A multilayer circuit board hot melt welding anti-displacement device

Abstract

This utility model discloses a multilayer circuit board hot melt welding anti-misalignment device, including a first support base, a second support base, and a support base. A sliding rod is positioned between the first and second support bases. A sliding seat is movably mounted on the sliding rod. A lifting drive seat is positioned at the bottom of the sliding seat. A lifting rod is positioned at the bottom of the lifting drive seat. A hot melt control box is positioned at the bottom of the lifting rod. A hot melt plate is positioned at the bottom of the hot melt control box. A horizontal hot melt head and a vertical hot melt head are positioned on the bottom surface of the hot melt plate. A support rod is positioned at the upper end of the support base. This multilayer circuit board hot melt welding anti-misalignment device adds two sets of hot melt areas to each longitudinal edge of the circuit board and two sets of hot melt heads to each corresponding longitudinal edge of the hot melt machine, solving the problem of multilayer board misalignment and reducing the defect rate and rework rate due to misalignment.

Description

Technical Field

[0001] This utility model relates to the field of hot melt welding technology for circuit boards, and in particular to a device for preventing displacement during hot melt welding of multilayer circuit boards. Background Technology

[0002] Multilayer circuit board hot melt welding anti-displacement equipment is a support device for hot melt positioning of circuit boards. In the PCB industry, multilayer boards need to go through a fusion process, which combines multiple inner cores and PPs. The cores and PPs are initially fixed by heating with the welding head of the hot melt machine. With the continuous development of technology, people have higher and higher requirements for the manufacturing process of multilayer circuit board hot melt welding anti-displacement equipment.

[0003] Existing multilayer circuit board hot melt welding equipment has certain drawbacks. The existing equipment has 8 hot melt zones, 4 on each side horizontally and none vertically. When producing special stacked structures or products with an A / R of less than 6mil, offset and scrap will occur. The scrap is concentrated in the vertical position, which has a certain adverse effect on the actual use process. To this end, we propose a multilayer circuit board hot melt welding anti-offset equipment. Utility Model Content

[0004] Technical problem to be solved: In view of the shortcomings of the existing technology, this utility model provides a multilayer circuit board hot melt welding anti-misalignment device, which adds two sets of hot melt areas to each longitudinal edge of the circuit board and two sets of hot melt heads to each longitudinal edge of the hot melt machine, so as to solve the problem of multilayer board misalignment, reduce the defect rate and rework rate of misalignment, and can effectively solve the problems in the background technology.

[0005] Technical Solution: To achieve the above objectives, the technical solution adopted by this utility model is as follows: A multilayer circuit board hot melt welding anti-deviation device, comprising a first support base, a second support base, and a support base. A sliding rod is positioned between the first support base and the second support base. A sliding seat is movably mounted on the sliding rod. A lifting drive seat is positioned at the bottom of the sliding seat. A lifting rod is positioned at the bottom of the lifting drive seat. A hot melt control box is positioned at the bottom of the lifting rod. A hot melt plate is positioned at the bottom of the hot melt control box. A horizontal hot melt head and a vertical hot melt head are positioned on the bottom surface of the hot melt plate. A support rod is positioned at the upper end of the support base. A quick-install positioning plate is positioned at the upper end of the support rod. A quick-install positioning groove is provided on the quick-install positioning groove. A circuit board assembly is engaged inside the quick-install positioning groove. A horizontal hot melt part and a vertical hot melt part are provided on the circuit board assembly. The horizontal hot melt head and the vertical hot melt head correspond to the positions of the horizontal hot melt part and the vertical hot melt part, respectively.

[0006] Preferably, a cylinder assembly is installed on the inner side of the first support base at the position between the slide rods, a cylinder seat is positioned at the bottom of the cylinder assembly, a fixing plate is positioned at the rear end of the cylinder assembly, a piston rod is provided at the front end of the cylinder assembly, a connecting plate is positioned at the front end of the piston rod, and a connector is positioned between the piston rod and the connecting plate.

