An adjustment structure for a base plate leveling mechanism and a heating plate assembly.

Abstract

This utility model discloses a base plate leveling mechanism and an adjustment structure for a heating plate assembly. The base plate leveling mechanism is located between the heating plate and a ceramic base plate below it, and includes: a plurality of locking screws inserted into the heating plate support rod and the ceramic base plate support rod, tightened to couple and fix the heating plate and the ceramic base plate; and an elastic component located between the heating plate support rod and the ceramic base plate support rod, used to support the ceramic base plate, decoupled from the heating plate, when the locking screws are loosened, to adjust the position of the ceramic base plate and maintain its parallelism with the heating plate. The aforementioned base plate leveling mechanism can improve the uniformity of the spacing between the heating plate and the ceramic base plate, increase their relative parallelism, thereby improving the uniformity of the surface temperature distribution of the heating plate and contributing to improved process performance.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor manufacturing, specifically to a base plate leveling mechanism and an adjustment mechanism for a heating plate assembly. Background Technology

[0002] With increasing market demand, the high-temperature amorphous carbon hard mask (ACHM) process has higher and higher requirements for the uniformity of film performance. Therefore, there are also higher requirements for the temperature uniformity of the heating plate surface.

[0003] In existing technologies, to improve the surface temperature uniformity of the heating plate, a ceramic base plate is typically installed under the heating plate. The high thermal resistance of the ceramic base plate helps to achieve uniform heating of the heating plate. Furthermore, to achieve the required uniform heating effect, there are also high requirements for the distance between the heating plate and the ceramic base plate, as well as their relative parallelism.

[0004] However, in current semiconductor equipment, the heating plate and ceramic substrate are in relatively fixed positions, and their relative parallelism is determined by the basic dimensions, dimensional tolerances, shape and position tolerances of each component, as well as thermal expansion. Therefore, the upper and lower limits differ significantly and cannot be adjusted. Furthermore, the relative parallelism between the heating plate and ceramic substrate directly affects the heat distribution radiated from the heating plate to the ceramic substrate. A large gap between them (i.e., poor relative parallelism) will generate significant variations in radiated heat, leading to uneven temperature distribution on the heating plate surface, thus affecting process performance.

[0005] In order to solve the above-mentioned problems in the prior art, there is an urgent need in the field for a base plate leveling technology that can improve the uniformity of the spacing between the heating plate and the ceramic base plate, improve the relative parallelism between the two, thereby improving the uniformity of the temperature distribution on the surface of the heating plate and helping to improve the process performance. Utility Model Content

[0006] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0007] In order to overcome the above-mentioned defects in the existing technology, the present invention provides a base plate leveling mechanism and a heating plate assembly adjustment mechanism, which can improve the uniformity of the spacing between the heating plate and the ceramic base plate, improve the relative parallelism between the two, thereby improving the uniformity of the surface temperature distribution of the heating plate and helping to improve the process performance.

[0008] Specifically, according to the first aspect of this utility model, the base plate leveling mechanism is disposed between the heating plate and the ceramic base plate located below it. The base plate leveling mechanism includes: a plurality of locking screws inserted into the heating plate support rod and the ceramic base plate support rod, tightened to couple and fix the heating plate and the ceramic base plate; and an elastic member located between the heating plate support rod and the ceramic base plate support rod, used to support the ceramic base plate decoupled from the heating plate when the locking screws are loosened, so as to adjust the position of the ceramic base plate and keep it parallel to the heating plate.

[0009] Furthermore, in some embodiments of this utility model, the plurality of locking screws includes a plurality of evenly distributed locking screws, and at least one of the plurality of locking screws is in a loosened state, partially decoupling the heating plate and the ceramic base plate to locally adjust the position of the ceramic base plate.

[0010] Furthermore, in some embodiments of this utility model, the elastic component includes a helical spring, which is sleeved on the outside of the locking screw. The elastic potential energy released by the spring provides support for the locking screw in the loosened state and laterally limits the locking screw in the loosened state.

[0011] Furthermore, in some embodiments of this utility model, one end of the heating plate support rod and the ceramic base plate support rod extends to the outside of the cavity bottom of the reaction chamber, so as to tighten or loosen the heating plate and the ceramic base plate on the outside of the cavity bottom via the locking screw.

[0012] Furthermore, in some embodiments of this utility model, a first corrugated pipe is provided between the heating plate support rod and the ceramic base plate support rod, for dynamically sealing the reaction chamber when adjusting the position of the ceramic base plate.

