An ultra-miniature ultra-high frequency temperature-compensated attenuator

Abstract

This utility model discloses an ultra-miniature ultra-high frequency temperature-compensated attenuator, relating to the field of attenuator design. It includes: a substrate; a first electrode plate, a second electrode plate, and a third electrode plate are disposed on the upper surface of the substrate; the first and second electrode plates are located on one side of the upper surface of the substrate and are separated by a first seam; the third electrode plate is located on the other side of the upper surface of the substrate and is separated from the first and second electrode plates by a second seam; an NTC resistor is located above the first seam; and a PTC resistor is located above the second seam. The first, second, and third electrode plates, the NTC resistor, and the PTC resistor are all fabricated using laser screen printing. This solution, supplemented by laser screen printing and a reasonable arrangement of the electrodes and resistors, reduces the thickness and line width of the resistors and conductors, achieving a small size while maintaining acceptable RF parameters.

Description

Technical Field

[0001] This utility model relates to the field of attenuator design, specifically to an ultra-miniature ultra-high frequency temperature-compensated attenuator. Background Technology

[0002] Existing temperature-compensated attenuators come in sizes of 3.70mm*3.10mm, 3.05mm*1.65mm, 1.81mm*1.52mm, 2.0*1.25mm, and 1.91mm*1.52mm, all larger than 1mm*1mm. They operate in frequencies not exceeding 20GHz and are primarily used in microwave amplification links in military communications, radar, and electronic warfare applications to provide temperature compensation for the amplified signal. Figure 1 The conventional π-type attenuator structure shown is large in size and has a low frequency.

[0003] Existing large-size temperature-compensated attenuators / fixed attenuators, manufactured using thick-film technology, cannot meet the VSWR requirements at high frequencies. At high frequencies, the skin effect intensifies, and the larger thickness of the thick-film resistors and conductors leads to current concentration on the conductor surface above 30GHz, increasing resistance losses. Impedance matching is challenging, as the line precision of thick-film printing is limited (typical linewidth greater than 50μm), and parasitic capacitance / inductance is significant at high frequencies, easily leading to impedance mismatch. Furthermore, these technologies do not meet the development trends of modern military and civilian electronic equipment, which are increasingly moving towards miniaturization, lightweight design, high operating frequency, multifunctionality, and high reliability. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention aims to provide an ultra-miniature ultra-high frequency temperature-compensated attenuator. By rationally arranging the electrodes and resistors and employing laser screen printing, the thickness and line width of the resistive elements and conductors are reduced, achieving a small size while maintaining qualified radio frequency parameters.

[0005] This utility model is achieved through the following technical solution:

[0006] An ultra-miniature ultra-high frequency temperature-compensated attenuator, comprising:

[0007] A substrate, wherein a first electrode plate, a second electrode plate and a third electrode plate are provided on the upper surface of the substrate, the first electrode plate and the second electrode plate are located on one side of the upper surface of the substrate and a first seam is left between them; the third electrode plate is located on the other side of the upper surface of the substrate and a second seam is left between it and the first electrode plate and the second electrode plate.

[0008] The NTC resistor is located above the first seam and is connected to the first electrode plate and the second electrode plate, respectively.

[0009] The PTC resistor is located above the second wire seam, with one end connected to the first or second electrode plate and the other end connected to the third electrode plate, which is connected to the ground electrode on the substrate.

[0010] The first electrode plate, the second electrode plate, the third electrode plate, the NTC resistor, and the PTC resistor are all made by laser screen printing.

[0011] Compared to existing technologies, which often feature large-sized temperature-compensated attenuators and whose thick-film manufacturing processes fail to meet VSWR requirements at high frequencies, this invention provides an ultra-miniature ultra-high-frequency temperature-compensated attenuator. By rationally arranging the electrodes and resistors and employing laser screen printing, the thickness and line width of the resistive elements and conductors are reduced, achieving a small size while maintaining acceptable RF parameters. Specifically, the solution includes a substrate and first, second, and third electrode plates, an NTC resistor, and a PTC resistor printed on it. Due to the ultra-miniature and ultra-high-frequency nature of this solution, the thickness of the resistive elements, conductors, and line width exhibit significant parasitic parameters at high frequencies, necessitating a high-precision screen printing process. Therefore, a laser-printed PI (Polyimide) film screen printing process is employed. This solution uses a 500-mesh laser-printed PI (Polyimide) film screen printing process, with a film thickness deviation of less than 2μm and good consistency. The overprinting accuracy is better than ±3μm, with precise alignment and strong stability. The resistive element thickness can be reduced by 5μm compared to latex lithography, and the electrical conductor thickness by 3μm, with a line width of less than 50μm (breaking the limits of thick-film processes and reaching chip-level processing). The thinner film thickness and finer line width optimize the product's RF parameters. In the actual printing process, a semi-automatic printing machine is used to achieve precise alignment, and the film thickness is controlled within a certain range by adjusting the equipment's printing parameters. The quality of the screen-printed pattern is closely related to the screen material, mesh quality, and mesh count used. The mesh count and latex thickness directly affect the printed pattern quality and film thickness. By experimenting with different screen processes, mesh counts, and latex thicknesses, a process and mesh count combination with good latex thickness control were found to ensure both pattern quality and film thickness, thereby guaranteeing the product's appearance and electrical performance. This is existing technology and will not be elaborated further here.

