Heat dissipation devices and photovoltaic inverters

Abstract

This application provides a heat dissipation device and a photovoltaic inverter, relating to the field of heat dissipation equipment technology. The heat dissipation device includes: an evaporation assembly, a condensation assembly, a liquid collection component, an evaporation tube, a return pipe, and a duct plate. The evaporation assembly has an evaporation chamber; the condensation assembly has a condensation chamber, a condensation inlet, and a condensation outlet, both of which are connected to the condensation chamber; the liquid collection component has a separately arranged return chamber and an evaporation chamber, which are connected to the evaporation chamber body. The evaporation chamber is connected to the condensation chamber body via the condensation inlet, and the return chamber is connected to the evaporation chamber body via the condensation outlet. The heat dissipation device and photovoltaic inverter provided in this application, with their integrated structure, help reduce size and weight and improve heat dissipation efficiency, thereby meeting the heat dissipation requirements of high-power inverters.

Description

Technical Field

[0001] This application relates to the field of heat dissipation equipment technology, and more particularly to a heat dissipation device and a photovoltaic inverter. Background Technology

[0002] Heat sinks are core heat dissipation components in fields such as computers, automobiles, and industrial equipment. They prevent equipment from overheating by effectively conducting and releasing heat. Heat sinks quickly transfer heat from the heat source to the heat dissipation surface and diffuse it with the help of air or liquid cooling systems. This ensures that critical components operate within a safe temperature range, thereby maintaining stable equipment performance, significantly extending service life, and preventing component damage or system failure caused by high temperature accumulation.

[0003] In photovoltaic inverters, the heat sink is in direct contact with the Insulated Gate Bipolar Transistor (IGBT), absorbing heat and dissipating it through a fan to prevent overheating that could lead to performance degradation or damage to the IGBT. Currently, serrated heat sinks, extruded aluminum heat sinks, heat pipe heat sinks, or thermosiphon heat sinks are commonly used for heat dissipation of the IGBT.

[0004] However, the aforementioned thermosiphon radiators are relatively large in size. The toothed radiator, aluminum extrusion radiator, and heat pipe radiator not only have low heat dissipation efficiency and cannot meet the heat dissipation requirements of high-power inverters, but are also large in size and heavy in weight. Utility Model Content

[0005] This application provides a heat dissipation device and a photovoltaic inverter to solve the problems of large size and weight and low heat dissipation efficiency of existing heat sinks.

[0006] On one hand, this application provides a heat dissipation device, including:

[0007] Evaporation assembly, having an evaporation chamber;

[0008] The condensing assembly has a condensing chamber, a condensing inlet, and a condensing outlet, both of which are connected to the condensing chamber.

[0009] The liquid collecting unit has a separately arranged reflux chamber and an evaporation chamber; the evaporation chamber and the evaporation chamber body are connected, and the evaporation chamber is connected to the condensation chamber body through a condensation inlet; the reflux chamber and the evaporation chamber are connected, and the reflux chamber is connected to the condensation chamber body through a condensation outlet.

[0010] In the above-mentioned heat dissipation device, it is possible to have the liquid collection component equipped with an evaporation connection hole, a reflux connection hole, a condensation inlet connection hole, and a condensation outlet connection hole.

[0011] The evaporation chamber is connected to the evaporation connection hole and is also connected to the evaporation chamber body through the evaporation connection hole; the evaporation chamber is connected to the condensation inlet connection hole.

[0012] The reflux chamber is connected to the reflux connection hole and is also connected to the evaporation chamber through the reflux connection hole; the reflux chamber is connected to the condensation outlet connection hole.

[0013] In the aforementioned heat dissipation device, it is possible to further include an evaporation pipe and a return pipe;

[0014] The evaporation tube connects the evaporation chamber and the evaporation connection hole, and the reflux tube connects the reflux chamber and the reflux connection hole.

[0015] In the above-mentioned heat dissipation device, it is possible to realize that the evaporation assembly includes an evaporation substrate and an evaporation cover plate, and the evaporation substrate and the evaporation cover plate are connected together.

