A handheld SPI and IIC bus integration tester

Abstract

This application relates to the field of communication testing equipment, and in particular to a handheld SPI and IIC bus integrated tester. It includes a battery, a power management module, a main control module with a built-in MCU, an SPI test module, an IIC test module, and a display control module. Both the SPI and IIC test modules include communication lines and connectors. The communication lines are connected in series with resistors to prevent signal overshoot. It also includes an IIC resistor configuration unit and an SPI / IIC mode switching unit. The tester has a housing with a reasonable layout of the modules, and the housing has test interfaces. This application achieves the technical effects of integrating SPI and IIC bus testing functions, allowing for handheld operation, preventing signal overshoot through resistor settings, flexibly switching test modes, and facilitating bus testing of devices.

Description

Technical Field

[0001] This application relates to the field of communication testing equipment, and in particular to a handheld SPI and IIC bus integrated tester. Background Technology

[0002] In embedded systems, SPI and IIC, as two widely used serial communication buses, play important roles in many fields such as electronic devices, industrial control, and smart homes. With the continuous development of technology, the application scenarios of embedded systems are becoming increasingly widespread, and the requirements for verifying the stability and correctness of SPI and IIC bus communication are also becoming increasingly stringent.

[0003] In the past, engineers typically used various devices to verify the correctness of bus communication during development and debugging. Common methods included using computers, logic analyzers, and oscilloscopes. Computers can analyze and process bus data using specific software; logic analyzers can capture and display the logic state of digital signals, helping engineers observe the timing and logical relationships of signals; and oscilloscopes can visually display the waveform of electrical signals, facilitating the detection of parameters such as signal amplitude and frequency.

[0004] However, these verification methods have obvious drawbacks: (1) The equipment required for debugging is numerous, the connection relationship is complex, the cost is high, and it requires external 220V power supply, which is extremely inconvenient when operating on the production line or on site; (2) It has limited functionality and cannot quickly configure the host or slave according to existing protocols, thus failing to efficiently complete the bus verification work. Utility Model Content

[0005] This application provides a handheld SPI and IIC bus integrated tester to solve the problems of poor portability, reliance on a host computer, inability to work offline, and lack of flexible configuration in existing test instruments. The technical solution adopted is as follows: A handheld SPI and IIC bus integration tester includes: Battery, Power management module; The main control module has a built-in MCU, and the MCU is electrically connected to the power management module; The SPI test module communicates with the MCU. The IIC test module communicates with the MCU. The display control module is electrically connected to the power management module; the MCU is communicatively connected to the display control module.

[0006] By adopting the above technical solution, the tester has a built-in battery and display screen, which frees it from dependence on external power supply and computer, and truly realizes testing anytime and anywhere; and the SPI test module and IIC test module are highly integrated and controlled by MUC, realizing the integration of the tester, which is particularly suitable for rapid testing on the production line and on-site equipment debugging.

[0007] Preferably, both the SPI test module and the IIC test module include a communication line and a connector; the input end of the communication line is connected to the MCU for communication, and the output end is connected to the connector.

[0008] By adopting the above technical solution, the SPI test module and the IIC test module can communicate with the MCU through the communication line and connect to external devices through the connector, so as to realize the tester's test function for the SPI and IIC buses.

[0009] Preferably, the communication lines of the SPI test module include SCK signal lines, MOSI signal lines, MISO signal lines, CS signal lines, and INT signal lines; the input ends of the SCK signal lines, MOSI signal lines, MISO signal lines, CS signal lines, and INT signal lines are all connected to the MCU for communication, and the output ends are all connected to a connector.

[0010] By adopting the above technical solution, the SPI test module has five signal lines (SCK, MOSI, MISO, CS, and INT) led out from the MCU and connected to the connector, which can realize the corresponding SPI test function.

[0011] Preferably, the SCK signal line, MOSI signal line, MISO signal line, CS signal line and INT signal line are all connected in series with a resistor to prevent signal overshoot.

[0012] Preferably, the communication lines of the IIC test module include SCK signal lines, SDA signal lines, and INT signal lines; the input terminals are all connected to the MCU for communication, and the output terminals are all connected to a connector.

[0013] By adopting the above technical solution, the IIC test module is led out from the MCU and includes three signal lines: SCK, SDA, and INT. The test signal is transmitted through a connector to realize the corresponding IIC test function.

[0014] Preferably, the SCK signal line, SDA signal line and INT signal line are all connected in series with a resistor to prevent signal overshoot.

