Optical coupling device

Abstract

This application discloses an optical coupling device, including: a substrate, a light-receiving element, a light-emitting element, and a switching circuit. The substrate includes an upper surface and a first groove extending from the upper surface into the interior of the substrate. The light-receiving element is disposed at the bottom of the first groove. The light-emitting element is disposed above the light-receiving element, and the light emitted by the light-emitting element is received by the light-receiving element. The switching circuit is electrically connected to the light-receiving element. The switching circuit is physically separated from the light-receiving element. Because the light-receiving element is disposed at the bottom of the first groove, the physical distance between the light-receiving element and the switching circuit is increased, reducing the impact of the high voltage of the switching circuit during operation on the light-receiving element, thereby improving the reliability of the optical coupling device.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more specifically to an optical coupling device. Background Technology

[0002] Optical coupling devices (including optocouplers and opto-relays) are a technology that achieves electrical isolation through optical signals and are widely used in power electronics, communications, industrial control, and other fields. An optical coupling device consists of a light-receiving element and a switching circuit. The switching circuit typically withstands high voltage, which can affect the light-receiving element and even cause damage to it. Utility Model Content

[0003] This application provides an optical coupling device that increases the physical distance between the light-receiving element and the switching circuit, thereby improving the reliability of the optical coupling device.

[0004] An optical coupling device includes: a substrate, a light-receiving element, a light-emitting element, and a switching circuit. The substrate includes a first groove extending from its upper surface into its interior. The light-receiving element is disposed at the bottom of the first groove. The light-emitting element is disposed above the light-receiving element, and light emitted by the light-emitting element is received by the light-receiving element. The switching circuit is electrically connected to the light-receiving element and physically separated from it.

[0005] In some embodiments, the upper surface of the light-receiving element is lower than the upper surface of the substrate.

[0006] In some embodiments, the upper surface of the light-receiving element is higher than the upper surface of the substrate.

[0007] In some embodiments, the projection of the light-emitting element along the vertical direction is completely located within the projection of the light-receiving element along the vertical direction.

[0008] In some embodiments, the optical coupling device further includes a first encapsulation body encapsulating the outside of the light-emitting element, the first encapsulation body being used to reflect light emitted by the light-emitting element and incident on the first encapsulation body to a light-receiving element.

[0009] In some embodiments, the material of the first encapsulation body is a light-transmitting material.

[0010] In some embodiments, the optical coupling device further includes a second encapsulation body located on the upper surface of the substrate, the second encapsulation body encapsulating the light-receiving element, the light-emitting element, and the switching circuit, wherein the material of the second encapsulation body is an opaque material.

[0011] In some embodiments, the depth of the first groove is greater than or equal to 10% of the thickness of the substrate and less than or equal to 80% of the thickness of the substrate.

[0012] In some embodiments, the width of the first groove is greater than or equal to 20% of the width of the substrate and less than or equal to 70% of the width of the substrate.

[0013] In some embodiments, the distance between the edge of the first groove and the edge of the substrate is greater than or equal to 50 μm.

[0014] In some embodiments, an adhesive layer is provided between the light-emitting element and the light-receiving element, and the adhesive layer has light transmittance and insulation.

[0015] In some embodiments, the adhesive layer is located in the first groove.

[0016] In some embodiments, the switching circuit is disposed on a first surface of the substrate.

[0017] In some embodiments, the switching circuit is spaced apart from the first groove, and the distance between the switching circuit and the first groove is greater than or equal to 50 μm.

[0018] In some embodiments, the substrate further includes a second groove extending from the upper surface of the substrate into the interior of the substrate, the second groove being spaced apart from the first groove, and the switching circuit being disposed in the second groove.

[0019] In some embodiments, the depth of the second groove is greater than the depth of the first groove.

[0020] In some embodiments, the depth of the second groove is less than the depth of the first groove.

[0021] In some embodiments, the depth of the second groove is equal to the depth of the first groove.

[0022] In some embodiments, the optical coupling device further includes an input terminal and an output terminal, with the light-emitting element electrically connected to the input terminal and the light-receiving element electrically connected to the output terminal via a switching circuit.