[0016] An evaporation substrate and an evaporation cover plate are arranged to form an evaporation cavity. The evaporation cover plate is provided with an evaporation tube connection hole and a reflux tube connection hole that communicate with the evaporation cavity, corresponding to the position of the evaporation cavity.

[0017] The evaporator tube connection hole is connected to the evaporator tube, and the reflux tube connection hole is connected to the reflux tube.

[0018] In the above-mentioned heat dissipation device, it is possible to include a condensation assembly comprising multiple condenser tubes and heat dissipation components disposed on the condenser tubes;

[0019] A portion of the condenser tubes are connected to the condenser inlet connection hole, while another portion are connected to the condenser outlet connection hole.

[0020] In the aforementioned heat dissipation device, it is possible to have multiple condenser tubes extending in the same direction;

[0021] The heat sink includes multiple heat sink fins, which are spaced apart along the extension direction of the condenser tube.

[0022] In the aforementioned heat dissipation device, it is possible to have at least two liquid collection components, with each of the at least two liquid collection components being disposed at both ends of the condensation assembly and located on one side of the evaporation assembly.

[0023] In the aforementioned heat dissipation device, it is possible to have at least two condensation components, both of which are located on the same side of the evaporation component.

[0024] In the above-mentioned heat dissipation device, it is possible to further include an air duct plate, which is disposed on the side of the condensing component away from the evaporating component and connected to the evaporating component.

[0025] A heat dissipation channel is formed between the air duct plate and the evaporation component.

[0026] On the other hand, this application provides a photovoltaic inverter, comprising:

[0027] Heating element;

[0028] In the aforementioned heat dissipation device, the heat-generating element is thermally connected to the heat dissipation device.

[0029] The heat dissipation device provided in this application improves the integration of the heat dissipation device by placing the liquid collecting component on one side of the evaporation component and the condensation component between the two liquid collecting components, which helps to reduce the size and weight. By separately setting the evaporation chamber and the return chamber in the liquid collecting component, and connecting the evaporation pipe and the return pipe to the evaporation chamber and the return chamber respectively to form separate flow paths, the mutual interference between the gaseous cooling medium and the liquid cooling medium is avoided, the gas-liquid conversion is accelerated, and the heat dissipation efficiency is improved. By setting multiple heat dissipation fins on the condensation component, the heat dissipation area is increased. By setting an air duct plate on the side of the condensation component away from the evaporation component, a heat dissipation channel is formed with the evaporation component, and the heat dissipation efficiency is further improved, thereby meeting the heat dissipation requirements of high-power inverters. Attached Figure Description

[0030] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0031] Figure 1 An exploded view of the heat dissipation device provided in the embodiments of this application;

[0032] Figure 2 A schematic diagram of the liquid collection component of the heat dissipation device provided in an embodiment of this application;

[0033] Figure 3 A schematic diagram of the liquid collection component of the heat dissipation device provided in an embodiment of this application from another perspective;

[0034] Figure 4 A schematic diagram showing the connection of the evaporator pipe, return pipe, and condenser pipe of the heat dissipation device provided in the embodiments of this application;

[0035] Figure 5 This is a schematic diagram of the evaporation assembly of the heat dissipation device provided in the embodiments of this application;

[0036] Figure 6 This is a schematic diagram of the condensation assembly of the heat dissipation device provided in the embodiments of this application;

[0037] Figure 7 This is a schematic diagram of the air duct plate of the heat dissipation device provided in the embodiments of this application.

[0038] Explanation of reference numerals in the attached figures:

[0039] 100. Evaporation assembly; 110. Evaporation substrate; 111. Evaporation chamber; 112. Heat pipe; 120. Evaporation cover plate; 121. Evaporation pipe connection hole; 122. Reflux pipe connection hole;

[0040] 200. Condensation assembly; 210. Condensation tube; 211. First condensation inlet; 212. First condensation outlet; 213. Second condensation inlet; 214. Second condensation outlet; 220. Heat dissipation fins; 230. Condensation chamber;

[0041] 300. Liquid collecting device; 310. First liquid collecting device; 311. First evaporation chamber; 312. First evaporation connection hole; 313. First reflux chamber; 314. First reflux connection hole; 315. First condenser inlet connection hole; 316. Second condenser outlet connection hole; 320. Second liquid collecting device; 321. Second evaporation chamber; 322. Second evaporation connection hole; 323. Second reflux chamber; 324. Second reflux connection hole; 325. Second condenser inlet connection hole; 326. First condenser outlet connection hole;

[0042] 400, Evaporator tube; 410, First evaporator tube; 420, Second evaporator tube;

[0043] 500, Reflux tube; 510, First Reflux tube; 520, Second Reflux tube;

[0044] 600, air duct plate; 610, heat dissipation channel.

