. Therefore, under the influence of gravity, the coolant in the second main pipe 212 tends to accumulate at its bottom, while air tends to accumulate at its top. This reduces the cooling capacity of the second main pipe 212 for the second heat source 20. However, by providing a second heat exchange enhancement structure on the inner wall of the second main pipe 212, the cooling capacity of the second main pipe 212 for the second heat source 20 can be improved, thus compensating for the reduced cooling capacity of the second main pipe 212. Similarly, when the first main pipe 211 is located above the second main pipe 212, air tends to accumulate at its top, reducing its cooling capacity. However, by providing a first heat exchange enhancement structure 2111 on the inner wall of the first main pipe 211, the cooling capacity of the first main pipe 211 can be improved, thus compensating for the reduced cooling capacity of the first main pipe 211.

[0073] Furthermore, the first heat exchange strengthening structure 2111 can be a structure protruding from the inner wall of the first heat exchange tube 2151, such as spade teeth, heat dissipation teeth, multiple needle ribs, multiple protrusions, multiple protruding rings, or multiple grooves, that can increase the heat exchange area between the first main tube 211 and the coolant. The second heat exchange strengthening structure can be a structure protruding from the inner wall of the second heat exchange tube 2152, such as spade teeth, heat dissipation teeth, multiple needle ribs, multiple protrusions, multiple protruding rings, or multiple grooves, that can increase the heat exchange area between the second main tube 212 and the coolant. The shapes of the first heat exchange strengthening structure 2111 and the second heat exchange strengthening structure can be the same or different.

[0074] In practical applications, the first heat exchange reinforcement structure 2111 and the second heat exchange reinforcement structure can be manufactured using relatively mature production methods in this field, such as CNC milling machines or forging processes.

[0075] In other embodiments, when only one of the first main pipe 211 and the second main pipe 212 is thermally connected to the second heat source 20, the inner wall of the one thermally connected to the second heat source 20 is provided with a heat exchange enhancement structure, while the inner wall of the other is not provided with a heat exchange enhancement structure.

[0076] Optionally, such as Figure 4 As shown, the liquid cooling radiator assembly 200 also includes two protective plates 230. Among the multiple heat exchange tubes 215, a protective plate 230 is provided on the opposite side of the two outermost heat exchange tubes 215. This serves to protect the two outermost heat exchange tubes 215.

[0077] In this embodiment, the protective plate 230 is made of aluminum, copper, or other metals with high thermal conductivity to ensure high structural strength. Furthermore, each protective plate 230 can be fixedly connected to its corresponding heat exchange tube 215 by welding or other methods.

[0078] In another implementation, the protection plate 230 can be omitted to reduce the size and weight of the liquid cooling radiator 210.

[0079] Optionally, the liquid cooling radiator assembly 200 further includes a thermally conductive layer (not shown in the figure), which can be clamped between the liquid cooling radiator 210 and the second heat source 20. This can reduce or even eliminate the gap between the liquid cooling radiator 210 and the second heat source 20, improve the thermal conductivity between the liquid cooling radiator 210 and the second heat source 20, and thus improve the cooling effect of the liquid cooling radiator 210 on the second heat source 20.

[0080] In this embodiment, the first main pipe 211, the second main pipe 212, and the two first heat exchange pipes 2151 (the two outermost heat exchange pipes 215 among the plurality of heat exchange pipes 215) are respectively thermally connected to the corresponding second heat source 20. Therefore, a thermally conductive layer is clamped between the first main pipe 211 and its corresponding second heat source 20, a thermally conductive layer is clamped between the second main pipe 212 and its corresponding second heat source 20, and the two protective plates 230 are respectively clamped with a corresponding thermally conductive layer on their opposite sides to the corresponding second heat source 20.

[0081] Optionally, the thermally conductive layer can be a thermally conductive and insulating elastic rubber pad or thermally conductive silicone grease, or it can be a thermally conductive filler such as alumina or magnesium oxide, depending on the actual application requirements.

[0082] Optionally, there are multiple first heat sources 10 and liquid cooling plates 110, each corresponding to a specific one. For example, there can be two, three, or four first heat sources 10, each of which is thermally connected to a corresponding liquid cooling plate 110. That is, multiple pump sources 11 are thermally connected to a corresponding liquid cooling plate 110. Since each pump source 11 is equipped with its own liquid cooling plate 110, all pump sources 11 or several of them can be stacked vertically, which not only improves space utilization but also enhances the flexibility of assembling multiple pump sources 11.

