A signal isolator and modulator with ultra-high isolation and withstand voltage
Patent Information
- Application Number
- CN202521858662.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-29
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2035-08-29
AI Technical Summary
[0005]本实用新型所要解决的技术问题是现有调制器的隔离耐压无法达到超高压隔离问题
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Figure CN224709642U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of signal isolator technology, specifically to an ultra-high isolation voltage withstand signal isolator and modulator. Background Technology
[0002] There are many signal isolation chips on the market, but the isolation voltage is generally around AC5000V. A typical example is the 1300 series small, high-precision, enhanced isolated Δ-Σ modulator from TI and NSI.
[0003] Typical applications of high-precision, enhanced isolated Δ-Σ modulators include: Figure 1 As shown. When applied to applications requiring isolation withstand voltages of tens of thousands of volts or higher, this type of enhanced isolated Δ-Σ modulator cannot meet the requirements; that is, the isolation withstand voltage of this type of modulator cannot reach tens of thousands of volts or higher. In addition, other isolation methods also have disadvantages such as complex circuitry and low reliability.
[0004] In view of the above, this application is hereby submitted. Utility Model Content
[0005] The technical problem this invention aims to solve is that existing modulators cannot achieve ultra-high voltage isolation. The purpose of this invention is to provide a signal isolator and modulator with ultra-high isolation voltage. First, it proposes a signal isolator using optoelectronic components to meet the requirements of ultra-high isolation; second, it proposes a modulator based on the above signal isolator.
[0006] This utility model is achieved through the following technical solution:
[0007] In a first aspect, this utility model provides an ultra-high isolation and withstand voltage signal isolator, which includes an optical medium, an optical emitting component, and an optical receiving component for achieving ultra-high voltage isolation;
[0008] The first side of the optical medium receives the input signal through an optical emitting component, and the second side of the optical medium outputs the output signal through an optical receiving component.
[0009] As a further preferred embodiment, an optical emitting component is used to convert the electrical signal of the input signal into an optical signal.
[0010] As a further preferred embodiment, the light emitting component includes resistor R1, resistor R2, light-emitting diode D1, and transistor Q;
[0011] The positive terminal of LED D1 is connected to one end of resistor R1, and the other end of resistor R1 is connected to power supply VCC. The negative terminal of LED D1 is connected to the emitter of transistor Q. The collector of transistor Q is grounded, and the base of transistor Q is connected to the input signal. One end of resistor R2 is connected to the base of transistor Q, and the other end of resistor R2 is connected to the other end of resistor R1.
[0012] Among them, the light-emitting diode D1 outputs the first intermediate signal OUT1 and serves as the input of the optical medium.
[0013] As a further preferred embodiment, the optical receiving component is used to convert the received optical signal into an electrical signal.
[0014] As a further preferred embodiment, the light receiving component includes a photodiode D2, a trigger U, and a resistor R3;
[0015] The positive terminal of photodiode D2 is connected to one end of trigger U, and the other end of trigger U serves as the output signal. The negative terminal of photodiode D2 is grounded. One end of resistor R3 is connected to the positive terminal of photodiode D2, and the other end of resistor R3 is connected to the power supply VCC.
[0016] Among them, the photodiode D2 inputs the second intermediate signal IN2, which is isolated by the optical medium.
[0017] As a further preferred option, trigger U is a Schmitt trigger.
[0018] As a further preferred option, the optical medium is a vacuum, air, or optical fiber.
[0019] As a further preferred option, the length of the optical medium can be adjusted (increased or decreased) according to actual needs.
[0020] Secondly, this utility model provides an ultra-high isolation voltage-resistant modulator, which includes a modulation chip, a first isolator, a second isolator, and an FPGA / DSP unit; both the first isolator and the second isolator adopt the aforementioned ultra-high isolation voltage-resistant signal isolator.
[0021] The output pin DOUT of the modulation chip is connected to the digital filter pin Digital Filter of the FPGA / DSP unit through the first isolator.
