Intelligent voice interaction devices
Patent Information
- Application Number
- CN202521999593.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-17
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2035-09-17
AI Technical Summary
[0002]传统灵机魔盒设备中,扬声器与麦克风常因布局紧凑、无独立发声空间,导致扬声器输出声音在设备内部反复反射形成回声,同时麦克风易受扬声器声音干扰,造成音频输出模糊、语音采集失真;且部分设备接口布局不合理、组件安装无缓冲设计,进一步影响音频效果与设备稳定性,难以满足语音模组对清晰音频交互的需求
1、通过将麦克风与扬声器分设于外壳体前后两侧,从空间上隔绝二者信号干扰;同时在外壳体内设置封闭式扬声器安装腔室,并对应腔室在背面设喇叭网孔结构,形成独立发声空间,减少声音向腔室外部反射,该设计有效解决传统设备的回声与信号干扰问题,提升音频输出清晰度与语音采集准确性。
Smart Images

Figure CN224709759U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of intelligent voice interaction devices, and relates to an intelligent voice interaction device. Background Technology
[0002] In traditional Lingji Magic Box devices, the speakers and microphones are often compactly arranged and lack independent sound-emitting space, causing the speaker output sound to repeatedly reflect inside the device, forming echoes. At the same time, the microphone is easily interfered with by the speaker sound, resulting in blurry audio output and distorted voice acquisition. Furthermore, some devices have unreasonable interface layouts and components installed without buffer design, which further affects the audio effect and device stability, making it difficult to meet the voice module's requirement for clear audio interaction. Summary of the Invention
[0003] The purpose of this invention is to address the aforementioned problems by providing an intelligent voice interaction device.
[0004] To achieve the above objectives, the present invention adopts the following technical solution: A smart voice interaction device includes a housing. The housing contains a power supply module, an audio module, a control button module, an external interface module, and a circuit board. The power supply module, audio module, control button module, and external interface module are all connected to the circuit board. The audio module includes a microphone and a speaker, which are respectively located on the front and rear sides of the housing. The housing contains a closed speaker mounting chamber, and a speaker mesh structure is provided on the back of the housing corresponding to the speaker mounting chamber.
[0005] In the aforementioned intelligent voice interaction device, the sound-emitting end of the speaker faces the speaker mesh structure.
[0006] In the aforementioned intelligent voice interaction device, the inner walls of the speaker mounting chamber, except for the side with the speaker mesh structure, are coated with a sound-absorbing coating.
[0007] In the aforementioned intelligent voice interaction device, the speaker mounting chamber is connected to a speaker mounting bracket via several springs on the side away from the speaker mesh structure, and the speaker is fixed on the speaker mounting bracket.
[0008] In the aforementioned intelligent voice interaction device, the speaker mesh structure includes a mesh forming plate, the thickness of which is less than the thickness of the back plate on the back of the outer shell, and the mesh forming plate is provided with multiple sound holes.
[0009] In the aforementioned intelligent voice interaction device, the perforated molding plate and the back plate on the back of the outer shell are integrally injection molded.
[0010] In the aforementioned intelligent voice interaction device, there are two microphones. The front side of the outer casing has a corresponding sound-receiving hole, and the sound-receiving end of the microphone faces the sound-receiving hole.
[0011] In the aforementioned intelligent voice interaction device, the power supply module is a lithium battery, which is connected to the circuit board via a battery interface. The control button module includes a power on / off button, a reset button, and two volume buttons for controlling volume up and down.
[0012] In the aforementioned intelligent voice interaction device, the external interface module includes an external MIC interface, an external LED interface, a power button interface, and an external speaker interface, and the circuit board has reserved a QSPI display interface, an LED-PWM interface, and a general-purpose GPIO interface.
[0013] In the aforementioned intelligent voice interaction device, the external interface module is located on the left and right side walls and the top side wall of the outer casing.
[0014] Compared with existing technologies, the advantages of this utility model are: 1. By placing the microphone and speaker on the front and back sides of the housing, spatial interference between the two signals is isolated. At the same time, a closed speaker mounting chamber is set inside the housing, and a speaker mesh structure is set on the back of the chamber to form an independent sound space, reducing sound reflection to the outside of the chamber. This design effectively solves the echo and signal interference problems of traditional equipment, and improves the clarity of audio output and the accuracy of voice acquisition.
