A circuit board and electronic device

Abstract

This disclosure relates to a circuit board and an electronic device. The circuit board includes: a circuit board body; and a first conductive adhesive layer covering the side surface of the circuit board body for shielding electromagnetic signals. The circuit board proposed in this disclosure has a first conductive adhesive layer covering the side surface, which can not only improve the circuit board's anti-electromagnetic interference performance, but also mitigate the adverse effects caused by edge plating.

Description

Technical Field

[0001] This disclosure relates to the field of circuit board manufacturing and application, and more particularly to a circuit board and electronic device. Background Technology

[0002] With the rapid development of microelectronics technology and the information industry, mobile phones, tablets and other electronic devices have gradually become the mainstream devices used in daily life. These electronic devices usually have various circuit boards, and the printed circuits formed by the components and traces on the circuit boards meet the various electrical functional requirements of the electronic devices.

[0003] However, printed circuits on circuit boards can generate electromagnetic interference, and some radio frequency (RF) circuit boards can generate RF interference, which can affect the performance of electronic devices and cause equipment malfunctions. Therefore, related technologies typically employ edge plating on circuit boards to prevent electromagnetic and RF interference. However, edge plating can lead to the formation of copper nodules on the board edges, and the plating layer has low adhesion to the side surface of the circuit board, exhibiting delamination. These problems can negatively impact the production and use of circuit boards. Utility Model Content

[0004] To overcome the problems existing in related technologies, this disclosure provides a circuit board and an electronic device. The circuit board proposed in the embodiments of this disclosure has a first conductive adhesive layer covering the side surface, which can not only improve the circuit board's electromagnetic interference resistance, but also mitigate the adverse effects caused by the electroplating on the board edge.

[0005] According to a first aspect of the present disclosure, a circuit board is provided, the circuit board comprising:

[0006] Circuit board body;

[0007] The first conductive adhesive layer covers the side surface of the circuit board body and is used to shield electromagnetic signals.

[0008] In some embodiments, the mounting surface of the circuit board body has an edge region connected to the side surface, wherein the mounting surface of the circuit board body includes a front surface and / or a back surface, and the edge region is provided with a grounding portion;

[0009] The circuit board also includes a second conductive adhesive layer;

[0010] The second conductive adhesive layer covers the edge area and the grounding portion, and is connected to the first conductive adhesive layer.

[0011] In some embodiments, the mounting surface includes a plurality of edge regions that are interconnected and form a side surround around the mounting surface;

[0012] The second conductive adhesive layer is aligned with and covers the side surround ring.

[0013] In some embodiments, the circuit board includes a metal conductive layer and a protective layer;

[0014] The conductive metal layer is disposed on the mounting surface;

[0015] The protective layer covers the metal conductive layer located in the edge region and together with the metal conductive layer located in the edge region, forms the grounding portion;

[0016] The second conductive adhesive layer covers the protective layer.

[0017] In some embodiments, the circuit board further includes an ink layer;

[0018] The ink layer and the metal conductive layer are respectively disposed at different positions on the mounting surface;

[0019] or,

[0020] The conductive metal layer includes a first portion located within the edge region and a second portion located outside the edge region, and the ink layer covers the second portion.

[0021] In some embodiments, when the ink layer is disposed on the mounting surface, there is a gap between the ink layer and the metal conductive layer located in the edge region;

[0022] At least a portion of the second conductive adhesive layer is located within the interval.

[0023] In some embodiments, the width of the second conductive adhesive layer in a preset direction is within a first preset width range;

[0024] The preset direction is the direction in which the side surface faces the central axis of the circuit board.

[0025] In some embodiments, the width of the first conductive adhesive layer in the preset direction is within a second preset width range;

[0026] Wherein, the width value within the second preset width range is smaller than the width value within the first preset width range.

[0027] In some embodiments, the first conductive adhesive layer and / or the second conductive adhesive layer include: dispensing adhesive or spraying adhesive.

[0028] In some embodiments, the side surface of the circuit board includes a plurality of side surfaces, which are interconnected to form a side surface surrounding ring of the circuit board.

[0029] The first conductive adhesive layer surrounds and covers the side surface.

[0030] In some embodiments, the circuit board further includes at least one micro-connection portion;

[0031] At least one of the micro-connectors is disposed on the side surface of the circuit board body for forming a connection position between circuit boards;

[0032] The first conductive adhesive layer has a notch, and the micro-connector is disposed at the notch.

[0033] According to a second aspect of the present disclosure, an electronic device is provided, the electronic device comprising:

[0034] The circuit board proposed in the embodiment of the first aspect above;

[0035] A functional module, electrically connected to the circuit board, is used to implement a preset function through the electrical connection with the circuit board.