[0023] In some embodiments, a first electrical connection structure and a second electrical connection structure are provided on the substrate, the light-emitting element is electrically connected to the first electrical connection structure, the switching circuit is electrically connected to the second electrical connection structure, and the light-receiving element is electrically connected to the switching circuit through a second lead.

[0024] In some embodiments, the light-emitting element is electrically connected to the first electrical connection structure via a first lead.

[0025] In some embodiments, the switching circuit is electrically connected to the second electrical connection structure by means of surface mounting.

[0026] In some embodiments, the first electrical connection structure and the second electrical connection structure are located on the upper surface of the substrate.

[0027] In some embodiments, the switching circuit includes a first transistor and a second transistor connected in a half-bridge configuration.

[0028] In some embodiments, the first transistor and the second transistor are at substantially the same distance from the light-receiving element.

[0029] In some embodiments, the distance between the second transistor and the light-receiving element is greater than the distance between the first transistor and the light-receiving element.

[0030] This application provides an optical coupling device, including: a substrate, a light-receiving element, a light-emitting element, and a switching circuit. The substrate includes a first groove extending from the upper surface of the substrate into the interior of the substrate. The light-receiving element is disposed at the bottom of the first groove, which increases the physical distance between the switching circuit and the light-receiving element, reduces the impact of the high voltage of the switching circuit during operation on the light-receiving element, and improves the reliability of the optical coupling device. Attached Figure Description

[0031] The above and other objects, features, and advantages of this application will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0032] Figure 1 This is a structural block diagram of the optical coupling device according to an embodiment of this application;

[0033] Figure 2 This is a cross-sectional view of an optical coupling device according to an embodiment of this application;

[0034] Figure 3 This is a cross-sectional view of another optical coupling device according to an embodiment of this application;

[0035] Figure 4 This is a circuit diagram of an optical coupling device according to an embodiment of this application;

[0036] Figure 5 This is a top view of an optical coupling device according to an embodiment of this application;

[0037] Figure 6 This is a cross-sectional view of the first transistor and electrical connection structure according to an embodiment of this application;

[0038] Figure 7 This is another cross-sectional view of the first transistor and electrical connection structure according to an embodiment of this application;

[0039] Figure 8 This is a top view of another optical coupling device according to an embodiment of this application. Detailed Implementation

[0040] The present application is described below based on embodiments, but it is not limited to these embodiments. In the detailed description of the present application below, certain specific details are described in detail. Those skilled in the art can fully understand the present application without these details. To avoid obscuring the substance of the present application, well-known methods, processes, flows, elements, and circuits are not described in detail.

[0041] Those skilled in the art will understand that the accompanying drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.

[0042] It should be understood that, in the following description, "circuit" refers to a conductive loop consisting of at least one element or sub-circuit connected by an electrical or electromagnetic connection. When an element or circuit is said to be "connected" to another element, or when an element / circuit is said to be "connected" between two nodes, it can be a direct connection or a connection to another element, or there may be intermediate elements. The connection between elements can be physical, logical, or a combination thereof. Conversely, when an element is said to be "directly connected" to another element, it means that there are no intermediate elements between them.

[0043] Unless the context explicitly requires it, words such as "including," "etc." throughout the application should be interpreted as having the meaning of "including but not limited to," rather than "exclusive" or "exhaustive."

[0044] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0045] This application provides an optical coupling device that improves the reliability of the optical coupling device by increasing the physical distance between the light-receiving element and the switching circuit.

[0046] Figure 1 This is an exemplary structural block diagram of an optical coupling device. Figure 2This is a cross-sectional view of an optical coupling device. The optical coupling device 10 includes: a substrate 100, a light-emitting element 300, a light-receiving element 200, and a switching circuit 400. The substrate 100 is formed, for example, of an insulating material. The substrate 100 includes an upper surface 101 and a lower surface 102. The upper surface 101 and the lower surface 102 are opposite each other in the vertical direction Z. The vertical direction Z is a direction perpendicular to the substrate 100. The top view plane of the substrate 100 is a plane defined by a first direction X and a second direction Y. The substrate 100 includes a first groove 110 extending from its upper surface 101 into its interior. The light-receiving element 200 is disposed at the bottom of the first groove 110. The light-emitting element 300 is disposed above the light-receiving element 200, and the light emitted by the light-emitting element 300 is received by the light-receiving element 200. The switching circuit 400 is electrically connected to the light-receiving element 200, and the switching circuit 400 is physically separated from the light-receiving element 200.