[0015] Preferably, it further includes an IIC resistor configuration unit, which includes a first pull-up resistor and a control unit. The MCU has a communication pin that is connected to the IIC test module. The communication pin is connected to a second pull-up resistor. The first pull-up resistor is connected to the second pull-up resistor through the control unit. The control unit is used to control the first pull-up resistor and the second pull-up resistor to be connected in parallel or disconnected.

[0016] By adopting the above technical solution, IIC is often used in a master-slave configuration. In this case, insufficient drive capability may occur, failing to meet the electrical characteristics of the IIC devices. This problem can be solved by adjusting the value of the IIC pull-up resistor. Under normal conditions, the IIC bus of the tester is pulled up to 3.3V through a second pull-up resistor (4.7KΩ), ensuring low power consumption. When multiple devices are connected to the IIC bus, the first and second pull-up resistors can be connected in parallel, thereby adjusting the pull-up resistor to 2.35KΩ, doubling the drive capability.

[0017] Preferably, it also includes an SPI / IIC mode switching unit for communication with the MCU.

[0018] By adopting the above technical solution and adding an SPI / IIC mode switching unit, the tester can flexibly switch between SPI and IIC test modes to meet different test requirements.

[0019] Preferably, the tester has a housing, and the battery is disposed inside the housing; the power management module, main control module, SPI test module, and IIC test module are integrated on a PCB, which is disposed inside the housing; the display control module includes a display screen and operation buttons, both of which are disposed on the housing; the housing is also provided with a test interface for communicating with the SPI test module and the IIC test module and for connecting with the test equipment.

[0020] By adopting the above technical solution, the main control module, SPI test module, IIC test module, battery, power management module, display screen, operation buttons, etc. are highly integrated into a single handheld shell, enabling it to work independently without a host computer and external power supply, fundamentally solving the pain points of on-site testing.

[0021] In summary, this application includes at least one of the following beneficial technical effects: 1. The tester has a built-in battery and display screen, which frees it from dependence on external power supply and computer, and truly realizes testing anytime and anywhere; and it highly integrates the SPI test module and IIC test module, controlled by MUC, to realize the integration of the tester, which is particularly suitable for rapid testing on the production line and on-site equipment debugging. 2. The communication lines of the SPI test module and the IIC test module are connected in series with resistors to prevent signal overshoot; the IIC pull-up resistor value can be adjusted through the IIC resistor configuration module to solve the problem of insufficient IIC drive capability in a master-slave test scenario; at the same time, an SPI / IIC mode switching module is provided to realize flexible switching between the two test modes. 3. The main control module, SPI test module, IIC test module, battery, power management module, display screen, buttons, etc. are highly integrated into a single handheld shell, enabling it to work independently without a host computer and external power supply, fundamentally solving the pain points of on-site testing. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of each circuit module in the tester in the embodiments of this application; Figure 2 This is a schematic diagram of the MUC in the embodiments of this application; Figure 3 This is a schematic diagram of the circuit structure of the SPI test module in an embodiment of this application; Figure 4 This is a schematic diagram of the circuit structure of the IIC test module in an embodiment of this application; Figure 5 This is a schematic diagram of the circuit structure of the IIC resistor configuration unit in an embodiment of this application; Figure 6 This is a schematic diagram of the circuit structure of the SPI / IIC mode switching unit in an embodiment of this application; Figure 7 This is a schematic diagram of the external structure of the tester in an embodiment of this application; Figure 8 This is a schematic diagram of the exploded structure of the tester in an embodiment of this application.

[0023] The attached diagram is labeled as follows: 1. Battery; 2. Power Management Module; 3. Main Control Module; 31. MCU; 311. Second Pull-up Resistor; 32. IIC Resistor Configuration Unit; 321. First Pull-up Resistor; 33. SPI / IIC Mode Switching Unit; 4. SPI Test Module; 5. IIC Test Module; 6. Display Control Module; 61. Display Screen; 62. Operation Buttons; 7. Housing; 8. PCB; 9. Test Interface. Detailed Implementation

[0024] The following will be combined with the appendix Figures 1 to 8 The technical solutions in the embodiments of this utility model are described in further detail below. The described embodiments are only possible technical implementations of this utility model, but are not limited thereto. Other embodiments obtained by those skilled in the art in conjunction with the embodiments of this utility model without creative effort are also within the protection scope of this utility model.

[0025] This application mainly adopts a built-in battery 1 and a display screen 61 and integrates a test module, achieving the effect of eliminating dependence on external power supply and computer, and realizing testing anytime and anywhere. The following is a further detailed description of this application.

