A power device

Abstract

The utility model relates to photovoltaic technical field discloses a kind of power equipment, comprising: box;First radiating assembly, including evaporator;Evaporator is arranged at one side of box, for the side wall of surrounding formation box;Component, including first component and second component, first component and second component are electrically connected, first component is arranged at the inner side wall of evaporator, and second component is arranged in box;Second radiating assembly, it is arranged at the outer side wall of box, and it is oppositely arranged with second component. To solve the problem that the box of existing inverter is guaranteed to have sufficient heat dissipation effect, the volume of the box needs to be enlarged, the space occupied is large, and it is difficult to meet the demand.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic technology, specifically to a power device. Background Technology

[0002] As the photovoltaic industry enters a stage of rapid development, customers have increasingly higher requirements for inverters. The output power of inverters is constantly increasing, while the size of inverters is required to be smaller than before. Therefore, the power density is constantly increasing, and the heat generation problem is becoming more and more obvious. The components inside the cavity will affect the life and reliability of the components if they work for a long time at excessively high temperatures. Therefore, the requirements for heat dissipation capacity are increasing sharply.

[0003] In related technologies, there are generally two methods for heat dissipation of inverter enclosures: The first method for low-power inverters typically uses a combination of die-cast integrated aluminum enclosure, heat sink, and natural heat dissipation. The cavity temperature is dissipated through air convection and outward radiation from the aluminum enclosure. The second method for high-power inverters typically uses a combination of sheet metal stretched enclosure, toothed heat sink, and forced air cooling. The cavity temperature is uniformly distributed through internal fan circulation. As the heat generation of high-power inverters gradually increases, the enclosure size needs to be smaller. However, using the above heat dissipation methods requires increasing the size of the enclosure to ensure sufficient heat dissipation, which takes up a lot of space and is difficult to meet the requirements. Utility Model Content

[0004] In view of this, the present invention provides a power device to solve the problem that existing inverter enclosures need to be enlarged in size to ensure sufficient heat dissipation, which takes up a lot of space and is difficult to meet the requirements.

[0005] This utility model provides a power device, including: Box; The first heat dissipation component includes an evaporator; the evaporator is disposed on one side of the housing and is used to enclose and form the side wall of the housing. The components include a first component and a second component, the first component and the second component are electrically connected, the first component is disposed on the inner side wall of the evaporator, and the second component is disposed in the housing; The second heat dissipation component is disposed on the outer side wall of the housing and is disposed opposite to the second component.

[0006] In one optional embodiment, the first component includes a MOSFET, an IGBT module, and a first PCB board; the MOSFET and IGBT module are disposed on the first PCB board and connected to the evaporator for electrical connection with the second component via the first PCB board.

[0007] In one optional embodiment, the first component includes a capacitor, a relay, a first inductive magnetic element, and a second PCB board; the second PCB board is connected to the evaporator via a thermally conductive pad and is electrically connected to the second component; the capacitor, the relay, and the first inductive magnetic element are all disposed on the side of the second PCB board away from the evaporator.

[0008] In one alternative implementation, the first heat dissipation component further includes: A first fan assembly is disposed within the housing and located between the first component and the second component; the air outlet direction of the fan assembly is towards the second component.

[0009] In one optional embodiment, the first component includes a capacitor, a relay, a first inductive magnetic element, and a second PCB board; the second PCB board is connected to the evaporator via potting compound and is electrically connected to the second component; the capacitor, the relay, and the first inductive magnetic element are all disposed on the side of the second PCB board facing the evaporator, and the potting compound covers the outer periphery of the capacitor, the relay, and the first inductive magnetic element.

[0010] In one alternative embodiment, the housing includes a main body, a cover, and the evaporator, the main body, the cover, and the evaporator together enclosing the housing.

[0011] In one alternative embodiment, the evaporator has multiple fins on the side opposite to the housing.

[0012] In one optional embodiment, the first heat dissipation component further includes: The first condenser is located on the outside of the housing; the evaporation hole of the evaporator is connected to the air inlet of the first condenser through a first pipe, and the return hole of the evaporator is connected to the liquid outlet of the first condenser through a second pipe; The second fan assembly is mounted on the housing; the first condenser is located in the air outlet path of the second fan assembly.

[0013] In one optional embodiment, the second heat dissipation component includes a phase change heat sink, a second condenser, and a third fan assembly. The phase change heat sink, the second condenser, and the third fan assembly are all disposed on the outer side wall of the housing. The phase change heat sink is disposed opposite to the second component. The phase change heat sink is connected to the air inlet of the second condenser through a third pipe, and the phase change heat sink is connected to the liquid outlet of the second condenser through a fourth pipe. The phase change heat sink and the second condenser are located on the air outlet path of the third fan assembly.