[0047] The light-emitting element 300 is an element that emits light when an electrical signal is input, such as a light-emitting diode (LED) or an LED array. The light-receiving element 200 is an element that outputs an electrical signal based on the incident light, such as a photodiode or a photodiode array.

[0048] like Figure 1 As shown, the optocoupler 10 also includes an input terminal 20 and an output terminal 30. The light-emitting element 300 is electrically connected to the input terminal 20. The light-receiving element 200 is connected to the output terminal 30 via a switching circuit 400. The optocoupler 10 receives a first electrical signal through the input terminal 20. The light-emitting element 300 generates a light signal based on the first electrical signal. The light-receiving element 200 generates an intermediate electrical signal based on the light signal. Based on the intermediate electrical signal, the switching circuit 400 outputs a second electrical signal through the output terminal 30. The electrical signal can be a voltage signal or a current signal.

[0049] The projection of the light-emitting element 300 along the vertical direction Z lies entirely within the projection of the light-receiving element 200 along the vertical direction Z. An adhesive layer 510 is disposed between the light-emitting element 300 and the light-receiving element 200. The adhesive layer 510 is used to fix the light-emitting element 300 to the upper surface of the light-receiving element 200. The adhesive layer 510 has light transmittance and insulation. Exemplarily, the adhesive layer 510 is formed by curing an insulating transparent adhesive. The adhesive layer 510 is located in the first groove 110. Since both the light-receiving element 200 and the adhesive layer 510 are located in the first groove 110, when transparent adhesive is applied to the light-receiving element 200, the first groove 110 restricts the flow of transparent adhesive, preventing transparent adhesive from overflowing onto the upper surface 101 of the substrate 100 and affecting the electrical connection devices on the substrate. The upper surface of the light-receiving element 200 includes a light-receiving area and a pad area. The light-emitting element 300 is disposed above the light-receiving area.

[0050] like Figure 2 As shown, the distance d between the edge of the first groove 110 and the edge of the substrate 100 is greater than or equal to 50 μm. A switch circuit 400 is disposed on the first surface 101 of the substrate 100, spaced apart from the first groove 110. The distance D1 between the first groove 110 and the switch circuit 400 is greater than or equal to 50 μm.

[0051] like Figure 2 As shown, the depth of the first groove 110 is greater than or equal to 10% of the thickness H of the substrate 100, and less than or equal to 80% of the thickness H of the substrate 100. The thickness H of the substrate 100 is the thickness of the substrate 100 in the vertical direction Z. The depth of the first groove 110 is the depth in the vertical direction Z.

[0052] In some embodiments, the width of the first groove 110 is greater than or equal to 20% of the width of the substrate 100 and less than or equal to 70% of the width of the substrate 100. The width of the first groove 110 is the width of the first groove 110 in the first direction X. The width of the substrate 100 is the width of the substrate in the first direction X. The first groove 110 and the switching circuit 400 are arranged in the first direction X.

[0053] like Figure 2 As shown, the light-receiving element 200 is disposed at the bottom of the first groove 110, and the switching circuit 400 is disposed on the first surface 101 of the substrate 100. Compared with the situation where both the light-receiving element 200 and the switching circuit 400 are disposed on the first surface 101 of the substrate 100, the physical distance between the light-receiving element 200 and the switching circuit 400 is increased, the impact of the high voltage of the switching circuit 400 during operation on the light-receiving element 200 is reduced, and the reliability of the optical coupling device is improved.

[0054] Figure 3 This is a cross-sectional view of another type of optical coupling device. For example... Figure 3 As shown, the optical coupling device 10 also includes a second groove 120 extending from the upper surface 101 of the substrate 100 into the interior of the substrate 100. The second groove 120 is spaced apart from the first groove 110. The switching circuit 400 is disposed in the second groove 120.

