A headset

CN224709745UActive Publication Date: 2026-09-01SHENZHEN WEIDONG ACOUSTIC TECH CO LTD
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Patent Information

Application Number
CN202521865857.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-01
Publication Date
2026-09-01
Estimated Expiration
2035-09-01

AI Technical Summary

Technical Problem

头梁支撑结构的力学分布不合理易导致耳部压迫感,而采用硬质材料又会影响长时间佩戴的舒适度

Benefits of technology

[0017]由上可知,本申请提供的一种耳机及其组件与降噪系统,通过双发声组件与可调节麦克风组件的结构设计,结合AI降噪芯片对语音信号与环境噪声的协同处理,有效解决了传统耳机在复杂声学环境中降噪效果差、佩戴舒适性与耐用性矛盾的技术问题,具有提升通话质量、增强设备可靠性、优化用户使用体验的优点。

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Abstract

The utility model relates to a kind of earphone, including first sound unit, second sound unit and microphone assembly, first sound unit is supported by first ear hanging connector beam support assembly, second sound unit is supported by second ear hanging connector beam support assembly, microphone assembly is wrapped in microphone protective shell, microphone protective shell is connected first sound unit by metal flexible tube stem.The earphone and its component and noise reduction system provided in the application, through the structural design of double sound components and adjustable microphone assembly, the synergistic processing of AI noise reduction chip to voice signal and environmental noise, effectively solve the technical problems that traditional earphone is poor in noise reduction effect in complex acoustic environment, wearing comfort and durability contradiction, with the advantages of improving call quality, enhancing equipment reliability, optimizing user experience.
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Description

Technical Field

[0001] This utility model relates to the field of headphone technology, and in particular to a noise-canceling headphone. Background Technology

[0002] In existing technologies, headphone products face numerous technical challenges when used in high-noise environments. When in complex acoustic environments such as high-speed wind noise, background human voices, or engine noise, traditional headphone microphone systems often struggle to effectively distinguish target speech from ambient noise, leading to a significant decline in call quality. Conventional single-microphone designs cannot simultaneously meet the dual needs of speech pickup and ambient noise acquisition, resulting in a lack of sufficient noise sample references for noise reduction algorithms, thus affecting noise reduction performance.

[0003] In terms of headphone structural design, existing products generally suffer from a trade-off between wearing comfort and durability. An unreasonable distribution of mechanical force in the headband support structure can easily lead to ear pressure, while using rigid materials can affect comfort during extended wear. The microphone assembly's fixing method typically lacks flexible adjustment capabilities, making it difficult to adapt to differences in mouth position among different users, thus affecting voice pickup quality.

[0004] At the signal processing level, traditional noise reduction technologies mostly employ fixed algorithms, making it difficult to cope with dynamically changing environmental noise. The lack of intelligent noise recognition and processing mechanisms leads to unstable noise reduction performance in complex acoustic environments. Furthermore, existing headphone products lack coordinated optimization between functional modules; power management, Bluetooth communication, and audio processing modules often operate independently, impacting overall energy efficiency and performance.

[0005] To address the aforementioned issues, existing technologies urgently need improvement. Utility Model Content

[0006] The purpose of this application is to provide an earphone and its components and a noise reduction system, which have the advantages of improving wearing comfort and durability, enhancing voice pickup effect, and optimizing noise reduction performance.

[0007] This application provides an earphone, the technical solution of which is as follows: An earphone includes a first sound-emitting unit, a second sound-emitting unit, and a microphone assembly, wherein the first sound-emitting unit is connected to a headband support assembly via a first ear hook, the second sound-emitting unit is connected to the headband support assembly via a second ear hook, and the microphone assembly is enclosed in a microphone protective shell, the microphone protective shell being connected to the first sound-emitting unit via a flexible metal rod.

[0008] Furthermore, this application also proposes that the microphone assembly includes a main pickup microphone and a secondary noise-canceling microphone.

[0009] Furthermore, this application also proposes an AI noise reduction chip, wherein the input terminal of the first sound-emitting unit is electrically connected to the output terminal of the AI ​​noise reduction chip, the input terminal of the second sound-emitting unit is electrically connected to the output terminal of the AI ​​noise reduction chip, the output terminal of the main microphone is electrically connected to the input terminal of the AI ​​noise reduction chip, and the output terminal of the auxiliary microphone is electrically connected to the input terminal of the AI ​​noise reduction chip. The main microphone is used to capture high-frequency speech signals and transmit the captured high-frequency speech signals to the AI ​​noise reduction chip. The auxiliary microphone is used to collect ambient noise and transmit the collected ambient noise to the AI ​​noise reduction chip. After the AI ​​noise reduction chip identifies, analyzes, and performs noise reduction processing on the received signals, it transmits the processed signals to the first sound-emitting unit and the second sound-emitting unit.

