A circuit board manufacturing substrate

Abstract

This utility model belongs to the technical field of circuit board manufacturing, and particularly relates to a circuit board manufacturing substrate. The substrate body has a first region and a second region. The first region is used for exposure and contains at least one exposure area. The second region is used to mount the circuit board. An exposure module is disposed within the exposure area, and the exposure module has two adjacent modules, the first module and the second module, with a metal layer on the first module. By placing the exposure areas on the manufacturing substrate, the use of additional testing modules is reduced, frequent scrapping of testing substrates is avoided, and repeated use of the same exposure module is prevented, thus avoiding impact on the exposure results.

Description

Technical Field

[0001] This utility model belongs to the technical field of circuit board manufacturing, and in particular relates to a circuit board manufacturing substrate. Background Technology

[0002] In the process of manufacturing PCB boards with solder mask exposure, an "exposure" process is required, which is a key step in pattern transfer.

[0003] Before exposing a circuit board, the exposure intensity is usually adjusted using an exposure ruler. The principle is to observe the exposure results after multiple exposures using the exposure ruler before exposing the circuit board, and adjust the exposure intensity to avoid excessively strong or weak exposure intensity, which could affect the quality of the circuit board.

[0004] In the prior art, the exposure scale is usually set on a separate test substrate. The optimal exposure intensity of the circuit board is achieved by performing multiple exposure tests on the test substrate before exposure.

[0005] Different circuit boards require different exposure intensities because the thickness of the solder resist ink on the copper plate differs significantly from that on the production board. Therefore, using the copper plate to capture the exposure energy will result in a large deviation. Consequently, testing and adjustments are often required before exposing each circuit board. A single test substrate cannot handle frequent exposure tests, and after each test, the ink on the test substrate needs to be removed, a very complex process. Repeated use of the test substrate necessitates frequent scrapping, and the repeated use of the test substrate can also affect the exposure meter results. Utility Model Content

[0006] To address the technical problem that "a single test substrate cannot cope with frequent exposure tests, and repeated use requires frequent scrapping of the test substrate, and the test substrate used multiple times will also affect the results of the exposure scale," this utility model proposes a circuit board production substrate.

[0007] This utility model solves the above problems through the following technical means: In a first aspect, this utility model proposes a circuit board manufacturing substrate, comprising: The substrate body has a first region and a second region, wherein the first region is used for exposure and at least one exposure area is provided in the first region; the second region is used for setting a circuit board. And an exposure module, which is set in the exposure area. The exposure module has a first module and a second module that are adjacent to each other on the left and right. The first module has a metal layer.

[0008] The substrate body comprises a first region and a second region. The first region is used for exposure and contains at least one exposure area. The second region is used for mounting a circuit board. An exposure module is disposed within the exposure area, and the exposure module comprises a first module and a second module arranged adjacent to each other. The first module has a metal layer. By placing the exposure area on the production substrate, the use of additional test modules is reduced, frequent scrapping of test substrates is avoided, and repeated use of the same exposure module is prevented, thus avoiding impact on the exposure results.

[0009] In some implementations, the metal layer is set as a copper layer.

[0010] In some implementations, the length of the exposure area is 127~150mm.

[0011] In some implementations, the width of the exposure area is 13~30mm.

[0012] In some implementations, a 3-10 mil line frame is provided outside the exposure area.

[0013] In some implementations, the distance between the exposure area and the second area is at least 5 mm.

[0014] In some embodiments, a first region is provided around the periphery of the substrate body with a first portion, a second region is provided between the first region and the second region, and a third portion is provided around the periphery of the second region.

[0015] In some implementations, the exposure module includes a first exposure module, a second exposure module, and a third exposure module; The first exposure module is located in the first part, the second exposure module is located in the second part, and the third exposure module is located in the third part.

[0016] In some implementations, the first exposure module and the third exposure module are symmetrical about the second exposure module.

[0017] In some embodiments, the substrate body is composed of a core board layer, a copper layer, and a solder resist layer; the copper layer is disposed on both sides of the core board layer, and the solder resist layer has openings in the exposure area, the positions of which correspond to the second module.