[0055] like Figure 3 As shown, the first groove 110 and the second groove 120 are separated by the wall portion 130 of the substrate 100. The distance between the second groove 120 and the first groove 110 is D2. In some embodiments, the depth of the second groove 120 is greater than the depth of the first groove 110. In other embodiments, the depth of the second groove 120 is equal to the depth of the first groove 110. In still other embodiments, the depth of the second groove 120 is less than the depth of the first groove 110.

[0056] The light-receiving element 200 and the switching circuit 400 are respectively disposed in the first groove 110 and the second groove 120. The first groove 110 and the second groove 120 are separated by an insulating wall 130, which further reduces the impact of the high voltage of the switching circuit 400 on the light-receiving element 200 during operation.

[0057] like Figure 2 and 3 As shown, the optical coupling device 10 further includes a first encapsulation body 520, which encapsulates the outside of the light-emitting element 300 and is used to reflect light emitted by the light-emitting element 300 and incident on the first encapsulation body 520 to the light-receiving element 200. The material of the first encapsulation body 520 is a light-transmitting material. For example, the material of the first encapsulation body 520 is transparent resin.

[0058] The first encapsulation 520 is formed by curing transparent resin. After the light-emitting element 300 is fixed to the light-receiving element 200 by the adhesive layer 510, transparent resin is then applied to the light-emitting element 300 and cured. Transparent resin has a free-flowing characteristic, causing it to overflow from the predetermined area. In this application, since the light-receiving element 200 is disposed in the first groove 110 and the light-emitting element 300 is disposed above the light-receiving element 200, the transparent resin is confined by the first groove 110 during the formation of the first encapsulation 520, preventing overflow.

[0059] In some embodiments, the upper surface of the light-receiving element 200 is lower than the upper surface 101 of the substrate 100. When the upper surface of the light-receiving element 200 is lower than the upper surface 101 of the substrate 100, the first groove 110 has a better confinement effect on the transparent resin.

[0060] In another embodiment, the upper surface of the light-receiving element 200 is higher than the upper surface 101 of the substrate 100.

[0061] The optical coupling device 10 also includes a second encapsulation body 530. The second encapsulation body 530 encapsulates the light-receiving element 200, the light-emitting element 300, the switching circuit 400, and the upper surface 101 of the substrate 100. The material of the second encapsulation body 530 is an opaque material. The second encapsulation body 530 is formed, for example, of a black resin material, such as epoxy resin. The second encapsulation body 530 serves to protect the light-receiving element 200, the light-emitting element 300, and the switching circuit 400.

[0062] Figure 4This is an exemplary circuit diagram of an optical coupling device according to an embodiment of this application. Input terminals 20 include a first input terminal 20a and a second input terminal 20b. Output terminals 30 include a first output terminal 30a and a second output terminal 30b. The first input terminal 20a and the second input terminal 20b are respectively connected to the two ends of the light-emitting element 300. The first input terminal 20a and the second input terminal 20b are used to receive a first electrical signal provided externally. The optical coupling device 10 also includes a control circuit 210. The light-receiving element 200 is connected to the control circuit 210. The control circuit 210 is connected to a switching circuit 400. The switching circuit 400 is connected to the first output terminal 30a and the second output terminal 30b.

[0063] The switching circuit 400 includes a first transistor 410 and a second transistor 420. The first transistor 410 and the second transistor 420 are connected in a half-bridge configuration, for example. The first transistor 410 and the second transistor 420 are, for example, metal-oxide-semiconductor field-effect transistors (MOSFETs). Figure 4 As shown, the first transistor 410 and the second transistor 420 are MOSFETs with common-source connection. The gate G of both the first transistor 410 and the second transistor 420 is connected to the first terminal of the control circuit 210. The source S of both the first transistor 410 and the second transistor 420 is connected to the second terminal of the control circuit 210. The drain D of the first transistor 410 is connected to the first output terminal 30a, and the drain D of the second transistor 420 is connected to the second output terminal 30b.