[0013] Furthermore, in some embodiments of this utility model, the ceramic base plate support rod is a structure of a metal base plate combined with a metal sleeve, the ceramic base plate is placed on the metal base plate, and the metal sleeve is sleeved on the outside of the heating plate support rod.

[0014] Furthermore, according to the adjustment mechanism of the heating plate assembly provided in the second aspect of this utility model, the heating plate assembly includes a heating plate and a ceramic base plate located below it. The adjustment structure includes: a slide leveling mechanism disposed below the heating plate assembly, including at least three non-collinear adjusting screws for adjusting the position of the heating plate to make it horizontal; and the base plate leveling mechanism provided in the first aspect of this utility model for decoupling the heating plate and the ceramic base plate after the heating plate is leveled, so as to adjust the position of the ceramic base plate to maintain the same parallelism with the heating plate.

[0015] Furthermore, in some embodiments of this utility model, the at least three adjusting screws include at least two leveling screws and one ball joint screw, wherein the heating plate assembly is adjusted vertically by means of the leveling screws and rotated in all directions by means of the ball joint screws to level the heating plate.

[0016] Furthermore, in some embodiments of this utility model, the adjustment mechanism includes a lifting component connected to the slide leveling mechanism, used for initially adjusting the height position of the heating plate component.

[0017] Furthermore, in some embodiments of this utility model, one end of the ceramic base plate support rod extends to the outside of the cavity bottom of the reaction chamber, and a second corrugated pipe is provided between the ceramic base plate support rod and the cavity bottom for dynamically sealing the reaction chamber when the height position of the heating plate assembly is initially adjusted. Attached Figure Description

[0018] The above-described features and advantages of this invention can be better understood after reading the following detailed description of the embodiments of this disclosure in conjunction with the accompanying drawings. In the drawings, the components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0019] Figure 1 A schematic diagram of the structure of an adjustment mechanism for a heating plate assembly according to some embodiments of the present invention is shown;

[0020] Figure 2 This diagram shows a cross-sectional view of a base plate leveling mechanism according to some embodiments of the present invention; and

[0021] Figure 3 A cross-sectional view of an adjustment mechanism for a heating plate assembly according to some embodiments of the present invention is shown.

[0022] Figure label:

[0023] 100 Adjustment mechanism;

[0024] 110 Heating plate;

[0025] 111 Heating plate support rod;

[0026] 120 Ceramic base plate;

[0027] 121 Ceramic base plate support rod;

[0028] 200 Base plate leveling mechanism;

[0029] 210 Locking screw;

[0030] 220 Elastic component;

[0031] 230. Pelvic floor cavity;

[0032] 241 First bellows;

[0033] 242 Second bellows;

[0034] 250 metal base plate;

[0035] 251 Metal sleeve;

[0036] 260 water-cooled base;

[0037] 261 Lateral extension plate;

[0038] 300 Slide Leveling Mechanism;

[0039] 310 leveling screw;

[0040] 320 ball joint screw;

[0041] 330 Lifting Component;

[0042] 331 Linear Guide;

[0043] 332 lead screw nut; and

[0044] 340 Leveling connector. Detailed Implementation

[0045] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. Although the description of this utility model will be presented in conjunction with preferred embodiments, this does not mean that the features of this utility model are limited to this embodiment. On the contrary, the purpose of describing the utility model in conjunction with the embodiments is to cover other options or modifications that may be derived based on the claims of this utility model. To provide a deep understanding of this utility model, many specific details will be included in the following description. This utility model may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this utility model, some specific details will be omitted in the description.

[0046] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0047] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described device must be manufactured or operated in a specific orientation; therefore, they should not be construed as limiting the scope of this invention.

[0048] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first component, region, layer, and / or part discussed below may be referred to as the second component, region, layer, and / or part without departing from some embodiments of this utility model.

[0049] As mentioned above, in current semiconductor equipment, the heating plate and the ceramic substrate are in relatively fixed positions, and their relative parallelism is determined by the basic dimensions, dimensional tolerances, shape and position tolerances of each component, as well as thermal expansion. Therefore, the upper and lower limits differ significantly and cannot be adjusted. Furthermore, the relative parallelism between the heating plate and the ceramic substrate directly affects the heat distribution radiated from the heating plate to the ceramic substrate. A large gap between them (i.e., poor relative parallelism) will generate significant variations in radiated heat, leading to uneven temperature distribution on the surface of the heating plate, thus affecting process performance.