[0036] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0037] This disclosure discloses a circuit board with a first conductive adhesive layer disposed on its side surface. This first conductive adhesive layer is used to shield electromagnetic signals. Thus, by providing the first conductive adhesive layer, the electromagnetic compatibility of the circuit board can be improved, reducing the electromagnetic and radio frequency (RF) impacts of the circuit board on external devices, and protecting the circuit board from external electromagnetic and RF interference to a certain extent. Furthermore, compared to providing an electroplated layer on the side surface of the circuit board for electromagnetic shielding, this method offers several advantages: firstly, the chemical reaction between the first conductive adhesive layer and the side surface enhances the adhesion of the first conductive adhesive layer to the side surface, improving connection stability; secondly, it can mitigate the problem of copper nodules in electroplating, improving the yield and safety of the circuit board; and thirdly, it can alleviate the high cost of electroless gold plating in the edge plating process, reducing the manufacturing cost of the circuit board.

[0038] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0039] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0040] Figure 1a This is a schematic diagram of a plate edge electroplating structure proposed by related technologies;

[0041] Figure 1b This is a schematic diagram of a plate edge electroplating structure proposed by related technologies (Figure 2).

[0042] Figure 1c This is a schematic diagram of a half-hole electroplating structure proposed by related technologies;

[0043] Figure 2a This is a schematic diagram of a cross-section of a plate edge electroplating method proposed in related technologies;

[0044] Figure 2b This is a schematic diagram of a cross-section of a plate edge electroplating method proposed in related technologies;

[0045] Figure 2c This is a schematic diagram of a cross-section of an edge electroplating process proposed in related technologies. Figure 3 ;

[0046] Figure 3 This is a schematic cross-sectional view of a circuit board according to an exemplary embodiment;

[0047] Figure 4 This is a top view schematic diagram of a circuit board structure according to an exemplary embodiment;

[0048] Figure 5 This is a schematic diagram illustrating a process flow for manufacturing a circuit board according to an exemplary embodiment;

[0049] Figure 6 This is a structural block diagram of an electronic device according to an exemplary embodiment. Detailed Implementation

[0050] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0051] See Figure 1a and Figure 1c , Figure 1a This is a schematic diagram of a plate edge electroplating structure proposed by related technologies; Figure 1b This is a schematic diagram of a plate edge electroplating structure proposed by related technologies (Figure 2). Figure 1c This is a schematic diagram of a half-hole electroplating structure proposed in related technologies; it addresses the problem of electromagnetic signal interference generated by circuit boards, especially radio frequency signal interference, such as... Figure 1a and Figure 1b As shown, in related technologies, an electroplating layer S is set on the circuit board, and the electroplating layer S is used to wrap the side area of ​​the circuit board; while current edge electroplating solutions usually involve drilling out a hole on the side of the circuit board, such as... Figure 1cThe semi-hole area O shown is then electroplated to form an electroplated layer. The materials used in this electroplated layer are typically copper and gold, achieving electromagnetic / radio frequency interference immunity of the circuit board through metal shielding principles.

[0052] See Figures 2a to 2c , Figure 2a This is a schematic diagram of a cross-section of a plate edge electroplating method proposed in related technologies; Figure 2b This is a schematic diagram of a cross-section of a plate edge electroplating method proposed in related technologies; Figure 2c This is a schematic diagram of a cross-section of an edge electroplating process proposed in related technologies. Figure 3 Here, the electroplated layer S includes a copper layer S1 and a plating layer S2. Since the circuit board body (substrate) is formed from a non-conductive material such as epoxy resin, the side surface of the circuit board body is in physical contact with the copper layer S1. Therefore, the adhesion of the copper layer S1 to the side surface is poor, and adhesion issues such as… Figure 2b The delamination phenomenon shown indicates that the electroplated layer S is prone to peeling off during long-term use of the circuit board, posing a safety hazard; furthermore, the electroplating process itself can produce issues such as… Figure 2c The copper plating nodule S3 shown can affect the circuit board's forming size and reduce its production yield. It is also prone to falling off during long-term use, posing a safety hazard. In addition, the side surface electroplating design increases the area for gold plating, resulting in higher circuit board manufacturing costs.

[0053] In view of this, the present disclosure provides a circuit board. The circuit board includes:

[0054] Circuit board body;

[0055] The first conductive adhesive layer covers the side surface of the circuit board body and is used to shield electromagnetic signals.

[0056] See Figure 3 , Figure 3 This is a cross-sectional schematic diagram of a circuit board according to an exemplary embodiment; wherein, the circuit board 1 of this disclosure includes: a mounting surface 111 and a side surface 112 of the circuit board body 11, the area of ​​the mounting surface 111 is larger than the area of ​​the side surface 112, and different components and signal traces are arranged on the mounting surface 111 to form a functional circuit.

[0057] Thus, the circuit board described in this embodiment can be used as a standalone product or applied to electronic devices to realize various preset functions of the electronic devices through the functional circuits printed on the circuit board.