[0012] Secondly, in this design, a first seam is left between the first and second electrode plates; a second seam is left between the third electrode plate and the first and second electrode plates. NTC and PTC resistors are respectively installed on the first and second seams, covering most of the seams. The NTC resistors form a good connection with both the first and second electrode plates, ensuring circuit continuity and facilitating signal transmission, thus playing a primary role in temperature compensation. One end of the PTC resistor is connected to either the first or second electrode plate, and the other end is connected to the third electrode plate, which is then connected to the ground electrode, ensuring circuit continuity and facilitating signal transmission. Compared to existing π-type and T-type attenuators, the arrangement of electrodes and resistors in this design allows for better control of the thickness of the resistor element and conductor, as well as the line width. Products as small as 0.6mm*0.6mm can be manufactured, with an area less than a quarter of existing temperature compensation attenuators. The minimum resistor element size is 0.08mm*0.2mm=0.016mm. 2 This design allows for the efficient arrangement of resistors within a limited area, ensuring no adhesion between resistors and sufficient power tolerance. Therefore, this solution achieves resistor distribution within a 0.6mm x 0.6mm dimension, satisfying high-frequency impedance matching requirements.

[0013] In a further optimization, the first and second seams are respectively straight or bent lines. In this design, the first electrode plate, the second electrode plate, and the third electrode can be configured into L-shaped, concave-convex, or other shapes to facilitate adjustment of the effective area of ​​the NTC and PTC resistors, thereby controlling their resistance values.

[0014] In a further optimization, the effective area of ​​the NTC resistor is the area of ​​the NTC resistor within the first seam; and the effective area of ​​the PTC resistor is the area of ​​the PTC resistor within the second seam.

[0015] In a further optimization, the NTC resistor is connected to the first electrode plate and the second electrode plate respectively by a lap connection.

[0016] One end of the PTC resistor is connected to the first or second electrode plate by overlapping, and the other end is connected to the third electrode plate by overlapping.

[0017] In a further optimization, the side of the substrate is provided with a side electrode plate serving as a grounding electrode, and the bottom of the substrate is provided with a back electrode plate serving as a grounding electrode. The side electrode plate can overlap with the back electrode plate and the third electrode plate respectively.

[0018] In a further optimization, both the side electrode plate and the back electrode plate are formed by printing and sintering palladium-silver electrode paste. In this solution, the side electrode plate and the back electrode plate, formed by printing and sintering palladium-silver electrode paste, are well connected to the third electrode plate to form the product grounding terminal. When using the product, only the back side needs to be adhered with conductive adhesive, eliminating the need for bonding on the third electrode plate, which saves costs and optimizes the installation method.

[0019] Further optimization involves sintering the first, second, and third electrode plates using pure gold printing paste. In this design, all three electrode plates are front electrodes, utilizing a mature domestically produced pure gold printing paste. This paste has a smooth, dense surface, excellent gold / aluminum wire bonding performance, good compatibility with conductor and insulating dielectric pastes, good oxidation resistance, and high adhesion, meeting performance and reliability requirements. Compared to conventional π-type attenuators, by reducing the diameter of the front electrode wire, current is less likely to concentrate on the conductor surface in high-frequency scenarios, effectively reducing parasitic parameters at high frequencies.

[0020] In a further optimization, a protective layer is provided on the substrate, which is used to cover the upper surface of the substrate and seal the NTC resistor and the PTC resistor.

[0021] For further optimization, the protective layer is made of epoxy resin. In this solution, the protective layer is made of epoxy resin, which has high chemical stability, excellent mechanical properties, good adhesion strength, low curing shrinkage, and good processing performance. This completely seals the PTC resistor and NTC resistor body, isolating them from moisture and oxygen atoms in the air, effectively preventing resistance value drift.

