Power module

Abstract

This application discloses a power module, comprising: a first circuit board with power devices disposed on its upper surface and power supply components disposed on its lower surface; a second circuit board with logic control devices disposed on its upper surface; and a frame disposed between the first and second circuit boards, the frame having conductive structures for electrical connection between the first and second circuit boards; wherein the power supply components and logic control devices are located inside the frame, and the lower surface of the second circuit board has pads for external electrical connection. Through multi-layer circuit board stacking design and frame connection technology, high integration and miniaturization are achieved, simplifying the production process and significantly reducing the package area. Simultaneously, the frame can incorporate partitions to divide independent areas, avoiding signal interference, and can add heat sinks or shielding layers to improve heat dissipation performance and electromagnetic compatibility.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and more specifically, to a power supply module. Background Technology

[0002] With the rapid development of electronic technology, related equipment has become deeply integrated into people's work and life. Reliable power supply is the core foundation for ensuring the stable operation of electronic equipment. Among them, power modules, with their advantages of integration and miniaturization, have been widely used in communication systems, industrial automation, and data communication interfaces due to their strong adaptability and low energy consumption.

[0003] In existing power modules, the power devices and drive circuits are often discrete components mounted on a circuit board with wiring to achieve the corresponding circuit functions. To enhance reliability, such as... Figure 1 As shown, the circuit board and corresponding components / circuits are typically encapsulated in the same housing 100, with pins 110 provided on one side of the circuit board, extending from the housing 100 for external connections. To improve integration, additional features are also provided. Figure 2 As shown, the power device 120 and related components of the drive circuit are respectively mounted on both sides of the circuit board 130 using double-sided mounting to further reduce the size of the circuit board 130 and the volume of the power module. While the power device 120 and related components of the drive circuit can be mounted using reflow soldering, the pins 110 require wave soldering. The combination of these two soldering processes is complex and costly, making it difficult to meet current requirements.

[0004] Therefore, there is an urgent need to design a power module to improve the above problems and enhance product reliability and production efficiency. Utility Model Content

[0005] The purpose of this invention is to provide a power module that solves the problems of complex processes and high costs in the existing technology, thereby enhancing product reliability and production efficiency.

[0006] This utility model provides a power module, comprising: a first circuit board with a power device disposed on its upper surface and a power supply element disposed on its lower surface; a second circuit board with a logic control device disposed on its upper surface; and a frame disposed between the first circuit board and the second circuit board, wherein the frame has a conductive structure for realizing the electrical connection between the first circuit board and the second circuit board; wherein the power supply element and the logic control device are located inside the frame, and the lower surface of the second circuit board is provided with pads for electrical connection with the outside.

[0007] Optionally, the frame includes a hollowed-out rectangular frame, and the thickness of the frame is not less than the sum of the maximum height of the power supply components in the first circuit board and the maximum height of the logic control devices in the second circuit board.

[0008] Optionally, the thickness of the frame is not less than the higher of the maximum height of the power supply components in the first circuit board and the maximum height of the logic controllers in the second circuit board.

[0009] Optionally, the pads on the lower surface of the second circuit board are fitted with solder balls, and the power module is a BGA package.

[0010] Optionally, the frame further includes a partition located inside the frame, which divides the inside of the frame into multiple independent areas to avoid signal interference.

[0011] Optionally, the partition also includes a conductive structure to shorten the connection path between the devices on the first circuit board and the second circuit board.

[0012] Optionally, a shielding layer is provided on the inner or outer side of the frame to enhance electromagnetic shielding capability.

[0013] Optionally, the upper surface of the first circuit board is provided with multiple power devices, and the lower surface of the first circuit board is correspondingly provided with multiple power supply components to realize multiple voltage outputs.

[0014] Optionally, the first circuit board and the second circuit board each have connection points corresponding to the conductive structure of the frame, and the conductive structure of the frame is connected to the connection points of the first circuit board and the second circuit board by reflow soldering.

[0015] Optionally, the power device is at least one of MOSFET, IGBT or SiC device, and the power supply element includes a resistor, a capacitor or a combination thereof.