[0022] The clock pin of the FPGA / DSP unit is connected to the CLKIN pin of the modulation chip through a second isolator.
[0023] As a further preferred option, the modulation chip model is NSI1306.
[0024] Compared with the prior art, this utility model has the following advantages and beneficial effects:
[0025] This utility model discloses an ultra-high isolation withstand voltage signal isolator and modulator. First, it proposes a signal isolator using optoelectronic components to meet the requirements of ultra-high isolation. Second, it proposes a modulator based on the above signal isolator, which significantly improves the insulation withstand voltage value and is suitable for applications with tens of thousands of volts or higher isolation withstand voltage. Attached Figure Description
[0026] The accompanying drawings, which are included to provide a further understanding of the embodiments of the present invention and form part of this application, do not constitute a limitation thereof. In the drawings:
[0027] Figure 1 This diagram shows a typical application of a high-precision, enhanced isolated Δ-Σ modulator in existing technology.
[0028] Figure 2 This is a schematic diagram of the structure of an ultra-high isolation and withstand voltage signal isolator according to the present invention;
[0029] Figure 3 This is a circuit diagram of the optical emitting component of this utility model;
[0030] Figure 4 This is a circuit diagram of the optical receiving component of this utility model;
[0031] Figure 5 This is a circuit diagram of a modulator with ultra-high isolation and withstand voltage according to the present invention. Detailed Implementation
[0032] In the following, the terms “comprising” or “may include”, which may be used in various embodiments of the present invention, indicate the presence of a function, operation, or element of the invention and do not limit the addition of one or more functions, operations, or elements. Furthermore, as used in various embodiments of the present invention, the terms “comprising,” “having,” and their cognates are intended only to indicate a specific feature, number, step, operation, element, component, or combination of the foregoing and should not be construed as primarily excluding the presence of one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing, or adding one or more combinations of the foregoing.
[0033] In various embodiments of this utility model, the expression "or" or "at least one of A and / or B" includes any combination or all combinations of the words listed simultaneously. For example, the expression "A or B" or "at least one of A and / or B" may include A, may include B, or may include both A and B.
[0034] The terms used in the various embodiments of this utility model (such as "first," "second," etc.) may modify various constituent elements in the various embodiments, but do not limit the corresponding constituent elements. For example, the above terms do not limit the order and / or importance of the elements. The above terms are only used for the purpose of distinguishing one element from other elements. For example, a first user device and a second user device refer to different user devices, although both are user devices. For example, without departing from the scope of the various embodiments of this utility model, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.
[0035] It should be noted that if a description is made of "connecting" one component to another, then the first component can be directly connected to the second component, and a third component can be "connected" between the first and second components. Conversely, when a component is "directly connected" to another component, it can be understood that there is no third component between the first and second components.
[0036] The terminology used in the various embodiments of this invention is for the purpose of describing particular embodiments only and is not intended to limit the various embodiments of this invention. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the various embodiments of this invention pertain. The terms (such as those defined in a generally used dictionary) are to be interpreted as having the same meaning as in the context of the relevant technical field and are not to be interpreted as having an idealized or overly formal meaning, unless clearly defined in the various embodiments of this invention.
[0037] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of this utility model are only used to explain this utility model and are not intended to limit this utility model.
[0038] Example 1
[0039] like Figure 2 As shown, in order to solve the problem of ultra-high voltage isolation, this utility model proposes an ultra-high isolation withstand voltage signal isolator to meet the requirements of ultra-high isolation.
[0040] The signal isolator includes an optical medium, an optical transmitting component, and an optical receiving component for achieving ultra-high voltage isolation;
[0041] The first side of the optical medium receives the input signal through an optical emitting component, and the second side of the optical medium outputs the output signal through an optical receiving component.
[0042] Specifically, the optical emitting component is used to convert the electrical signal of the input signal into an optical signal.
[0043] An optical receiving component is used to convert received optical signals into electrical signals.
