A heat dissipation module for electronic devices

Abstract

This application relates to the field of heat dissipation module technology, specifically disclosing a heat dissipation module for electronic devices, including a base, a heat-conducting part, and a heat dissipation mechanism. The bottom of the base is integrally formed with a contact part for contacting electronic components. The heat-conducting part is located above the base and corresponds to the contact part. The heat dissipation mechanism includes a heat sink plate, which covers the heat-conducting part and is fixed above the base. The upper surface of the heat sink plate is integrally formed with several heat dissipation channels. The heat dissipation module provided by this application has a relatively simple overall structure by installing the heat-conducting part on the base and fixing the heat dissipation mechanism to the base and the heat-conducting part. When installed with electronic devices, the contact part can directly contact the electronic components in the electronic devices. In this way, the heat generated by the electronic components can be conducted through the heat-conducting part to multiple heat dissipation channels for rapid discharge, greatly improving the heat dissipation efficiency and having high application value.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation module technology, and in particular to a heat dissipation module for electronic devices. Background Technology

[0002] In recent years, the rapid changes in computer communication and consumer electronic devices have led to an increase in the overall performance of computer technology, resulting in higher operating frequencies for various components and increased power consumption. Furthermore, with the rapid development of electronic technology, the size of electronic devices has been continuously reduced, leading to a greater increase in heat generation per unit volume. However, the reliability of electronic components decreases as temperature rises. Therefore, achieving high heat dissipation has become an urgent problem to be solved.

[0003] However, although many heat dissipation modules have been disclosed in the existing technology, their overall structure is too complex and their heat dissipation quality is relatively poor.

[0004] To address this issue, this application discloses a heat dissipation module for electronic devices. Utility Model Content

[0005] To overcome the shortcomings of the existing technology, this utility model discloses a heat dissipation module for electronic devices.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is: an electronic device heat dissipation module, including a base, a heat-conducting part, and a heat dissipation mechanism. The bottom of the base is integrally formed with a contact part for contacting electronic components. The heat-conducting part is located above the base and corresponds to the contact part. The heat dissipation mechanism includes a heat dissipation plate, which covers the heat-conducting part and is fixed above the base. The upper surface of the heat dissipation plate is integrally formed with a plurality of heat dissipation air channels.

[0007] As a preferred embodiment of this application, the base and the heat dissipation mechanism are both made of aluminum.

[0008] As a preferred embodiment of this application, the base has a plurality of threaded posts for installation distributed around its bottom perimeter.

[0009] As a preferred embodiment of this application, the number of contact portions is provided in multiples.

[0010] As a preferred embodiment of this application, the base has an installation groove on its upper surface, and the heat-conducting part is arranged in the installation groove.

[0011] As a preferred embodiment of this application, the heat-conducting part is configured with a corrugated structure and is made of copper.

[0012] In a preferred embodiment of this application, the heat sink and the base are fixed by heat pressing and / or by screws.

[0013] As a preferred embodiment of this application, several heat dissipation air ducts are arranged in a wind-line pattern.

[0014] This utility model achieves the following beneficial effects:

[0015] The heat dissipation module provided in this application has a relatively simple overall structure by mounting the heat-conducting part on the base and covering the heat dissipation mechanism with the heat-conducting part and fixing it to the base. When installed with electronic devices, the contact part can directly contact the electronic components in the electronic devices. In this way, the heat generated by the electronic components can be conducted to the heat dissipation channel through the heat-conducting part and quickly discharged, greatly improving the heat dissipation efficiency and having high application value.

[0016] Other features and advantages of this invention will be set forth in the following description and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention can be realized and obtained through the structures pointed out in the description and the accompanying drawings. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the specification, serve to explain the principles of the disclosure.