[0026] Reference Figure 1 The handheld SPI and IIC bus integration tester provided in this application includes a battery 1, a power management module 2, a main control module 3, an SPI test module 4, an IIC test module 5, and a display control module 6. Battery 1 provides power to the entire tester. Power management module 2 distributes and manages the power from battery 1, ensuring stable power supply to all modules. The MCU 31 of the main control module 3 is electrically connected to power management module 2, receiving power from it. Furthermore, the MCU 31 of the main control module 3 is communicatively connected to SPI test module 4, IIC test module 5, and display control module 6, enabling control and data exchange with these modules. The display control module 6 is electrically connected to power management module 2 to obtain power, display test results, and operate the tester.

[0027] This application achieves the goal of freeing the tester from dependence on external power supply and computer, enabling testing anytime and anywhere, and integrating SPI and IIC testing functions, making it suitable for rapid production line testing and on-site equipment debugging. This is because the built-in battery 1 eliminates the need for an external 220V power supply, the display screen 61 can independently display test results, and the MCU 31 uniformly controls all modules, achieving functional integration.

[0028] Specifically, battery 1 can be a lithium battery, suitable for devices with high portability requirements. Power management module 2 includes a voltage conversion circuit and a charging circuit. The voltage conversion circuit converts the voltage of battery 1 to different voltage values ​​required by various modules, for example, converting the high voltage of battery 1 to a low voltage suitable for the operation of MCU 31. The charging circuit manages the charging of battery 1, preventing overcharging or over-discharging and extending its lifespan. The voltage conversion circuit can be implemented using a switching power supply chip, and the charging circuit can use a dedicated charging management chip.

[0029] Reference Figure 2 The MCU 31 in the main control module 3 is a 32-bit STM32F103C8T6 microcontroller, characterized by high performance and low power consumption, which can meet the data processing and control requirements of the tester. MCU 31 is connected to the output of the power management module 2 via a power supply pin to obtain a stable power supply. Simultaneously, MCU 31 also transmits data and control signals to the SPI test module 4, the IIC test module 5, and the display control module 6 via communication pins.

[0030] Reference Figure 3 The SPI test module 4 includes communication lines and connectors. The communication lines include SCK, MOSI, MISO, CS, and INT signal lines. The inputs of these signal lines are connected to the first communication pin of the MCU 31 to achieve data communication, and the outputs are connected to the connectors for connection to the device under test.

[0031] To prevent signal overshoot, resistors are connected in series with the SCK, MOSI, MISO, CS, and INT signal lines.

[0032] Reference Figure 4 The IIC test module 5 also includes communication lines and connectors. The communication lines include SCK, SDA, and INT signal lines. The inputs of these signal lines are connected to the second communication pin of the MCU 31 to achieve data communication, while the outputs are connected to the connectors.

[0033] Similarly, to prevent signal overshoot, resistors are connected in series on the SCK, SDA, and INT signal lines.

[0034] Reference Figure 5 Furthermore, the control module also includes an IIC resistor configuration unit 32, which includes a first pull-up resistor 321 and a control unit. The second communication pin of the MCU 31 is connected to a second pull-up resistor 311. The first pull-up resistor 321 is connected to the second pull-up resistor 311 via the control unit, which controls whether the first pull-up resistor 321 and the second pull-up resistor 311 are connected in parallel or disconnected. In the commonly used master-slave mode of IIC, when insufficient drive capability occurs and the electrical characteristics of the IIC device are not met, the pull-up resistor can be adjusted via the control unit. For example, under normal conditions, the IIC bus of the tester is pulled up to 3.3V via the second pull-up resistor 311 (e.g., a 4.7KΩ resistor), ensuring low power consumption. When multiple devices are connected to the IIC bus, the control unit controls the first pull-up resistor 321 and the second pull-up resistor 311 to be connected in parallel, making the pull-up resistor 2.35KΩ, doubling the drive capability while still within the chip's allowable range.

[0035] The control unit can be a physical push-button switch, which can be manually adjusted to connect or disconnect the first pull-up resistor 321 and the second pull-up resistor 311 in parallel.

[0036] Reference Figure 6Furthermore, the control module also includes an SPI / IIC mode switching unit, which communicates with the MCU 31. The user can send commands to the MCU 31 via the buttons on the display control module 6. The MCU 31 then controls the SPI / IIC mode switching unit to switch between SPI and IIC test modes. The SPI / IIC mode switching unit can be implemented using an analog switch chip. By controlling the on and off states of the analog switch, the MCU 31 is connected to either the SPI test module 4 or the IIC test module 5.