[0083] In practical applications, mechanical fasteners such as bolts can be used to connect the pump source 11 and its corresponding liquid cooling plate 110. Furthermore, after connecting the pump source 11 and its corresponding liquid cooling plate 110, they can be fixed in a suitable position within the laser assembly to make the overall structure of the laser more compact.

[0084] Optionally, such as Figure 7As shown, the liquid cooling radiator assembly 200 also includes a fan 220, with the air outlet or inlet side of the fan 220 facing the liquid cooling radiator 210. Activating the fan 220 accelerates the airflow around the fins 216, thereby improving the heat exchange efficiency between the coolant and air in the heat exchange tube 215. This accelerates the cooling of the coolant in the heat exchange tube 215 and also improves the efficiency of the coolant in the heat exchange tube 215 in absorbing heat from the second heat source 20. In this embodiment, the first heat source 10 includes a pump source 11, and the second heat source 20 includes an optical fiber disk 21. That is, the pump source 11 is cooled by the liquid cooling plate 110, and the optical fiber disk 21 is cooled by the liquid cooling radiator 210. Since the pump source 11 needs to operate at a relatively high temperature (approximately 50°C-80°C) to ensure stable light output, while the optical fiber disk 21 needs to operate at a relatively low temperature (as low as possible). When the ambient temperature is low, turn off fan 220 to avoid the problem of pump source 11 being too cold due to low coolant temperature, and also to save energy.

[0085] Furthermore, the duty cycle of fan 220 is adjustable, thus the speed and airflow of fan 220 can be adjusted by regulating the duty cycle. When the ambient temperature is low, fan 220 runs at a low speed to prevent the coolant temperature from getting too low, thereby saving energy.

[0086] It should be noted that when the temperature is low, although the fan 220 is running at low speed or is off, the coolant can still transfer heat to the surrounding environment. Furthermore, due to the low ambient temperature, the coolant's heat dissipation efficiency is high. Therefore, even when the fan 220 is running at low speed or is off, the liquid cooling plate assembly 100 and the liquid cooling radiator 210 can still cool the pump source 11 and the fiber optic disk 21, respectively. Further, the duty cycle of the circulating pump 300 is adjustable. Therefore, by adjusting the duty cycle of the circulating pump 300, the flow rate of the circulating pump 300 can be adjusted, thereby adjusting the flow rate of the coolant in the liquid cooling plate 110 and the liquid cooling radiator 210. This allows for the adjustment of the cooling efficiency of the liquid cooling plate assembly 100 on the pump source 11 and the cooling efficiency of the liquid cooling radiator 210 on the fiber optic disk 21.

[0087] In this embodiment, the duty cycle of fan 220 and the duty cycle of circulating pump 300 are adjustable. Therefore, the cooling efficiency of liquid cooling plate 110 on pump source 11 can be achieved by adjusting the flow rate of circulating pump 300, and the cooling efficiency of liquid cooling radiator 210 on fiber optic disk 21 can be achieved by adjusting the flow rate of circulating pump 300 and the speed of fan 220. Thus, under different ambient temperature conditions, both pump source and fiber optic disk 21 can maintain suitable operating temperatures.

[0088] In this embodiment, the laser cooling device also includes a controller. The fan 220 and the circulation pump 300 are both connected to the controller for communication. The controller controls the speed of the fan 220 and the flow rate of the circulation pump 300.

[0089] The laser cooling device provided in this embodiment uses a liquid cooling plate 110 to cool the pump source 11 and a liquid cooling radiator 210 to cool the fiber optic disk 21 and the power supply, which are heat-generating components in the laser with smaller heat dissipation than the pump source 11 but larger volume. This reduces the heat dissipation pressure on the liquid cooling plate 110, while also reducing its volume and weight. The fiber optic disk 21 and the power supply (i.e., the second heat source 20) are cooled by the liquid cooling radiator 210, and the heat dissipation efficiency of the second heat source 20 can be controlled simultaneously by the flow rate of the circulating pump 300 and the speed of the fan 220. Meanwhile, the pump source 11 (i.e., the first heat source 10) is cooled by the liquid cooling plate 110, and the heat dissipation efficiency of the first heat source 10 can be controlled by the circulating pump 300. This allows for targeted cooling of the first heat source 10 and the second heat source 20, enabling them to operate at their respective suitable temperatures. Each pump source 11 is connected to a corresponding liquid cooling plate 110. This allows for the stacking of multiple pump sources 11 connected to liquid cooling plates 110, improving space utilization and flexibility. The liquid cooling array 210 can cool multiple secondary heat sources 20, such as the fiber optic disk 21 and the power supply, reducing the overall weight and volume of the laser cooling device, which aligns with the trend towards miniaturization and integration of laser systems.