[0064] When the light signal is turned on (when the light-emitting element 300 emits light), the control circuit 210 provides the current and / or voltage generated by the light-receiving element 200 to the first transistor 410 and the second transistor 420, so that the first transistor 410 and the second transistor 420 are turned on.

[0065] When the light signal is turned off (when the light-emitting element 300 does not emit light), the control circuit 210 short-circuits the gate G and source S of the first transistor 410 and the second transistor 420, discharging the accumulated charge and disconnecting the first transistor 410 and the second transistor 420.

[0066] The control circuit 210 includes, for example, a resistor connected between the gate G and source S of the first transistor 410 and a resistor connected between the gate G and source S of the second transistor 420. The first transistor 410 and the second transistor 420 are, for example, n-channel enhancement-mode MOSFETs.

[0067] Figure 5 This is a top view of an optical coupling device according to an embodiment of this application. The substrate 100 has a width of W in the second direction Y and a width of L in the first direction X. Figure 5As shown, a first electrical connection structure 303 and 304, and a second electrical connection structure 305 and 306 are provided on the substrate 100. The first electrical connection structures 303 and 304 are disposed on the first surface 101 of the substrate 100. The first and second electrical connection structures are, for example, copper layers. The first electrical connection structures 303 and 304 are electrically connected to the input terminal 20, and the second electrical connection structures 305 and 306 are electrically connected to the output terminal 30. The light-emitting element 300 is electrically connected to the first electrical connection structures 303 and 304, and the switching circuit 400 is electrically connected to the second electrical connection structures 305 and 306. The light-receiving element 200 is electrically connected to the switching circuit 400.

[0068] The upper surface of the light-emitting element 300 is provided with pad areas 301 and 302. For example, pad areas 301 and 302 are the anode pad area and cathode pad area of ​​the light-emitting diode, respectively. Pad areas 301 and 302 are connected to first electrical connection structures 303 and 304 via first leads 601 and 602, respectively. First electrical connection structures 303 and 304 are connected to the first input terminal 20a and the second input terminal 20b, respectively.

[0069] The light-receiving element 200 includes a first pad region 201, a second pad region 202, a third pad region 203, and a fourth pad region 204. The first pad region 201 and the fourth pad region 204 are, for example, the anode pad regions of a photodiode. The second pad region 202 and the third pad region 203 are, for example, the cathode pad regions of a photodiode.

[0070] The first transistor 410 includes a first pad region 411 and a second pad region 412. The first pad region 411 is, for example, the gate pad region of the first transistor 410, and the second pad region 412 is, for example, the source pad region of the first transistor 410. The second transistor 420 includes a first pad region 421 and a second pad region 422. The first pad region 421 is, for example, the gate pad region of the second transistor 420, and the second pad region 422 is, for example, the source pad region of the second transistor 420.

[0071] The first pad region 201 and the fourth pad region 204 of the light-receiving element 200 are connected to the first pad region 411 of the first transistor 410 and the first pad region 421 of the second transistor 420 via second leads 603 and 606, respectively. The second pad region 202 and the third pad region 203 of the light-receiving element 200 are connected to the second pad region 412 of the first transistor 410 and the second pad region 422 of the second transistor 420 via second leads 604 and 605, respectively. The second pad region 412 of the first transistor 410 is also connected to the second pad region 422 of the second transistor 420 via lead 607, thereby realizing the common source connection of the first transistor 410 and the second transistor 420. The leads are formed of, for example, an iron-nickel alloy, a copper alloy, or a gold alloy.

[0072] For example, the switch circuit 400 is connected to the second electrical connection structures 305 and 306 by means of surface mounting. Figure 6 This is a cross-sectional view of the first transistor 410. The cross-sectional view of the second transistor 420 is basically the same as that of the first transistor 410. For example, the first transistor 410 and the second transistor 420 have a vertical structure. The drain contact areas of the first transistor 410 and the second transistor 420 are located on the lower surfaces of the first transistor 410 and the second transistor 420. The drain contact area of ​​the first transistor 410 is in direct contact with the second electrical connection structure 305 or connected through a conductive adhesive layer. The drain contact area of ​​the second transistor 420 is in direct contact with the second electrical connection structure 306 or connected through a conductive adhesive layer. The second electrical connection structures 305 and 306 are respectively connected to the first output terminal 30a and the second output terminal 30b.