[0014] In one alternative embodiment, the housing is a sheet metal stretch housing or a die-cast housing.

[0015] The technical solution provided by this utility model has at least the following advantages: In this invention, the components are divided into two parts for independent heat dissipation, and heat is dissipated separately through an evaporator and a second heat dissipation component. This avoids the problem of excessively high local temperatures caused by the concentration of components during operation, improves the heat dissipation effect, increases the service life of the components, and enhances the reliability of the equipment. It can make full use of the limited space inside the cabinet. By arranging them separately, the entire cabinet can be further reduced in size while meeting the heat dissipation requirements. Furthermore, the evaporator forms the side wall of the cabinet, resulting in a simple structure that is convenient for transportation and installation, reduces costs, saves cabinet space, reduces the volume of the cabinet, and improves space utilization to meet the user's requirements for the floor space of the equipment. Attached Figure Description

[0016] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is an exploded view of the structure of a power device according to an embodiment of the present utility model; Figure 2 for Figure 1 The diagram shows the structural connection between the main body and the evaporator. Figure 3 This is a schematic diagram of the connection between a first component and an evaporator according to an embodiment of the present invention; Figure 4 for Figure 3 A magnified view of a portion of point A in the middle; Figure 5 for Figure 3 The diagram shows the structure of the first component from the first viewpoint. Figure 6 This is a schematic diagram of another embodiment of the present invention showing the connection between the first component and the evaporator; Figure 7 for Figure 6 The diagram shows the structure of the first component from a second perspective. Figure 8 for Figure 6 The diagram shows the structure of the first component from a third-view perspective. Figure 9 This is a schematic diagram of the connection between the first component and the evaporator in another embodiment of the present utility model; Figure 10 for Figure 9 A magnified view of a portion of point B in the middle; Figure 11 This is a schematic diagram of the structure of the second heat dissipation component according to an embodiment of the present invention.

[0018] Explanation of reference numerals in the attached figures: 1. Housing; 101. Main body; 102. Cover; 2. Evaporator; 3. First component; 301. MOSFET; 302. IGBT module; 303. First PCB board; 304. Capacitor; 305. Relay; 306. First inductor / magnetic component; 307. Second PCB board; 4. Second component; 5. Second heat dissipation assembly; 501. Phase change heat sink; 502. Second condenser; 503. Third fan assembly; 504. Third piping; 505. Fourth piping; 6. Thermal pad; 7. First fan assembly; 8. Encapsulant; 9. Fins; 10. First condenser; 11. First piping; 12. Second piping; 13. Second inductor / magnetic component; 14. Third inductor / magnetic component; 15. Second fan assembly. Detailed Implementation

[0019] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0020] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0022] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0023] The following is combined with Figures 1 to 11 The following describes embodiments of the present invention.

[0024] According to an embodiment of the present invention, a power device is provided, comprising: a housing 1; a first heat dissipation assembly including an evaporator 2; the evaporator 2 being disposed on one side of the housing 1 for enclosing and forming a side wall of the housing 1; components including a first component 3 and a second component 4, the first component 3 being electrically connected to the second component 4, the first component 3 being disposed on the inner side wall of the evaporator 2, and the second component 4 being disposed inside the housing 1; and a second heat dissipation assembly 5 being disposed on the outer side wall of the housing 1 and disposed opposite to the second component 4.

[0025] It should be noted that the second component 4 can be set on the wall of the housing 1 adjacent to the evaporator 2 to improve the heat dissipation effect by being close to the evaporator 2. The specific choice can be made according to actual needs.

[0026] In this embodiment, the first component 3 is placed on the evaporator 2, and the second component 4 is placed inside the housing 1. The evaporator 2 and the second heat dissipation assembly 5 dissipate heat from the first component 3 and the second component 4 respectively. By dividing the components into two parts for independent heat dissipation, the local temperature is not too high due to the concentration of components, which improves the heat dissipation effect, increases the service life of the components, and improves the reliability of the equipment. The limited space inside the housing 1 can be fully utilized. By arranging them separately, the entire housing 1 can be further reduced in size while meeting the heat dissipation requirements. The evaporator 2 forms the side wall of the housing 1. The structure is simple, convenient for transportation and installation, reduces costs, saves space in the housing 1, reduces the volume of the housing 1, and improves space utilization to meet the user's requirements for the floor space of the equipment.

[0027] In one embodiment, such as Figures 3 to 5As shown, the first component 3 includes a MOSFET 301, an IGBT module 302, and a first PCB board 303; the MOSFET 301 and the IGBT module 302 are disposed on the first PCB board 303 and connected to the evaporator 2 for electrical connection with the second component 4 through the first PCB board 303.