[0050] To address the aforementioned problems in the prior art, this utility model provides a base plate leveling mechanism and a heating plate assembly adjustment mechanism, which can improve the uniformity of the spacing between the heating plate and the ceramic base plate, increase the relative parallelism between the two, thereby improving the uniformity of the surface temperature distribution of the heating plate and helping to improve process performance.

[0051] In some non-limiting embodiments, the base plate leveling mechanism provided in the first aspect of the present invention can be configured in the adjustment mechanism of the heating plate assembly provided in the second aspect of the present invention.

[0052] The working principle of the aforementioned base plate leveling mechanism will be described below with reference to some embodiments of the adjustment mechanisms of the heating plate assemblies. Those skilled in the art will understand that these embodiments of the adjustment mechanisms of the heating plate assemblies are merely non-limiting implementations provided by this utility model, intended to clearly demonstrate the main concept of this utility model and provide some specific solutions convenient for public implementation, rather than limiting all working methods or functions of the base plate leveling mechanism. Similarly, this base plate leveling mechanism is also only one non-limiting implementation provided by this utility model and does not constitute a limitation on all working methods or functions of these heating plate assemblies' adjustment mechanisms.

[0053] Please refer to Figure 1 , Figure 1 A schematic diagram of the structure of an adjustment mechanism for a heating plate assembly provided according to some embodiments of the present invention is shown.

[0054] like Figure 1As shown, in some embodiments of this utility model, the heating plate assembly in the adjusting mechanism 100 of the heating plate assembly may include a heating plate 110 and a ceramic base plate 120 located below it. The heating plate 110 can be used to support the wafer for processing. Furthermore, since the heating plate 110 and the ceramic base plate 120 have different coefficients of thermal expansion, if they are brought into contact at low temperatures, the materials will expand under high temperatures, posing a risk of crushing and causing significant losses. Therefore, for the assembly of the heating plate 110 and the ceramic base plate 120, it is preferable to leave a sufficient gap at room temperature to allow for gap contact between the two, thereby ensuring that a certain gap is maintained after the two components expand at high temperatures.

[0055] Continue as Figure 1 As shown, the adjusting mechanism 100 of the heating plate assembly may include a slide leveling mechanism 300 and a base plate leveling mechanism 200. It can be combined with... Figure 1 As shown in the top view of the adjustment mechanism 100, the slide leveling mechanism 300 is located below the heating plate assembly and may include at least three non-collinear adjusting screws for adjusting the position of the heating plate 110 to a horizontal state. The base plate leveling mechanism 200 can be used to decouple the heating plate 110 and the ceramic base plate 120 after the heating plate 110 is leveled, allowing for individual adjustment of the position of the ceramic base plate 120 to maintain the same parallelism with the heating plate 110. In this embodiment of the invention, by decoupling the fixed relationship between the ceramic base plate 120 and the heating plate 110, the levelness of the ceramic base plate 120 can be individually adjusted after the heating plate 110 is leveled, adjusting the gap distance between it and various points on the heating plate 110 to ensure the ceramic base plate 120 achieves the same parallelism with the heating plate 110. This improves the uniformity of the surface temperature distribution of the heating plate and helps improve process performance.

[0056] Specifically, please see Figure 2 , Figure 2 A cross-sectional structural schematic diagram of a base plate leveling mechanism provided according to some embodiments of the present invention is shown.

[0057] like Figure 2 As shown, in some embodiments of this utility model, the base plate leveling mechanism 200 can be disposed between the heating plate 110 and the ceramic base plate 120 located below it. Specifically, the base plate leveling mechanism 200 can be configured between the heating plate support rod 111 extending downward from the heating plate 110 and the ceramic base plate support rod 121 extending downward from the ceramic base plate 120.

[0058] The base plate leveling mechanism 200 may include a plurality of locking screws 210 and an elastic component 220. The locking screws 210 can be inserted into the heating plate support rod 111 and the ceramic base plate support rod 121. By tightening the locking screws 210, the heating plate support rod 111 and the ceramic base plate support rod 121 are fixed, thereby coupling and fixing the heating plate 110 and the ceramic base plate 120 above them. Furthermore, by loosening the locking screws 210, the heating plate 110 and the ceramic base plate 120 can be decoupled, thus breaking their fixed connection. At this time, the position and orientation of the ceramic base plate 120 can be individually adjusted to achieve the same parallelism as the heating plate 110.