[0073] In some embodiments, the first input terminal 20a, the second input terminal 20b, the first output terminal 30a, and the second output terminal 30b are located on the lower surface 102 of the substrate 100. First electrical connection structures 303 and 304 connect the first input terminal 20a and the second input terminal 20b respectively through conductive vias passing through the substrate 100 in the vertical Z direction. Figure 6 As shown, the second electrical connection structure 305 corresponding to the first transistor 410 is connected to the first output terminal 30a through a conductive via 307 passing through the substrate 100 in the vertical direction Z. The second electrical connection structure 306 corresponding to the second transistor 420 is connected to the second output terminal 30b through a conductive via 307 passing through the substrate 100 in the vertical direction Z.

[0074] In other embodiments, the first input terminal 20a, the second input terminal 20b, the first output terminal 30a, and the second output terminal 30b are located on the upper surface 101 of the substrate 100 and exposed outside the second encapsulation 530. For example, the first input terminal 20a and the first electrical connection structure 303 are integral conductive structures, and the second input terminal 20b and the first electrical connection structure 304 are integral conductive structures. Figure 7 A cross-sectional view of the first transistor and the second electrical connection structure is shown. The second electrical connection structure 305 corresponding to the first transistor 410 and the first output terminal 30a are integral conductive structures. The second electrical connection structure 305 is the part enclosed by the second encapsulation body 530, and the second electrical connection structure 305 is the part exposed outside the second encapsulation body 530.

[0075] exist Figure 5 In the illustrated embodiment, the light-receiving element 200 is disposed in the first recess 110, and the first transistor 410 and the second transistor 420 are disposed on the upper surface 101 of the substrate 100 or in the second recess 120. When the first transistor 410 and the second transistor 420 are disposed on the upper surface 101 of the substrate 100, the second electrical connection structure 305 is disposed on the upper surface 101 of the substrate 100. When the first transistor 410 and the second transistor 420 are disposed in the second recess 120, the second electrical connection structure 305 is disposed at the bottom of the second recess 120.

[0076] exist Figure 5 In the illustrated embodiment, the first transistor 410 and the second transistor 420 are arranged along the second direction Y, so the distance between the first transistor 410 and the light-receiving element 200 and the distance between the second transistor 420 and the light-receiving element 200 are substantially the same. "Substantially the same" means that the difference between the distance between the first transistor 410 and the light-receiving element 200 and the distance between the second transistor 420 and the light-receiving element 200 is within the range affected by process errors.

[0077] Figure 5 The width L of the substrate 100 in the first direction X, the width W of the substrate 100 in the second direction Y, and the width L of the first groove 110 in the first direction X are shown. 110 The width W of the first groove 110 in the second direction Y 110 20% L≤L 110 ≤70%L, 20%W≤W 110 ≤100%W.

[0078] Figure 8 This is a top view of another optical coupling device according to an embodiment of this application. Figure 8In the illustrated embodiment, the first transistor 410 and the second transistor 420 are arranged along a first direction X. The distance between the first transistor 410 and the light-receiving element 200 is less than the distance between the second transistor 420 and the light-receiving element 200.

[0079] exist Figure 8 In the illustrated embodiment, the light-receiving element 200 is disposed in the first groove 110, and the first transistor 410 and the second transistor 420 are disposed on the upper surface 101 of the substrate 100 or disposed in the second groove 120.

[0080] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An optical coupling device, characterized in that, The optical coupling device includes: A substrate, the substrate including a first groove extending from the upper surface of the substrate into the interior of the substrate; A light-receiving element is disposed at the bottom of the first groove; A light-emitting element is disposed above a light-receiving element, and the light emitted by the light-emitting element is received by the light-receiving element. A switching circuit is electrically connected to the light-receiving element, and the switching circuit is physically separated from the light-receiving element.

