A water-cooled radiator and workstation

Abstract

This utility model relates to the field of radiator technology, and in particular to a water-cooled radiator and workstation. The water-cooled radiator includes a water block, a water pump, a radiator, and a cooling fan. The water block includes a base plate, first heat dissipation fins, a fin cover, and a top cover. The first heat dissipation fins are disposed in a first mounting groove on the base plate, and the fin cover covers the first heat dissipation fins. The base plate is provided with a heat absorption seat. The top cover has a first flow channel, a heat exchange groove, a second flow channel, a third flow channel, and a fourth flow channel. The first heat dissipation fins and the fin cover are embedded in the heat exchange groove. The cross-sectional area S1 of the first flow channel is locally narrowed. The cross-sectional area S2 of the second flow channel is smaller than the cross-sectional area S3 of the third flow channel. The heat exchange groove connects the second and third flow channels, and the fourth flow channel connects to the third flow channel. The refrigerant enters the heat dissipation fins for heat exchange through the first flow channel, the first path of refrigerant exits through the second flow channel, and the second path of refrigerant exits through the fourth flow channel. The refrigerant can fully exchange heat with the heat dissipation fins, which helps to improve the efficiency of heat exchange.

Description

Technical Field

[0001] This utility model relates to the field of radiator technology, and in particular to a water-cooled radiator and workstation. Background Technology

[0002] A liquid cooling radiator is a device that uses a liquid (working fluid) as the heat transfer medium, replacing the air medium of traditional air-cooled radiators, to achieve efficient heat transfer and dissipation. Its core advantage lies in the fact that the specific heat capacity of liquid is much higher than that of air, which can more quickly and stably absorb and remove the heat generated by heat-generating components (such as CPUs, GPUs, server chips, etc.), making it particularly suitable for scenarios with high power density and high requirements for heat dissipation efficiency and quiet operation.

[0003] To improve heat conduction and dissipation efficiency, some water blocks incorporate cooling fins. These fins increase the contact area with the refrigerant, resulting in higher heat conduction efficiency. However, some cooling fins are simply placed within the cavity without proper design of the internal flow channels of the water block. Consequently, the refrigerant cannot effectively carry away heat, and the heat transfer efficiency between the refrigerant and the cooling fins is generally low, affecting overall heat dissipation efficiency.

[0004] For example, Chinese patent application number CN201420044357.5 discloses a high-efficiency CPU cooler, specifically stating that "the base plate of the water-cooling head is a water-cooled copper base, and the side of the water-cooled copper base located in the inner cavity of the water-cooling head is the inner surface, with densely arranged fine grooves in parallel on the inner surface." These fine grooves are equivalent to heat dissipation fins. This design directly places the heat dissipation fins inside the inner cavity without designing internal flow channels. The refrigerant cannot effectively carry away heat, resulting in generally low heat transfer efficiency between the refrigerant and the heat dissipation fins, thus affecting the overall heat dissipation efficiency. Utility Model Content

[0005] In view of this, the present invention addresses the deficiencies of the existing technology and its main purpose is to provide a water-cooled radiator that optimizes the flow channel so that the refrigerant can fully remove heat, thereby improving heat dissipation efficiency and overcoming the shortcomings of the existing technology.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: This application provides a water-cooled heat sink, including a water block, a water pump, a radiator, and a cooling fan; a first pipe connects the water block and the water pump; a second pipe connects the water pump and the radiator; the water block includes a base plate, a first heat dissipation fin, a fin cover, and a top cover; a first mounting groove is formed by a partial recess on the base plate; the first heat dissipation fin is disposed in the first mounting groove, and the fin cover covers the first heat dissipation fin; a heat-absorbing seat on the base plate is attached to the chip and absorbs the heat generated by the chip. The top cover has a first flow channel, a heat exchange groove, a second flow channel, a third flow channel, and a fourth flow channel. The first heat dissipation fins and fin covers are embedded in the heat exchange groove. The cross-sectional area S1 of the first flow channel is locally narrowed to form a first slow flow section. The cross-sectional area S2 of the second flow channel is smaller than the cross-sectional area S3 of the third flow channel. The heat exchange groove connects the second flow channel and the third flow channel, and the fourth flow channel is connected to the third flow channel. The bottom plate is fitted onto the top cover, and the top cover is provided with an inlet connector and an outlet connector; the inlet connector is connected to the first flow channel, and the outlet connector is connected to the second and fourth flow channels; the cooling medium enters the fifth flow channel on the first heat dissipation fin and flows out from both sides of the first heat dissipation fin.