[0010] Furthermore, this application also proposes to include a Bluetooth communication module, which is located within the first sound-emitting unit. The input terminal of the Bluetooth communication module is electrically connected to the output terminal of the AI ​​noise reduction chip. The Bluetooth communication module is used to receive the noise reduction signal processed by the AI ​​noise reduction chip and transmit the signal to the terminal device.

[0011] Furthermore, this application also proposes that it includes a power management module, which is located within the first sound-generating unit and is electrically connected to the AI ​​noise reduction chip. The power management module is used to adjust the power supply current of the AI ​​noise reduction chip.

[0012] Furthermore, this application also proposes to include a volume control module, which is electrically connected to the first sound unit and the second sound unit, and is used to control the volume of the first sound unit and the second sound unit.

[0013] Furthermore, this application also proposes that the volume control module consists of a volume up button and a volume down button located on the microphone protective shell.

[0014] Furthermore, this application also proposes to include a multi-functional control module, which is electrically connected to the Bluetooth communication module.

[0015] Furthermore, this application also proposes that the distance between the main pickup microphone and the secondary noise-canceling microphone be 4cm-10cm.

[0016] Furthermore, this application also proposes to include a connecting adapter, which is fixed to the first sound unit, with one end of the metal flexible rod connected to the microphone protective shell and the other end of the metal flexible rod away from the microphone protective shell rigidly connected to the connecting adapter.

[0017] As can be seen from the above, the earphone and its components and noise reduction system provided in this application, through the structural design of dual sound-emitting components and adjustable microphone components, combined with the collaborative processing of voice signals and environmental noise by AI noise reduction chip, effectively solves the technical problems of poor noise reduction effect and contradiction between wearing comfort and durability of traditional earphones in complex acoustic environments. It has the advantages of improving call quality, enhancing device reliability and optimizing user experience. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the earphone of this utility model; Figure 2 This is a structural schematic diagram of the earphone of this utility model from another angle; Figure 3 This is a logic block diagram of each module inside the headphone component of this utility model.

[0019] The attached diagram lists the components represented by each number as follows: 1. Main microphone; 2. Secondary noise-canceling microphone; 3. Flexible metal rod; 4. Connecting adapter; 5. Microphone protective shell; 6. First ear hook; 7. First sound unit; 8. Second ear hook; 9. Headband support assembly; 10. Indicator light; 11. Multifunction button; 12. Second sound unit; 13. Volume down button; 14. Volume up button; 15. AI noise-canceling chip; 16. Bluetooth communication module; 17. Power management module. Detailed Implementation

[0020] To make the above-mentioned objectives, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model are described clearly and completely below with reference to the accompanying drawings. Obviously, the specific details described below are only a part of the embodiments of this utility model, and this utility model can be implemented in many other embodiments different from those described herein. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0021] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0023] In existing technologies, there is a significant trade-off between voice transmission quality and wearing comfort in complex acoustic environments for over-ear headphones. Traditional noise-canceling headphones often use a fixed microphone layout, which cannot dynamically adjust the pickup angle according to the user's facial features, resulting in limited environmental noise suppression. At the same time, the rigid headband structure and ear hook components often adopt a homogeneous design, which can easily cause uneven pressure distribution in the ears during prolonged wear, resulting in ear pain or the device slipping out.

[0024] To address these issues, researchers discovered a strong correlation between environmental noise suppression efficiency and microphone pointing accuracy, while traditional fixed microphones cannot adapt to the diverse facial features of different users. Analysis of the ear's stress model revealed that the matching degree between the ear hook support force distribution and the elastic modulus of the headband material directly affects wearing comfort. Based on this, a modular design was proposed, separating the microphone assembly from the sound-generating unit. An adjustable mechanism optimizes the pickup angle, while a composite support structure balances the device's weight distribution.

[0025] Please see Figure 1 and Figure 2 This application proposes an earphone, including a first sound-emitting unit 7, a second sound-emitting unit 12, and a microphone assembly. The first sound-emitting unit 7 is connected to a headband support assembly 9 via a first ear hook 6, and the second sound-emitting unit 12 is connected to the headband support assembly 9 via a second ear hook 8. The microphone assembly is enclosed in a microphone protective shell 5, and the microphone protective shell 5 is connected to the first sound-emitting unit 7 via a metal flexible rod 3.