[0044] The optical transmitting component receives the input signal IN1 and outputs the first intermediate signal OUT1 as the input of the optical medium; the second intermediate signal IN2, isolated by the optical medium, serves as the input of the optical receiving component, and the optical receiving component outputs OUT2.
[0045] In this embodiment, the light emitting component consists of a driving circuit (which can be composed of gate circuits, transistors, or operational amplifiers, etc.) and a light-emitting diode. Its main function is to convert the electrical signal input at IN1 into an optical signal output at OUT1 via the light-emitting diode D1.
[0046] like Figure 3 As shown, Figure 3 This is a block diagram of the optical emitting component. The optical emitting component includes resistors R1 and R2, an LED D1, and a transistor Q. The positive terminal of LED D1 is connected to one end of resistor R1, and the other end of resistor R1 is connected to the power supply VCC. The negative terminal of LED D1 is connected to the emitter of transistor Q. The collector of transistor Q is grounded, and the base of transistor Q is connected to the input signal. One end of resistor R2 is connected to the base of transistor Q, and the other end of resistor R2 is connected to the other end of resistor R1. LED D1 outputs a first intermediate signal OUT1, which serves as the input to the optical medium.
[0047] In this embodiment, the optical medium is a vacuum, air, or optical fiber, and the length of the optical medium can be adjusted (increased or decreased) according to actual needs.
[0048] In this embodiment, the optical receiving component consists of a photodiode and a shaping circuit (the shaping circuit can be composed of gate circuits, transistors, or operational amplifiers, etc.). Its main function is to generate an electrical signal from the optical signal IN2 received by the photodiode D2. The electrical signal is rectified by the trigger U and then converted into a stable electrical signal OUT2 for output.
[0049] like Figure 4 As shown, Figure 4 This is a block diagram of the optical receiver component. The optical receiver component includes a photodiode D2, a trigger U, and a resistor R3;
[0050] The positive terminal of photodiode D2 is connected to one end of trigger U, and the other end of trigger U serves as the output signal. The negative terminal of photodiode D2 is grounded. One end of resistor R3 is connected to the positive terminal of photodiode D2, and the other end of resistor R3 is connected to the power supply VCC. The photodiode D2 receives the second intermediate signal IN2, which is optically isolated.
[0051] In this embodiment, trigger U is a Schmitt trigger.
[0052] The above technical solution, in this utility model, achieves signal isolation through an optical path formed by an optical emitting component, an optical medium, and an optical receiving component.
[0053] Example 2
[0054] like Figure 5 As shown, the difference between this embodiment and Embodiment 1 is that this embodiment provides an ultra-high isolation voltage-resistant modulator, which includes a modulation chip, a first isolator, a second isolator, and an FPGA / DSP unit; both the first isolator and the second isolator adopt an ultra-high isolation voltage-resistant signal isolator of Embodiment 1;
[0055] The output pin DOUT of the modulation chip is connected to the digital filter pin Digital Filter of the FPGA / DSP unit through the first isolator.
[0056] The clock pin of the FPGA / DSP unit is connected to the CLKIN pin of the modulation chip through a second isolator.
[0057] The Clock pin is the clock pin of the FPGA / DSP unit, used to generate periodic pulse signals. The CLKIN pin is the clock input pin of the NSI1306 modulation chip, used to receive the time reference signal for the modulation chip's operation.
[0058] The Digital Filter pin is the digital filter pin port of the FPGA / DSP unit. The OUT2 signal enters the FPGA / DSP unit for digital signal processing optimization. The FPGA / DSP unit can use existing chips, such as the GW1N-UV4QN88C6 chip.
[0059] In this embodiment, the modulation chip is model NSI1306.
[0060] The modulator operates as follows:
[0061] The digital signal output from the enhanced isolated Δ-Σ modulation chip NSI1306 enters the IN1 pin of the optical emitting component through the output pin DOUT, driving the LED to output the optical signal OUT1, corresponding to DOUT. The OUT1 optical signal is transmitted through an optical transmission medium (which can be vacuum, air, optical fiber, etc.) and enters the photodiode through IN2 to complete photoelectric conversion. After shaping, it is output as OUT2, which still corresponds to DOUT. This signal then enters the FPGA / DSP unit (…). Figure 5 As shown), high isolation measurement of the signal is completed.