[0090] This embodiment also provides a laser, which includes a first heat source 10, a second heat source 20, and the aforementioned laser cooling device. The first heat source 10 includes a pump source 11, and the second heat source 20 includes an optical fiber disk 21. The first heat source 10 is thermally connected to the liquid-cooled plate assembly 100, and the second heat source 20 is thermally connected to the liquid-cooled radiator 210. This laser, employing the aforementioned laser cooling device, can reduce the heat dissipation pressure on the liquid-cooled plate assembly 100, achieve separate heat dissipation for the pump source and the optical fiber disk, and eliminate the need for a traditional chiller unit, thus reducing costs, decreasing size, and eliminating the need for additional connecting pipes.

[0091] This embodiment also provides a laser processing device, which includes the laser described above.

[0092] Example 2

[0093] This embodiment provides a laser cooling device. The following mainly describes the differences between this embodiment and Embodiment 1, while the similarities will not be repeated.

[0094] like Figure 8As shown, both the inlet 213 and the outlet 214 are located on the first main pipe 211. A baffle (not shown in the figure) is installed inside the first main pipe 211, dividing the interior of the first main pipe 211 into an inlet chamber and an outlet chamber (neither shown in the figure). The inlet chamber is connected to the inlet 213, and the outlet chamber is connected to the outlet 214. The two ends of some heat exchange tubes 215 are connected to the inlet chamber and the second main pipe 212, respectively, while the two ends of the remaining heat exchange tubes 215 are connected to the outlet chamber and the second main pipe 212, respectively. Coolant enters the inlet chamber through the inlet 213, then enters the heat exchange tubes 215 connected to the inlet chamber, and then enters the heat exchange tubes 215 connected to the outlet chamber through the second main pipe 212. Finally, it exits the liquid coolant radiator 210 through the outlet chamber and the outlet 214 in sequence.

[0095] Example 3

[0096] This embodiment provides a laser cooling device. The following mainly describes the differences between this embodiment and Embodiment 1, while the similarities will not be repeated.

[0097] like Figures 9 to 11 As shown, the liquid cooling radiator 210 also includes a plurality of heat dissipation fins 240, which are inserted between the first main pipe 211 and the second main pipe 212. The plurality of heat dissipation fins 240 are configured to be thermally connected to the fiber optic disk 21. For example, the heat dissipation fins 240 can be pasted onto the fiber optic disk 21 using thermally conductive adhesive, or the heat dissipation fins 240 can be fixed onto the fiber optic disk 21 using connecting elements, or the heat dissipation fins 240 can be welded or integrally formed onto the outer shell of the fiber optic disk 21, or a slot adapted to the shape of the heat dissipation fins 240 can be provided on the fiber optic disk 21, and the heat dissipation fins 240 can be detachably inserted into the slot to achieve thermal connection between the heat dissipation fins 240 and the fiber optic disk 21.

[0098] The heat dissipation fins 240, which are thermally connected to the fiber optic disk 21, can absorb the heat from the fiber optic disk 21 and transfer the heat to the surrounding environment, thereby achieving a cooling effect on the fiber optic disk 21. Furthermore, if the fan 220 is turned on, the heat transfer efficiency between the heat dissipation fins 240 and the surrounding environment can be accelerated, thereby improving the cooling effect on the fiber optic disk 21.

[0099] When assembling the fiber optic tray 21 and the liquid cooling radiator 210, first connect the heat dissipation fins 240 to the fiber optic tray 21, and then insert the heat dissipation fins 240 between the first main pipe 211 and the second main pipe 212. It is evident that this structure reduces the assembly difficulty of the fiber optic tray 21 and the liquid cooling radiator 210, which is beneficial for improving production efficiency and reducing production costs.

[0100] It should be noted that the specific number of heat dissipation fins 240 can be determined based on the spacing between the first main pipe 211 and the second main pipe 212, as well as the size of the fiber optic tray 21. For example, the number of heat dissipation fins 240 can be one, twenty, fifty-five, etc., which will not be listed in detail here. It should also be noted that in actual production, the heat dissipation fins 240 and the liquid cooling radiator 210 can be integrated as a whole and assembled with the fiber optic tray 21. Alternatively, the heat dissipation fins 240 and the fiber optic tray 21 can be integrated as a whole and assembled with the liquid cooling radiator 210. Alternatively, the heat dissipation fins 240 can be treated as independent units and assembled separately with the liquid cooling radiator 210 and the fiber optic tray 21.