[0015] Other advantages, objectives and features of this invention will be partly apparent from the following description, and partly understood by those skilled in the art through study and practice of this invention. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the external structure provided by this utility model; Figure 2 This is a cross-sectional view of the present invention; Figure 3 This is a schematic diagram of the structure on the back of the outer casing; Figure 4 This is a schematic diagram of the internal structure of the outer shell back panel. Detailed Implementation
[0017] like Figures 1-4As shown, an intelligent voice interaction device includes a housing 1. The housing 1 contains a power supply module 2, an audio module 3, a control button module 4, an external interface module 5, and a circuit board 6. The power supply module 2, audio module 3, control button module 4, and external interface module 5 are all connected to the circuit board 6. The audio module 3 includes a microphone 7 and a speaker 8, which are respectively located on the front and rear sides of the housing 1. The housing 1 contains a closed speaker mounting chamber 9. A speaker mesh structure 10 is provided on the back of the housing 1 at a position corresponding to the speaker mounting chamber 9.
[0018] In this invention, the microphone and speaker are separated on the front and rear sides of the housing, thus isolating their signals from interference. At the same time, a closed speaker mounting chamber is set inside the housing, and a speaker mesh structure is set on the back of the chamber to form an independent sound-emitting space, reducing sound reflection to the outside of the chamber. This design effectively solves the echo and signal interference problems of traditional equipment, and improves the clarity of audio output and the accuracy of voice acquisition.
[0019] It also includes a 4G voice module. The connection between each module and the circuit board ensures the coordinated operation of the device's power supply, control, and expansion functions, and adapts to the communication requirements of the 4G voice module.
[0020] Specifically, the sound-emitting end of speaker 8 faces the speaker mesh structure 10. This orientation allows the speaker's output sound to propagate directly outward through the mesh, shortening the sound propagation path and preventing sound from being reflected and detoured within the casing. This design optimizes the weak echo effect from the direction of sound propagation, solving the sound reflection and accumulation problem caused by the speaker's sound-emitting direction deviating from the output port in traditional devices. This results in more direct and pure audio output, further improving the user's listening experience and voice communication quality.
[0021] Specifically, the speaker mounting chamber 9, except for the side with the speaker mesh structure 10, has its inner walls coated with a sound-absorbing coating 11. This coating absorbs residual reflected sound that doesn't directly pass through the mesh, reducing sound reflection intensity. This design complements the weak echo effect of a closed chamber and directional sound emission, solving the echo superposition problem caused by residual reflected sound from the inner walls of traditional chambers, maximizing echo reduction, and is particularly suitable for scenarios requiring high sound quality, such as voice calls and audio playback.
[0022] Specifically, a speaker mounting chamber 9, located away from the speaker mesh structure 10, is connected to a speaker mounting bracket 13 via several springs 12. The speaker 8 is fixed to the speaker mounting bracket 13. The speaker mounting chamber is connected to the speaker mounting bracket via springs, and the speaker is fixed to the mounting bracket. The springs buffer the vibrations generated during speaker operation, preventing vibrations from being transmitted to the outer casing and causing secondary sound reflections. They also reduce vibration interference to other components such as the microphone and circuit board. This design solves the vibration interference and echo superposition problems caused by traditional rigid installations, ensuring stable weak echo effects, improving the overall operational stability of the equipment, and extending the service life of components.
[0023] Specifically, the speaker mesh structure 10 includes a mesh forming plate 14, the thickness of which is less than the thickness of the back plate on the back of the outer casing 1. The mesh forming plate 14 has multiple sound-emitting holes 15. The thinness of the mesh forming plate compared to the back plate of the outer casing prevents sound reflection within the holes due to an excessively thick mesh structure. The multiple sound-emitting holes on the plate ensure uniform and efficient sound output, expanding the audio coverage range. This design solves the problems of sound output obstruction and reflection caused by traditional single or excessively thick meshes, further optimizing weak echo effects while improving the uniformity and propagation efficiency of audio output.
[0024] Specifically, the perforated plate 14 is integrally injection molded with the back plate on the back of the housing 1. This integral injection molding improves the sealing performance between the speaker mesh structure and the housing, preventing sound leakage or impurities from entering the speaker mounting chamber due to assembly gaps. The integral molding also enhances structural stability, preventing the perforated plate from loosening or shifting. This design solves the sealing and stability problems of traditional assembled mesh structures, ensuring the durability of the weak echo effect while reducing damage to the speaker from impurities and extending equipment maintenance cycles.
[0025] Specifically, there are two microphones 7. A corresponding sound-receiving hole 16 is located on the front side of the housing 1, with the receiving end of the microphone 7 facing the sound-receiving hole 16. This dual-microphone design, with the receiving end facing the sound-receiving hole on the front of the housing, improves the sensitivity and anti-interference capability of sound acquisition, ensuring accurate capture of external sounds and reducing interference from the speaker output inside the housing. The dual microphones also further filter environmental noise, optimizing the sound pickup effect. This design, combined with the speaker's weak echo effect, solves the problems of low sensitivity and susceptibility to interference inherent in traditional single-microphone designs, significantly improving the clarity of remote voice communication.
[0026] Specifically, the power supply module 2 is a lithium battery, which is connected to the circuit board 6 through a battery interface.