[0018] The beneficial effects of this utility model on the circuit board manufacturing substrate are: The substrate body comprises a first region and a second region. The first region is used for exposure and contains at least one exposure area. The second region is used for mounting a circuit board. An exposure module is disposed within the exposure area, and the exposure module comprises a first module and a second module arranged adjacent to each other. The first module has a metal layer. By placing the exposure area on the production substrate, the use of additional test modules is reduced, frequent scrapping of test substrates is avoided, and repeated use of the same exposure module is prevented, thus avoiding impact on the exposure results. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a circuit board manufacturing substrate according to the present invention. Figure 1 ; Figure 2 This is a schematic diagram of a circuit board manufacturing substrate according to the present invention. Figure 2 ; Figure 3 This is a schematic diagram of an exposure module for a circuit board production substrate according to the present invention. Figure 4 This is an exploded view of the substrate body of a circuit board manufacturing substrate according to the present invention.

[0020] Figure label: 1. Substrate body; 11. First region; 111. First part; 112. Second part; 113. Third part; 12. Second region; 13. Exposure area; 14. Core layer; 15. Copper layer; 16. Solder resist layer; 2. Exposure module; 21. First module; 22. Second module; 23. First exposure module; 24. Second exposure module; 25. Third exposure module; Detailed implementation method: It should be noted that, in the absence of conflict, the embodiments and technical features in the embodiments of this utility model can be combined with each other. The detailed description in the specific embodiments should be understood as an explanation of the spirit of this utility model and should not be regarded as an improper limitation of this utility model.

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the specific technical solutions of this utility model will be further described in detail below with reference to the accompanying drawings of the embodiments of this utility model. The following embodiments are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0022] In the embodiments of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0023] Furthermore, in this embodiment of the invention, directional terms such as "upper," "lower," "left," and "right" are defined relative to the positions of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the position of the components in the accompanying drawings.

[0024] In the embodiments of this utility model, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0025] In embodiments of this invention, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0026] In this embodiment of the invention, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" or "for example" in this embodiment of the invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant information in a specific manner.

[0027] Example 1: like Figure 1 As shown, this embodiment proposes a circuit board manufacturing substrate, comprising: The substrate body 1 has a first region 11 and a second region 12. The first region 11 is used for exposure and at least one exposure area 13 is provided in the first region 11. The second region 12 is used for setting the circuit board. And exposure module 2, which is located in exposure area 13. Exposure module 2 has a first module 21 and a second module 22 that are adjacent to each other on the left and right. The first module 21 has a metal layer.

[0028] Specifically, the substrate body 1 has a first region 11 and a second region 12. The first region 11 is the routing area designed for the production substrate, used only to fix the circuit board. The second region 12 is the area for setting the circuit board product. Normally, after all processes are completed, the first region 11 is routed away, leaving only the product in the second region 12. Therefore, by setting an exposure area 13 on the first region 11, the resource utilization rate of the substrate body 1 can be improved by utilizing the routing area. Multiple exposure areas 13 can be set within the first region 11 and evenly distributed on the substrate body 1. By setting the exposure areas 13, the required exposure intensity of the required exposure area 13 can be determined, and further, the uniformity of the overall exposure intensity of the substrate body 1 can be determined. During test exposure, only the exposure area 13 is tested. The equipment can be adjusted for area exposure, or a special shielding part can be set. The shielding part can have openings to expose only the exposure area 13. The shielding part can be reused, thus avoiding resource waste. The second region 12 is the product that needs to be exposed, usually the circuit board.

[0029] Furthermore, an exposure module 2 is installed within the exposure area 13. This module consists of a first module 21 and a second module 22 positioned adjacent to each other. These two modules serve as a comparison, facilitating better control. To differentiate them, a metal layer is applied to the first module 21 for better monitoring of the exposure effect and mutual comparison. A solder resist exposure ruler test module is designed and added to the forming mill area of ​​the production board. Exposure personnel can use this module to capture exposure energy parameters. Finally, during the forming process, the solder resist exposure ruler test module is scrapped under the mill.