[0045] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0046] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0047] In related technologies, aluminum extrusion radiators are formed by high-temperature extrusion of aluminum materials. The structure is mostly a simple straight fin design with limited heat dissipation area. Furthermore, due to the thermal conductivity of aluminum, the heat conduction rate is low and the heat dissipation efficiency is insufficient, making it difficult to meet the heat dissipation requirements of high-power inverters. The toothed radiator uses a high-precision toothing process to cut the metal block to form an integrated dense fin structure. The thicker base plate and the thin and tall fin design increase the vertical space occupied, resulting in a large size and increased weight of the radiator. Some thermosiphon radiators adopt a split structure, where the evaporator and condenser are directly connected by heat pipes. Some of the pipes are too long, resulting in a loose structure and low integration, leading to a large size. Others are too short, which can cause thermal short circuits and low heat dissipation efficiency.

[0048] In view of this, this application provides a heat dissipation device, including an evaporation assembly, a condensation assembly, a liquid collection component, an evaporation tube, a return pipe, and an air duct plate. The evaporation assembly contains an evaporation chamber, the condensation assembly contains a condensation chamber, and the liquid collection component contains an evaporation chamber and a return chamber. The liquid collection component is connected to one side of the evaporation assembly via the evaporation tube and the return pipe. One end of the evaporation tube and the return pipe are connected to the evaporation chamber, and the other end is connected to the evaporation chamber and the return chamber, respectively. The condensation assembly is disposed between the two liquid collection components, and the evaporation chamber and the return chamber are in communication with the condensation chamber. The air duct plate is disposed on the side of the condensation assembly opposite to the evaporation assembly. By placing the liquid collector on one side of the evaporator and the condenser between the two liquid collectors, the integration of the heat dissipation device is improved, which helps to reduce its size and weight. By separating the evaporation chamber and the return chamber in the liquid collector, and connecting the evaporator pipe and the return pipe to the evaporator and the return chamber respectively to form separate flow paths, the mutual interference between the gaseous and liquid cooling media is avoided, the gas-liquid conversion is accelerated, and the heat dissipation efficiency is improved. By setting multiple heat dissipation fins on the condenser, the heat dissipation area is increased. By setting an air duct plate on the side of the condenser away from the evaporator, a heat dissipation channel is formed with the evaporator, and the heat dissipation efficiency is further improved, thereby meeting the heat dissipation requirements of high-power inverters.

[0049] On the one hand, refer to Figure 1 As shown, this application provides a heat dissipation device, which includes: an evaporation assembly 100 having an evaporation chamber 111; a condensation assembly 200 having a condensation chamber 230, a condensation inlet, and a condensation outlet, both of which are connected to the condensation chamber 230; and a liquid collection component 300 having a separately arranged reflux chamber and an evaporation chamber; the evaporation chamber and the evaporation chamber 111 are connected, and the evaporation chamber is connected to the condensation chamber 230 through the condensation inlet; the reflux chamber and the evaporation chamber 111 are connected, and the reflux chamber is connected to the condensation chamber 230 through the condensation outlet.