[0058] In practical applications of electronic devices, the aforementioned circuit board can serve as the motherboard of an electronic device, used to house a central processing unit; the aforementioned circuit board can also serve as a radio frequency board, used to generate and transmit radio frequency signals to meet the communication needs of electronic devices; the aforementioned circuit board can also be applied to various scenarios to assist electronic devices in realizing multiple preset functions such as image acquisition and audio transmission, which will not be further elaborated in the embodiments disclosed herein.

[0059] It should be noted that the circuit board proposed in this disclosure embodiment can be a printed circuit board (PCB), a flexible printed circuit board (FPC), or a rigid-flex PCB, etc. This disclosure embodiment does not limit it.

[0060] In this embodiment of the disclosure, the circuit board body serves as the circuit board substrate and is formed of a non-conductive material such as epoxy resin. A metal conductive layer is provided on the mounting surface of the circuit board body, and various different types of components are connected and signal traces are formed using the metal conductive layer, thereby obtaining the aforementioned functional circuit printed on the circuit board.

[0061] Here, in this embodiment of the disclosure, a first conductive adhesive layer for shielding electromagnetic signals is provided on the circuit board. The first conductive adhesive layer covers the side surface of the circuit board body and is tightly adhered to the side surface.

[0062] The first conductive adhesive layer contains conductive components that form a conductive network, thereby shielding electromagnetic waves. When the circuit board is a motherboard, this reduces electromagnetic interference from electromagnetic signals on the board to other functional components within the electronic device, improving the board's electromagnetic compatibility (EMC). When the circuit board is a radio frequency (RF) board, it reduces radio frequency (RF) interference from RF signals on the board to other functional components within the electronic device. Furthermore, due to the shielding effect of the first conductive adhesive layer on both electromagnetic and RF signals, it also protects internal components from interference by external electromagnetic signals, ensuring the normal operation of the circuit board.

[0063] In this embodiment of the disclosure, the first conductive adhesive layer can be any of the following forms: conductive epoxy resin, conductive tape, conductive coating, conductive adhesive formed from resin-based materials containing metal particles (such as silver, nickel, copper, etc.), silicone rubber containing conductive particles, etc.

[0064] It should be noted that the first conductive adhesive layer should completely cover the side surface of the circuit board to improve the shielding effect of the circuit board; if specific components need to be soldered on the side surface, or specific pins or connection positions need to be set, the first conductive adhesive layer can avoid the aforementioned components / pins / connection positions.

[0065] It should also be noted that, since the circuit board body is made of materials such as epoxy resin, the physical connection generated by the electroplated shielding layer on the side surface of the circuit board body is unstable, which can easily lead to the problem of the electroplated layer peeling off. However, the first conductive adhesive layer provided in this disclosure contains conductive fillers (such as metal particles) or resin matrix (which may be epoxy resin or other resins), so the first conductive adhesive layer can produce a certain chemical reaction with the side surface, such as a cross-linking reaction. Through the above chemical reaction, the adhesion of the first conductive adhesive layer on the side surface can be higher than that of the electroplated layer. This ensures the connection stability between the first conductive adhesive layer and the side surface of the circuit board, further improving the effectiveness of the first conductive adhesive layer in electromagnetic and radio frequency shielding of the circuit board, as well as the safety of the circuit board in use.

[0066] This disclosure discloses a circuit board with a first conductive adhesive layer disposed on its side surface. This first conductive adhesive layer is used to shield electromagnetic signals. Thus, by providing the first conductive adhesive layer, the electromagnetic compatibility of the circuit board can be improved, reducing the electromagnetic and radio frequency (RF) impacts of the circuit board on external devices, and protecting the circuit board from external electromagnetic and RF interference to a certain extent. Furthermore, compared to providing an electroplated layer on the side surface of the circuit board for electromagnetic shielding, this method offers several advantages: firstly, the chemical reaction between the first conductive adhesive layer and the side surface enhances the adhesion of the first conductive adhesive layer to the side surface, improving connection stability; secondly, it can mitigate the problem of copper nodules in electroplating, improving the yield and safety of the circuit board; and thirdly, it can alleviate the high cost of electroless gold plating in the edge plating process, reducing the manufacturing cost of the circuit board.

[0067] In some embodiments, combined with Figure 3 The mounting surface 111 of the circuit board body 11 has an edge region 113 connected to the side surface 112, wherein the mounting surface 111 of the circuit board body 11 includes a front surface and / or a back surface, and the edge region 113 is provided with a grounding portion.

[0068] Circuit board 1 also includes a second conductive adhesive layer 14;

[0069] The second conductive adhesive layer 14 covers the edge area 113 and the grounding portion, and is connected to the first conductive adhesive layer 12.

[0070] Here, the mounting surface has a side edge that is connected to the side surface. Thus, in this embodiment of the present disclosure, a portion of the side edge extending toward the center of the mounting surface is defined as an edge region. In this way, the edge region is also connected to the side surface and has an angle with the side surface.

