A board and controller

Abstract

This application discloses a circuit board and controller, including a motherboard, a first functional subboard, and a second functional subboard. The motherboard is used for image signal processing and has a first connector. The first functional subboard has a second connector for plugging into the first connector and also has multiple first video interfaces. The second functional subboard has a third connector for plugging into the first connector and also has multiple second video interfaces. The first and second functional subboards are interchangeable. When the first connector is connected to the second connector, the first video interface is used to connect to an external video processing device, and the first functional subboard is used to simulate a camera inputting image signals to the external video processing device. When the first connector is connected to the third connector, the second video interface is used to connect to an external video acquisition device, and the first functional subboard is used to receive image signals acquired by the external video acquisition device for input to the motherboard.

Description

Technical Field

[0001] This application relates to the field of controllers, and more particularly to a board and controller. Background Technology

[0002] The requirements for the accuracy of image display of the scene around the vehicle in vehicle intelligent driving algorithms are getting higher and higher. In vehicle intelligent driving algorithms, the image quality of the camera needs to meet specific requirements to ensure the recognition accuracy of autonomous driving algorithms.

[0003] In related technologies, image quality testing of cameras typically involves using a controller. The controller's mainboard usually integrates an RX module, which simulates a domain controller receiving image information from the camera to test its image quality. However, testing the controller's signal processing and control decision-making capabilities requires connecting additional testing equipment, leading to cumbersome testing procedures and high equipment costs. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a board and controller capable of testing the controller's control decision-making ability and also capable of image quality detection.

[0005] This application provides a board and related devices for use in this application.

[0006] In a first aspect, embodiments of this application provide a board, including:

[0007] A motherboard for processing image signals, the motherboard having a first connector;

[0008] The first functional sub-board is provided with a second connector for plugging and connecting with the first connector, and also provides a plurality of first video interfaces;

[0009] The second functional sub-board is provided with a third connector for plugging and connecting with the first connector, and also has multiple second video interfaces;

[0010] The first functional sub-board and the second functional sub-board are replaceable. When the first connector is connected to the second connector, the first video interface is used to connect to an external video processing device, and the first functional sub-board is used to simulate a camera inputting image signals to the external video processing device.

[0011] When the first connector is connected to the third connector, the second video interface is used to connect to an external video acquisition device, and the first functional sub-board is used to receive image signals acquired by the external video acquisition device for input to the motherboard.

[0012] According to some embodiments of the present invention, the first functional sub-board and the second functional sub-board are of the same size and have a first connector at the same position. The first connector is used to connect to the motherboard.

[0013] According to some embodiments of the present invention, the motherboard is provided with a stud on the side near the first functional sub-board or the second functional sub-board for threaded connection of the first connector.

[0014] According to some embodiments of the present invention, the board further includes a heat sink and a first cooling fan connected to each other. One side of the motherboard is divided into a first mounting area and a second mounting area. The first functional sub-board or the second functional sub-board is disposed in the first mounting area, and the heat sink is disposed in the second mounting area.

[0015] According to some embodiments of the present invention, the motherboard has a main chip in the second mounting area, and the rotation center area of ​​the first cooling fan is offset from the main chip.

[0016] According to some embodiments of the present invention, the heat sink includes a heat sink plate and heat sink fins. The heat sink plate is disposed in the second mounting area, and the heat sink fins are disposed on the side of the heat sink plate away from the motherboard and are arranged in parallel with each other. An air guide channel is formed between adjacent heat sink fins.

[0017] The heat sink is provided with a second connector, and the motherboard is provided with at least two connection positions. The second connector can be connected to any one of the connection positions to adjust the direction of the airflow channel.

[0018] According to some embodiments of the present invention, the heat sink is square in shape and the second connector is provided at each of its four corners. The motherboard is provided with four connection positions for the four second connectors to be connected arbitrarily.

[0019] According to some embodiments of this utility model, the second connecting member is a spring-loaded rubber nail.

[0020] According to some embodiments of the present invention, the overall thickness of the board is less than or equal to 20mm along the thickness direction of the motherboard, so that multiple boards can be stacked for use in a housing.

[0021] Secondly, embodiments of this application provide a controller, including:

[0022] shell;

[0023] The circuit board described in any of the above embodiments is disposed in the housing;

[0024] Wherein, if the board is provided, the board includes a first cooling fan, the first cooling fan being disposed on one side of the motherboard; or,

[0025] If there are multiple boards, the multiple boards are stacked inside the housing.