[0037] The display control module 6 includes a display screen 61 and operation buttons 62. The display screen 61 can be an LCD screen. The operation buttons 62 can be mechanical or touch buttons, used for controlling the tester, such as power-on control buttons, SPI / IIC mode switching buttons, IIC resistor configuration setting buttons, and start / end test buttons. The display screen 61 and operation buttons 62 are connected to the MCU 31 of the main control module 3 via ribbon cables to display data and input user commands.

[0038] Reference Figure 7 and Figure 8 The tester has a housing 7, with the battery 1 housed inside. The power management module 2, main control module 3, SPI test module 4, and IIC test module 5 are integrated onto a PCB 8, which is also located within the housing 7. The display screen 61 and buttons of the display control module 6 are located on the housing 7. The housing 7 also has a test interface 9 for communication with the SPI test module 4 and IIC test module 5 and for connecting to test equipment. The housing 7 can be made of plastic, offering advantages such as lightweight, robustness, and insulation. The test interface 9 can be a standard connector, such as a USB interface, or a dedicated test probe interface, facilitating connection to different test equipment.

[0039] The implementation principle of this embodiment is as follows: The handheld SPI and IIC bus integrated tester of this embodiment highly integrates various modules into a single handheld device. Its built-in battery 1 and display screen 61 eliminate dependence on external power supplies and computers, truly enabling testing anytime, anywhere. The MCU 31 uniformly controls the SPI test module 4 and the IIC test module 5, achieving integrated testing functions and improving testing efficiency. The IIC resistor configuration unit 32 can adjust the pull-up resistors according to actual conditions to enhance driving capability. The SPI / IIC mode switching unit allows users to switch between the two test modes to meet different testing needs. This design solves the problems of poor portability, dependence on host computers, inability to work offline, and insufficient configuration flexibility in existing technologies, providing convenience for rapid production line testing and on-site equipment debugging.

[0040] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A handheld SPI and IIC bus integration tester, characterized in that, include: Battery (1) Power management module (2); The main control module (3) has a built-in MCU (31), and the MCU (31) is electrically connected to the power management module (2); The SPI test module (4) is connected to the MCU (31) for communication. The IIC test module (5) is connected to the MCU (31) for communication. The display control module (6) is electrically connected to the power management module (2); the MCU (31) is communicatively connected to the display control module (6).

2. The handheld SPI and IIC bus integration tester according to claim 1, characterized in that, Both the SPI test module (4) and the IIC test module (5) include communication lines and connectors; the input end of the communication line is connected to the MCU (31) for communication, and the output end is connected to the connector.

3. The handheld SPI and IIC bus integration tester according to claim 2, characterized in that, The communication lines of the SPI test module (4) include SCK signal line, MOSI signal line, MISO signal line, CS signal line and INT signal line; the input ends of the SCK signal line, MOSI signal line, MISO signal line, CS signal line and INT signal line are all connected to the MCU (31) for communication, and the output ends are all connected to the connector.

4. The handheld SPI and IIC bus integration tester according to claim 3, characterized in that, The SCK signal line, MOSI signal line, MISO signal line, CS signal line, and INT signal line are all connected in series with resistors to prevent signal overshoot.

5. The handheld SPI and IIC bus integration tester according to claim 2, characterized in that, The communication lines of the IIC test module (5) include SCK signal line, SDA signal line and INT signal line; the input terminals are all connected to the MCU (31) for communication, and the output terminals are all connected to the connector.

6. The handheld SPI and IIC bus integration tester according to claim 5, characterized in that, The SCK, SDA, and INT signal lines are all connected in series with resistors to prevent signal overshoot.

7. The handheld SPI and IIC bus integration tester according to claim 1, characterized in that, The main control module (3) further includes an IIC resistor configuration unit (32), which includes a first pull-up resistor (321) and a control unit. The MCU (31) has a communication pin that is connected to the IIC test module (5). The communication pin is connected to a second pull-up resistor (311). The first pull-up resistor (321) is connected to the second pull-up resistor (311) through the control unit. The control unit is used to control the first pull-up resistor (321) and the second pull-up resistor (311) to be connected in parallel or disconnected.

8. The handheld SPI and IIC bus integration tester according to claim 1, characterized in that, The main control module (3) also includes an SPI / IIC mode switching unit, which is connected to the MCU (31) for communication.

9. The handheld SPI and IIC bus integration tester according to claim 1, characterized in that, The tester has a housing (7), and the battery (1) is located inside the housing (7). The power management module (2), main control module (3), SPI test module (4), and IIC test module (5) are integrated on a PCB (8), which is located inside the housing (7). The display control module (6) includes a display screen (61) and operation buttons (62), both of which are located on the housing (7). The housing (7) is also provided with a test interface (9) for communicating with the SPI test module (4), the IIC test module (5), and connecting to the test equipment.

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