[0026] The first sound-generating unit 7 refers to a structural module containing an audio signal conversion unit, which can be implemented using a cavity structure with a built-in electromagnetically driven diaphragm to convert electrical signals into sound wave signals. The second sound-generating unit 12 forms a symmetrical layout with the first sound-generating unit 7, and is connected to the headband support assembly 9 via independent ear hooks to achieve spatial separation of the sound field. The headband support assembly 9 is a load-bearing structure connecting the left and right ear hooks, which can be implemented using a composite structure of elastic metal wire and flexible covering material to distribute ear pressure. The microphone protective shell 5 is a protective shell that encloses the pickup element, which can be implemented using an injection-molded shell with controllable aperture ratio to isolate the microphone from the impact of physical collisions. The flexible metal hose rod 3 is a connecting rod with multi-directional bending retention function, which can be implemented using a stainless steel spiral flexible hose covering the wire structure to achieve three-dimensional spatial positioning of the microphone assembly.

[0027] Specifically, the first sound unit 7 and the second sound unit 12 are connected to the headband support assembly 9 via independent ear hooks, forming a symmetrical mechanical support system. This split-structure design ensures that the weight of the device is evenly distributed across the auricle area, avoiding concentrated pressure at a single point. The microphone protective shell 5 is rigidly connected to the first sound unit 7 via a flexible metal tube 3. The operator can bend and adjust the flexible metal tube 3 according to the actual usage scenario to ensure that the main pickup microphone 1 is precisely pointed towards the sound source. The headband support assembly 9 adopts a composite structure of elastic material and rigid frame, which absorbs external impact energy through material deformation while maintaining the necessary clamping force. The flexible metal tube 3 integrates signal transmission lines, shortening the electrical signal transmission path and reducing signal attenuation.

[0028] Compared to existing technologies, traditional headphones often have microphone components fixed to the side of the earcup, limiting the pickup angle to the wearing position. This solution, however, utilizes a flexible metal rod 3 to achieve adjustable microphone spatial positioning, significantly improving noise acquisition accuracy. Existing headband structures often use a single material, making it difficult to balance support strength and wearing comfort. This solution optimizes mechanical performance through a composite support structure. Traditional ear hook designs do not consider the needs of eyeglass wearers, while this solution's ergonomically designed ear hook curvature is compatible with various wearing scenarios.

[0029] Through the above technical solutions, this application effectively improves the quality of voice signal acquisition in high-noise environments, ensuring optimal pickup angle through an adjustable microphone assembly. The dual-ear hook split design, combined with a flexible headband structure, ensures even weight distribution and reduces localized pressure on the auricle. The rigid connection between the flexible metal rod 3 and the protective shell ensures microphone positioning stability while enhancing the device's impact resistance. The application of a composite support structure extends the service life of key components, preventing material fatigue fracture caused by frequent bending.

[0030] This application further proposes a microphone assembly including a main pickup microphone 1 and a secondary noise-canceling microphone 2.

[0031] The main microphone 1 is an audio acquisition component used to capture high-frequency speech signals. Specifically, it can be implemented using a digital microphone with a sensitivity greater than or equal to -26dB. Its placement near the user's mouth allows it to preferentially acquire raw speech signals containing human voice characteristics. The secondary noise-canceling microphone 2 is an auxiliary audio acquisition component used to acquire ambient noise. Specifically, it can be implemented using a digital microphone with a wide bandwidth response. It is positioned outside the earpiece or away from the user's mouth, acquiring ambient noise samples through spatial distribution differences.

[0032] Specifically, the main pickup microphone 1 and the secondary noise-canceling microphone 2 form a complementary acoustic architecture. The main pickup microphone 1 captures a mixed signal containing both speech and ambient noise, while the secondary noise-canceling microphone 2 collects noise samples reflecting the characteristics of interference sources in the current environment. Both signals are synchronously transmitted to the noise reduction processing unit, where comparative analysis identifies the noise components in the mixed signal and generates a cancellation signal. The high-sensitivity design of the main pickup microphone 1 ensures complete acquisition of the speech signal, while the directional layout of the secondary noise-canceling microphone 2 effectively captures the spatial distribution characteristics of ambient noise. Their collaborative work provides multi-dimensional acoustic data input for the noise reduction algorithm.

[0033] Compared to existing technologies, traditional single-microphone systems cannot distinguish between speech signals and environmental noise, resulting in speech distortion or noise residue during noise reduction processing. This solution achieves physical separation of speech and noise signals through the spatial layout and functional division of a dual-microphone array. This allows the noise reduction algorithm to accurately cancel noise based on noise samples, avoiding the noise reduction failure problem caused by signal aliasing in single-microphone systems.

[0034] Through the above technical solution, this application effectively reduces noise interference in voice signals during calls in high ambient noise scenarios, solves the problem of decreased voice clarity caused by noise aliasing, ensures that human voice characteristics are fully preserved during calls, and significantly suppresses environmental noise components, thereby improving the quality of voice communication.