[0007] Preferably, a sixth flow channel is provided on the side of the heat exchange tank, and the sixth flow channel connects the heat exchange tanks on the left and right sides of the first heat dissipation fin; the cross-sectional area S6 of the sixth flow channel is smaller than the cross-sectional area S2 of the second flow channel.

[0008] Preferably, sealing grooves are provided at the edges of the first flow channel, the heat exchange tank, the second flow channel, the third flow channel, and the fourth flow channel, and sealing rings are provided in the sealing grooves.

[0009] Preferably, the top cover has second heat dissipation fins cut at its corners; the bottom plate and the top cover are assembled together by welding or screw connection.

[0010] Preferably, the first heat dissipation fin has a first sintered layer or a first rough surface on both sides of the fin.

[0011] Preferably, a second sintered layer or a second rough surface is provided on the inner side of the base plate corresponding to the first flow channel, the second flow channel, the third flow channel, and the fourth flow channel.

[0012] Preferably, the water pump has a metal housing; the housing is disposed on a top cover, and thermally conductive silicone grease is disposed between the housing and the top cover.

[0013] Preferably, the outer side of the base plate protrudes to form a plurality of heat-absorbing seats and threaded pillars; the heat-absorbing seats have a third rough surface; and some of the threaded pillars are stepped pillars.

[0014] Preferably, the fin cover has an clearance opening in the middle; the left and right ends of the fin cover have openings; and the inner wall of the top cover has a positioning post, which is inserted into the fin cover.

[0015] This application provides a workstation, including the aforementioned water-cooled radiator; the motherboard is disposed inside the chassis, and the water block is fixed on the motherboard; the heat absorber is attached to the chip and absorbs the heat generated by the chip; the radiator is disposed at the inner top of the chassis, and the distance between the cooling fan and the water pump is between 1-2 cm; the cooling fan blows the heat from the radiator out from the top of the chassis.

[0016] This invention has significant advantages and beneficial effects compared with existing technologies. Specifically, as shown in the above technical solution, the water cooling head contacts the chip and absorbs the heat generated by the chip. The water pump drives the refrigerant to move to the radiator, where a cooling fan blows heat, thus cooling the refrigerant. The cooled refrigerant then returns to the water cooling head to continue absorbing heat and circulating continuously.

[0017] When the water pump is working, the refrigerant enters the first flow channel through the inlet connector. Within this channel, the refrigerant is slowed down, allowing it to enter the heat exchange tank at a relatively gentle speed. There, it undergoes heat exchange with the heat sink fins. At this point, the hotter refrigerant splits into two paths: the first path leads to the outlet connector via the second flow channel; the second path leads to the outlet connector via the third and fourth flow channels. This design ensures that the refrigerant moves only along a predetermined path, allowing for thorough heat exchange with the heat sink fins and improving heat exchange efficiency.

[0018] Since the cross-sectional area S2 of the second flow channel is smaller than the cross-sectional area S3 of the third flow channel, both the second and third flow channels will have refrigerant flowing, ensuring heat dissipation performance. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a water cooling head according to one embodiment of this utility model.

[0020] Figure 2 This is an exploded view of the water cooling head according to Embodiment 1 of this utility model.

[0021] Figure 3 This is one embodiment of the present utility model. Figure 2 Another perspective diagram.

[0022] Figure 4 This is a cross-sectional schematic diagram of the water cooling head according to Embodiment 1 of this utility model.

[0023] Figure 5 This is an exploded view of one embodiment of the present invention.

[0024] Figure 6 This is a schematic diagram of the overall structure of Embodiment 2 of this utility model.

[0025] Figure 7 This is a partial structural schematic diagram of Embodiment 2 of this utility model.

[0026] Explanation of reference numerals in the attached diagram: 10. Water block; 11. Inlet connector; 12. Outlet connector; 13. Heat absorber; 14. Threaded post; 110. Base plate; 111. First mounting slot; 112. First heat dissipation fin; 113. First sintered layer; 114. Fifth flow channel; 115. Fin cover; 116. Clearance opening; 117. Opening; 120. Top cover; 121. First flow channel; 122. Heat exchanger; 123. Second flow channel; 124. Third flow channel; 125. Fourth flow channel; 126. Sixth flow channel; 127. Second heat dissipation fin; 128. Second sintered layer; 129. Sealing groove; 130. Water pump; 131. Radiator; 132. Cooling fan; 133. Chassis; 134. Sealing ring. Detailed Implementation

[0027] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.