[0059] Furthermore, in the base plate leveling mechanism 200, an elastic component 220 can be provided between the heating plate support rod 111 and the ceramic base plate support rod 121. When the heating plate 110 and the ceramic base plate 120 are in a coupled and fixed state, the elastic component 220 is compressed and deformed to store elastic potential energy. When the locking screw 210 is loosened, the ceramic base plate 120 and the heating plate 110 are decoupled, the elastic potential energy of the elastic component 220 is released, and a vertically upward force is provided to the ceramic base plate 120 to support the ceramic base plate 120 decoupled from the heating plate 110. This avoids the risk of the ceramic base plate 120 falling after decoupling from the heating plate 110, and facilitates continuous adjustment of the distance between the ceramic base plate 120 and the heating plate 110, thereby improving the continuous adjustability of the position and posture of the ceramic base plate 120 and helping to improve the relative parallelism between the two.

[0060] In some preferred embodiments, the plurality of locking screws 210 may comprise a plurality of evenly distributed locking screws. Optionally, at least three locking screws 210 distributed at 120 degrees may be included.

[0061] Furthermore, with at least one of the locking screws 210 in a loosened state, the heating plate 110 and the ceramic base plate 120 can be partially decoupled, and then the position and orientation of the ceramic base plate 120 can be locally adjusted, which is beneficial for fine-tuning the level of the ceramic base plate 120.

[0062] Continue as Figure 1 As shown, in some embodiments, the elastic member 220 may include a helical spring. The helical spring may be sleeved on the outside of the locking screw 210, and the elastic potential energy released therefrom can provide support force for the locking screw 210 in the loosened state. At the same time, the helical spring can laterally limit the locking screw 210 in the loosened state to prevent it from shifting after it has unscrewed away from the ceramic base plate support rod 121.

[0063] In some alternative embodiments, the elastic component 220 may also be selected from other components with elastic potential energy, such as a serpentine spring, to provide upward support when the ceramic base plate 120 and the heating plate 110 are in a decoupled state, so as to avoid the risk of large displacement of the ceramic base plate 120, such as the risk of falling.

[0064] Continue as Figure 2 As shown, in some optional embodiments, one end of the heating plate support rod 111 and the ceramic base plate support rod 121 can extend to the outside of the cavity bottom 230 of the reaction chamber. Correspondingly, the locking screw 210 is also located on the outside of the cavity bottom 230. In this case, technicians can adjust the position of the ceramic base plate 120 by directly tightening or loosening the heating plate 110 and the ceramic base plate 120 on the outside of the cavity bottom 230 via the locking screw 210 without opening the cavity. In this embodiment, the convenience of adjusting the ceramic base plate 120 individually is improved.

[0065] Furthermore, continue as Figure 2 As shown, in some embodiments, a first bellows 241 may be provided between the heating plate support rod 111 and the ceramic base plate support rod 121, which is used to dynamically seal the reaction chamber during the adjustment of the position of the ceramic base plate 120 after the ceramic base plate 120 is decoupled from the heating plate 110, thereby preventing the leakage of process gas in the reaction chamber.

[0066] like Figure 2 As shown, in some optional embodiments, the ceramic base plate support rod 121 located below the ceramic base plate 120 can preferably be a structure combining a metal base plate 250 with a metal sleeve 251, which has excellent thermal conductivity. Due to the characteristics of ceramic materials, the ceramic base plate 120 is not suitable for processing into a complex shape that extends its lower surface axially. This not only results in high processing costs, but also makes the complex-shaped ceramic structure prone to cracking at high temperatures. Therefore, in this embodiment, the ceramic base plate 120, made of ceramic, can be placed on top of the metal base plate 250 and in close contact with it to improve the heat transfer performance from the metal base plate 250 to the ceramic base plate 120. The metal sleeve 251 can be sleeved on the outside of the heating plate support rod 111 to jointly support the ceramic base plate 120 on top of the metal base plate 250. The ceramic base plate 120 can move synchronously with the metal base plate 250 and the metal sleeve 251 to adjust its position and orientation.

[0067] In this embodiment, the three parts, ceramic base plate 120, metal base plate 250 and metal sleeve 251, can be rigidly connected by fasteners to improve overall rigidity and stability and prevent relative displacement of the parts.

[0068] This concludes the basic introduction of the base plate leveling mechanism 200 provided in the first aspect of this utility model. Next, please return to the embodiment of the heating plate assembly adjustment mechanism 100. This can be combined with... Figure 3 Common understanding Figure 3 A cross-sectional view of an adjustment mechanism for a heating plate assembly according to some embodiments of the present invention is shown.