[0035] like Figure 3 As shown, this application further proposes an earphone, which also includes an AI noise reduction chip 15. The input terminal of the first sound unit 7 is electrically connected to the output terminal of the AI ​​noise reduction chip 15, the input terminal of the second sound unit 12 is electrically connected to the output terminal of the AI ​​noise reduction chip 15, the output terminal of the main pickup microphone 1 is electrically connected to the input terminal of the AI ​​noise reduction chip 15, and the output terminal of the auxiliary noise reduction microphone 2 is electrically connected to the input terminal of the AI ​​noise reduction chip 15. The main pickup microphone 1 is used to capture high-frequency voice signals and transmit the signals to the AI ​​noise reduction chip 15, and the auxiliary noise reduction microphone 2 is used to collect ambient noise and transmit the signals to the AI ​​noise reduction chip 15. The AI ​​noise reduction chip 15 processes the received signals and transmits them to the first sound unit 7 and the second sound unit 12.

[0036] The AI ​​noise reduction chip 15 is an integrated circuit that executes deep learning algorithms. Specifically, it can be implemented using a low-power chip with an integrated DNN accelerator, used for real-time analysis of the spectral characteristics of speech signals and environmental noise. The main pickup microphone 1 is a directional sound-to-electric conversion device, specifically a MEMS microphone with a sensitivity of at least -26dB, used to capture effective signals in the human voice frequency band. The secondary noise reduction microphone 2 is a noise acquisition device with omnidirectional sound pickup characteristics, specifically a wide-frequency response digital microphone, used to acquire environmental noise samples. Specifically, the main pickup microphone 1 and the secondary noise reduction microphone 2 respectively acquire speech signals and environmental noise, and the two signals are synchronously input to the AI ​​noise reduction chip 15. The chip identifies speech frequency band features through a built-in deep neural network model, while simultaneously extracting the spectral characteristics of the noise samples. During signal processing, the chip generates an inverse signal with the opposite phase to the noise, which is superimposed and canceled out by the main microphone signal. The processed noise-reduced signal is transmitted to the left and right channel sound units through parallel circuits, achieving synchronous binaural output. The coordinated operation of the main and secondary microphones allows noise samples to participate in algorithmic calculations in real time, forming a dynamically adjusted noise reduction closed loop. The direct connection between the sound unit and the chip avoids interference attenuation during signal transmission, ensuring the complete output of the processed, clean voice signal.

[0037] Compared to existing technologies, traditional noise-canceling headphones typically use a single microphone with a fixed filtering algorithm, which cannot distinguish the spectral characteristics of speech signals from environmental noise, thus limiting noise cancellation effectiveness. Existing dual-microphone solutions often rely on fixed-space hardware designs, lacking the ability to dynamically analyze noise characteristics. This solution utilizes deep learning algorithms from an AI chip, combined with collaborative signal acquisition from dual microphones, to achieve real-time noise feature identification and dynamic cancellation, solving the problem that fixed algorithms cannot adapt to complex noisy environments.

[0038] Through the above technical solution, this application can effectively separate human voice from background noise in high ambient noise scenarios, reduce noise components in call signals, and improve the clarity of voice transmission. The collaborative work of the main and secondary microphones enables the noise reduction algorithm to obtain accurate noise samples, the dynamic processing capability of the AI ​​chip ensures adaptability to different types of noise, and the synchronous output of the left and right channels maintains the integrity of the voice signal, ultimately achieving high-quality calls in complex acoustic environments.

[0039] This application further proposes that a Bluetooth communication module is also included. The Bluetooth communication module is located in the first sound unit. The input terminal of the Bluetooth communication module 16 is electrically connected to the output terminal of the AI ​​noise reduction chip 15. The Bluetooth communication module 16 is used to receive the noise reduction signal processed by the AI ​​noise reduction chip 15 and transmit the signal to terminal devices such as mobile phones and tablets.

[0040] The Bluetooth communication module refers to the hardware unit that realizes wireless signal transmission. Specifically, it can be implemented using a radio frequency chip that integrates the Bluetooth protocol. Its function is to convert the noise-reduced voice signal into an electromagnetic wave signal that conforms to wireless communication standards. The electrical connection refers to the signal transmission path established through a conductive medium. Specifically, it can be implemented using a flexible circuit board or wire bonding. Its function is to directly transmit the electrical signal output by the AI ​​noise reduction chip 15 to the input terminal of the Bluetooth communication module.

[0041] Specifically, the noise-reduced voice signal is output by the AI ​​noise reduction chip 15 and then directly input to the Bluetooth communication module via an electrical connection. The Bluetooth communication module encodes and modulates the signal to generate a wireless signal conforming to the Bluetooth communication protocol, which is then transmitted to a mobile phone or tablet terminal via an antenna. Since the Bluetooth communication module 16 is integrated inside the first sound-generating unit, its physical distance to the AI ​​noise reduction chip 15 is shortened, reducing impedance interference and signal attenuation in the signal transmission path, thereby ensuring the integrity of the voice signal.