[0030] The substrate body 1 has a first region 11 and a second region 12. The first region 11 is used for exposure and contains at least one exposure area 13. The second region 12 is used for mounting circuit boards. An exposure module 2 is also included, located within the exposure area 13. The exposure module 2 has two adjacent modules, a first module 21 and a second module 22. The first module 21 has a metal layer. By placing the exposure area 13 on the production substrate, the use of additional test modules is reduced, frequent scrapping of test substrates is avoided, and repeated use of the same exposure module 2 is prevented, thus avoiding impact on the exposure results.

[0031] Example 2: like Figures 2-3 As shown, this embodiment further optimizes and explains the structure proposed in Embodiment 1: In some embodiments, the metal layer is set as a copper layer.

[0032] Specifically, the metal layer is typically a copper layer to simulate the copper plating on the surface of a circuit board, thus making the exposure results closer to the real result. Furthermore, the copper layer can be the copper plating layer of the circuit board, eliminating the need for an additional exposure ruler. The second module 22 can remove the original copper plating layer, distinguishing it from the copper plating layer of the first module 21. Separate detection by the two modules allows for more accurate adjustment of the exposure intensity. Moreover, the fact that the metal layer is made of copper, the same material as the copper layer on the circuit board, ensures that the effect produced by the tested exposure energy matches the effect produced by the actual exposure energy.

[0033] In some embodiments, the length of the exposure area 13 is 127~150mm.

[0034] Specifically, the length of the exposure area 13 is 127~150mm, so that the length of the exposure area 13 is long enough that when exposing the exposure area 13, the exposure results at the beginning and end of the exposure area 13 can be used to determine whether the exposure is uniform, thus avoiding uneven exposure intensity on the substrate body 1.

[0035] In some embodiments, the width of the exposure area 13 is 13~30mm.

[0036] Specifically, this width ensures that the width of the first module 21 and the second module 22 is at least 6~15mm. When observing the exposure effect, this width makes the effect easier to observe directly and also makes the effect of the exposure area 13 more obvious.

[0037] In some embodiments, a 3-10 mil line frame is provided outside the exposure area 13.

[0038] Specifically, the line frame is set outside the exposure area 13 so that the visual frame line can be positioned or aligned before exposure, so that the exposure ruler area can be exposed first during the test exposure to achieve the effect of early testing.

[0039] In some embodiments, the distance between the exposure area 13 and the second area 12 is at least 5 mm.

[0040] Specifically, during the design phase, the distance between the circuit frame of exposure area 13 and the second area 12 should be at least 5mm. This is to prevent poor exposure caused by unevenness in the film ruler during film exposure machine production, which could result in poor adhesion between the film and the production board.

[0041] In some embodiments, a first region 11 is provided with a first portion 111 around the periphery of the substrate body 1, a second portion 112 is provided between the first region 11 and the second region 12, and a third portion 113 is provided around the periphery of the second region 12.

[0042] Specifically, the first part 111 is arranged around the periphery of the substrate body 1, the first region 11 is disposed between the second regions 12, and the third part 113 is disposed around the periphery of the second regions 12, so that the first regions 11 are uniformly disposed on the substrate body 1, and the exposure areas 13 can be uniformly disposed within one or more of the first regions 11. This allows the exposure intensity to be judged by the results of multiple exposure areas 13 during exposure testing, and further, the exposure uniformity of the exposure machine can be judged. More specifically, there can be three second regions 12, with two second regions 12 arranged side by side and the third second region 12 disposed on both sides of the two second regions 12. The first part 111 wraps around the periphery of the substrate body 1, the second part 112 is disposed between the two second regions 12, and the third part 113 is disposed on both sides of the third second region 12, so that the first region 11 is disposed at any location on the substrate body 1 as much as possible. When observing the exposure results at the end, it is possible to further determine whether the exposure energy is at any location on the substrate body 1, avoiding the problem of incomplete exposure caused by different exposure energy.

[0043] In some embodiments, the exposure module 2 includes a first exposure module 23, a second exposure module 24, and a third exposure module 25; The first exposure module 23 is located on the first part 111, the second exposure module 24 is located on the second part 112, and the third exposure module 25 is located on the third part 113.

[0044] Specifically, exposure modules 2 are provided in the first part 111, the second part 112, and the third part 113, so that after exposure, the exposure modules 2 in different areas can determine whether the exposure energy is uniform during exposure, thus avoiding circuit board problems caused by uneven exposure.