[0050] Exemplarily, the heat dissipation device provided in this application includes an evaporation assembly 100, a condensation assembly 200, and a liquid collection unit 300. The condensation assembly 200 is connected between two liquid collection units 300. The condensation assembly 200 and the liquid collection units 300 are disposed on one side of the evaporation assembly 100, which improves the integration of the heat dissipation device of this application and helps to reduce its size and weight. The evaporation assembly 100 has an evaporation chamber 111 inside, and the evaporation chamber 111 has a cooling medium. The evaporation assembly 100 transfers the heat released by the heating element to the cooling medium, causing the cooling medium to absorb heat and evaporate. The liquid collection unit 300 is provided with an evaporation chamber and a reflux chamber. The evaporation chamber and the reflux chamber are respectively connected to the evaporation chamber 111. One end of the condensation chamber 230 is connected to the evaporation chamber through a condensation inlet, and the other end is connected to the reflux chamber through a condensation outlet, forming a cooling medium circulation loop. Therefore, the liquid collecting unit 300 can transfer the vaporized cooling medium to the condensing component 200 through the evaporation chamber. The condensing component 200 cools and liquefies the gaseous cooling medium, releasing heat. The liquid cooling medium is then returned to the evaporation chamber 111 through the return chamber in the liquid collecting unit 300, forming a heat dissipation cycle.

[0051] The separate design of the evaporation component 100 and the condensation component 200 allows for independent evaporation or condensation of the cooling medium. This not only avoids vibration interference caused by phase change of the cooling medium in the evaporation component 100 and the condensation component 200, but also reduces thermal short circuits and prevents heat from being directly conducted to the condensation component 200.

[0052] The liquid collector 300 serves as an intermediate component connecting the evaporator assembly 100 and the condenser assembly 200, allowing for quick disassembly and maintenance in case of malfunction. The liquid collector 300 internally features independent evaporation and reflux chambers, preventing interference between the gaseous cooling medium flowing from the evaporator assembly 100 and the liquid cooling medium condensed by the condenser assembly 200, thereby improving heat dissipation efficiency. The liquid collector 300 is welded onto the evaporator assembly 100, allowing it to withstand internal mechanical vibrations caused by phase changes in the cooling medium, reducing malfunctions due to vibration or displacement, and increasing the structural stability of both the liquid collector 300 and the evaporator assembly 100. The cooling medium can be water, acetone, fluorinated liquid, etc.

[0053] In one feasible implementation, the liquid collecting device 300 is provided with an evaporation connection hole, a reflux connection hole, a condensation inlet connection hole, and a condensation outlet connection hole; the evaporation chamber is connected to the evaporation connection hole and is connected to the evaporation chamber body 111 through the evaporation connection hole; the evaporation chamber is connected to the condensation inlet connection hole; the reflux chamber is connected to the reflux connection hole and is connected to the evaporation chamber body 111 through the reflux connection hole; the reflux chamber is connected to the condensation outlet connection hole.

[0054] For example, the liquid collecting device 300 may be a container made of stainless steel and formed by vacuum welding, used to temporarily store the cooling medium. The liquid collecting device 300 includes a first liquid collecting device 310 and a second liquid collecting device 320. The first liquid collecting device 310 is located on the left side of the evaporation assembly 100, and the second liquid collecting device 320 is located on the right side of the evaporation assembly 100.

[0055] The first liquid collecting device 310 is provided with a first evaporation connection hole 312, a first reflux connection hole 314, a first condensation inlet connection hole 315, and a first condensation outlet connection hole 326. The first liquid collecting device 310 is also provided with a first evaporation chamber 311 and a first reflux chamber 313. The first evaporation connection hole 312, the first evaporation chamber 311, and the first condensation inlet connection hole 315 are interconnected, and the first reflux connection hole 314, the first reflux chamber 313, and the first condensation outlet connection hole 326 are interconnected. The second liquid collecting device 320 is provided with a second evaporation connection hole 322, a second reflux connection hole 324, a second condensation inlet connection hole 325, and a second condensation outlet connection hole 316. The second liquid collecting device 320 is also provided with a second evaporation chamber 321 and a second reflux chamber 323. The second evaporation connection hole 322, the second evaporation chamber 321, and the second condensation inlet connection hole 325 are interconnected, and the second reflux connection hole 324, the second reflux chamber 323, and the second condensation outlet connection hole 316 are interconnected.

[0056] The evaporation connection hole is higher than the reflux connection hole, and the condensation inlet connection hole is parallel to and higher than the evaporation connection hole. This can prevent the condensed cooling medium from flowing back into the evaporation chamber due to gravity, ensuring that the gaseous and liquid cooling media are in a separate state, thereby avoiding mutual interference.