[0042] Compared to existing technologies, traditional headphones typically place the Bluetooth communication module 16 independently in the headband or ear hook area, requiring long-distance wiring between the noise-canceling chip and the Bluetooth communication module 16. This makes the signal transmission susceptible to electromagnetic interference and introduces delays. In contrast, this solution eliminates the intermediate links in cross-component signal transmission through modular integration, achieving end-to-end direct connection between the noise-canceling signal and the wireless transmission.

[0043] Through the above technical solution, this application solves the problem of signal degradation caused by the complex path during the transmission of noise-reduced voice signals to external devices, realizes the efficient establishment of wireless communication links, and enables the noise-reduced voice to be transmitted to mobile phones or tablets in a low-latency and low-distortion manner, thus ensuring the audio transmission quality in call and voice interaction scenarios.

[0044] This application further proposes that a power management module 17 is also included, which is located in the first sound unit and is electrically connected to the AI ​​noise reduction chip. The power management module 17 is used to adjust the power supply current of the AI ​​noise reduction chip.

[0045] The power management module 17 refers to a circuit component used to monitor and dynamically adjust the supply current. It can be implemented using an integrated power management chip or a programmable power controller. It generates corresponding current regulation commands by acquiring the load signal from the AI ​​noise reduction chip in real time. The AI ​​noise reduction chip is the computing unit that performs noise signal processing. Its power consumption fluctuates with the complexity of the algorithm. It can be implemented using a low-power chip with a built-in DNN accelerator, generating differentiated current requirements in different modes such as call noise reduction and ambient sound cancellation.

[0046] Specifically, the power management module 17 is configured to form a closed-loop control circuit with the AI ​​noise reduction chip. When the AI ​​noise reduction chip is under high computational load, such as executing a deep neural network algorithm for real-time noise feature extraction, the power management module 17 increases the supply current to ensure operational stability. When the AI ​​noise reduction chip is detected to be under low load, such as during a voice signal silence period or in standby monitoring mode, the supply current is dynamically reduced to decrease ineffective power consumption. The current adjustment process is achieved through a preset voltage-load correspondence table, which is based on the typical power consumption curves of the AI ​​noise reduction chip under different operating modes. To facilitate users' observation of the headset's operating status (such as power-on, connection, charging, etc.), an indicator light 10 is also configured. This indicator light uses an LED light source and uses different colors (such as red and blue) and flashing patterns to intuitively display the headset's operating status.

[0047] Compared to existing technologies, traditional headphone power management uses a fixed current output mode, which cannot adapt to the dynamic power consumption changes of noise-canceling chips, easily leading to insufficient power supply under high load or wasted power under low load. This solution establishes a real-time feedback mechanism to precisely match the power supply current with the computing needs, optimizing power distribution while maintaining noise-canceling performance.

[0048] Through the above technical solution, this application can automatically adjust the power supply according to the actual working state of the AI ​​noise reduction chip, ensure system stability during the operation of complex algorithms, reduce ineffective power consumption during idle periods, thereby effectively extending the battery life of the headphones after a single charge, while avoiding the decline in noise reduction performance due to insufficient current supply.

[0049] This application further proposes a volume control module, which is electrically connected to the first sound unit 7 and the second sound unit 12, and is used to control the volume of the first sound unit 7 and the second sound unit 12.

[0050] The control module refers to the electronic control unit used to generate volume adjustment commands. It can be implemented using physical buttons or touch sensors. Physical buttons may include a volume up button 14 and a volume down button 13, which trigger different level signals upon pressing. The first sound unit 7 refers to the left channel audio output component, which can be implemented using a moving-coil or balanced-iron speaker, generating sound waves by driving the diaphragm to vibrate through electrical signals. The second sound unit 12 refers to the right channel audio output component, implemented in the same way as the left channel; both work together to output stereo signals. The electrical connection refers to the signal transmission path between the control module and the sound units, which can be implemented using a flexible circuit board or wires to transmit the electrical signals corresponding to the volume adjustment commands to the sound units.

[0051] Specifically, the control module receives user operation commands via physical buttons and generates corresponding volume adjustment signals. These signals are transmitted electrically to the first sound unit 7 and the second sound unit 12, synchronously adjusting the input electrical signal strength of both, thereby changing the output volume of the left and right channel speakers. Since the control module is directly integrated into the headphone body, users can adjust the volume without relying on external devices. The synchronous adjustment mechanism for the left and right channels avoids sound field imbalance caused by unilateral volume changes, ensuring the integrity of the stereo effect. For example, when the volume up button 14 is pressed, the control module sends increasing signals to the left and right sound units, both increasing their output power proportionally; when the volume down button 13 is pressed, the signal strength decreases synchronously.