[0026] As can be seen from the above technical solutions, the embodiments of this application have the following advantages: The same motherboard can connect to different functional sub-boards, and different external devices can be connected through these sub-boards to achieve different functions, thereby satisfying various testing functions, providing high testing flexibility and low cost. Specifically, the first functional sub-board is connected to the motherboard and has a first video interface. This first video interface is connected to an external video processing device. The first functional sub-board acts as a transmitting module, using the motherboard to simulate a camera and generate image signals, which are then sent to the external video processing device to test its signal processing and control decision-making capabilities. The second functional sub-board is also connected to the motherboard and has a second video interface. This second video interface is connected to an external image acquisition device to test the image quality output by the external image acquisition device. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0028] Figure 1 This is an exploded view of the functional sub-board on the board disclosed in the embodiments of this application;

[0029] Figure 2 This is an exploded view of the heatsink on the circuit board disclosed in an embodiment of this application;

[0030] Figure 3 This is a schematic diagram of the desktop controller disclosed in the embodiments of this application;

[0031] Figure 4 This is an exploded view of the controller disclosed in an embodiment of this application;

[0032] Figure 5 This is a schematic diagram of the installation structure of multiple circuit boards disclosed in the embodiments of this application;

[0033] Figure 6 This is a schematic diagram of the chassis-level controller disclosed in an embodiment of this application.

[0034] Reference numerals: 10, board; 11, insert; 20, housing; 21, mounting bracket; 22, lower housing; 221, snap-fit ​​spring; 23, upper housing; 231, slot; 100, motherboard; 110, first mounting area; 111, first connector; 120, second mounting area; 121, main chip; 122, connection position; 130, stud; 200, first functional sub-board; 210, second connector; 220, first video interface; 300, second functional sub-board; 310, third connector; 320, second video interface; 400, first connector; 500, second connector; 600, heat sink; 610, heat sink plate; 620, heat sink fins; 700, first cooling fan; 800, second cooling fan; 900, third cooling fan. Detailed Implementation

[0035] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0036] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, up, down, etc., indicating the directional or positional relationship, are based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0037] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0038] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0039] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0040] The present invention will now be described in further detail with reference to the accompanying drawings.

[0041] Please see Figure 1 This application discloses a board 10, including a motherboard 100, a first functional subboard 200, and a second functional subboard 300. The motherboard 100 is used for image signal processing and is provided with a first connector 111. The first functional subboard 200 is provided with a second connector 210 for plugging and connecting with the first connector 111, and is also provided with a plurality of first video interfaces 220. The second functional subboard 300 is provided with a third connector 310 for plugging and connecting with the first connector 111, and is also provided with a plurality of second video interfaces 320.

[0042] The first functional sub-board 200 and the second functional sub-board 300 are interchangeable. While their functions differ, both have a connector that connects to the first connector 111. When the first connector 111 is connected to the second connector 210, the first video interface 220 is used to connect to an external video processing device, and the first functional sub-board 200 is used to simulate a camera inputting image signals to the external video processing device. When the first connector 111 is connected to the third connector 310, the second video interface 320 is used to connect to an external video acquisition device, and the second functional sub-board 300 is used to receive image signals acquired by the external video acquisition device for input to the mainboard 100.

[0043] Specifically, in one application configuration, a first functional sub-board 200 is connected to the main board 100. The first functional sub-board 200 has a first video interface 220, which is connected to an external video processing device. The first functional sub-board 200 acts as a transmitting module, using the main board 100 to simulate a camera and generate image signals, which are then sent to the external video processing device to test its signal processing and control decision-making capabilities. For example, during the test, the main board 100 has built-in image generation software, such as scene software, to generate scene images. These images can include virtual roads, vehicles, pedestrians, and other traffic environmental factors. The acquired scene images are then rendered, and after rendering, a standard image is output through the video port and shared with the external video processing device. The first functional sub-board 200 converts the standard image to a preset resolution image and then processes the preset resolution image into an image injection format that matches the camera type and the domain controller image processor (IPD) processing format. For example, camera types include fisheye cameras and panoramic cameras. The motherboard 100 needs to process the camera according to its configuration and the communication protocol between the camera and the intelligent driving domain controller. The processed image is then injected into an external video processing device, such as an intelligent driving controller, as a test device to test the signal processing and control decision-making capabilities of the intelligent driving controller. At the same time, it can also test the image signal generation quality of the motherboard 100.