[0022] Further optimization is needed because traditional temperature-compensated attenuator / fixed attenuator substrate materials cannot meet the requirements for effective heat dissipation and large parasitic capacitance at high frequencies. Therefore, it is necessary to find a suitable substrate material with high thermal conductivity, low dielectric loss, and low surface roughness to achieve effective heat dissipation at high frequencies and reduce the parasitic capacitance of the product. The substrate is set to be 99% alumina. In this solution, traditional temperature-compensated attenuators use 96% alumina as the substrate. Considering the requirements of this project for high thermal conductivity, low dielectric loss, and low roughness of the substrate material, 99% alumina is comprehensively selected as the substrate. Its roughness is 0.1μm, thermal conductivity is 24-30W / m / K, and dielectric loss is 0.0001-0.0003@10GHz, all of which are superior to 96% alumina substrates. Under the same geometric dimensions, the parasitic capacitance is smaller, as shown in Table 1 below:

[0023]

[0024] Compared with the prior art, this utility model has the following advantages and beneficial effects:

[0025] This invention provides an ultra-miniature ultra-high frequency temperature-compensated attenuator. Through a rational arrangement of electrodes and resistors, supplemented by laser screen printing, the thickness and line width of the resistive elements and conductors are reduced, achieving a small size while maintaining qualified radio frequency parameters. This solution can produce a product with a size of 0.6mm*0.6mm, and a minimum resistor size of 0.08mm*0.2mm=0.016mm. 2 It allows for the reasonable arrangement of resistors within an effective area, ensuring that the resistors are not stuck together and have high power tolerance. Attached Figure Description

[0026] The accompanying drawings, which are included to provide a further understanding of the embodiments of the present invention and form part of this application, do not constitute a limitation thereof. In the drawings:

[0027] Figure 1 This is a structural design diagram of a π-type attenuator in the existing technology;

[0028] Figure 2 A schematic diagram of the product planar structure provided for this utility model;

[0029] Figure 3 Exploded view of the product provided for this utility model;

[0030] Figure 4 The process flow diagram provided for this utility model;

[0031] Figure 5 The product outline dimensions provided for this utility model.

[0032] The attached diagram shows the markings and corresponding component names:

[0033] 1-Substrate, 2-First electrode plate, 3-Second electrode plate, 4-NTC resistor, 5-PTC resistor, 6-Third electrode plate, 7-Side electrode plate, 8-Back electrode plate, 9-Protective layer. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of this utility model are only used to explain this utility model and are not intended to limit this utility model.

[0035] Example: This example provides an ultra-miniature ultra-high frequency temperature-compensated attenuator, such as... Figures 2-5 As shown, it includes:

[0036] A substrate 1 has a first electrode plate 2, a second electrode plate 3, and a third electrode plate 6 on its upper surface. The first electrode plate 2 is located on one side of the upper surface of the substrate and a first seam is left between them. The third electrode plate 6 is located on the other side of the upper surface of the substrate and a second seam is left between it and the first electrode plate 2 and the second electrode plate 3.

[0037] NTC resistor 4, the NTC resistor 4 is located above the first seam and is connected to the first electrode plate 2 and the second electrode plate 3 respectively;

[0038] PTC resistor 5, the PTC resistor 5 is located above the second wire seam, and one end is connected to the first electrode plate 2 or the second electrode plate 3, and the other end is connected to the third electrode plate 6, the third electrode plate 6 is connected to the ground electrode on the substrate 1;

[0039] The first electrode plate 2, the second electrode plate 3, the third electrode plate 6, the NTC resistor 4, and the PTC resistor 5 are all made by laser screen printing.