[0052] Compared to existing technologies, traditional headphones typically rely on terminal devices for volume adjustment, requiring users to interrupt operations and use their phones during calls or audio playback. This solution, however, achieves direct adjustment through an independent control module within the headphones themselves, avoiding such interruptions. While some existing headphones have physical buttons, they can only adjust the volume of a single channel or the overall volume, easily disrupting the sound field balance. This solution's synchronous adjustment mechanism maintains consistent volume ratios between the left and right channels.

[0053] Through the above technical solution, this application solves the problem of inconvenient volume adjustment during calls or audio playback, enabling volume control without removing the headphones or operating external devices. Synchronous adjustment of the left and right channels avoids sound field imbalance, ensuring stable stereo output. The tactile feedback design of the physical buttons reduces the probability of accidental operation and improves the accuracy and reliability of adjustment operations.

[0054] This application further proposes a control module consisting of a volume up button 14 and a volume down button 13 located on the microphone protective shell 5.

[0055] The volume up button 14 is a physical button used to send volume increase commands. It can be implemented using a micro switch or membrane switch. Pressing it triggers an electrical signal, transmitting the volume adjustment command to the control module. The volume down button 13 is a physical button used to send volume decrease commands. It can be implemented using a similar switching device symmetrically arranged to the volume up button 14, connected to the control module via an independent circuit to avoid signal interference. The microphone protective shell 5 is the outer shell structure that encloses the microphone assembly. It can be manufactured using injection molding, with pre-drilled holes for button mounting and an internal waterproof and dustproof sealing ring, protecting the microphone assembly while providing fixed support for the buttons.

[0056] Specifically, the volume up button 14 and volume down button 13 are integrated into the outer surface of the microphone housing 5. Physical pressing triggers a signal, which is transmitted to the control module via internal wires. Since the microphone housing 5 is typically located near the user's mouth and is independent of the ear hook structure, the user can directly access the buttons with one hand without moving their hand to the earcups or headband area. The physical triggering method avoids the risk of accidental triggering by touch sensors, and the symmetrical layout conforms to the natural operating direction of the thumb and forefinger. As an independent functional component, the surface space of the microphone housing 5 is reused as a control area, eliminating the need for an additional control module mounting structure and thus avoiding damage to the structural integrity of the ear hook or speaker unit.

[0057] Compared to existing technologies, traditional headphones typically place volume control buttons on the side of the earcups or at the headband connection, requiring users to fumble for them and affecting ease of use. Some headphones using touch controls are prone to sudden volume changes due to accidental touches. This solution, however, reuses the existing space of the microphone protective shell 5 to place physical buttons in a location easily accessible to the user, simplifying the operation path and avoiding increased structural complexity.

[0058] Through the above technical solution, this application solves the problem of inconvenient headphone volume adjustment, enabling quick one-handed control; at the same time, it avoids the structural redundancy caused by adding an independent control module, maintaining overall compactness. The physical button triggering method reduces the probability of accidental operation, and the symmetrical layout improves the intuitiveness of the operation logic.

[0059] This application further proposes a multi-functional control module, which is electrically connected to the Bluetooth communication module 16. The multi-functional control module controls the functions of the terminal device through the Bluetooth communication module 16. In this embodiment, the multi-functional control module is a multi-functional button 11. The multi-functional button 11 can realize multiple functions such as answering / hanging up calls, switching songs, activating the voice assistant, and turning the device on and off through operation logic such as short press, long press, and repeated click.

[0060] This application further proposes that the distance between the main pickup microphone 1 and the secondary noise-canceling microphone 2 is 4cm-10cm.

[0061] The distance between the main microphone 1 and the secondary noise-canceling microphone 2 refers to the straight-line distance between the centers of the two microphone apertures. This distance can be calculated using acoustic modeling, specifically by determining the phase difference based on the difference in sound wave propagation paths. This distance range has been verified through acoustic simulation to meet the spatial parameter requirements of the beamforming algorithm. The beamforming algorithm adjusts the phase and amplitude of the signals received by the microphone array to form a directional pickup beam. This can be achieved using an adaptive filtering algorithm, leveraging the time delay difference between the signals acquired by the two microphones to enhance the sound source in the target direction. This technical feature optimizes the spatial layout of the dual-microphone array, providing an accurate signal comparison basis for noise suppression.