[0057] As one feasible implementation, the heat dissipation device also includes an evaporation pipe 400 and a return pipe 500, wherein the evaporation pipe 400 connects the evaporation chamber and the evaporation connection hole, and the return pipe 500 connects the return chamber and the return connection hole.

[0058] For example, the evaporator 400 and the return pipe 500 are used to connect the evaporator assembly 100 and the liquid collector 300. The evaporator 400 quickly transports the gaseous cooling medium in the evaporator chamber 111 to the evaporator chamber in the liquid collector 300. The return pipe 500 quickly returns the liquid cooling medium cooled by the condenser assembly 200 to the evaporator chamber 111 under the action of gravity. The evaporator 400 and the return pipe 500 are designed independently to avoid mutual interference between the gaseous cooling medium and the liquid cooling medium, which helps to reduce flow resistance and thus improve the heat dissipation circulation efficiency.

[0059] Evaporator tube 400 includes a first evaporator tube 410 and a second evaporator tube 420. One end of the first evaporator tube 410 is connected to the evaporator cavity 111, and the other end is connected to the first evaporator cavity 311 through the first evaporation connection hole 312. One end of the second evaporator tube 420 is connected to the evaporator cavity 111, and the other end is connected to the second evaporator cavity 321 through the second evaporation connection hole 322. Reflux tube 500 includes a first reflux tube 510 and a second reflux tube 520. One end of the first reflux tube 510 is connected to the evaporator cavity 111, and the other end is connected to the first reflux cavity 313 through the first reflux connection hole 314. One end of the second reflux tube 520 is connected to the evaporator cavity 111, and the other end is connected to the second evaporator cavity 321 through the second reflux connection hole 324. This allows the gaseous cooling medium of the evaporator assembly 100 to flow from two passages to the two evaporator cavities 111, increasing the flow rate of the gaseous cooling medium and thus improving heat dissipation efficiency.

[0060] The evaporator tube 400 and the reflux tube 500 can be round, square or any other shape. The evaporator tube connection hole 121 and the evaporation connection hole have the same shape as the evaporator tube 400. The reflux tube connection hole 122 and the reflux connection hole have the same shape as the reflux tube 500.

[0061] In one feasible implementation, the evaporation assembly 100 includes an evaporation substrate 110 and an evaporation cover plate 120, which are connected in a mating manner. The evaporation substrate 110 and the evaporation cover plate 120 enclose an evaporation chamber 111. The evaporation cover plate 120 is provided with an evaporation tube connection hole 121 and a reflux tube connection hole 122, which are connected to the evaporation chamber 111, at a position corresponding to the evaporation chamber 111. The evaporation tube connection hole 121 is connected to the evaporation tube 400, and the reflux tube connection hole 122 is connected to the reflux tube 500.

[0062] Exemplarily, the evaporation assembly 100 includes an evaporation substrate 110 and an evaporation cover plate 120. A first side of the evaporation substrate 110 is used to connect a heating element, and a second side, together with the evaporation cover plate 120, forms an evaporation cavity 111. The evaporation cavity 111 is formed by creating slots in the evaporation substrate 110, and there are two evaporation cavities 111. In other embodiments, slots are simultaneously created at corresponding positions on both the evaporation substrate 110 and the evaporation cover plate 120 to form the evaporation cavity 111. The evaporation cavity 111 can be a single cavity or multiple independent cavities. Furthermore, multiple heat-conducting pipes 112 are disposed inside the evaporation cavity 111. The extending direction of the heat-conducting pipes 112 is perpendicular to the evaporation assembly 100, and they are arranged in an array within the evaporation cavity 111 along a direction parallel to the evaporation assembly 100. The multiple heat-conducting pipes 112 are used to transfer the heat released by the heating element to the cooling medium in the evaporation cavity 111. The heat-conducting pipes 112 can be circular, square, wavy, needle-shaped, etc.

[0063] The evaporator cover plate 120 is provided with an evaporator tube connection hole 121 and a return pipe connection hole 122. The evaporator tube connection hole 121 is higher than the return pipe connection hole 122, and the evaporator tube 400 is also higher than the return pipe 500. This prevents the returning cooling medium from flowing back into the evaporator tube 400 and avoids mutual interference with the rising gaseous cooling medium after evaporation. The evaporator tube 400 and the return pipe 500 are connected to the evaporation chamber 111 through the evaporator tube connection hole 121 and the return pipe connection hole 122.