[0016] The power module provided by this utility model achieves high integration and miniaturization through a multi-layer circuit board stacking design and frame connection technology. Specifically, it adopts a vertical stacking layout of the first and second circuit boards, combined with conductive structures in the frame to achieve electrical connection. This not only eliminates the need for traditional pins and wave soldering processes, simplifying the production process, but also significantly reduces the package area. Simultaneously, the frame can incorporate partitions to divide independent areas, avoiding signal interference, and can add heat sinks or shielding layers to improve heat dissipation performance and electromagnetic compatibility. Furthermore, the pads on the lower surface of the second circuit board can be ball-mounted to achieve BGA packaging, further optimizing the density and reliability of external connections and solving the problems of high cost and low production efficiency caused by multiple mixed processes in existing technologies.

[0017] The power module provided by this utility model achieves component assembly and circuit board interconnection through a full surface mount technology (SMT) process, unifying the soldering process and significantly reducing production costs and process complexity. The frame, acting as a connection medium between adjacent circuit boards, replaces external connectors, reducing material costs and avoiding the risk of poor contact caused by connector insertion, thus improving overall reliability. The multi-layer stacking design also allows for flexible expansion (such as increasing the number of circuit board layers) to meet more needs. In summary, the power module provided by this utility model has significant advantages in terms of integration, production efficiency, and long-term reliability. Attached Figure Description

[0018] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the present invention with reference to the accompanying drawings.

[0019] Figure 1 A schematic diagram of a power module is shown;

[0020] Figure 2 A cross-sectional schematic diagram of a power module is shown;

[0021] Figure 3 A side view of the power module according to the first embodiment of the present invention is shown;

[0022] Figure 4 A schematic diagram of the first circuit board of the power module according to the second embodiment of the present invention is shown;

[0023] Figure 5 An exploded view of the power module according to the second embodiment of this utility model is shown. Detailed Implementation

[0024] The present invention will now be described in more detail with reference to the accompanying drawings. In the various drawings, the same elements are indicated by similar reference numerals. For clarity, the various parts in the drawings are not drawn to scale. Furthermore, some well-known parts may not be shown. For simplicity, the semiconductor structure obtained after several steps can be depicted in a single figure.

[0025] It should be understood that when describing a structure, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the device is flipped, the layer or region will be located "below" or "under" the other layer or region.

[0026] To describe a situation where it is located directly on another layer or another area, this article will use the expressions "directly on top of" or "on and adjacent to".

[0027] The solder pads described in this invention can refer to the metal areas on the substrate used for electrical connections. Furthermore, these metal areas can also be designed to accommodate solder balls. Solder ball placement refers to the process of soldering solder balls to the solder pads.

[0028] Many specific details, such as the structure, materials, dimensions, processing techniques, and methods of the devices or circuit elements, are described below to provide a clearer understanding of the present invention. However, as those skilled in the art will understand, the present invention may be implemented without following these specific details.

[0029] This utility model can be presented in various forms, some of which will be described below.

[0030] Figure 3 The diagram shows a side view of a power module according to an embodiment of the present invention. The power module includes a first circuit board 210, a second circuit board 220, and a frame 230. The upper surface of the first circuit board 210 is provided with a power device 211 and an inductor. The power device 211 is a MOSFET, IGBT, or SiC device. The lower surface of the first circuit board 210 is provided with components such as resistors and capacitors to supply power to the power device 211 and inductor on the upper surface of the first circuit board 210, thereby ensuring the normal operation of the power device 211. The upper surface of the second circuit board 220 is provided with logic controllers for controlling the power-on timing and operating logic of the power module. The lower surface of the second circuit board 220 is not provided with any electrical components, but only with pads for electrical connection with the outside. Further, solder balls 221 can be formed on the pads to realize BGA (Ball Grid Array) packaging. Compared with traditional DIP or QFP packaging, BGA packaging achieves electrical connection with the outside with a dense array of solder balls on the bottom. On the one hand, it can arrange dozens of connection points in a smaller area to meet the needs of large signal transmission with high-density connection; on the other hand, the uniformly distributed solder balls can efficiently conduct heat and have better heat dissipation performance; at the same time, the short and dense solder ball connection greatly shortens the signal transmission distance, which not only reduces electromagnetic interference, but also reduces signal delay.