[0007] Preferably, the slide block has grooves at both ends where it passes through the slide rod, and a fixing bracket and a mounting plate are positioned between the slide block and the lifting drive seat, and the mounting plate is fixed to the lifting drive seat.

[0008] Preferably, the first support base is fixed to the cylinder assembly by a fixing plate, the cylinder assembly drives the piston rod to extend and retract, and the piston rod is fixed to the connecting plate by a connector.

[0009] Preferably, the slide block moves horizontally on the slide rod via a slide groove, and the slide block and the lifting drive seat are fixed together by a fixing bracket and a mounting plate.

[0010] Preferably, the lifting rod moves up and down at the bottom of the lifting drive seat, and the lifting rod drives the hot melt control box and the hot melt plate to move up and down. The hot melt plate is pressed down to coincide with the quick-installation positioning groove. At this time, the horizontal hot melt head and the vertical hot melt head at the lower end of the hot melt plate contact the horizontal hot melt part and the vertical hot melt part on the circuit board assembly.

[0011] Beneficial Effects: Compared with the prior art, this utility model provides a multi-layer circuit board hot melt welding anti-deviation device with the following beneficial effects: This multi-layer circuit board hot melt welding anti-deviation device adds two sets of hot melt areas on each longitudinal side of the circuit board and two sets of hot melt heads on each corresponding longitudinal side of the hot melt machine, solving the problem of multi-layer board misalignment, reducing the defect rate and rework rate of misalignment. The lifting rod moves up and down at the bottom of the lifting drive seat, and the lifting rod drives the hot melt control box and hot melt plate to move up and down. The hot melt plate is pressed down and overlaps with the quick-installation positioning groove. At this time, the horizontal hot melt head and the vertical hot melt head at the lower end of the hot melt plate contact the horizontal hot melt part and the vertical hot melt part on the circuit board assembly. The horizontal hot melt head and the vertical hot melt head simultaneously perform hot melt processing on the horizontal hot melt part and the vertical hot melt part on the circuit board assembly. The entire multi-layer circuit board hot melt welding anti-deviation device has a simple structure, is easy to operate, and has a better effect than the traditional method. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of a multilayer circuit board hot melt welding anti-displacement device according to the present invention.

[0013] Figure 2 This is a schematic diagram of the cylinder assembly in a multilayer circuit board hot melt welding anti-deviation device according to the present invention.

[0014] Figure 3 This is a schematic diagram of the lifting structure of the hot melt control box in a multilayer circuit board hot melt welding anti-deviation device of this utility model.

[0015] Figure 4 This is a top view structural schematic diagram of the circuit board assembly in the multilayer circuit board hot melt welding anti-displacement device of this utility model.

[0016] Figure 5 This is a schematic diagram of the structure of the bottom surface of the hot melt plate in the multilayer circuit board hot melt welding anti-displacement device of this utility model.

[0017] In the diagram: 1. First support seat; 2. Cylinder assembly; 3. Piston rod; 4. Slide rod; 5. Slide seat; 6. Slide groove; 7. Lifting drive seat; 8. Second support seat; 9. Quick-release positioning groove; 10. Quick-release positioning plate; 11. Support rod; 12. Support base; 13. Fixing plate; 14. Cylinder seat; 15. Connecting plate; 16. Connector; 17. Fixing bracket; 18. Mounting plate; 19. Lifting rod; 20. Hot melt control box; 21. Hot melt plate; 22. Horizontal hot melt section; 23. Circuit board assembly; 24. Vertical hot melt section; 25. Horizontal hot melt head; 26. Vertical hot melt head. Detailed Implementation

[0018] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings and specific embodiments. However, those skilled in the art will understand that the embodiments described below are only some embodiments of this utility model, not all embodiments, and are only used to illustrate this utility model, and should not be regarded as limiting the scope of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall be followed. Where the manufacturers of reagents or instruments are not specified, they are all conventional products that can be purchased commercially.