[0071] The circuit board has at least three surfaces, including a front surface, a back surface, and at least one side surface; at least one of the front and back surfaces can serve as the mounting surface; typically, the area of ​​the side surface is smaller than the area of ​​the mounting surface. It should be noted that in actual production circuit boards, the front surface is usually chosen to house more components and / or form more complex wiring diagrams.

[0072] The embodiments disclosed herein do not limit the shape of the circuit board; in some examples, the circuit board is a rectangular circuit board, in which case the mounting surface is rectangular and there may be four side surfaces, all of which are rectangular; in other examples, the circuit board is a circular circuit board, in which case the mounting surface is circular (or elliptical), and there is one side surface, which is annular.

[0073] It should be noted that, in order to ensure the effectiveness of the printed functional circuits on the circuit board, the embodiments of this disclosure also provide a grounding part in the edge area of ​​the circuit board; by providing a grounding part, the current in the circuit can be guided to the ground to protect the circuit board from damage; in addition, providing a circuit board can also reduce the accumulation of static electricity on the surface of the circuit board and protect the components mounted on the mounting surface.

[0074] Based on this, the present invention further provides a second conductive adhesive layer, which covers the edge area and the grounding portion located within the edge area. Since the second conductive adhesive layer contains conductive components that can guide current, the second conductive adhesive layer can serve as a shielding layer, connecting with the first conductive adhesive layer and shielding electromagnetic and radio frequency signals together. On the other hand, it can form a certain grounding impedance, working together with the aforementioned grounding portion for the grounding of the circuit board, thereby enhancing the grounding effect of the circuit board.

[0075] In the embodiments of this disclosure, the first conductive adhesive layer and the second conductive adhesive layer can be the same material or different materials. Covering the side surface with the first conductive adhesive layer and the edge area with the second conductive adhesive layer can be formed in one step using the same process or formed separately using different processes. The embodiments of this disclosure do not limit this.

[0076] It should be noted that, in this embodiment, a second conductive adhesive layer is also provided on the edge areas of both mounting surfaces (front surface and back surface), thereby forming electromagnetic shielding on the edge areas of both mounting surfaces and grounding together with the grounding portions on both mounting surfaces. The aforementioned side surface is located between the front surface and the back surface and is connected to both surfaces respectively. Therefore, both second conductive adhesive layers are connected to the first conductive adhesive layer covering the side surface, forming a continuous U-shaped shielding area. This U-shaped shielding area surrounds the entire side of the circuit board, thereby enhancing the shielding effect against electromagnetic and radio frequency signals.

[0077] This embodiment of the invention provides a second conductive adhesive layer that covers the edge area of ​​the mounting surface and the grounding portion, thereby ensuring the grounding effect of the circuit board and improving its electromagnetic and radio frequency shielding.

[0078] In some embodiments, see Figure 4 , Figure 4 This is a top view schematic diagram of a circuit board structure according to an exemplary embodiment; combined with Figure 3 and Figure 4 The mounting surface 111 includes multiple edge regions 113, which are interconnected to form a side enclosure 113a for the mounting surface 111;

[0079] The second conductive adhesive layer 14 is aligned with and covers the side surround ring 113a.

[0080] Here, because multiple edge areas of the mounting surface surround to form a closed side enclosure, the embodiments of this disclosure provide a circumferentially closed second conductive adhesive layer; and the second conductive adhesive layer is aligned to cover the side enclosure; for example, if the side enclosure is annular, the second conductive adhesive layer is also annular; if the side enclosure is a hollow rectangle, the second conductive adhesive layer is also a hollow rectangle.

[0081] Thus, the embodiments of this disclosure can utilize a continuous and closed second conductive adhesive layer to form a more stable shielding space on the mounting surface, thereby effectively protecting the functional circuits printed on the mounting surface and improving the electromagnetic compatibility and anti-electromagnetic and radio frequency interference of the circuit board.

[0082] In addition, in the embodiments of this disclosure, the grounding part may include multiple grounding parts, which are respectively disposed in each edge area forming the side enclosure. The contact area between each grounding part and the mounting surface may be the same as or smaller than the area of ​​the edge area where the grounding part is located. An edge area may be provided with only one grounding part or multiple grounding parts. The embodiments of this disclosure do not limit this.

[0083] In some embodiments, the circuit board includes a metal conductive layer and a protective layer;

[0084] A conductive metal layer is disposed on the mounting surface;

[0085] A protective layer covers the metal conductive layer located in the edge area and together with the metal conductive layer located in the edge area, forms a grounding part;

[0086] The second conductive adhesive layer covers the protective layer.

[0087] Here, the aforementioned conductive metal layer includes a copper layer. During the circuit board manufacturing process, a copper layer can be laid on the mounting surface, and the conductive metal layer can be processed using etching and other processes according to the needs of circuit board manufacturing. In subsequent processes, the conductive metal layer can be used to solder components and form signal traces.