[0062] The digital signal output from the FPGA / DSP unit is transmitted to IN11 of the optical emitting component via the Clock pin, driving the respective light-emitting diodes to output optical signals OUT11, corresponding to the Clock. The OUT11 optical signal is transmitted through an optical transmission medium (which can be vacuum, air, optical fiber, etc.) and enters the photodiode via IN21 to complete photoelectric conversion. After shaping, it is output as OUT21, which also corresponds to the Clock. This signal then enters the enhanced isolated Δ-Σ modulator to achieve high-isolation signal reception.
[0063] Because of the use of optical emitting and receiving components, the isolation spacing and creepage distance can be flexibly adjusted as needed, which greatly improves the insulation withstand voltage value.
[0064] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.
Claims
1. An ultra-high isolation voltage-tolerant signal isolator, characterized by, The signal isolator includes an optical medium, an optical transmitting component, and an optical receiving component for achieving ultra-high voltage isolation; The first side of the optical medium receives the input signal through an optical emitting component, and the second side of the optical medium outputs the output signal through an optical receiving component.
2. The ultra-high isolation withstand voltage signal isolator according to claim 1, characterized in that, The optical emitting component is used to convert the electrical signal of the input signal into an optical signal.
3. The ultra-high isolation withstand voltage signal isolator according to claim 2, characterized in that, The light-emitting component includes resistor R1, resistor R2, light-emitting diode D1, and transistor Q; The positive terminal of the light-emitting diode D1 is connected to one end of the resistor R1, and the other end of the resistor R1 is connected to the power supply VCC. The negative terminal of the light-emitting diode D1 is connected to the emitter of the transistor Q. The collector of the transistor Q is grounded, and the base of the transistor Q is connected to the input signal. One end of the resistor R2 is connected to the base of the transistor Q, and the other end of the resistor R2 is connected to the other end of the resistor R1. Among them, the light-emitting diode D1 outputs the first intermediate signal and serves as the input of the optical medium.
4. The ultra-high isolation withstand voltage signal isolator according to claim 1, characterized in that, The optical receiving component is used to convert the received optical signal into an electrical signal.
5. A signal isolator with ultra-high isolation withstand voltage according to claim 4, characterized in that, The optical receiving component includes a photodiode D2, a trigger U, and a resistor R3; The positive terminal of the photodiode D2 is connected to one end of the trigger U, and the other end of the trigger U serves as the output signal. The negative terminal of the photodiode D2 is grounded. One end of the resistor R3 is connected to the positive terminal of the photodiode D2, and the other end of the resistor R3 is connected to the power supply VCC. Among them, the photodiode D2 inputs the second intermediate signal which is isolated by the optical medium.
6. A signal isolator with ultra-high isolation withstand voltage according to claim 5, characterized in that, The trigger U is a Schmitt trigger.
7. A signal isolator with ultra-high isolation withstand voltage according to claim 1, characterized in that, The optical medium is a vacuum, air, or optical fiber.
8. A signal isolator with ultra-high isolation withstand voltage according to claim 1 or 7, characterized in that, The length of the optical medium can be adjusted according to actual needs.
9. A modulator with ultra-high isolation withstand voltage, characterized in that, The modulator includes a modulation chip, a first isolator, a second isolator, and an FPGA / DSP unit; both the first and second isolators are ultra-high isolation voltage withstand signal isolators as described in any one of claims 1 to 8. The output pin DOUT of the modulation chip is connected to the digital filter pin Digital Filter of the FPGA / DSP unit through a first isolator. The clock pin of the FPGA / DSP unit is connected to the CLKIN pin of the modulation chip via a second isolator.
10. A modulator with ultra-high isolation withstand voltage according to claim 9, characterized in that, The modulation chip is model NSI1306.