[0031] A frame 230 is provided between the first circuit board 210 and the second circuit board 220. The lower surface of the first circuit board 210 is connected to the upper surface of the second circuit board 220 through the frame 230. The frame 230 is, for example, a rectangular frame with a hollowed-out center to provide space for the components on the lower surface of the first circuit board 210 and the components on the upper surface of the second circuit board 220. Specifically, the size of the frame 230 corresponds to the edge of the first circuit board 210 and the edge of the second circuit board 220. The lower surface of the first circuit board 210 is also provided with a plurality of first connection points corresponding to the frame 230, and the upper surface of the second circuit board 220 is also provided with a plurality of second connection points corresponding to the frame 230. The frame 230 is provided with a plurality of conductive structures, the two ends of which correspond to the first connection points of the first circuit board and the second connection points of the second circuit board, respectively. The first circuit board 210 is connected to the second connection points of the second circuit board through the first connection points and the conductive structures in the frame 230, thereby achieving an electrical connection between the first circuit board 210 and the second circuit board 220. Specifically, the frame 230 is made of a circuit board with a thickness of 3.2 mm, with a hollow center. The thickness of the frame 230 is, for example, not less than the sum of the maximum height of the power supply components on the lower surface of the first circuit board 210 and the maximum height of the logic control devices in the second circuit board 220. Of course, when the power supply components and the logic control devices are offset in the top view, the thickness of the frame 230 may not be less than the height of the two. The frame 230 also has a conductive structure inside, which is formed, for example, by a vertical conductive layer. The first circuit board 210, the frame 230, and the second circuit board 220 can also be connected, for example, by reflow soldering.

[0032] Furthermore, a shielding layer can be provided on the inner or outer side of the frame 230 to enhance electromagnetic shielding capabilities, prevent external influences on the logic control devices on the upper surface of the second circuit board 220, and enhance the reliability of the power module. Compared to being encapsulated in a housing, the power devices 211 on the upper surface of the first circuit board 210 are exposed in this invention, which can achieve better heat dissipation.

[0033] Figure 3 Although only a vertical stacking scheme of two circuit boards is shown in the image, more can be implemented depending on requirements and actual conditions. Figure 3 Based on the first circuit board 210, another frame 230 is set above it, and circuits are set on the newly set frame 230 to achieve vertical stacking of more circuit boards and further reduce the area occupied.

[0034] Figure 4The diagram shows a schematic of the first circuit board of the power module according to a second embodiment of the present invention. In this second embodiment, the upper surface of the first circuit board 210 is provided with, for example, four power devices 211, and the lower surface of the first circuit board 210 is provided with, for example, electrical components such as resistors and capacitors corresponding to the four power devices 211, so as to realize four-way voltage output. Of course, the number of power devices 211 is not limited to four, and the number of power devices 211 and the corresponding electrical components and circuits can be set according to actual needs.

[0035] Figure 5 This diagram shows an exploded view of the power module according to the second embodiment of the present invention. Figure 5 As can be seen, the power module of this second embodiment not only includes four power devices 211 to achieve four-way voltage output, but also has a partition 231 in its frame 230. The partition 231 divides the space within the frame 230 into multiple independent areas to avoid mutual interference between the areas. Furthermore, the partition 231 also has a conductive structure, which can shorten the connection path between the devices of the first circuit board 210 and the second circuit board 220. Specifically, the areas can be divided according to the electrical components on the lower surface of the first circuit board 210 and the logic devices 222 on the upper surface of the second circuit board 220. By setting the partition 231, the support of the inner side of the frame 230 for the first circuit board 210 can also be improved, avoiding the downward deformation of the middle area of ​​the first circuit board 210 due to insufficient support.