[0088] It should be noted that in actual processes, the aforementioned conductive metal layer can also be made using other conductive metal materials, such as aluminum, copper alloy, or nickel.

[0089] See Figure 5 , Figure 5 This is a schematic diagram illustrating a process flow for manufacturing a circuit board according to an exemplary embodiment; wherein, Figure 5 (a) to (c) illustrate the process flow for fabricating a metal conductive layer 15, a protective layer 16, and an ink coating layer 17 on the circuit board body; wherein, Figure 5 (a) illustrates the distribution of each of the metal conductive layers 15 after being laid and etched on the two mounting surfaces 111. Here, of the two mounting surfaces 111, the upper mounting surface 111 in the figure is the front surface, and the lower mounting surface 111 in the figure is the back surface.

[0090] In this embodiment of the disclosure, for the metal conductive layer disposed in the edge region, a protective layer is also disposed on the metal conductive layer (such as a copper layer). Here, the protective layer is conductive and chemically inert, so that the protective layer can protect the metal conductive layer from wear and oxidation, and can also guide current, forming a grounding part together with the metal conductive layer located in the edge region. The protective layer may include a gold layer, a platinum layer, etc.

[0091] here, Figure 5 (c) An example is a protective layer 16 formed by electroplating on a conductive metal layer 15 (such as a copper layer) located in the edge region; exemplaryly, the protective layer 16 may be a gold layer obtained by further gold plating treatment of the copper layer surface. After the gold plating treatment, the circuit board may also undergo subsequent shaping treatment; wherein, the shaping treatment includes mechanical processing such as cutting and edge grinding to remove excess material and form the final shape of the circuit board.

[0092] In this embodiment of the disclosure, combined with Figure 3 and Figure 5 As shown, in this embodiment of the present disclosure, a second conductive adhesive layer 14 is provided, and the second conductive adhesive layer 14 is used to wrap and cover the protective layer 16, so that together with the metal conductive layer 15 and the protective layer 16 located in the edge area, it is used as the grounding treatment of the circuit board.

[0093] In some embodiments, combined with Figure 3 and Figure 5 As shown, circuit board 1 also includes an ink layer 17;

[0094] The ink layer 17 and the metal conductive layer 15 are respectively disposed at different positions on the mounting surface 111;

[0095] or,

[0096] The conductive metal layer 15 includes a first portion located in the edge region 113 and a second portion located outside the edge region 113, and the ink layer 17 covers the second portion.

[0097] Here, there are two masks installed, such as Figure 3 As shown, on the upper mounting surface 111 (front surface), the ink layer 17 and the metal conductive layer 15 cover different areas of the mounting surface 111. Combined Figure 5 (a) and (b) can be understood to mean that after etching the metal conductive layer 15 laid on the upper mounting surface 111, a void area is formed. In the actual production process, ink is applied to the void area to protect the mounting surface 111, thereby forming... Figure 5 (b) shows the upper ink layer 17. During this process, the ink is not applied to the metal conductive layer at the edge, i.e., the reserved board edge grounding area, to facilitate subsequent formation. Figure 5 (c) shows the protective layer 16 and Figure 3 The upper second conductive adhesive layer 14 is shown; and the metal conductive layer 15, which is not located in the edge area, is used for subsequent soldering of components and formation of signal traces.

[0098] in addition, Figure 3 On the mounting surface 111 (reverse surface) shown below, there is a continuous and unetched metal conductive layer 15, which covers the edge region 113 and the area connected to the edge region 113. Therefore, the metal conductive layer 15 includes a first portion located in the edge region 113 and a second portion located outside the edge region 113, thus combining... Figure 5 As can be understood from (a) to (c), embodiments of this disclosure may involve coating the second portion with ink to protect the second portion and form Figure 5 (b) and (c), and Figure 3 The ink layer 17 shown below. Here, Figure 5 (b) shows that when the ink layer 17 is formed on the mounting surface 111 below, a grounding area is also reserved at the board edge to facilitate subsequent formation on the first portion of the metal conductive layer 15. Figure 5 (c) shows the protective layer 16, and Figure 3 The second conductive adhesive layer 14 shown below.

[0099] It should be noted that in this embodiment, the ink layer and the second conductive adhesive layer on the mounting surface are at the same height, thereby ensuring the appearance consistency of the circuit board.

[0100] It is understood that the embodiments of this disclosure will set different distributions of metal conductive layers according to the circuit design requirements of different mounting surfaces. Based on the distribution of different metal conductive layers and the circuit design requirements, ink layers are coated at different positions to protect the conductive structure inside the circuit board.

[0101] In some embodiments, when the ink layer is disposed on the mounting surface, there is a gap between the ink layer and the metal conductive layer located in the edge region;

[0102] At least a portion of the second conductive adhesive layer is located within the gap.