[0044] In another application, the second functional sub-board 300 is connected to the main board 100. The second functional sub-board 300 is equipped with a second video interface 320, which is connected to an external image acquisition device to test the image signal quality output by the external image acquisition device. Furthermore, it can also test the image signal processing and control decision-making capabilities of the main board 100. As a receiving module, the second functional sub-board 300 first acquires the transmitted image data signal from the channel. If the received signal is modulated or encoded, a reverse operation needs to be performed on the received information, i.e., decoding and demodulation, to restore the original image data content. The received image data format is converted to a format that the domain controller can process and recognize. For example, if the received image data is in LVDS signal format from a camera input, it may need to be converted to the parallel data format required for internal processing by the domain controller or a specific image format (such as YUV, RGB, etc.). Afterwards, the main board 100 can perform image quality detection on the converted image data to test the quality of the image output by the camera. Furthermore, the main board 100 can also perform necessary processing on the converted image data, such as filtering and noise reduction preprocessing operations, to improve image quality. The processed image data is then output to the subsequent processing module of the motherboard 100. The motherboard 100 may have built-in software from the domain controller, so that the motherboard 100 can perform image analysis, target recognition, decision control and other operations just like the domain controller processes images input from the camera. Thus, it can be used as a test device to simulate the domain controller receiving images from image acquisition devices (such as cameras), and can realize the testing of image information output by external image acquisition devices (such as testing the image quality output by the camera). Furthermore, it can also test the image signal processing capability and control decision-making capability of the motherboard 100.

[0045] Therefore, the embodiments of this application can use the same motherboard to connect different functional daughterboards, and then connect different external devices through different functional daughterboards to realize different functional tests, thereby satisfying various test functions, providing high test flexibility, and reducing test costs.

[0046] In some embodiments, please refer to Figure 1The first functional sub-board 200 and the second functional sub-board 300 are of the same size and have a first connector 400 at the same position. The first connector 400 is used to connect to the main board 100. The first connector 400 is a screw. The main board 100 has a connection hole or a stud 130. The first connector 400 is connected to the main board 100 through the connection hole or the stud 130 to fix the first functional sub-board 200 and the second functional sub-board 300 to the main board 100. Understandably, when the first functional sub-board 200 and the second functional sub-board 300 need to be replaced, since they are connected to the same location on the motherboard 100, the second connector 210 and the third connector 310 can be easily connected to the first connector 111. Furthermore, the motherboard 100 does not need separate connection structures for the first functional sub-board 200 and the second functional sub-board 300, simplifying the structure of the motherboard 100 and facilitating its manufacturing. The second connector 210, the third connector 310, and the first connector 111 can be board-to-board (B to B) connectors.

[0047] Furthermore, the motherboard 100 has a stud 130 on the side near the first functional sub-board 200 or the second functional sub-board 300 for threaded connection of the first connector 400. Specifically, the stud 130 is fixedly connected to the side of the motherboard 100 used to connect the functional sub-board. The first connector 400 can be a screw, passing through the first functional sub-board 200 or the second functional sub-board 300 to be threadedly connected to the stud 130, thereby conveniently fixing the first functional sub-board 200 and the second functional sub-board 300 to one side of the motherboard 100. It is understood that through the stud 130, the first functional sub-board 200 and the second functional sub-board 300 are connected to the stud 130 via the first connector 400. Sufficient distance is maintained between the first functional sub-board 200 and the second functional sub-board 300 and the motherboard 100 to accommodate the connector with the first video interface 220 without compressing the components on the motherboard 100 and the functional sub-boards.

[0048] In some embodiments, each video interface connector has a corresponding LED indicator below it; a green light indicates a normal connection to an external video acquisition device, while a red light indicates a non-connection. The motherboard also features a toggle switch, a DC-07 power connector, dual-layer USB ports, an RJ45 100Mbps Ethernet port, and a Mini DP port, allowing the motherboard to be used in various scenarios. For example, the DC-07 power connector, typically small in size, offers good power transmission stability and reliability, providing stable DC power to various electronic devices. The DC-07 power connector is an interface for connecting to Ethernet networks, supporting adaptive network speeds of 10 Mbps and 100 Mbps; the RJ45 100Mbps Ethernet port is also an interface for connecting to Ethernet networks, supporting adaptive network speeds of 10 Mbps and 100 Mbps.