[0036] The power module provided by this utility model achieves high integration and miniaturization through a multi-layer circuit board stacking design and frame connection technology. Specifically, it adopts a vertical stacking layout of the first and second circuit boards, combined with conductive structures in the frame to achieve electrical connection. This not only eliminates the need for traditional pins and wave soldering processes, simplifying the production process, but also significantly reduces the package area. Simultaneously, the frame can incorporate partitions to divide independent areas, avoiding signal interference, and can add heat sinks or shielding layers to improve heat dissipation and electromagnetic compatibility. Furthermore, conductive structures are also provided in the partitions to enhance the signal connection between the two circuit boards and shorten the connection path. In addition, the pads on the lower surface of the second circuit board can be ball-mounted to achieve BGA packaging, further optimizing the density and reliability of external connections and solving the problems of high cost and low production efficiency caused by multiple mixed processes in existing technologies.

[0037] The power module provided by this invention achieves component assembly and circuit board interconnection through a full surface mount technology (SMT) process, unifying the soldering process and significantly reducing production costs and process complexity. The frame, acting as a connection medium between adjacent circuit boards, replaces external connectors, reducing material costs and avoiding the risk of poor contact caused by connector insertion, thus improving overall reliability. The multi-layer stacking design also allows for flexible expansion (such as increasing the number of circuit board layers) to meet more needs. In summary, this invention has significant advantages in terms of integration, production efficiency, and long-term reliability.

[0038] The above description does not provide detailed explanations of the technical aspects of the device's layout and injection molding. However, those skilled in the art should understand that various technical means can be used to form the desired shape of sidewalls, areas, etc. Furthermore, to form the same structure, those skilled in the art can also design methods that are not entirely identical to those described above. Additionally, although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination.

[0039] The embodiments of this utility model have been described above. However, these embodiments are merely illustrative and not intended to limit the scope of this utility model. The scope of this utility model is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of this utility model, and all such substitutions and modifications should fall within the scope of this utility model.

Claims

1. A power module, characterized in that, include: The first circuit board has power devices on its upper surface and power supply components on its lower surface. The second circuit board has logic control devices disposed on its upper surface; A frame is disposed between the first circuit board and the second circuit board, and the frame is provided with a conductive structure for realizing the electrical connection between the first circuit board and the second circuit board; The power supply element and the logic control device are located inside the frame, and the lower surface of the second circuit board is provided with pads for external electrical connection.

2. The power module according to claim 1, characterized in that, The frame includes a hollowed-out rectangular frame, and the thickness of the frame is not less than the sum of the maximum height of the power supply components in the first circuit board and the maximum height of the logic control devices in the second circuit board.

3. The power module according to claim 1, characterized in that, The thickness of the frame is not less than the higher of the maximum height of the power supply components in the first circuit board and the maximum height of the logic control devices in the second circuit board.

4. The power module according to claim 1, characterized in that, The pads on the lower surface of the second circuit board are fitted with solder balls, and the power module is a BGA package.

5. The power module according to claim 1, characterized in that, The frame also includes a partition located inside the frame, which divides the inside of the frame into multiple independent areas to avoid signal interference.

6. The power module according to claim 5, characterized in that, The partition also includes conductive structures to shorten the connection path between the devices on the first circuit board and the second circuit board.

7. The power module according to claim 1, characterized in that, The frame is provided with a shielding layer on its inner or outer side to enhance electromagnetic shielding capability.

8. The power module according to claim 1, characterized in that, The upper surface of the first circuit board is provided with multiple power devices, and the lower surface of the first circuit board is provided with multiple power supply components to realize multiple voltage outputs.

9. The power module according to claim 1, characterized in that, The first circuit board and the second circuit board each have connection points corresponding to the conductive structure of the frame, and the conductive structure of the frame is connected to the connection points of the first circuit board and the second circuit board by reflow soldering.

10. The power module according to claim 1, characterized in that, The power device is at least one of MOSFET, IGBT or SiC device, and the power supply element includes resistor, capacitor or combination thereof.

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