[0103] Here, combined Figure 3 and Figure 5 (c) shows the upper mounting surface 111, where the ink layer 17 covers the vacant areas of each metal conductive layer 15 after etching. In this example, the ink layer 17 applied to the upper surface is spaced apart from the metal conductive layer 15 located in the edge region 113.

[0104] In this way, the protective layer 16 can wrap around the metal conductive layer 15 located in the edge region 113 from three sides, that is, the protective layer 16 is partially located within the gap; at the same time, the second conductive adhesive layer 14 also wraps around the protective layer 16 from three sides, that is, the second conductive adhesive layer 14 is partially located within the gap.

[0105] By setting at least a portion of the second conductive adhesive layer within the gap between the ink layer and the conductive layer, the tightness of the circuit board setup, as well as the grounding and shielding effects, can be fully guaranteed.

[0106] In other embodiments, where the ink layer covers a second portion of the metal conductive layer, the ink layer is in close contact with the protective layer and the second conductive adhesive layer, and the ink layer and the second conductive adhesive layer are located at the same height on the mounting surface.

[0107] In some embodiments, the width of the second conductive adhesive layer in a preset direction is within the range of the first preset width;

[0108] The preset direction is the direction in which the side surface faces the central axis of the circuit board.

[0109] Here, taking the direction of the side surface toward the central axis of the circuit board as the X direction as an example, the extension direction of the first conductive adhesive is the Y direction, and the height direction of the circuit board is the Z direction. At this time, the width of the second conductive adhesive layer in the X direction is within the first preset width range; wherein, the width of the part of the extension area of ​​the side of the mounting surface toward the center of the mounting surface is the same as the width of the second conductive adhesive layer in the preset direction, and is also within the first preset range.

[0110] Here, the first preset width range of this embodiment can be from 0.15 mm to 0.3 mm.

[0111] In this embodiment of the disclosure, the width of the second conductive adhesive layer is set within the first preset width range, for example, within 0.15mm to 0.3mm, so that the grounding impedance of the second conductive adhesive layer can meet the grounding requirements of the circuit board, and thus together with the grounding part of the edge area, realize the grounding performance of the functional circuit in the circuit board.

[0112] In some embodiments, the width of the first conductive adhesive layer in a preset direction is within a second preset width range;

[0113] The width value within the second preset width range is smaller than the width value within the first preset width range.

[0114] Following the example above, the width of the first conductive adhesive layer in the X direction is within a second preset range; wherein, the second preset width range can be from 20 micrometers (μm) to 50 μm.

[0115] Here, in this embodiment of the present disclosure, the width value within the second preset width range is smaller than the width value within the first preset width range, which can effectively reduce the size of the entire circuit board in the X direction, thereby reducing the overall structural size of the circuit board; in addition, setting the width of the first conductive adhesive layer to be within the second preset width range, for example, within 20μm to 50μm, has achieved effective anti-electromagnetic and radio frequency interference in actual product testing and application, and improved the electromagnetic compatibility of the circuit board.

[0116] In some embodiments, the first conductive adhesive layer and / or the second conductive adhesive layer comprises: dispensing or spraying adhesive. In some examples, both the first and second conductive adhesive layers can be dispensing adhesives formed by coating a fluid or semi-fluid adhesive onto a side surface. The dispensing adhesive formed by coating can be a conductive adhesive formed from a resin-based material containing metal particles (such as silver, nickel, copper, etc.), conductive silicone rubber, or conductive epoxy resin, etc.

[0117] In other examples, both the first conductive adhesive layer and the second conductive layer can be inkjet adhesive formed by uniformly spraying adhesive onto the side surface using a printing machine. The inkjet adhesive can be conductive acrylic, conductive coating, or conductive polyurethane, etc.

[0118] In this embodiment of the disclosure, because the dispensing process can precisely control the position of the adhesive layer and the inkjet printing process can quickly and over a large area, the two methods of setting the first conductive adhesive layer and the second conductive adhesive layer proposed in this embodiment of the disclosure can effectively improve the flexibility of setting the conductive adhesive layer in this disclosure.

[0119] In some embodiments, the side surfaces of the circuit board include a plurality of side surfaces, which are interconnected to form a side surface enclosure of the circuit board.

[0120] The first conductive adhesive layer surrounds and covers the side surface.

[0121] Here, when the circuit board has multiple side surfaces, the multiple side surfaces surround to form a closed side surface enclosure. Therefore, in this embodiment of the present disclosure, a continuous and circumferentially closed first conductive adhesive layer is provided, and the first conductive adhesive layer is aligned to cover the side surface enclosure.

[0122] Specifically, if the aforementioned side enclosure is annular, then the second conductive adhesive layer is also annular; if the side enclosure is a hollow rectangle, then the second conductive adhesive layer is also a hollow rectangle.

[0123] Thus, the embodiments of this disclosure utilize an axially closed first conductive adhesive layer to form a more stable shielding space for the circuit board, thereby improving the electromagnetic compatibility and anti-electromagnetic and radio frequency interference of the circuit board.