[0101] In other embodiments, the heat dissipation fins 240 can also be connected to the liquid cooling radiator 210 simultaneously. Specifically, the heat dissipation fins 240 can be glued to the first main pipe 211 and the second main pipe 212, or the heat dissipation fins 240 can be fixed to the first main pipe 211 and the second main pipe 212 using connecting elements, or the heat dissipation fins 240 can be welded or integrally formed between the first main pipe 211 and the second main pipe 212, or slots adapted to the shape of the heat dissipation fins 240 can be provided on both the first main pipe 211 and the second main pipe 212, and the heat dissipation fins 240 can be detachably inserted into the slots.

[0102] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A laser cooling device, characterized in that, include: A liquid cooling plate assembly (100) is configured to be thermally connected to a first heat source (10) of a laser and to cool the first heat source (10), the first heat source (10) including a pump source (11). A liquid cooling radiator assembly (200) includes a liquid cooling radiator (210) configured to be thermally connected to a second heat source (20) of the laser and used to cool the second heat source (20), the second heat source (20) including an optical fiber disk (21), and a coolant circulating between the liquid cooling plate assembly (100) and the liquid cooling radiator (210).

2. The laser cooling device according to claim 1, characterized in that, The liquid cooling radiator (210) includes a first main pipe (211), a second main pipe (212), a liquid inlet (213), a liquid outlet (214), a plurality of heat exchange tubes (215) and a plurality of fins (216), with the fins (216) provided between each pair of adjacent heat exchange tubes (215); The liquid inlet (213) is provided on the first main pipe (211), the liquid outlet (214) is provided on the second main pipe (212), and the two ends of the heat exchange tube (215) are respectively connected to the first main pipe (211) and the second main pipe (212); Alternatively, the inlet (213) and the outlet (214) are both located on the first main pipe (211). The first main pipe (211) is equipped with a partition that divides the interior of the first main pipe (211) into an inlet chamber and an outlet chamber. The inlet chamber is connected to the inlet (213), and the outlet chamber is connected to the outlet (214). The two ends of some of the heat exchange tubes (215) are connected to the inlet chamber and the second main pipe (212) respectively, and the two ends of the remaining heat exchange tubes (215) are connected to the outlet chamber and the second main pipe (212) respectively.

3. The laser cooling device according to claim 2, characterized in that, The first manifold (211) is configured to be thermally connected to the second heat source (20); And / or, the second manifold (212) is configured to be thermally connected to the second heat source (20); And / or, of the plurality of heat exchange tubes (215), at least one of the outermost heat exchange tubes (215) is configured to be thermally connected to the second heat source (20).

4. The laser cooling device according to claim 2, characterized in that, Of the plurality of heat exchange tubes (215), at least one of the outermost heat exchange tubes (215) is configured to be thermally connected to the second heat source (20), the heat exchange tube (215) thermally connected to the second heat source (20) is the first heat exchange tube (2151), and the remaining heat exchange tubes (215) are all second heat exchange tubes (2152). The flow rate of the coolant in the first heat exchange tube (2151) is A, and the flow rate of the coolant in the second heat exchange tube (2152) is B, wherein A is greater than B.

5. The laser cooling device according to claim 2, characterized in that, The first main pipe (211) is configured to be thermally connected to the second heat source (20), and the inner wall of the first main pipe (211) is provided with a first heat exchange enhancement structure (2111); And / or, the second main pipe (212) is configured to be thermally connected to the second heat source (20), and the inner wall of the second main pipe (212) is provided with a second heat exchange enhancement structure.

6. The laser cooling device according to any one of claims 2-5, characterized in that, The liquid cooling radiator assembly (200) also includes a fan (220), with the air outlet side or air inlet side of the fan (220) facing the liquid cooling radiator (210).

7. The laser cooling device according to claim 6, characterized in that, The laser cooling device further includes a circulation pump (300), through which the coolant circulates between the liquid cooling plate assembly (100) and the liquid cooling radiator (210). The duty cycle of the circulation pump (300) is adjustable, and the duty cycle of the fan (220) is also adjustable.

8. The laser cooling device according to claim 6, characterized in that, The liquid cooling radiator (210) also includes a plurality of heat dissipation fins (240), which are inserted between the first main pipe (211) and the second main pipe (212), and are configured to be thermally connected to the fiber optic disk (21).

9. A laser, characterized in that, The device includes a first heat source (10), a second heat source (20), and a laser cooling device as described in any one of claims 1-8. The first heat source (10) includes a pump source (11), the second heat source (20) includes an optical fiber disk (21), the first heat source (10) is thermally connected to the liquid cooling plate assembly (100), and the second heat source (20) is thermally connected to the liquid cooling radiator (210).

10. Laser processing equipment, characterized in that, Including the laser as described in claim 9.

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