[0019] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] like Figure 1-5 As shown, a multilayer circuit board hot melt soldering anti-deviation device includes a first support base 1, a second support base 8, and a support base 12. A slide rod 4 is positioned between the first support base 1 and the second support base 8. A slide block 5 is movably mounted on the slide rod 4. A lifting drive seat 7 is positioned at the bottom of the slide block 5. A lifting rod 19 is positioned at the bottom of the lifting drive seat 7. A hot melt control box 20 is positioned at the bottom of the lifting rod 19. A hot melt plate 21 is positioned at the bottom of the hot melt control box 20. A horizontal hot melt head 25 and a vertical hot melt head 26 are positioned on the bottom surface of the hot melt plate 21. The upper end of the support base 12 is positioned... There is a support rod 11, and a quick-installation positioning plate 10 is positioned on the upper end of the support rod 11. The quick-installation positioning plate 10 has a quick-installation positioning groove 9. A circuit board assembly 23 is engaged inside the quick-installation positioning groove 9. The circuit board assembly 23 is provided with a horizontal hot-melt section 22 and a vertical hot-melt section 24. The horizontal hot-melt head 25 and the vertical hot-melt head 26 correspond to the positions of the horizontal hot-melt section 22 and the vertical hot-melt section 24. Two sets of hot-melt areas are added to each longitudinal side of the circuit board, and two sets of hot-melt heads are added to each longitudinal side of the hot-melt machine to solve the problem of multi-layer board misalignment and reduce the defect rate and rework rate of the misalignment.

[0022] Furthermore, a cylinder assembly 2 is installed on the inner side of the first support 1 at the position between the slide rods 4. A cylinder seat 14 is installed at the bottom of the cylinder assembly 2. A fixing plate 13 is positioned at the rear end of the cylinder assembly 2. A piston rod 3 is provided at the front end of the cylinder assembly 2. A connecting plate 15 is positioned at the front end of the piston rod 3. A connector 16 is positioned between the piston rod 3 and the connecting plate 15.

[0023] Furthermore, the slide block 5 has grooves 6 at both ends where it passes through the slide rod 4, and a fixed bracket 17 and a mounting plate 18 are positioned between the slide block 5 and the lifting drive seat 7, and the mounting plate 18 is fixed to the lifting drive seat 7.

[0024] Furthermore, the first support 1 is fixed to the cylinder assembly 2 by a fixing plate 13, the cylinder assembly 2 drives the piston rod 3 to extend and retract, and the piston rod 3 is fixed to the connecting plate 15 by a connector 16.

[0025] Furthermore, the slide block 5 moves horizontally on the slide rod 4 via the slide groove 6, and the slide block 5 and the lifting drive seat 7 are fixed together by the fixed bracket 17 and the mounting plate 18.

[0026] Furthermore, the lifting rod 19 moves up and down at the bottom of the lifting drive seat 7. The lifting rod 19 drives the hot melt control box 20 and the hot melt plate 21 to move up and down. The hot melt plate 21 is pressed down and overlaps with the quick-installation positioning groove 9. At this time, the horizontal hot melt head 25 and the vertical hot melt head 26 at the lower end of the hot melt plate 21 contact the horizontal hot melt part 22 and the vertical hot melt part 24 on the circuit board assembly 23.

[0027] Working principle: This utility model includes a first support base 1, a cylinder assembly 2, a piston rod 3, a slide rod 4, a slide seat 5, a slide groove 6, a lifting drive base 7, a second support base 8, a quick-release positioning groove 9, a quick-release positioning plate 10, a support rod 11, a support base 12, a fixing plate 13, a cylinder seat 14, a connecting plate 15, a connector 16, a fixing bracket 17, a mounting plate 18, a lifting rod 19, a hot melt control box 20, a hot melt plate 21, a horizontal hot melt section 22, a circuit board assembly 23, a vertical hot melt section 24, a horizontal hot melt head 25, and a vertical hot melt head 26. Two sets of hot melt areas are added to each of the longitudinal edges of the circuit board. Two sets of hot melt heads are added to each of the corresponding longitudinal edges to solve the problem of multilayer board misalignment, reduce the defect rate and rework rate of misalignment. The lifting rod 19 moves up and down at the bottom of the lifting drive seat 7. The lifting rod 19 drives the hot melt control box 20 and the hot melt plate 21 to move up and down. The hot melt plate 21 is pressed down and overlaps with the quick-installation positioning groove 9. At this time, the horizontal hot melt head 25 and the vertical hot melt head 26 at the lower end of the hot melt plate 21 contact the horizontal hot melt part 22 and the vertical hot melt part 24 on the circuit board assembly 23. The horizontal hot melt head 25 and the vertical hot melt head 26 simultaneously perform hot melt processing on the horizontal hot melt part 22 and the vertical hot melt part 24 on the circuit board assembly 23.