[0049] In some embodiments, please refer to Figure 2 The board 10 also includes a heat sink 600 and a first cooling fan 700 connected to each other. One side of the motherboard 100 is divided into a first mounting area 110 and a second mounting area 120. The first functional sub-board 200 or the second functional sub-board 300 is disposed in the first mounting area 110, and the second mounting area 120 is used to mount components such as chips. The heat sink 600 is disposed in the second mounting area 120 to fit snugly against the components. The first cooling fan 700 is disposed in the second mounting area 120 and is located on the side of the heat sink 600 away from the motherboard 100. Thus, the components on the second mounting area 120 transfer heat to the heat sink 600, and the first cooling fan 700 blows air onto the heat sink 600 and the motherboard 100. The heat sink 600 quickly absorbs the heat generated by the electronic components and dissipates it through the airflow.

[0050] Furthermore, the motherboard 100 has a main chip 121 in the second mounting area 120. The rotation center area of ​​the first cooling fan 700 is offset from the main chip 121, that is, the blades of the first cooling fan 700 are facing the main chip 121. With this configuration, the airflow generated by the first cooling fan 700 is directed towards the main chip 121, thereby effectively dissipating heat from the main chip 121 and ensuring that the motherboard 100 receives optimal cooling.

[0051] In some embodiments, please refer to Figure 2The heat sink 600 includes a heat sink 610 and heat sink fins 620. The heat sink 610 is disposed in the second mounting area 120 to be attached to electronic components on the motherboard 100, such as the main chip 121. The heat sink fins 620 are disposed on the side of the heat sink 610 away from the motherboard 100, and are arranged parallel to each other. Each adjacent heat sink fin 620 is spaced apart to form an airflow channel between adjacent heat sink fins 620. The heat sink 610 has a second connector 500 at its edge, and the motherboard 100 has at least two connection positions 122 at its edge. The second connector 500 can be connected to any one of the connection positions 122, allowing the heat sink 600 to be adjusted in orientation, thereby facilitating the adjustment of the airflow channel direction according to usage requirements and improving heat dissipation efficiency.

[0052] For example, please see Figure 3 and Figure 4 If a board 10 is used in a desktop enclosure 20, and the heatsink 600 is arranged as described above, the heatsink 600 guides airflow to the side of the desktop enclosure 20 during application. Furthermore, the side and / or top of the enclosure 20 are provided with ventilation holes to facilitate the outflow of cooling airflow, thereby improving the heat dissipation of the desktop heatsink. Please refer to [link to relevant documentation]. Figure 5 and Figure 6 If multiple boards 10 are installed inside the chassis-type housing 20, the heat sink 600 can flexibly adjust its orientation, that is, the air duct faces opposite sides of the chassis-type housing 20. For example, one side of the air duct faces the area where the functional sub-boards on the board 10 are located, and the other side faces the inside of the housing 20. In this way, the heat from the stacked area of ​​the functional boards can be directed into the air duct. The airflow entering the air duct can be guided to other directions of the chassis-type housing 20 or to the outside of the housing 20, thereby facilitating the exhaust of airflow between the boards 10, which is beneficial to the heat dissipation of the chassis-level controller.

[0053] In some embodiments, please refer to Figure 2 The heat sink 610 is square in shape, and each of its four corners is provided with a second connector 500. The motherboard 100 has four connection positions 122 for arbitrarily connecting the four second connectors 500. It is understood that when the board 10 is used in applications such as... Figure 3 When the desktop controller shown is used, the heatsink 600 can be flexibly adjusted in position, and the second connector 500 can be connected to the connector 122, so that the airflow channel is not directed towards the functional subboard. When the board 10 is used in, for example... Figure 5When the chassis-level controller shown in / 6 is used, the heat sink 600 can be flexibly adjusted in position, and the second connector 500 can be connected to the connector 122, so that the air duct extends towards the direction of the functional sub-board, which facilitates the heat generated by the stacking of functional sub-boards.

[0054] Furthermore, the second connector 500 is a spring-loaded rubber pin. It is understood that the heatsink 600 is fixedly connected to the motherboard 100 via the spring-loaded rubber pin, facilitating disassembly and adjustment. A spring is provided between the rubber pin and the heatsink 600, ensuring that the pressure at the four corners of the heatsink fins 620 is uniform, resulting in even pressure on the surface of the main chip 121, thus effectively protecting the main chip 121.