2. The optical coupling device according to claim 1, characterized in that, The upper surface of the light-receiving element is lower than the upper surface of the substrate.

3. The optical coupling device according to claim 1, characterized in that, The upper surface of the light-receiving element is higher than the upper surface of the substrate.

4. The optical coupling device according to claim 1, characterized in that, The projection of the light-emitting element along the vertical direction is completely located within the projection of the light-receiving element along the vertical direction.

5. The optical coupling device according to claim 1, characterized in that, The optical coupling device further includes a first encapsulation body, which encapsulates the outside of the light-emitting element and is used to reflect the light emitted by the light-emitting element and incident on the first encapsulation body to the light-receiving element.

6. The optical coupling device according to claim 5, characterized in that, The material of the first encapsulation body is a light-transmitting material.

7. The optical coupling device according to claim 1, characterized in that, The optical coupling device further includes a second encapsulation body located on the upper surface of the substrate. The second encapsulation body encapsulates the light-receiving element, the light-emitting element, and the switching circuit. The material of the second encapsulation body is an opaque material.

8. The optical coupling device according to claim 1, characterized in that, The depth of the first groove is greater than or equal to 10% of the thickness of the substrate and less than or equal to 80% of the thickness of the substrate.

9. The optical coupling device according to claim 1, characterized in that, The width of the first groove is greater than or equal to 20% of the width of the substrate and less than or equal to 70% of the width of the substrate.

10. The optical coupling device according to claim 1, characterized in that, The distance between the edge of the first groove and the edge of the substrate is greater than or equal to 50 μm.

11. The optical coupling device according to claim 1, characterized in that, An adhesive layer is provided between the light-emitting element and the light-receiving element, and the adhesive layer has light transmittance and insulation.

12. The optical coupling device according to claim 11, characterized in that, The adhesive layer is located in the first groove.

13. The optical coupling device according to claim 1, characterized in that, The switching circuit is disposed on the first surface of the substrate.

14. The optical coupling device according to claim 1, characterized in that, The switching circuit is spaced apart from the first groove, and the distance between the switching circuit and the first groove is greater than or equal to 50 μm.

15. The optical coupling device according to claim 1, characterized in that, The substrate also has a second groove extending from the upper surface of the substrate into the interior of the substrate, the second groove being spaced apart from the first groove, and the switching circuit being disposed in the second groove.

16. The optical coupling device according to claim 15, characterized in that, The depth of the second groove is greater than the depth of the first groove.

17. The optical coupling device according to claim 15, characterized in that, The depth of the second groove is less than the depth of the first groove.

18. The optical coupling device according to claim 15, characterized in that, The depth of the second groove is equal to the depth of the first groove.

19. The optical coupling device according to any one of claims 1-18, characterized in that, The optical coupling device further includes an input terminal and an output terminal. The light-emitting element is electrically connected to the input terminal, and the light-receiving element is electrically connected to the output terminal through the switching circuit.

20. The optical coupling device according to claim 1, characterized in that, The substrate is provided with a first electrical connection structure and a second electrical connection structure. The light-emitting element is electrically connected to the first electrical connection structure, the switching circuit is electrically connected to the second electrical connection structure, and the light-receiving element is electrically connected to the switching circuit through a second lead.

21. The optical coupling device according to claim 20, characterized in that, The light-emitting element is electrically connected to the first electrical connection structure via a first lead.

22. The optical coupling device according to claim 20, characterized in that, The switching circuit is electrically connected to the second electrical connection structure by means of surface mounting.

23. The optical coupling device according to claim 20, characterized in that, The first electrical connection structure and the second electrical connection structure are located on the upper surface of the substrate.

24. The optical coupling device according to claim 1, characterized in that, The switching circuit includes a first transistor and a second transistor connected in a half-bridge configuration.

25. The optical coupling device according to claim 24, characterized in that, The first transistor and the second transistor are at substantially the same distance from the light-receiving element.

26. The optical coupling device according to claim 24, characterized in that, The distance between the second transistor and the light-receiving element is greater than the distance between the first transistor and the light-receiving element.

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