[0124] In some embodiments, the circuit board further includes at least one micro-connection portion;

[0125] At least one micro-connection is disposed on the side surface of the circuit board body for forming a connection position between circuit boards;

[0126] The first conductive adhesive layer has a notch, and the micro-connector is disposed at the notch.

[0127] In the actual manufacturing process of circuit boards, multiple circuit boards are usually formed by using a single substrate. Thus, micro-connection portions are provided on the side surface of the circuit boards. In the embodiments of this disclosure, when cutting the substrate to form adjacent circuit boards, the micro-connection portions are used to connect the circuit boards.

[0128] Thus, during the process of setting the first conductive adhesive layer, the micro-connector is located at a position where the first conductive adhesive layer cannot be formed, that is, at the gap position of the first conductive adhesive layer. Similarly, during the process of setting the second conductive adhesive layer, the micro-connector is also located at a position where the second conductive adhesive layer cannot be formed, that is, also at the gap position of the second conductive adhesive layer.

[0129] In this embodiment of the disclosure, Figure 4 The micro-connector 18 is shown.

[0130] In practical implementation, the aforementioned micro-connection portion can be used as a connection pin between the current circuit board and other circuit boards, and can also be used to make pins for soldering components to enrich the circuit design. Its specific design can be adjusted according to the actual manufacturing needs of the current circuit board, and the embodiments disclosed herein do not impose any limitations on this.

[0131] This disclosure also provides an electronic device; the electronic device includes:

[0132] The circuit board presented in the above embodiments of this disclosure;

[0133] Functional modules are electrically connected to the circuit board and are used to implement preset functions through the electrical connection between the module and the circuit board.

[0134] Here, electronic devices include fixed terminals, mobile terminals, or portable devices; fixed terminals include, but are not limited to, vehicle terminals, televisions, etc.; mobile terminals include, but are not limited to, mobile phones, tablets, etc.; portable devices include, but are not limited to, smartwatches, etc., and this disclosure does not impose further limitations on these.

[0135] The aforementioned functional modules can be audio modules, control modules, or image acquisition modules, etc. Thus, the electronic device realizes various preset functions through the functional circuits printed on the circuit board. These preset functions can be audio transmission functions, control and calculation functions, image acquisition functions, etc., which will not be elaborated here in the embodiments of this disclosure.

[0136] In this embodiment, the circuit board has a first conductive adhesive layer covering its side surface and a second conductive adhesive layer covering the edge area of ​​its mounting surface. The first and second conductive adhesive layers are continuously disposed, which not only enhances the electromagnetic compatibility of the circuit board in electronic devices, but also strengthens the connection between the conductive adhesive layer and the circuit board body through the chemical effect between the conductive adhesive layer and the circuit board body, reduces the shedding of the conductive adhesive layer, and improves the safety of the electronic device during use. At the same time, the conductive adhesive layer provides electromagnetic and radio frequency shielding, which reduces the area of ​​gold plating compared to electroplating, effectively reducing the manufacturing cost of the circuit board, and thus further reducing the cost of the electronic device.

[0137] Figure 6 This is a structural block diagram of an electronic device according to an exemplary embodiment. For example, the electronic device 600 may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc.

[0138] Reference Figure 6 The electronic device 600 may include one or more of the following components: processing component 602, memory 604, power supply component 606, multimedia component 608, audio component 610, input / output interface 612, sensor component 614, and communication component 616.

[0139] Processing component 602 typically controls the overall operation of electronic device 600, such as operations associated with at least one of display, telephone call, data communication, camera operation, and recording operation. Processing component 602 may include one or more processors 620 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 602 may include one or more modules to facilitate interaction between processing component 602 and other components. For example, processing component 602 may include a multimedia module to facilitate interaction between multimedia component 608 and processing component 602.

[0140] Memory 604 is configured to store various types of data to support operation on electronic device 600. Examples of such data include at least one of the following: instructions for any application or method operating on electronic device 600, contact data, phonebook data, messages, pictures, and videos. Memory 604 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as Static Random Access Memory (SRAM), Electrically Erasable Programmable Read Only Memory (EEPROM), Erasable Programmable Read-Only Memory (EPROM), Programmable Read Only Memory (PROM), Read-Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0141] Power supply component 606 provides power to various components of electronic device 600. Power supply component 606 may include at least one of the following: a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to electronic device 600.

[0142] Multimedia component 608 includes a screen that provides an output interface between electronic device 600 and user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a Touch Panel, the screen may be implemented as a touchscreen to receive input signals from the user. The Touch Panel includes one or more touch sensors to sense touches, swipes, and gestures on the Touch Panel. The touch sensors may sense not only the boundaries of touch or swipe actions but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 608 includes a front-facing camera and / or a rear-facing camera. When electronic device 600 is in an operating mode, such as a shooting mode or video mode, the front-facing camera and / or rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0143] Audio component 610 is configured to output and / or input audio signals. For example, audio component 610 includes a microphone (MIC) configured to receive external audio signals when electronic device 600 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 604 or transmitted via communication component 616. In some embodiments, audio component 610 also includes a speaker for outputting audio signals.