[0055] In some embodiments, please refer to Figure 5 Along the thickness direction of the motherboard 100, the overall thickness of the board 10 is less than or equal to 10mm, so that multiple boards 10 can be stacked to fit a chassis-type housing 20. Specifically, if the board 10 is applied to the chassis-type housing 20, a mounting bracket 21 is provided inside the housing 20, and a second cooling fan 800 is disposed on the mounting bracket 21. The mounting bracket 21 is mounted on the end of each board 10 away from the functional sub-board, and each board 10 can be mounted on the chassis-type housing 20. For example, the mounting bracket 21 has at least one mounting foot on the side facing the board 10, and the mounting foot can be locked to the board 10 by screws or other means, so that multiple boards 10 can be stacked to adapt to different chassis-type housings 20. In other embodiments, the mounting bracket 21 can also be connected and installed to the board 10 by means of snap-fit ​​connection or other means. Furthermore, each board 10 has a insertion member 11 on its side, and the housing 20 has a slot (not shown) inside. For example, a circuit board (not shown) is provided inside the housing 20, and the circuit board has a slot. The insertion member 11 of each board 10 is inserted into this slot, thereby allowing the boards 10 to be stacked and assembled inside the housing 20. Exemplarily, the insertion member 11 is a gold finger structure provided on the side of the board 10, facilitating insertion into the card slots provided on the chassis-type housing 20. Since the internal space of the chassis is limited, and the overall thickness of the boards 10 is less than or equal to 10mm, this arrangement allows multiple boards 10 to be stacked and inserted into the slots inside the chassis (housing 20), improving slot utilization without affecting the use of other boards. For example... Figure 5 or Figure 6 As shown, four boards 10 can be connected together, each with eight video connector interfaces. The four boards 10 can simultaneously support 32 cameras, greatly improving testing efficiency. Therefore, the overall thickness of the boards 10 in this application is less than or equal to 10mm. The boards 10 can be used not only in desktop controllers but also in chassis-level controllers.

[0056] This application also discloses a controller, in one embodiment of which please refer to Figures 3 to 5 The system includes a desktop housing 20 and the aforementioned board 10, with the board 10 disposed on the housing 20. The board 10 includes a first cooling fan 700, which is disposed on one side of the motherboard 100. This configuration allows the board 10 to be used in a desktop controller.

[0057] In another embodiment, such as Figure 5 and Figure 6 As shown, the controller includes a chassis-type housing 20 and the aforementioned board 10. Multiple boards 10 are provided and are stacked inside the housing 20.

[0058] In some embodiments, the controller further includes a second cooling fan 800 and / or a third cooling fan 900. A mounting bracket 21 is provided within the housing 20. The second cooling fan 800 is mounted on the mounting bracket 21, which is installed at the end of each board 10 away from the functional sub-board. The third cooling fan 900 is mounted on another mounting bracket 21, and is installed on the same side of each functional sub-board via the mounting bracket 21 to provide cooling airflow towards the gap between any adjacent boards 10. In other embodiments, the third cooling fan 900 and the second cooling fan 800 may be mounted on the same mounting bracket, which may have an L-shaped structure and be installed on both sides of the board 10. The third cooling fan 900 and the second cooling fan 800 may be installed at opposite ends of the L-shaped structure. Each board 10 is mounted on a chassis-level enclosure 20. For example, a mounting bracket 21 has at least one mounting foot facing the board 10. The mounting foot can be secured to the board 10 by screws or other means, allowing multiple boards 10 to be stacked and equipped with their own cooling fans to accommodate different chassis-type enclosures 20. In other embodiments, the mounting bracket 21 can also be connected to the board 10 by means of snap-fit ​​connections or other methods.

[0059] Furthermore, each board 10 has a insertion part 11 on its side, and a slot (not shown) is provided inside the housing 20 or on a circuit board disposed within the housing 20. The insertion parts 11 of each board 10 are inserted into the slots, thereby allowing the boards 10 to be stacked and assembled within the housing 20. For example, the third cooling fan 900 is used to blow air toward the area where multiple functional sub-boards are stacked in the board 10, and the second cooling fan 800 is used to guide the airflow from the side of the stacked boards 10, thereby dissipating the heat of the multiple boards 10. This heat can then be directly dissipated to the housing 20 or dissipated through other heat dissipation components within the housing 20, thereby improving heat dissipation efficiency, preventing a large amount of heat from accumulating in the multiple boards 10, and ensuring the normal operation of the boards 10.