[0028] In this embodiment, the MOS transistor 301 and IGBT module 302 are attached to the evaporator 2 to improve the heat exchange effect during heat exchange with the evaporator 2, thereby improving the heat dissipation effect. The MOS transistor 301 and IGBT module 302 are electrically connected to the second component 4 through the first PCB board 303. Specifically, copper busbars and ribbon cables can be used to realize the transmission of current and electrical signals.

[0029] As a possible implementation method, it can also be, for example... Figures 6 to 8 As shown, the first component 3 includes a capacitor 304, a relay 305, a first inductive magnetic element 306, and a second PCB board 307. The second PCB board 307 is connected to the evaporator 2 via a thermal pad 6 and is electrically connected to the second component 4. The capacitor 304, relay 305, and first inductive magnetic element 306 are all located on the side of the second PCB board 307 facing away from the evaporator 2. In this embodiment, heat is transferred to the evaporator 2 for heat dissipation via the thermal pad 6 through the second PCB board 307. Simultaneously, the capacitor 304, relay 305, and first inductive magnetic element 306 transfer heat to the thermal pad 6 through the pins on the second PCB board 307, thereby improving the heat dissipation effect.

[0030] In one embodiment, such as Figure 1 , Figure 3 and Figure 6 As shown, the first heat dissipation component also includes: a first fan assembly 7, which is disposed inside the housing 1 and located between the first component 3 and the second component 4; the air outlet direction of the fan assembly is towards the second component 4.

[0031] In this embodiment, by setting a first fan assembly 7 inside the housing 1 to blow air, the airflow inside the cavity is disturbed, the temperature inside the cavity is further balanced, local hot spots are reduced, and the heat dissipation effect is improved.

[0032] As a possible implementation method, it can also be, for example... Figure 9 and Figure 10As shown, the first component 3 includes a capacitor 304, a relay 305, a first inductive magnetic element 306, and a second PCB board 307; the second PCB board 307 is connected to the evaporator 2 via potting compound 8 and is electrically connected to the second component 4; the capacitor 304, the relay 305, and the first inductive magnetic element 306 are all disposed on the side of the second PCB board 307 facing the evaporator 2, and the potting compound 8 covers the outer periphery of the capacitor 304, the relay 305, and the first inductive magnetic element 306. In this embodiment, the encapsulant 8 is used to cover the outer periphery of the capacitor 304, the relay 305, and the first inductive magnetic element 306. The heat generated by the capacitor 304, the relay 305, and the first inductive magnetic element 306 is conducted to the evaporator 2 for heat dissipation through the encapsulant 8, preventing the heat generated by the capacitor 304, the relay 305, and the first inductive magnetic element 306 from escaping into the housing 1. This eliminates the need for additional components such as cooling fans, reducing costs. Furthermore, the second PCB board 307 is located on the side, saving a significant amount of space inside the housing 1 and thus reducing the overall volume of the housing 1.

[0033] Specifically, the second component 4 includes at least one of a MOSFET 301, an IGBT module 302, a capacitor 304, a relay 305, and a first inductor magnetic element 306, as well as a third PCB board. At least one of the MOSFET 301, IGBT module 302, capacitor 304, relay 305, and first inductor magnetic element 306 is disposed on the third PCB board and cooperates with the first component 3 to divide the MOSFET 301, IGBT module 302, capacitor 304, relay 305, and first inductor magnetic element 306 into two parts.

[0034] In one embodiment, the housing 1 includes a main body 101, a cover 102, and an evaporator 2, which together enclose the housing 1 to form the housing 1.

[0035] In this embodiment, the main body 101, the cover 102 and the evaporator 2 together enclose the box 1, which facilitates installation, disassembly and maintenance and reduces costs. At the same time, it makes reasonable use of space to install the evaporator 2 and improves space utilization.

[0036] In one embodiment, such as Figure 2 , Figure 3 , Figure 7 , Figure 9 and Figure 10 As shown, the evaporator 2 has multiple fins 9 on the side opposite to the housing 1.

[0037] In this embodiment, multiple fins 9 are provided on the side of the evaporator 2 away from the casing 1, so that the evaporator 2 can convect with the natural air through the fins 9, and radiate some of the heat into the air during the heat exchange process, thereby improving the heat exchange effect of the first condenser 10.

[0038] In one embodiment, such as Figure 2 As shown, multiple fins 9 are arranged in a rectangular array.

[0039] In this embodiment, multiple fins 9 are arranged in a rectangular array on the evaporator 2, which helps to increase airflow turbulence and improve heat dissipation capacity.