[0069] like Figure 1 and Figure 3 As shown, in some embodiments of this utility model, the sliding table leveling mechanism 300 in the adjusting mechanism 100 can be located outside the cavity bottom 230 of the reaction chamber, so that technicians can perform leveling operations on the heating plate 110 from outside the cavity without opening the cavity, thus improving the convenience of leveling the heating plate 110.

[0070] Specifically, in some optional embodiments, the at least three adjusting screws in the slide leveling mechanism 300 may include at least two leveling screws 310 and one ball joint screw 320. The outer side of the leveling screw 310 may have a threaded structure, thereby converting the rotational motion of the leveling screw 310 into a vertical translational motion when rotated. The heating plate assembly can be adjusted vertically via the leveling screw 310. The ball joint screw 320 may include a ball head and a ball socket; the cooperation between the ball head and the ball socket restricts all translational motion but not all rotational motion, achieving multi-directional rotational freedom. The heating plate assembly can be rotated in all directions via the ball joint screw to level the heating plate.

[0071] In this embodiment, by utilizing the principle of three non-collinear points defining a single plane, at least two leveling screws 310 can be used as two adjustable points for vertical movement, while one ball joint screw 320 can be used as a rotation point for rotation only, without translation. This allows the slide leveling mechanism 300 to be adjustable on any plane. Therefore, in some optional embodiments, only at least two leveling screws 310 in the slide leveling mechanism 300 need to be adjusted, without actively adjusting the ball joint screw 320, to achieve synchronous adjustment of the heating plate assembly including the heating plate 110 and the ceramic base plate 120, thereby reducing the complexity of system adjustment.

[0072] Optionally, at least two leveling screws 310 can be installed on the front of the machine tool, and the ball joint screw 320 can be installed on the back of the machine tool. Here, the front of the machine tool is the side facing the maintenance personnel, while the back is the side not facing the maintenance personnel. In principle, the positions of the leveling screws 310 and the ball joint screw 320 can be changed, but in this embodiment, installing the leveling screws 310 on the front of the machine tool can help facilitate the maintenance of the machine tool.

[0073] Furthermore, such as Figure 2 As shown, in some embodiments, the adjustment mechanism 100 may also include a water-cooled base 260. The water-cooled base 260 may be located below the heating plate support rod 111 to support the heating plate 110. In addition, the water-cooled base 260 may also have a lateral extension plate 261 to support the ceramic base plate support rod 121, thereby supporting the ceramic base plate 120.

[0074] Combination Figure 3 It is understood that the adjustment mechanism 100 may also include a lifting component 330. The lifting component 330 may be located below the water-cooled base 510. With the double support of the water-cooled base 510, the lifting component 330 may simultaneously adjust the height of the heating plate 110 and the ceramic base plate 120 to achieve initial adjustment of the height of the heating plate component.

[0075] Specifically, such as Figure 3 As shown, in some optional embodiments, the lifting assembly 330 may include a linear guide rail 331 and a lead screw nut 332. The lead screw nut 332 converts rotational motion into linear motion to drive the heating plate assembly, which includes at least the heating plate 110 and the ceramic base plate 120, to rise and fall. When the motor (not shown) drives the lead screw to rotate, the nut can move linearly along the lead screw axis. The linear guide rail 331 guides and supports the load connected to the nut, i.e., the heating plate assembly, limiting its rotation around the lead screw and offset in other directions, ultimately achieving stable linear lifting and lowering motion of the heating plate assembly.

[0076] Those skilled in the art will understand that the above-described lifting assembly 330 of the linear guide rail 331 and lead screw nut 332 is merely a non-limiting embodiment provided by this utility model, intended to clearly demonstrate the main concept of this utility model and provide a specific solution that is easy for the public to implement, rather than to limit the scope of protection of this utility model. Optionally, in other embodiments, those skilled in the art may also adopt lifting assemblies 330 with other structures based on the concept of this utility model to achieve the same technical effect.

[0077] Furthermore, the sliding table leveling mechanism 300 can be connected to the lifting assembly 330 via the leveling connector 340, and is used to further precisely adjust the posture of the heating plate 110 so that it is in a horizontal state after the initial adjustment of the height position of the heating plate assembly including the heating plate 110 and the ceramic base plate 120 via the lifting assembly 330.

[0078] Continue back Figure 2 As shown, in some embodiments, when one end of the ceramic base plate support rod 121 extends to the outside of the cavity bottom 230 of the reaction chamber, the ceramic base plate support rod 121 and the cavity bottom 230...