[0060] It should be noted that the board 10 adopts the above-mentioned stacking design, which retains the form of the board 10 and controls the thickness of the board 10. The shape of the heat sink 620 can be used in both desktop and chassis types. Multiple boards 10 can be inserted and operated simultaneously in the chassis type 20, which greatly increases the testing efficiency.

[0061] Please see Figure 4 The desktop-type housing 20 includes a lower housing 22 and an upper housing 23, which are formed by bending two steel plates. A mounting plate 10 is pre-positioned on the lower housing 22 using riveting pins and nuts. After the mounting plate 10 is pre-positioned, it is fixed to the upper housing 23 with five M3 screws. The upper housing 23 is then snapped down, causing the snap-fit ​​spring 221 of the lower housing 22 to deform and slide into the slot 231 of the upper housing 23, thus positioning the lower housing 22. Finally, the side screws are tightened to complete the assembly. The desktop-type housing 20 utilizes sheet metal bending and riveting processes. The lower housing 22 and upper housing 23 are fixed using snap-fits and two screws, making assembly relatively simple with low cost; this is highly advantageous for automated production assembly.

[0062] In this embodiment, the replaceable functional subboard of board 10 increases the usage scenarios. TX can simulate the output image of the camera for testing the domain controller; conversely, RX simulates the domain controller receiving image information from the camera to test the camera; thus, bidirectional testing is achieved, which greatly improves testing efficiency.

[0063] The technical means disclosed in this utility model are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications are also considered within the scope of protection of this utility model.

Claims

1. A circuit board, characterized in that, include: A motherboard for processing image signals, the motherboard having a first connector; The first functional sub-board is provided with a second connector for plugging and connecting with the first connector, and also provides a plurality of first video interfaces; The second functional sub-board is provided with a third connector for plugging and connecting with the first connector, and also has multiple second video interfaces; The first functional sub-board and the second functional sub-board are replaceable. When the first connector is connected to the second connector, the first video interface is used to connect to an external video processing device, and the first functional sub-board is used to simulate a camera inputting image signals to the external video processing device. When the first connector is connected to the third connector, the second video interface is used to connect to an external video acquisition device, and the first functional sub-board is used to receive image signals acquired by the external video acquisition device for input to the motherboard.

2. The board according to claim 1, characterized in that, The first functional sub-board and the second functional sub-board are of the same size and have a first connector in the same position. The first connector is used to connect to the motherboard.

3. The board according to claim 2, characterized in that, The motherboard has a stud on the side near the first functional sub-board or the second functional sub-board for threaded connection of the first connector.

4. The board according to claim 1, characterized in that, The board also includes a heat sink and a first cooling fan connected to it. One side of the motherboard is divided into a first mounting area and a second mounting area. The first functional sub-board or the second functional sub-board is disposed in the first mounting area, and the heat sink is disposed in the second mounting area.

5. The circuit board according to claim 4, characterized in that, The motherboard has a main chip in the second mounting area, and the rotation center area of ​​the first cooling fan is offset from the main chip.

6. The board according to claim 4, characterized in that, The heat sink includes a heat sink plate and heat sink fins. The heat sink plate is disposed in the second mounting area, and the heat sink fins are disposed on the side of the heat sink plate away from the motherboard and are arranged parallel to each other. An air guide channel is formed between adjacent heat sink fins. The heat sink is provided with a second connector, and the motherboard is provided with at least two connection positions. The second connector can be connected to any one of the connection positions to adjust the direction of the airflow channel.

7. The board according to claim 6, characterized in that, The heat sink is square in shape, and the second connector is provided at each of its four corners. The motherboard has four connection positions for the four second connectors to be connected arbitrarily.

8. The board according to claim 6, characterized in that, The second connector is a spring-loaded rubber nail.

9. The board according to claim 6, characterized in that, Along the thickness direction of the motherboard, the overall thickness of the board is less than or equal to 20mm, so that multiple boards can be stacked to fit the housing.

10. A controller, characterized in that, include: shell; The board according to any one of claims 1 to 9, wherein the board is disposed in the housing; Wherein, if the board is provided, the board includes a first cooling fan, the first cooling fan being disposed on one side of the motherboard; or, If there are multiple boards, the multiple boards are stacked inside the housing.

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