[0062] Specifically, by setting the distance between the main pickup microphone 1 and the secondary noise-canceling microphone 2 within a specific range, an effective phase difference is formed between the sound wave signals collected by the two microphones. When the ambient noise signal reaches the two microphones, the time delay change caused by the difference in propagation path is captured by the algorithm, thereby distinguishing the spatial distribution characteristics of the target speech from the background noise. This distance range avoids noise signal aliasing due to excessive distance, while also preventing the increase in headphone structural complexity due to excessive distance, thus providing optimal acoustic conditions for noise sample collection within a compact layout.

[0063] Compared to existing technologies, traditional headphone microphone spacing designs do not consider the spatial parameter adaptability of beamforming algorithms, resulting in limited noise suppression performance. For example, some products use random spacing layouts, which cannot meet the accuracy requirements of phase difference calculation; others excessively pursue large spacing to enhance noise reduction, but this leads to bulky headphones. This solution optimizes structural compactness by limiting the spacing range, ensuring the effective operation of the algorithm, and achieving a balance between noise reduction performance and wearing comfort.

[0064] Through the above technical solution, this application can improve the recognition accuracy of environmental noise by the dual-microphone array and optimize the noise reduction algorithm's efficiency in extracting noise features. In high-speed wind noise or multi-voice mixed scenarios, this spacing design enables the noise samples collected by the secondary noise reduction microphone 2 to form an effective comparison with the speech signal collected by the main pickup microphone 1, providing clear noise feature data for subsequent signal processing, thereby improving the clarity of the call speech.

[0065] This application further proposes that it also includes a connecting adapter 4, which is fixed on the first sound unit. One end of the metal flexible rod 3 is connected to the microphone protective shell 5, and the other end of the metal flexible rod 3 away from the microphone protective shell 5 is rigidly connected to the connecting adapter 4.

[0066] The connecting adapter 4 is a transitional component used to establish a mechanical connection between the flexible metal tube 3 and the sound-generating component. It can be made from an injection-molded part or a machined metal part. Its surface has fixing holes that match the housing of the sound-generating component, and its interior has cable channels for passing signal wires. This component provides a stable mounting point for the flexible metal tube 3 by eliminating relative displacement deviations between moving parts. The rigid connection refers to a fixing method achieved using a non-deformable physical locking structure, specifically through threaded fastening or snap-fit ​​engagement. By eliminating elastic deformation space at the connection point, it prevents loosening due to material fatigue and avoids signal transmission interruption caused by wire bending.

[0067] Specifically, the connecting adapter 4 is fixed in a preset position on the housing of the first sound-generating unit, with its mounting holes aligned and locked to the internal support structure of the housing. The end of the flexible metal hose 3 is screwed into the connection port of the adapter via a thread, or is engaged and fixed to the adapter via a snap-fit ​​mechanism. This connection method maintains the angle adjustment capability of the flexible metal hose 3 while limiting the mechanical stress generated by bending within the deformation range of the hose itself, preventing it from being transmitted to the connection interface. The sealed design of the cable channel prevents foreign objects from entering the sound-generating component, and the signal line remains straight within the channel, avoiding conductor breakage caused by repeated bending.

[0068] In some specific embodiments, the connecting adapter 4 is designed as an aluminum alloy sleeve with internal threads. The outer wall of the sleeve has an annular groove for injection molding and fixing with the housing of the sound-generating component. The inner wall of the sleeve is tapped with standard threads to match and screw into the external threads at the end of the metal flexible hose rod 3. The cable channel is filled with a silicone buffer layer to absorb vibration energy and fix the position of the cable.

[0069] Compared to existing technologies, traditional headphones use elastic clips or adhesives to connect the flexible tube to the sound-generating component. Prolonged bending can easily lead to clip failure or adhesive peeling. This solution replaces the elastic deformation connection method with a rigid connection structure, reducing the stress on the connection interface, improving structural stability, and extending service life.

[0070] Through the above technical solution, this application solves the problem of loosening caused by frequent adjustments to the connection structure between the microphone assembly and the sound-emitting unit, avoids signal transmission failures due to poor cable contact, and improves the reliability of the headphones in dynamic usage scenarios. The rigid connection structure ensures the long-lasting stability of the mechanical connection while maintaining the angle adjustment function, protecting the internal wiring from bending damage.

[0071] This application further proposes that the microphone be a digital microphone with a sensitivity of not less than -26dB.

[0072] Digital microphones refer to acoustic-to-electric conversion devices that use digital signal output. Specifically, they can be implemented using silicon microphones manufactured based on MEMS technology, which integrate analog-to-digital conversion circuits to directly convert sound wave vibrations into digital signals. This feature reduces signal attenuation through digital transmission and improves the accuracy of noise sample acquisition. A sensitivity of at least -26dB means that the microphone's output voltage per Pascal of sound pressure at 1kHz reaches a specific threshold, which can be achieved by optimizing the diaphragm thickness and the spacing between the backplates using micromechanical structures. This parameter ensures effective capture of low-intensity sound waves in complex sound fields, providing high-fidelity raw data for noise reduction algorithms.