[0144] Input / output interface 612 provides an interface between processing component 602 and peripheral interface modules, such as keyboards, click wheels, and buttons. These buttons may include, but are not limited to, home buttons, volume buttons, start buttons, and lock buttons.

[0145] Sensor assembly 614 includes one or more sensors for providing state assessments of various aspects of electronic device 600. For example, sensor assembly 614 may detect the on / off state of electronic device 600, the relative positioning of components such as the display and keypad of electronic device 600, changes in position of electronic device 600 or one of its components, the presence or absence of user contact with electronic device 600, orientation or acceleration / deceleration of electronic device 600, and temperature changes of electronic device 600. Sensor assembly 614 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 614 may also include an optical sensor, such as a complementary metal-oxide-semiconductor (CMOS) or charge-coupled device (CCD) image sensor, for use in imaging applications. In some embodiments, sensor assembly 614 may also include, but is not limited to, at least one of the following: an accelerometer, a gyroscope, a magnetometer, a pressure sensor, and a temperature sensor.

[0146] Communication component 616 is configured to facilitate wired or wireless communication between electronic device 600 and other devices. Electronic device 600 can access wireless networks based on communication standards, such as Wi-Fi, 4G, 5G, or combinations thereof. In one exemplary embodiment, communication component 616 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 616 also includes a Near Field Communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID), Infrared Data Association (IrDA), Ultra Wide Band (UWB), Bluetooth (BT), and other technologies.

[0147] In an exemplary embodiment, the electronic device 600 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0148] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the utility models disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the claims.

[0149] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A circuit board, characterized in that, include: Circuit board body; The first conductive adhesive layer covers the side surface of the circuit board body and is used to shield electromagnetic signals. The first conductive adhesive layer is tightly bonded to the side surface and adheres to the side surface through a chemical reaction with it.

2. The circuit board according to claim 1, characterized in that, The mounting surface of the circuit board body has an edge area connected to the side surface, wherein the mounting surface of the circuit board body includes a front surface and / or a back surface, and the edge area is provided with a grounding portion; The circuit board also includes a second conductive adhesive layer; The second conductive adhesive layer covers the edge area and the grounding portion, and is connected to the first conductive adhesive layer.

3. The circuit board according to claim 2, characterized in that, The mounting surface includes multiple edge regions, which are interconnected to form a side enclosure around the mounting surface; The second conductive adhesive layer is aligned with and covers the side surround ring.

4. The circuit board according to claim 2, characterized in that, The circuit board includes a metal conductive layer and a protective layer; The conductive metal layer is disposed on the mounting surface; The protective layer covers the metal conductive layer located in the edge region and together with the metal conductive layer located in the edge region, forms the grounding portion; The second conductive adhesive layer covers the protective layer.

5. The circuit board according to claim 4, characterized in that, The circuit board also includes an ink layer; The ink layer and the metal conductive layer are respectively disposed at different positions on the mounting surface; or, The conductive metal layer includes a first portion located within the edge region and a second portion located outside the edge region, and the ink layer covers the second portion.

6. The circuit board according to claim 5, characterized in that, When the ink layer is disposed on the mounting surface, there is a gap between the ink layer and the metal conductive layer located in the edge region; At least a portion of the second conductive adhesive layer is located within the interval.

7. The circuit board according to any one of claims 2 to 6, characterized in that, The width of the second conductive adhesive layer in the preset direction is within the range of the first preset width; The preset direction is the direction in which the side surface faces the central axis of the circuit board.

8. The circuit board according to claim 7, characterized in that, The width of the first conductive adhesive layer in the preset direction is within a second preset width range; Wherein, the width value within the second preset width range is smaller than the width value within the first preset width range.

9. The circuit board according to any one of claims 2 to 6, characterized in that, The first conductive adhesive layer and / or the second conductive adhesive layer include: dispensing adhesive or spraying adhesive.

10. The circuit board according to any one of claims 1 to 6, characterized in that, The circuit board has multiple side surfaces, which are interconnected to form a side surface enclosure of the circuit board. The first conductive adhesive layer surrounds and covers the side surface.

11. The circuit board according to any one of claims 1 to 6, characterized in that, The circuit board also includes at least one micro-connection portion; At least one of the micro-connectors is disposed on the side surface of the circuit board body for forming a connection position between circuit boards; The first conductive adhesive layer has a notch, and the micro-connector is disposed at the notch.

12. An electronic device, characterized in that, include: The circuit board as described in any one of claims 1 to 11; A functional module, electrically connected to the circuit board, is used to implement a preset function through the electrical connection with the circuit board.

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