[0040] Specifically, three fins 9 are evenly spaced along the length of the evaporator 2, and each fin has multiple fins 9 spaced apart.

[0041] Specifically, the evaporator 2 is welded to the housing 1 to improve the connection strength. Specifically, the evaporator 2 and the housing 1 can be connected by brazing or friction stir welding.

[0042] In one embodiment, such as Figure 11 As shown, the first heat dissipation assembly further includes: a first condenser 10, disposed on the outside of the housing 1; the evaporation hole of the evaporator 2 is connected to the air inlet of the first condenser 10 through the first pipe 11, and the return hole of the evaporator 2 is connected to the liquid outlet of the first condenser 10 through the second pipe 12; a second fan assembly 15, disposed on the housing 1; and the first condenser 10 is located on the air outlet path of the second fan assembly 15.

[0043] In this embodiment, a first condenser 10 is installed on the outside of the housing 1. When hot air passes through the heat dissipation cavity, it exchanges heat with the evaporator 2. The heat is introduced into the interior of the evaporator 2, causing the phase change liquid in the evaporation cavity to absorb heat and change from liquid to gas. Under the action of pressure, the gas is discharged from the first pipe 11 and enters the first condenser 10 for cooling. It condenses from gas to liquid through heat release. The second fan assembly 15 further cools the first condenser 10, thereby improving the cooling effect. The cooled liquid returns to the interior of the evaporator 2 through the second pipe 12 for heat dissipation, completing the entire heat exchange process. This process is repeated to cool the interior of the housing 1.

[0044] In one embodiment, such as Figure 11 As shown, the second heat dissipation assembly 5 includes a phase change heat sink 501, a second condenser 502, and a third fan assembly 503. The phase change heat sink 501, the second condenser 502, and the third fan assembly 503 are all disposed on the outer side wall of the housing 1. The phase change heat sink 501 is disposed opposite to the second component 4. The phase change heat sink 501 is connected to the air inlet of the second condenser 502 through a third pipe 504, and the phase change heat sink 501 is connected to the liquid outlet of the second condenser 502 through a fourth pipe 505. The phase change heat sink 501 and the second condenser 502 are located on the air outlet path of the third fan assembly 503.

[0045] It should be noted that the phase change radiator 501 contains a phase change fluid.

[0046] In this embodiment, the phase change heat sink 501 is arranged opposite to the component. The phase change heat sink 501 introduces the heat of the second component 4 into its inner cavity. Through heat exchange with the phase change liquid, the phase change liquid absorbs energy and its temperature rises, changing from liquid to gas. Under the action of pressure, the gas is discharged from the third pipe 504 and enters the second condenser 502 for cooling. Through heat release and condensation, it changes from gas to liquid. The third fan assembly 503 further cools the second condenser 502, improving the cooling effect. The cooled liquid returns to the inner cavity of the phase change heat sink 501 through the fourth pipe 505 for heat dissipation, completing the entire heat exchange process. This process is repeated to cool the inner cavity of the housing 1.

[0047] In one embodiment, the housing 1 is a sheet metal stretching housing or a die-cast housing.

[0048] In this embodiment, the enclosure 1 is made of sheet metal stretching or die casting to improve the structural strength and heat dissipation effect of the enclosure 1.

[0049] Specifically, such as Figure 11 As shown, the power device also includes a second inductive magnetic element 13 and a third inductive magnetic element 14. The second inductive magnetic element 13 is located at the end of the air outlet path of the second fan assembly 15, and the third inductive magnetic element 14 is located at the end of the air outlet path of the third fan assembly 503. By making reasonable use of these elements, heat dissipation can be achieved for the second inductive magnetic element 13 and the third inductive magnetic element 14, thereby improving space utilization.