[0073] Specifically, the digital microphone directly outputs pulse-code modulation signals through a built-in analog-to-digital converter module, eliminating electromagnetic interference experienced by traditional analog microphones during signal transmission. When ambient noise reaches 80dB, a sensitivity setting of no less than -26dB allows the microphone to accurately capture subtle differences between the user's voice and ambient noise. In the beamforming algorithm, this sensitivity threshold ensures accurate measurement of the phase difference between the sound source and the primary microphone array, enabling the AI ​​noise reduction chip 15 to effectively distinguish the direction of the target speech from the propagation path of ambient noise.

[0074] Compared to existing technologies, traditional headphones often use analog microphones with sensitivity below -30dB, whose signals are easily distorted by circuit interference during transmission. This solution utilizes a digital microphone with integrated analog-to-digital conversion, avoiding electromagnetic noise intrusion in the signal transmission link. Simultaneously, the increased sensitivity threshold allows the microphone to output a higher signal-to-noise ratio speech signal under the same sound pressure level, overcoming the technical deficiency of insufficient speech feature extraction in high-noise environments.

[0075] Through the above technical solutions, this application can accurately capture the fundamental frequency and formant characteristics of user voice signals in outdoor scenarios where high-speed wind noise reaches 75dB. In environments where factory equipment generates continuous low-frequency noise of 85dB, this technical solution improves the signal-to-noise ratio of voice signals to over 15dB, ensuring that the noise reduction algorithm can effectively separate clear human voice frequency bands. When users are in a conference room scenario with multiple people talking, the high sensitivity of the digital microphone can accurately collect effective voice within a distance of 3 meters, avoiding interference from background noise on call quality.

[0076] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications, substitutions, and improvements without departing from the concept of this utility model, and these should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the claims.

Claims

1. An earphone, characterized by comprising: The device includes a first sound-emitting unit, a second sound-emitting unit, and a microphone assembly. The first sound-emitting unit is connected to a headband support assembly via a first ear hook, the second sound-emitting unit is connected to the headband support assembly via a second ear hook, and the microphone assembly is enclosed in a microphone protective shell. The microphone protective shell is connected to the first sound-emitting unit via a flexible metal rod.

2. The earphone of claim 1, wherein, The microphone assembly includes a main pickup microphone and a secondary noise-canceling microphone.

3. The earphone of claim 2, wherein It also includes an AI noise reduction chip. The input terminal of the first sound-emitting unit is electrically connected to the output terminal of the AI ​​noise reduction chip, the input terminal of the second sound-emitting unit is electrically connected to the output terminal of the AI ​​noise reduction chip, the output terminal of the main microphone is electrically connected to the input terminal of the AI ​​noise reduction chip, and the output terminal of the secondary microphone is electrically connected to the input terminal of the AI ​​noise reduction chip. The main microphone is used to capture high-frequency speech signals and transmit the captured high-frequency speech signals to the AI ​​noise reduction chip. The secondary microphone is used to collect ambient noise and transmit the collected ambient noise to the AI ​​noise reduction chip. After the AI ​​noise reduction chip identifies, analyzes, and performs noise reduction processing on the received signals, it transmits the processed signals to the first sound-emitting unit and the second sound-emitting unit.

4. The earphone of claim 3, wherein It also includes a Bluetooth communication module, the input of which is electrically connected to the output of the AI ​​noise reduction chip. The Bluetooth communication module is used to receive the noise reduction signal processed by the AI ​​noise reduction chip and transmit the signal to the terminal device.

5. The earphone of claim 3, wherein It also includes a power management module, which is electrically connected to the AI ​​noise reduction chip and is used to adjust the power supply current of the AI ​​noise reduction chip.

6. The earphone of claim 3, wherein, It also includes a volume control module, which is electrically connected to the first sound unit and the second sound unit. The control module is used to control the volume of the first sound unit and the second sound unit.

7. The earphone of claim 6, wherein The control module consists of volume up and volume down buttons located on the microphone protective shell.

8. The headphones according to claim 4, characterized in that, It also includes a multi-functional control module, which is electrically connected to the Bluetooth communication module.

9. The headphones according to any one of claims 2-8, characterized in that, The distance between the main microphone and the secondary noise-canceling microphone is 4cm-10cm.

10. The earphone according to claim 1, characterized in that, It also includes a connecting adapter, which is fixed to the first sound-emitting unit. One end of the metal flexible tube is connected to the microphone protective shell, and the other end of the metal flexible tube is rigidly connected to the connecting adapter.