[0064] The aforementioned evaporation substrate 110 can be an aluminum alloy die-casting part, a cold plate, an aluminum profile, etc. The evaporation substrate 110 and the evaporation cover plate 120 can be friction stir welded or brazed, etc., which can ensure the sealing of the evaporation chamber 111.

[0065] In one feasible implementation, the condensation assembly 200 includes a plurality of condenser tubes 210 and heat dissipation components disposed on the condenser tubes 210; a portion of the condenser tubes 210 are connected to a condensation inlet connection hole, and another portion of the condenser tubes 210 are connected to a condensation outlet connection hole.

[0066] In one feasible implementation, the multiple condenser tubes 210 extend in the same direction; the heat dissipation component includes multiple heat dissipation fins 220, which are spaced apart along the extension direction of the condenser tubes 210.

[0067] For example, multiple condenser tubes 210 extend in the same direction and are perpendicularly connected to the liquid collection components 300 between two liquid collection components 300, and are spaced above the evaporator tubes 400 to prevent the backflow of gaseous cooling medium flowing into the condenser assembly 200. The condenser tubes 210 have a condensation cavity 230 inside, and both ends of the condenser tubes 210 are connected to the liquid collection components 300. Specifically, the condenser tubes 210 include a first condenser tube and a second condenser tube. The first condenser tube is located on the side away from the evaporator assembly 100, and the second condenser tube is located on the side close to the evaporator assembly 100. One end of the first condenser tube is connected to the first evaporator cavity 311 through the first condenser inlet connection hole 315, and the other end is connected to the second reflux cavity 323 through the second condenser outlet connection hole 316. One end of the second condenser tube is connected to the second evaporator cavity 321 through the second condenser inlet connection hole 325, and the other end is connected to the first reflux cavity 313 through the first condenser outlet connection hole 326. Specifically, a portion of the cooling medium evaporated by the evaporation assembly 100 flows through the first evaporation tube 410, through the first evaporation chamber 311, and then into the first condenser tube for phase change. The cooled liquid cooling medium then flows into the second reflux chamber 323 and then back to the evaporation chamber 111 through the second reflux pipe 520, forming a heat dissipation cycle. The other portion of the cooling medium flows through the second evaporation tube 420, through the second evaporation chamber 321, and then into the second condenser tube for phase change. The cooled medium then flows into the first reflux chamber 313 and then back to the evaporation chamber 111 through the first reflux pipe 510, forming a heat dissipation cycle. In this way, the evaporation tube 400, the liquid collection unit 300, the condenser assembly 200, and the reflux pipe 500 form two circulation loops simultaneously for phase change circulation of the cooling medium, increasing the flow rate of the cooling medium and thus improving the heat dissipation efficiency.

[0068] A condensation chamber 230 is formed inside the condenser tube 210. The condenser tube 210 has a condensation inlet and a condensation outlet. The first condenser tube and the second condenser tube have a first condensation inlet 211 and a second condensation outlet 214 respectively at the end near the first liquid collector 310, and a first condensation outlet 212 and a second condensation inlet 213 respectively at the end near the second liquid collector 320. The first condensation outlet 212 extends into the first return chamber 313 of the first liquid collector 310, and the second condensation outlet 214 extends into the second return chamber 323 of the second liquid collector 320. This allows the liquid cooling medium to quickly return to the return chamber under the action of gravity, increasing the flow rate of the cooling medium.

[0069] For example, the heat dissipation fins 220 are perpendicular to the extension direction of the condenser tube 210. Multiple heat dissipation fins 220 are riveted to the condenser tube 210, which helps to increase the heat dissipation area. The riveting method improves the structural stability and vibration resistance of the condenser assembly 200. Then, the thermal resistance between the fins and the copper tube is reduced by brazing in a brazing furnace, which further improves the heat dissipation efficiency of the heat dissipation fins 220.