[0040] Compared to existing technologies, which often feature large-sized temperature-compensated attenuators and whose thick-film manufacturing processes fail to meet VSWR requirements at high frequencies, this invention provides an ultra-miniature ultra-high-frequency temperature-compensated attenuator. By rationally arranging the electrodes and resistors and employing laser screen printing, the thickness and line width of the resistive elements and conductors are reduced, achieving a small size while maintaining acceptable RF parameters. Specifically, the design includes a substrate 1, and first electrode plates 2, 3, and 6, NTC resistors 4 and PTC resistors 5 printed on the substrate 1. Due to the ultra-miniature and ultra-high-frequency nature of this design, the thickness of the resistive elements, conductors, and line width exhibit significant parasitic parameters at high frequencies, necessitating a high-precision screen printing process. Therefore, a laser-printed PI (Polyimide) film screen is used. This design employs a 500-mesh laser-printed PI (Polyimide) film screen, with a film thickness deviation of less than 2μm and good consistency. The printing accuracy is better than ±3μm, with precise alignment and strong stability. The resistive element thickness can be reduced by 5μm compared to latex lithography, and the electrical conductor thickness by 3μm. The line width is less than 50μm, and can be as low as 30μm (breaking through the limits of thick-film processes, reaching chip-level processing). The thinner film thickness and finer line width optimize the product's RF parameters. In the actual printing process, a semi-automatic printing machine is used to achieve precise alignment, and the film thickness is controlled within a certain range by adjusting the equipment's printing parameters. The quality of the screen-printed pattern is closely related to the screen material, mesh quality, and mesh count. The mesh count and latex thickness directly affect the printed pattern quality and film thickness. By experimenting with different screen processes, mesh counts, and latex thicknesses, a process and mesh count combination with good control over pattern quality and film thickness have been found, ensuring pattern quality and film thickness, and thus guaranteeing the product's appearance and electrical performance. This is existing technology and will not be elaborated further here.

[0041] Secondly, in this design, a first seam is left between the first electrode plate 2 and the second electrode plate 3; a second seam is left between the third electrode plate 6 and the first electrode plate 2 and the second electrode plate 3. NTC resistors 4 and PTC resistors 5 are respectively installed on the first and second seams, covering most of the seams. The NTC resistor 4 forms a good connection with both the first and second electrode plates 2 and 3, ensuring circuit continuity and facilitating signal transmission, thus playing a primary role in temperature compensation. One end of the PTC resistor 5 is connected to either the first or second electrode plate 3, and the other end is connected to the third electrode plate 6, which is then connected to the ground electrode, ensuring circuit continuity and facilitating signal transmission. Compared to existing π-type and T-type attenuators, the arrangement of electrodes and resistors in this design allows for better control of the thickness of the resistive element and conductor, as well as the line width. Products as small as 0.6mm*0.6mm can be manufactured, with an area less than one-quarter that of existing temperature compensation attenuators. The minimum resistive element size is 0.08mm*0.2mm=0.016mm. 2 This design allows for the efficient arrangement of resistors within a limited area, ensuring no adhesion between resistors and sufficient power tolerance. Therefore, this solution achieves resistor distribution within a 0.6mm x 0.6mm dimension, satisfying high-frequency impedance matching requirements.

[0042] In this embodiment, the first seam and the second seam are respectively straight lines or bends. In this design, the first electrode plate 2, the second electrode plate 3, and the third electrode plate 4 can be configured into L-shaped, concave-convex, or other shapes to facilitate adjustment of the squares of the NTC and PTC resistors, thereby controlling their resistance values.

[0043] In this embodiment, the effective area of ​​the NTC resistor 4 is the area of ​​the NTC resistor 4 within the first seam; the effective area of ​​the PTC resistor 5 is the area of ​​the PTC resistor 5 within the second seam.

[0044] In this embodiment, the NTC resistor 4 is connected to the first electrode plate 2 and the second electrode plate 3 respectively by overlapping;

[0045] One end of the PTC resistor 5 is connected to the first electrode plate 2 or the second electrode plate 3 by overlapping, and the other end is connected to the third electrode plate 6 by overlapping.

[0046] In this embodiment, the side of the substrate 1 is provided with a side electrode plate 7 serving as a grounding electrode, and the bottom of the substrate 1 is provided with a back electrode plate 8 serving as a grounding electrode. The side electrode plate 7 can overlap with the back electrode plate 8 and the third electrode plate 6 respectively.

[0047] In this embodiment, both the side electrode plate 7 and the back electrode plate 8 are formed by printing and sintering palladium-silver electrode paste. In this design, the side electrode plate 7 and the back electrode plate 8, formed by printing and sintering palladium-silver electrode paste, are well connected to the third electrode plate 6, forming the product's grounding terminal. When using the product, only the back side needs to be adhered with conductive adhesive; bonding to the third electrode plate 6 is unnecessary, thus saving costs and optimizing the installation method.