[0045] In some embodiments, the first exposure module 23 and the third exposure module 25 are symmetrical about the second exposure module 24.

[0046] Specifically, the substrate body 1 is typically set as a rectangle, and the second exposure module 24 is set on the second part 112. The second part 112 is set as close as possible to the center of the rectangle, and the second exposure module 24 is set at the center, so as to determine whether the exposure energy at the center of the substrate body 1 meets the requirements. By symmetrically setting the first exposure module 23 and the third exposure module 25, or setting them on both sides of the second exposure module 24, it is possible to determine whether the exposure energy on the substrate body 1 is uniform while testing whether the exposure energy meets the requirements during exposure.

[0047] Example 3: like Figure 4As shown, this embodiment further illustrates the circuit board manufacturing substrate proposed in Embodiments 1 and 2: In some embodiments, the substrate body 1 is composed of a core board layer 14, a copper layer 15 and a solder resist layer 16; the copper layer 15 is disposed on both sides of the core board layer 14, and the solder resist layer 16 has a window in the exposure area 13, the window position corresponding to the second module 22.

[0048] Specifically, the substrate body 1 consists of an inner core layer 14. The material of the core layer 14 can be the same as that of the core layer of the circuit board, so that the core layer 14 is exposed when the metal layer is removed in the second module 22. During exposure, not only the first module 21 simulates the exposure effect of the copper-clad layer of the circuit board, but also the second module 22 simulates the exposure effect of the core layer 14, allowing the exposure scale to completely mimic the exposure effect of the circuit board. A solder resist layer 16 is provided on the copper surface to prevent solder from remaining on the substrate body 1 in subsequent processes, thus preventing contamination of the circuit board and the exposure area 13. The solder resist layer is solder resist printing ink; no solder resist printing ink layer is provided in the exposure area 13.

[0049] The serial numbers of the utility model embodiments are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments. The above are only preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent device or equivalent process transformation made based on the content of this utility model specification and drawings, or direct or indirect application in other related technical fields, are similarly included in the patent protection scope of this utility model.

Claims

1. A circuit board manufacturing substrate, characterized in that, include: A substrate body (1) is provided with a first region (11) and a second region (12), wherein the first region (11) is used for exposure and at least one exposure area (13) is provided in the first region (11); the second region (12) is used for setting a circuit board; And an exposure module (2), which is located in the exposure area (13). The exposure module (2) is provided with a first module (21) and a second module (22) that are adjacent to each other on the left and right. The first module (21) is provided with a metal layer.

2. The circuit board manufacturing substrate according to claim 1, characterized in that, The metal layer is set to a copper layer.

3. The circuit board manufacturing substrate according to claim 1, characterized in that, The length of the exposure area (13) is 127~150mm.

4. The circuit board manufacturing substrate according to claim 1, characterized in that, The width of the exposure area (13) is 13~30mm.

5. The circuit board manufacturing substrate according to claim 1, characterized in that, A 3-10 mil line frame is provided outside the exposure area (13).

6. The circuit board manufacturing substrate according to claim 1, characterized in that, The distance between the exposure area (13) and the second area (12) is at least 5 mm.

7. The circuit board manufacturing substrate according to claim 1, characterized in that, The first region (11) is surrounded by a first part (111) on the periphery of the substrate body (1), the first region (11) is provided with a second part (112) between the second region (12), and the second region (12) is provided with a third part (113) on the periphery of the second region (12).

8. The circuit board manufacturing substrate according to claim 7, characterized in that, The exposure module (2) includes a first exposure module (23), a second exposure module (24), and a third exposure module (25). The first exposure module (23) is disposed on the first part (111), the second exposure module (24) is disposed on the second part (112), and the third exposure module (25) is disposed on the third part (113).

9. The circuit board manufacturing substrate according to claim 8, characterized in that, The first exposure module (23) and the third exposure module (25) are symmetrical about the second exposure module (24).

10. The circuit board manufacturing substrate according to claim 1, characterized in that, The substrate body (1) is composed of a core board layer (14), a copper layer (15) and a solder resist layer (16); the copper layer (15) is disposed on both sides of the core board layer (14), and the solder resist layer (16) has a window in the exposure area (13), the window position corresponding to the second module (22).

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