[0028] It should be noted that, in this document, relational terms such as first and second (number one, number two), etc., are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A multilayer circuit board hot melt welding anti-displacement device, comprising a first support base (1), a second support base (8), and a support base (12), characterized in that: A slide rod (4) is positioned between the first support base (1) and the second support base (8). A slide block (5) is movably mounted on the slide rod (4). A lifting drive base (7) is positioned at the bottom of the slide block (5). A lifting rod (19) is provided at the bottom of the lifting drive base (7). A hot melt control box (20) is positioned at the bottom of the lifting rod (19). A hot melt plate (21) is positioned at the bottom of the hot melt control box (20). A horizontal hot melt head (25) and a vertical hot melt head (26) are positioned on the bottom surface of the hot melt plate (21). The upper end of the support base (12) is positioned with a support rod (11), and the upper end of the support rod (11) is positioned with a quick-installation positioning plate (10). The quick-installation positioning plate (10) is provided with a quick-installation positioning groove (9). The inner side of the quick-installation positioning groove (9) is fitted with a circuit board assembly (23). The circuit board assembly (23) is provided with a horizontal hot-melt part (22) and a vertical hot-melt part (24). The horizontal hot-melt head (25) and the vertical hot-melt head (26) correspond to the positions of the horizontal hot-melt part (22) and the vertical hot-melt part (24).

2. The multilayer circuit board hot melt welding anti-displacement device according to claim 1, characterized in that: A cylinder assembly (2) is installed on the inner side of the first support base (1) between the slide rods (4). A cylinder seat (14) is installed at the bottom of the cylinder assembly (2). A fixing plate (13) is positioned at the rear end of the cylinder assembly (2). A piston rod (3) is provided at the front end of the cylinder assembly (2). A connecting plate (15) is positioned at the front end of the piston rod (3). A connector (16) is positioned between the piston rod (3) and the connecting plate (15).

3. The multilayer circuit board hot melt welding anti-displacement device according to claim 1, characterized in that: The slide block (5) has a slide groove (6) at both ends where it passes through the slide rod (4). A fixed bracket (17) and a mounting plate (18) are positioned between the slide block (5) and the lifting drive seat (7). The mounting plate (18) is fixed to the lifting drive seat (7).

4. The multilayer circuit board hot melt welding anti-displacement device according to claim 2, characterized in that: The first support base (1) is fixed to the cylinder assembly (2) by a fixing plate (13). The cylinder assembly (2) drives the piston rod (3) to extend and retract. The piston rod (3) is fixed to the connecting plate (15) by a connector (16).

5. The multilayer circuit board hot melt welding anti-displacement device according to claim 3, characterized in that: The slide block (5) moves horizontally on the slide rod (4) through the slide groove (6), and the slide block (5) and the lifting drive seat (7) are fixed together by the fixing bracket (17) and the mounting plate (18).

6. The multilayer circuit board hot melt welding anti-displacement device according to claim 1, characterized in that: The lifting rod (19) moves up and down at the bottom of the lifting drive seat (7). The lifting rod (19) drives the hot melt control box (20) and the hot melt plate (21) to move up and down. The hot melt plate (21) is pressed down and overlaps with the quick-install positioning groove (9). At this time, the horizontal hot melt head (25) and the vertical hot melt head (26) at the lower end of the hot melt plate (21) contact the horizontal hot melt part (22) and the vertical hot melt part (24) on the circuit board assembly (23).

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