[0048] In this embodiment, the first electrode plate 2, the second electrode plate 3, and the third electrode plate 6 are all sintered using pure gold printing paste. In this design, the first electrode plate 2, the second electrode plate 3, and the third electrode plate 6 are all front electrodes. A relatively mature domestic pure gold printing paste is selected, which has a smooth and dense surface, good gold / aluminum wire bonding performance, good compatibility with conductor paste and insulating dielectric paste, good oxidation resistance, and high adhesion, meeting performance and reliability requirements. Compared to the electrodes of conventional π-type attenuators, by reducing the diameter of the front electrode wire, current is less likely to concentrate on the surface of the conductor in high-frequency scenarios, effectively reducing parasitic parameters at high frequencies.

[0049] In this embodiment, a protective layer 9 is also provided on the substrate 1. The protective layer 9 is used to cover the upper surface of the substrate 1 and seal the NTC resistor 4 and the PTC resistor 5.

[0050] In this embodiment, the protective layer 9 is made of epoxy resin. In this design, the protective layer 9 is made of epoxy resin, which has high chemical stability, excellent mechanical properties, good adhesion strength, low curing shrinkage, and good processing performance. This completely seals the PTC resistor 5 and NTC resistor 4, isolating them from moisture and oxygen atoms in the air, effectively preventing resistance value drift.

[0051] In this embodiment, since the traditional temperature-compensated attenuator / fixed attenuator substrate 1 material cannot meet the requirements for effective heat dissipation at high frequencies and has a large parasitic capacitance, it is necessary to find a suitable substrate 1 material with high thermal conductivity, low dielectric loss, and low surface roughness to achieve effective heat dissipation at high frequencies and reduce the parasitic capacitance of the product. The substrate 1 is set to be a 99% alumina substrate 1. In this solution, the traditional temperature-compensated attenuator uses 96% alumina as substrate 1. Considering the requirements of this project for high thermal conductivity, low dielectric loss, and low roughness of the substrate 1 material, 99% alumina is comprehensively selected as substrate 1. Its roughness is 0.1μm, thermal conductivity is 24-30W / m / K, and dielectric loss is 0.0001-0.0003@10GHz, all of which are superior to 96% alumina substrate 1. Under the same geometric dimensions, the parasitic capacitance is smaller, as shown in Table 1 below:

[0052]

[0053] Technical principles of this solution:

[0054] This scheme requires the distribution of resistive elements within a 0.6mm*0.6mm dimension to meet high-frequency impedance matching. The design of a microstrip structure formed by two thermistors and the ground terminal was studied. Figure 2 , Figure 3 To mitigate the impact of parasitic parameters on the product's RF parameters, microwave matching design technology is applied to the attenuator's structural design in this project. The product is constructed by fabricating electrodes, resistors, and a protective layer 9 on a 99% alumina substrate 1, forming a multi-layer thick-film structure. After printing the first electrode plate 2, second electrode plate 3, third electrode plate 6, and back electrode plate 8 on the top and bottom sides of the 99% alumina substrate 1, side electrode plates 7 are formed through vias. The side electrode plates 7 overlap with the back electrode plate 8 and the third electrode plate 6 to form an electrical connection. Resistor paste is printed into resistor patterns of a specific shape and size, with a certain overlap between the electrodes and resistors to form an electrical connection. The internal structure of the product in this solution is achieved through thick-film overprinting. The key is the overprinting accuracy, ensuring that the overlap and coverage between the electrodes, resistors, and protective layer 9 meet the design requirements.

[0055] This solution determines the shape, position, and size of the resistive element and conductor based on electromagnetic field simulation, and optimizes the electrical parameters. The matching design structure is rationally modeled and simulated in 3D electromagnetic field simulation software, resulting in excellent radio frequency characteristics.

[0056] Secondly, traditional temperature-compensated attenuators operate at low frequencies and generate virtually no parasitic parameters, allowing for simple screen printing using ordinary latex photolithography. However, this solution employs laser-etched PI (Polyimide) film screen printing. Electrode, resistor paste, and protective layer 9 are printed into patterns of specific shapes and sizes on a 99% alumina ceramic substrate 1, with sufficient overlap between the electrodes and resistors to ensure a good electrical connection. The quality of the pattern, such as flatness, continuity, dryness, and shape, directly affects the product's electrical performance and reliability. The fabrication process is as follows: Figure 4As shown. The printing process requires strict control over the thickness of the first electrode plate 2 and the second electrode plate 3, which must be 12±4μm, with a length of 0.30-0.40mm and a width of 0.20-0.28mm, and a minimum line spacing of 30μm; the thickness of the third electrode plate 6 must be 12±4μm, with a length of 0.50-0.60mm and a width of 0.12-0.16mm; the overlap between the side electrode plate 7 and the back electrode plate 8, as well as the third electrode plate 6, must be greater than 20μm; the length of the NTC resistor 4 body must be 0.20-0. The NTC resistor 4 has a length of 30mm, a width of 0.15-0.24mm, and a thickness of 20±10μm. The PTC resistor 5 has a length of 0.05-0.06mm, a width of 0.16-0.20mm, and a thickness of 10±5μm. The NTC resistor 4 and PTC resistor 5 overlap with the first electrode plate 2, the second electrode plate 3, and the third electrode plate 6 by more than 30μm, and there is no adhesion between the resistors. The protective layer 9 completely covers the NTC resistor 4 and PTC resistor 5, while ensuring that the printed pattern is not deformed and remains intact.