[0070] In the heat dissipation device provided in this application embodiment, the condenser tubes 210 are copper tubes, and there are twelve of them. The six condenser tubes 210 on the side facing away from the evaporator assembly 100 are the first condenser tubes, and the six condenser tubes 210 on the side facing closer to the evaporator assembly 100 are the second condenser tubes. In other embodiments, the condenser tubes 210 can also be aluminum tubes, and the shape of the condenser tubes 210 can be square or any other shape. The condenser tube inlet connection hole and the condenser tube outlet connection hole are consistent with the shape of the condenser tubes 210.

[0071] As one feasible implementation, there are at least two liquid collection units 300, which are respectively disposed at both ends of the condensation assembly 200 and located on one side of the evaporation assembly 100.

[0072] As one possible implementation, there are at least two condensation components 200, both of which are disposed on the same side of the evaporation component 100.

[0073] For example, in the heat dissipation device provided in this application embodiment, there are two condensation components 200, two liquid collection elements 300 are provided at both ends of the condensation components 200, and two evaporation chambers 111 are provided on the evaporation substrate 110, forming two independent upper and lower parts, thereby improving heat dissipation efficiency and reliability. In other embodiments, there can be three, four, or even more evaporation chambers 111 and condensation components 200. Since the two liquid collection elements 300 are provided at both ends of the condensation components 200, the number of liquid collection elements 300 is twice that of the condensation components 200. By designing the condensation components 200 and evaporation chambers 111 independently, heat dissipation can be uniformly applied to the heat-generating elements.

[0074] As one feasible implementation, the heat dissipation device also includes a duct plate 600, which is disposed on the side of the condensing assembly 200 away from the evaporating assembly 100 and connected to the evaporating assembly 100; a heat dissipation channel 610 is formed between the duct plate 600 and the evaporating assembly 100.

[0075] For example, the air duct plate 600, evaporation assembly 100, and liquid collection component 300 are welded together to form a closed heat dissipation channel 610, preventing airflow diffusion and increasing airflow concentration. A fan is installed below the heat dissipation channel 610, driving airflow along the inner wall of the air duct plate 600, thereby allowing the airflow to carry away the heat transferred to the heat dissipation fins 220 through the surface of the heat dissipation fins 220, further improving heat dissipation efficiency. The condensation assembly 200 is disposed within the heat dissipation channel 610, improving the integration of the heat dissipation device, which helps to reduce size and weight.

[0076] The specific heat dissipation process of the heat dissipation device provided in this application is as follows:

[0077] Reference Figure 4As shown, the straight arrows and dashed arrows represent the heat dissipation loops of the two cooling media during the heat dissipation process.

[0078] In the embodiments of this application, the heating element is installed on the evaporation substrate 110 of the evaporation assembly 100. When the heating element is working, the heat emitted is transferred to the evaporation chamber 111 through the heat pipe 112. The cooling medium in the evaporation chamber 111 absorbs the heat and evaporates and expands, forming an upward airflow. Under the action of the pressure difference between the evaporation assembly 100 and the condensation assembly 200, in the first heat dissipation circuit, taking the solid straight arrow as an example, the evaporated gaseous cooling medium enters the first liquid collector 310 through the first evaporation pipe 410, and enters the first condensation pipe of the condensation assembly 200 through the first evaporation chamber 311 of the first liquid collector 310, transferring the heat to the heat dissipation fins 220 of the condensation assembly 200. The heat is carried away by the heat dissipation fins 220 by the airflow driven by the external fan, causing the gaseous cooling medium in the condensation assembly 200 to gradually cool and liquefy. The liquefied cooling medium flows into the second return chamber 323 of the second liquid collector 320, and flows back to the bottom of the evaporation chamber 111 through the second return pipe 520, forming a heat dissipation cycle. In the second heat dissipation circuit, the flow direction of the cooling medium is opposite to that of the first circuit, which will not be explained in detail here.

[0079] On the other hand, this application provides a photovoltaic inverter, including: a heating element and the above-mentioned heat dissipation device, wherein the heating element and the heat dissipation device are thermally connected.