[0079] A second bellows 242 can also be provided between them to dynamically seal the reaction chamber when the height position of the heating plate assembly is initially adjusted by the lifting component 330, so as to prevent the leakage of process gas in the chamber.

[0080] In the above embodiments provided by this utility model, the sliding table leveling mechanism 300 first synchronously levels the heating plate 110 and the ceramic base plate 120, along with their related components. The leveling reference is based on the horizontality of the heating plate 110, meaning the heating plate 110 is prioritized to be level. At this time, the ceramic base plate 120 may be tilted, meaning the distance between the ceramic base plate 120 and the heating plate 110 is uneven. Based on this, the base plate leveling mechanism 200 decouples the ceramic base plate 120 from the heating plate 110, allowing for individual adjustment of the position and orientation of the ceramic base plate 120. This enables continuous adjustment of the distance and relative parallelism between the ceramic base plate 120 and the heating plate 110, ensuring that the distance and parallelism at all points between them remain consistent.

[0081] In summary, this utility model provides a base plate leveling mechanism and a heating plate assembly adjustment mechanism, which can improve the uniformity of the spacing between the heating plate and the ceramic base plate, improve the relative parallelism between the two, thereby improving the uniformity of the surface temperature distribution of the heating plate and helping to improve the process performance.

[0082] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A base plate leveling mechanism, characterized in that, The base plate leveling mechanism, located between the heating plate and the ceramic base plate below it, includes: Several locking screws are inserted into the heating plate support rod and the ceramic base plate support rod, and tightened to couple and fix the heating plate and the ceramic base plate; and An elastic component, located between the heating plate support rod and the ceramic base plate support rod, is used to support the ceramic base plate, which is decoupled from the heating plate, when the locking screw is loosened, so as to adjust the position of the ceramic base plate and keep it parallel to the heating plate.

2. The base plate leveling mechanism as described in claim 1, characterized in that, The plurality of locking screws includes a plurality of evenly distributed locking screws. At least one of the plurality of locking screws is in a loosened state, which partially decouples the heating plate and the ceramic base plate to locally adjust the position of the ceramic base plate.

3. The base plate leveling mechanism as described in claim 1, characterized in that, The elastic component includes a helical spring, which is sleeved on the outside of the locking screw. The elastic potential energy released by the spring provides support for the locking screw in the loosened state and laterally limits the locking screw in the loosened state.

4. The base plate leveling mechanism as described in claim 1, characterized in that, One end of the heating plate support rod and the ceramic base plate support rod extends to the outside of the cavity bottom of the reaction chamber, so as to tighten or loosen the heating plate and the ceramic base plate on the outside of the cavity bottom via the locking screw.

5. The base plate leveling mechanism as described in claim 4, characterized in that, A first corrugated pipe is also provided between the heating plate support rod and the ceramic base plate support rod, which is used to dynamically seal the reaction chamber when adjusting the position of the ceramic base plate.

6. The base plate leveling mechanism as described in claim 1, characterized in that, The ceramic base plate support rod has a structure of a metal base plate combined with a metal sleeve. The ceramic base plate is placed on the metal base plate, and the metal sleeve is sleeved on the outside of the heating plate support rod.

7. An adjustment structure for a heating plate assembly, characterized in that, The heating plate assembly includes a heating plate and a ceramic base plate located below it, and the adjustment structure includes: A sliding table leveling mechanism, located below the heating plate assembly, includes at least three non-collinear adjusting screws for adjusting the position of the heating plate to ensure it is horizontal; and The base plate leveling mechanism as described in any one of claims 1 to 6 is used to decouple the heating plate and the ceramic base plate after the heating plate is leveled, so as to adjust the position and orientation of the ceramic base plate to maintain the same parallelism with the heating plate.

8. The adjustment structure as described in claim 7, characterized in that, The at least three adjusting screws include at least two leveling screws and one ball joint screw, wherein the heating plate assembly is adjusted vertically by translation via the leveling screws and rotated in all directions via the ball joint screws to level the heating plate.

9. The adjustment structure as described in claim 8, characterized in that, It includes a lifting component connected to the slide leveling mechanism, used for initial adjustment of the height position of the heating plate component.

10. The adjustment structure as described in claim 9, characterized in that, One end of the ceramic base plate support rod extends to the outside of the cavity bottom of the reaction chamber. A second corrugated pipe is also provided between the ceramic base plate support rod and the cavity bottom to dynamically seal the reaction chamber when the height position of the heating plate assembly is initially adjusted.

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