[0057] The thick-film resistor process employed in the above scheme allows the thick-film resistor material to withstand a power of 1W / mm² per unit area. 2 (Verified by actual measurement). A product with a size of 0.6mm * 0.6mm can be manufactured, and the smallest resistive element size is 0.08mm * 0.2mm = 0.016mm. 2 This allows for the efficient arrangement of resistors within a suitable area, ensuring that the resistors do not adhere and have sufficient power tolerance. The resulting product has the following external dimensions: Figure 5 And as shown in Table 2:

[0058]

[0059] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A miniature ultra-high frequency temperature-compensated attenuator, characterized in that, include: A substrate (1) has a first electrode plate (2), a second electrode plate (3) and a third electrode plate (6) on its upper surface. The first electrode plate (2) and the second electrode plate (3) are located on one side of the upper surface of the substrate and are separated by a first seam. The third electrode plate (6) is located on the other side of the upper surface of the substrate and is separated by a second seam from the first electrode plate (2) and the second electrode plate (3). NTC resistor (4), the NTC resistor (4) is located above the first seam and is connected to the first electrode plate (2) and the second electrode plate (3) respectively; PTC resistor (5), the PTC resistor (5) is located above the second wire seam, and one end is connected to the first electrode plate (2) or the second electrode plate (3), and the other end is connected to the third electrode plate (6), the third electrode plate (6) is connected to the ground electrode on the substrate (1); The first electrode plate (2), the second electrode plate (3), the third electrode plate (6), the NTC resistor (4), and the PTC resistor (5) are all made by laser screen printing.

2. The ultra-miniature ultra-high frequency temperature-compensated attenuator according to claim 1, characterized in that, The first seam and the second seam are respectively straight or zigzag lines.

3. The ultra-miniature ultra-high frequency temperature-compensated attenuator according to claim 2, characterized in that, The effective area of ​​the NTC resistor (4) is the area of ​​the NTC resistor (4) in the first seam; the effective area of ​​the PTC resistor (5) is the area of ​​the PTC resistor (5) in the second seam.

4. The ultra-miniature ultra-high frequency temperature-compensated attenuator according to claim 1, characterized in that, The NTC resistor (4) is connected to the first electrode plate (2) and the second electrode plate (3) respectively by overlapping; One end of the PTC resistor (5) is connected to the first electrode plate (2) or the second electrode plate (3) by overlapping, and the other end is connected to the third electrode plate (6) by overlapping.

5. The ultra-miniature ultra-high frequency temperature-compensated attenuator according to claim 1, characterized in that, The substrate (1) has a side electrode plate (7) as a grounding electrode on its side and a back electrode plate (8) as a grounding electrode at its bottom. The side electrode plate (7) can overlap with the back electrode plate (8) and the third electrode plate (6) respectively.

6. The ultra-miniature ultra-high frequency temperature-compensated attenuator according to claim 5, characterized in that, Both the side electrode plate (7) and the back electrode plate (8) are formed by printing and sintering palladium-silver electrode paste.

7. The ultra-miniature ultra-high frequency temperature-compensated attenuator according to claim 1, characterized in that, The first electrode plate (2), the second electrode plate (3) and the third electrode plate (6) are all sintered by pure gold printing paste.

8. The ultra-miniature ultra-high frequency temperature-compensated attenuator according to claim 1, characterized in that, The substrate (1) is further provided with a protective layer (9), which is used to cover the upper surface of the substrate (1) and seal the NTC resistor (4) and the PTC resistor (5).

9. The ultra-miniature ultra-high frequency temperature-compensated attenuator according to claim 8, characterized in that, The protective layer (9) is made of epoxy resin.

10. The ultra-miniature ultra-high frequency temperature-compensated attenuator according to claim 1, characterized in that, The substrate (1) is made of 99% alumina.

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