[0027] Furthermore, the power supply module is a 3.6-4.5V single-cell lithium battery, and the device is equipped with a TYPE-C charging port that is electrically connected to the power supply module. The TYPE-C charging port also serves as a communication port.
[0028] Specifically, the control button module 4 includes a power on / off button 17, a reset button 18, and two volume buttons 19 for controlling volume up and down. The control button module includes power on / off, reset, and volume adjustment functions, offering intuitive and convenient operation for quick device status control and audio adjustment.
[0029] Specifically, the external interface module 5 includes an external MIC1 interface 20, an external MIC2 interface 21, an external LED interface 22, a power button interface 23, and an external speaker interface 24. The circuit board 6 also has reserved QSPI display interface, 3 LED-PWM interfaces, and 4 general-purpose GPIO interfaces. The external interface module covers a variety of external interfaces, supporting external microphones, LEDs, speakers, and other devices, expanding the device's audio acquisition, status indication, and power output functions. The multiple function interfaces reserved on the circuit board support external display devices, sensors, and actuators, further expanding the device's functional range. This design solves the problem of poor expandability in traditional devices, enabling the device to adapt to different usage scenarios, improving versatility and flexibility, and meeting diverse user needs.
[0030] Specifically, the external interface module 5 is located on the left, right, and top side walls of the outer casing 1. This distribution of the external interface modules on the left, right, and top side walls conforms to user operating habits, facilitates the connection of external devices, and avoids the problems of connection congestion and operational inconvenience caused by concentrated interfaces. The reasonable interface layout also ensures that connected external devices do not obstruct the speaker grille or microphone hole, and do not affect weak echo effects or sound acquisition. This design solves the problems of inconvenience and functional interference caused by unreasonable traditional interface layouts, improves the ease of use of the device, and ensures the stable implementation of core audio functions.
[0031] The specific embodiments described herein are merely illustrative examples illustrating the spirit of this utility model. Those skilled in the art to which this utility model pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of this utility model or exceeding the scope defined by the appended claims.
Claims
1. An intelligent voice interaction device, comprising a housing (1), characterized in that, The outer casing (1) is provided with a power supply module (2), an audio module (3), a control button module (4), an external interface module (5), and a circuit board (6). The power supply module (2), audio module (3), control button module (4), and external interface module (5) are all connected to the circuit board (6). The audio module (3) includes a microphone (7) and a speaker (8). The microphone (7) and speaker (8) are respectively located on the front and rear sides of the outer casing (1). The outer casing (1) is enclosed with a speaker mounting chamber (9). The back of the outer casing (1) is provided with a speaker mesh structure (10) corresponding to the position of the speaker mounting chamber (9).
2. The intelligent voice interaction device according to claim 1, characterized in that, The sound-emitting end of the loudspeaker (8) faces the speaker mesh structure (10).
3. The intelligent voice interaction device according to claim 2, characterized in that, The speaker mounting chamber (9) is coated with a sound-absorbing coating (11) on all inner walls except for the side with the speaker mesh structure (10).
4. The intelligent voice interaction device according to claim 3, characterized in that, The speaker mounting chamber (9) is connected to a speaker mounting bracket (13) on the side away from the speaker mesh structure (10) by several springs (12), and the speaker (8) is fixed on the speaker mounting bracket (13).
5. The intelligent voice interaction device according to any one of claims 1-4, characterized in that, The speaker mesh structure (10) includes a mesh forming plate (14), the thickness of which is less than the thickness of the back plate on the back of the outer shell (1), and the mesh forming plate (14) is provided with a plurality of sound holes (15).
6. The intelligent voice interaction device according to claim 5, characterized in that, The mesh forming plate (14) and the back plate on the back of the outer shell (1) are integrally injection molded.
7. The intelligent voice interaction device according to any one of claims 1-4, characterized in that, The microphone (7) is provided in two parts. The front side of the outer shell (1) is provided with a sound receiving hole (16) corresponding to the microphone (7) and the sound receiving end of the microphone (7) faces the sound receiving hole (16).
8. The intelligent voice interaction device according to any one of claims 1-4, characterized in that, The power supply module (2) is a lithium battery, which is connected to the circuit board (6) through the battery interface; The control button module (4) includes a power switch button (17), a reset button (18), and two volume buttons (19) for controlling the volume up and down.
9. The intelligent voice interaction device according to any one of claims 1-4, characterized in that, The external interface module (5) includes an external MIC1 interface (20), an external MIC2 interface (21), an external LED interface (22), a power button interface (23), and an external speaker interface (24). The circuit board (6) also has a reserved QSPI display interface, 3 LED-PWM interfaces, and 4 general GPIO interfaces.
10. The intelligent voice interaction device according to claim 9, characterized in that, The external interface module (5) is disposed on the left and right side walls and the top side wall of the outer shell (1).