[0050] The specific working principle of the power device provided in this embodiment is as follows: A first component 3 is placed on an evaporator 2, and a second component 4 is placed inside a housing 1. The evaporator 2 and a phase-change heat sink 501 dissipate heat from the first component 3 and the second component 4 respectively. The components are divided into two parts for independent heat dissipation. Specifically, the components can be a MOSFET 301, an IGBT module 302, a capacitor 304, a relay 305, and a first inductor magnetic element 306. These are divided into two parts and placed on two separate PCBs. The two PCBs transmit current and electrical signals through copper busbars and ribbon cables. A first fan assembly 7 turbulents the airflow within the housing 1, balancing the internal temperature and preventing excessively high local temperatures caused by component concentration during operation. This improves heat dissipation, increases the lifespan of the components, and enhances the reliability of the device. Alternatively, potting compound 8 can be used to encapsulate and cover the capacitor 304, the relay 305, and the first inductor magnetic element. The novel heat dissipation in the form of component 306 can fully utilize the limited space inside the housing 1. By arranging components separately, the entire housing 1 can be further reduced in size while meeting heat dissipation requirements. The evaporator 2 forms the side wall of the housing 1, resulting in a simple structure that facilitates transportation and installation, reduces costs, saves space in the housing 1, reduces the volume of the housing 1, and improves space utilization to meet users' requirements for equipment floor space. It also employs two circulating heat dissipation methods. For example, the phase change heat sink 501 can handle the heat dissipation of the high-loss IGBT module 302, providing high heat dissipation efficiency to meet users' requirements for equipment floor space. The size of the first condenser 10 or the second condenser 502 can be reasonably adjusted according to different heat dissipation requirements, saving costs while meeting the requirements. This solves the problem that existing inverter housings need to be enlarged to ensure sufficient heat dissipation, resulting in large space requirements and difficulty in meeting the needs.

[0051] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A power device, characterized in that, include: Box (1); The first heat dissipation component includes an evaporator (2); the evaporator (2) is disposed on one side of the housing (1) and is used to enclose and form the side wall of the housing (1); The components include a first component (3) and a second component (4), the first component (3) and the second component (4) are electrically connected, the first component (3) is disposed on the inner side wall of the evaporator (2), and the second component (4) is disposed inside the housing (1); The second heat dissipation component (5) is disposed on the outer side wall of the housing (1) and is disposed opposite to the second component (4).

2. The power device according to claim 1, characterized in that, The first component (3) includes a MOSFET (301), an IGBT module (302), and a first PCB board (303); the MOSFET (301) and the IGBT module (302) are disposed on the first PCB board (303), and the MOSFET (301) and the IGBT module (302) are connected to the evaporator (2) for electrical connection with the second component (4) through the first PCB board (303).

3. The power device according to claim 1, characterized in that, The first component (3) includes a capacitor (304), a relay (305), a first inductive magnetic element (306), and a second PCB board (307); the second PCB board (307) is connected to the evaporator (2) through a thermal pad (6) and is electrically connected to the second component (4); the capacitor (304), the relay (305), and the first inductive magnetic element (306) are all disposed on the side of the second PCB board (307) away from the evaporator (2).

4. The power device according to any one of claims 1 to 3, characterized in that, The first heat dissipation component also includes: The first fan assembly (7) is disposed inside the housing (1) and located between the first component (3) and the second component (4); the air outlet direction of the fan assembly is towards the second component (4).

5. The power device according to claim 1, characterized in that, The first component (3) includes a capacitor (304), a relay (305), a first inductive magnetic element (306), and a second PCB board (307); the second PCB board (307) is connected to the evaporator (2) by potting compound (8) and is electrically connected to the second component (4); the capacitor (304), the relay (305), and the first inductive magnetic element (306) are all disposed on the side of the second PCB board (307) facing the evaporator (2), and the potting compound (8) covers the outer periphery of the capacitor (304), the relay (305), and the first inductive magnetic element (306).

6. The power device according to claim 1, characterized in that, The housing (1) includes a main body (101), a cover (102) and an evaporator (2), which together enclose the housing (1).

7. The power device according to claim 1, characterized in that, The evaporator (2) has multiple fins (9) on the side opposite to the housing (1).

8. The power device according to any one of claims 1 to 3, 5 to 7, characterized in that, The first heat dissipation component also includes: The first condenser (10) is located on the outside of the housing (1); the evaporation hole of the evaporator (2) is connected to the air inlet of the first condenser (10) through the first pipe (11), and the return hole of the evaporator (2) is connected to the liquid outlet of the first condenser (10) through the second pipe (12). The second fan assembly (15) is disposed on the housing (1); the first condenser (10) is located on the air outlet path of the second fan assembly (15).

9. The power device according to claim 1, characterized in that, The second heat dissipation component (5) includes a phase change heat sink (501), a second condenser (502), and a third fan assembly (503). The phase change heat sink (501), the second condenser (502), and the third fan assembly (503) are all disposed on the outer side wall of the housing (1). The phase change heat sink (501) is disposed opposite to the second component (4). The phase change heat sink (501) is connected to the air inlet of the second condenser (502) through a third pipe (504). The phase change heat sink (501) is connected to the liquid outlet of the second condenser (502) through a fourth pipe (505). The phase change heat sink (501) and the second condenser (502) are located on the air outlet path of the third fan assembly (503).

10. The power device according to claim 1, characterized in that, The box body (1) is a sheet metal stretch box body or a die-cast box body.

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