[0018] Figure 1 This is a schematic diagram of the overall structure disclosed in this utility model;

[0019] Figure 2 This is a schematic diagram of the exploded structure disclosed in this utility model;

[0020] Figure 3 This is a front structural diagram of the present utility model;

[0021] Figure 4 This is a schematic diagram of the reverse side structure disclosed in this utility model;

[0022] In the diagram: 10, base; 11, contact part; 12, mounting groove; 20, heat-conducting part; 30, heat dissipation mechanism; 31, heat sink; 32, heat dissipation duct; 40, screw. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0024] In the description of this utility model, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around" and other terms indicating orientation or positional relationship are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0025] Example

[0026] To address the issues of overly complex overall structures and relatively poor heat dissipation quality in existing electronic heat dissipation modules, reference is made to... Figures 1-4 As shown, this application discloses a heat dissipation module for an electronic device, including a base 10, a heat-conducting part 20, and a heat dissipation mechanism 30. The base 10 and the heat dissipation mechanism 30 are both made of aluminum, which can reduce the weight of the entire heat dissipation module. The bottom of the base 10 is integrally formed with a contact part 11 for contacting electronic components. Of course, the contact part 11 of this application can be provided with multiple parts for contacting multiple electronic components. The heat-conducting part 20 is located above the base 10 and corresponds to the contact part 11. As a preferred embodiment, the heat-conducting part 20 is set with a wave-shaped structure and is made of copper, which has a better heat conduction effect. The heat dissipation mechanism 30 includes a heat dissipation plate 31, which covers the heat-conducting part 20 and is fixed above the base 10. As a preferred embodiment, the heat dissipation plate 31 and the base 10 are fixed by hot pressing and / or by screws 40. The upper surface of the heat dissipation plate 31 is integrally formed with a plurality of heat dissipation air channels 32, which are arranged in a wind-line shape.

[0027] In practical implementation, the heat-conducting part 20 is installed on the base 10 and the heat dissipation mechanism 30 is covered and fixed to the heat-conducting part 20 and the base 10. The overall structure is relatively simple. When installed with electronic equipment, the contact part 11 can directly contact the electronic components in the electronic equipment. In this way, the heat generated by the electronic components can be conducted to the heat dissipation duct 32 through the heat-conducting part 20 and quickly discharged, greatly improving the heat dissipation efficiency.

[0028] To facilitate subsequent installation with electronic devices, this application has several threaded posts distributed around the bottom of the base 10 for installation. In specific implementation, the base 10 can be fixed to the electronic device by screwing screws into the threaded holes. Considering that the electronic device is not entirely a planar structure, the height of the threaded posts can be set to be different to facilitate the fixing of the base 10 to the electronic device.

[0029] In one embodiment, the present application provides an installation groove 12 above the base 10, and the heat-conducting part 20 is arranged in the installation groove 12. Based on this design, when the heat-conducting part 20 is placed inside the installation groove 12, the entire upper surface of the base 10 can be kept horizontal, and there will be no tilting when the heat sink 31 is installed with it. In this way, the heat-conducting part 20 can stably discharge heat through several heat dissipation channels 32.

[0030] In the description of this specification, the references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0031] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the scope of protection of this utility model.

Claims

1. An electronic device heat dissipation module, characterized in that, The device includes a base (10), a heat-conducting part (20), and a heat dissipation mechanism (30). The bottom of the base (10) is integrally formed with a contact part (11) for contacting electronic components. The heat-conducting part (20) is located above the base (10) and corresponds to the contact part (11). The heat dissipation mechanism (30) includes a heat sink (31). The heat sink (31) covers the heat-conducting part (20) and is fixed above the base (10). The upper surface of the heat sink (31) is integrally formed with a plurality of heat dissipation channels (32).

2. The heat dissipation module of claim 1, wherein, The base (10) and the heat dissipation mechanism (30) are both made of aluminum.

3. The heat dissipation module for an electronic device according to claim 1, characterized in that, The base (10) has several threaded posts for installation distributed around its bottom.

4. The heat dissipation module for an electronic device according to claim 1, characterized in that, The number of contact portions (11) is set to multiple.

5. The heat dissipation module for an electronic device according to claim 1, characterized in that, The base (10) has an installation groove (12) on its upper part, and the heat-conducting part (20) is arranged in the installation groove (12).

6. The heat dissipation module for an electronic device according to claim 5, characterized in that, The heat-conducting part (20) is configured with a wave-shaped structure and is made of copper.

7. The heat dissipation module for an electronic device according to claim 1, characterized in that, The heat sink (31) is fixed to the base (10) by hot pressing and / or by screws (40).

8. The heat dissipation module for an electronic device according to claim 1, characterized in that, Several heat dissipation air ducts (32) are arranged in a wind line shape.

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