[0080] For example, the photovoltaic inverter provided in this application includes a heating element and the above-mentioned heat dissipation device. The heat dissipation element in the photovoltaic inverter is installed on the evaporation substrate 110 of the heat dissipation device. Through the action of the heat dissipation device, the heat released by the heat dissipation element is transferred to the cooling medium of the evaporation chamber 111 through the heat pipe 112. The cooling medium undergoes a phase change through the evaporation component 100 and the condensation component 200 to dissipate heat quickly, which can accelerate the heat dissipation efficiency of the heat dissipation device, thereby meeting the heat dissipation requirements of high-power inverters and extending the service life of the heating element and the photovoltaic inverter.

[0081] It should be noted that relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0082] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the utility models disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0083] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A heat dissipation device, characterized in that, include: Evaporation assembly (100) having evaporation chamber (111); A condensing assembly (200) has a condensing chamber (230), a condensing inlet, and a condensing outlet, wherein the condensing inlet and the condensing outlet are both connected to the condensing chamber (230); The liquid collection unit (300) has a separately arranged reflux chamber and an evaporation chamber; the evaporation chamber is connected to the evaporation chamber body (111), and the evaporation chamber is connected to the condensation chamber body (230) through the condensation inlet; the reflux chamber is connected to the evaporation chamber body (111), and the reflux chamber is connected to the condensation chamber body (230) through the condensation outlet.

2. The heat dissipation device according to claim 1, characterized in that, The liquid collecting component (300) is provided with an evaporation connection hole, a reflux connection hole, a condensation inlet connection hole and a condensation outlet connection hole; The evaporation chamber is connected to the evaporation connection hole and is also connected to the evaporation chamber body (111) through the evaporation connection hole; the evaporation chamber is connected to the condensation inlet connection hole. The reflux chamber is connected to the reflux connection hole and is connected to the evaporation chamber (111) through the reflux connection hole; the reflux chamber is connected to the condensation outlet connection hole.

3. The heat dissipation device according to claim 2, characterized in that, It also includes an evaporator (400) and a reflux pipe (500); The evaporation tube (400) connects the evaporation chamber and the evaporation connection hole, and the reflux tube (500) connects the reflux chamber and the reflux connection hole.

4. The heat dissipation device according to claim 3, characterized in that, The evaporation assembly (100) includes an evaporation substrate (110) and an evaporation cover plate (120), which are mated and connected. The evaporation substrate (110) and the evaporation cover plate (120) enclose the evaporation cavity (111). The evaporation cover plate (120) is provided with an evaporation tube connection hole (121) and a return tube connection hole (122) that communicate with the evaporation cavity (111) at the position corresponding to the evaporation cavity (111). The evaporator tube connection hole (121) is connected to the evaporator tube (400), and the reflux tube connection hole (122) is connected to the reflux tube (500).

5. The heat dissipation device according to claim 2, characterized in that, The condensation assembly (200) includes a plurality of condenser tubes (210) and heat dissipation components disposed on the condenser tubes (210); A portion of the condenser tubes (210) are connected to the condenser inlet connection hole, and another portion of the condenser tubes (210) are connected to the condenser outlet connection hole.

6. The heat dissipation device according to claim 5, characterized in that, The multiple condenser tubes (210) extend in the same direction; The heat sink includes a plurality of heat sink fins (220), which are spaced apart along the extension direction of the condenser tube (210).

7. The heat dissipation device according to any one of claims 1-6, characterized in that, There are at least two liquid collection units (300), and the at least two liquid collection units (300) are respectively disposed at both ends of the condensation assembly (200) and located on one side of the evaporation assembly (100).

8. The heat dissipation device according to any one of claims 1-6, characterized in that, There are at least two condensation components (200), all of which are located on the same side of the evaporation component (100).

9. The heat dissipation device according to any one of claims 1-6, characterized in that, It also includes a duct plate (600), which is disposed on the side of the condensing assembly (200) away from the evaporating assembly (100) and connected to the evaporating assembly (100); A heat dissipation channel (610) is formed between the air duct plate (600) and the evaporation component (100).

10. A photovoltaic inverter, characterized in that, include: Heating element; The heat dissipation device according to any one of claims 1-9, wherein the heating element is thermally connected to the heat dissipation device.

Images