[0028] Example 1 Please refer to Figures 1 to 5 As shown, it illustrates the specific structure of a preferred embodiment of the present invention, which is a water-cooled radiator.

[0029] Among these improvements, the structure of the flow channel is optimized so that the heat dissipation fins can fully contact the refrigerant, which helps to improve heat exchange capacity and heat dissipation capacity.

[0030] This application provides a water-cooled radiator, including a water block 10, a water pump 130, a radiator 131, and a cooling fan 132; a first pipe connects the water block 10 and the water pump 130; a second pipe connects the water pump 130 and the radiator 131. The water block 10 includes a base plate 110, first heat dissipation fins 112, a fin cover 115, and a top cover 120; a first mounting groove 111 is formed by a partial recess on the base plate 110; the first heat dissipation fins 112 are disposed in the first mounting groove 111, and the fin cover 115 covers the first heat dissipation fins 112; a heat absorption seat 13 on the base plate 110 is attached to a chip and absorbs the heat generated by the chip; a first flow channel 121, a heat exchange groove 122, a second flow channel 123, a third flow channel 124, and a fourth flow channel 125 are formed on the top cover 120. The heat exchange groove 122 is formed by embedding the first heat dissipation fin 112 and the fin cover 115 in the heat exchange groove 125. The cross-sectional area S1 of the first flow channel 121 is partially narrowed to form a first slow-flow section. The cross-sectional area S2 of the second flow channel 123 is smaller than the cross-sectional area S3 of the third flow channel 124. The heat exchange groove 122 connects the second flow channel 123 and the third flow channel 124, and the fourth flow channel 125 connects to the third flow channel 124. The bottom plate 110 covers the top cover 120, and the top cover 120 is provided with an inlet connector 11 and an outlet connector 12. The inlet connector 11 communicates with the first flow channel 121, and the outlet connector 12 communicates with the second flow channel 123 and the fourth flow channel 125. The cooling medium enters the fifth flow channel 114 on the first heat dissipation fin 112 and flows out from both sides of the first heat dissipation fin 112. The water cooling head 10 is used to absorb the heat of the chip, and thermally conductive silicone is placed between the water cooling head 10 and the chip. Water pump 130 drives the flow of refrigerant, which can be water, acetone, alcohol, etc. The first and second pipes are flexible conduits, which can be metal flexible conduits, plastic flexible hoses, etc. The base plate 110, top cover 120, fin cover 115, and fins can be made of copper or aluminum. The flow channels can be CNC machined. The first heat dissipation fin 112 can be welded or bonded to the first mounting groove 111. The top cover 120 can be welded to the heat dissipation fins. The base plate 110 can be formed by stamping and CNC machining. When water pump 130 is working, the refrigerant enters from the first flow channel 121, and then the flow rate is slowed down in the first buffer section. The refrigerant in the first flow channel 121 enters the fifth flow channel 114 of the heat dissipation fins, and then flows out from the left and right sides of the heat dissipation fins. The first refrigerant flows from the second channel 123 into the outlet connector 12, and the second refrigerant flows from the third channel 124 to the fourth channel 125, and then to the outlet connector 12.Since the cross-sectional area S2 of the second flow channel 123 is smaller than the cross-sectional area S3 of the third flow channel 124, refrigerant will flow out from both sides of the heat dissipation fins, which helps to ensure the balance of heat dissipation.

[0031] Preferably, a sixth flow channel 126 is provided on the side of the heat exchange groove 122, and the sixth flow channel 126 connects the heat exchange groove 122 on the left and right sides of the first heat dissipation fin 112; the cross-sectional area S6 of the sixth flow channel 126 is smaller than the cross-sectional area S2 of the second flow channel 123. The sixth flow channel 126 is U-shaped or gate-shaped. The sixth flow channel 126 helps to adjust the pressure on the left and right sides of the heat dissipation fin, and further finely adjusts the flow rate on both sides of the heat dissipation fin. This design helps to improve the overall heat dissipation capacity of the refrigerant, and the refrigerant flows out from both sides of the first heat dissipation fin, resulting in better heat dissipation effect.

[0032] Preferably, sealing grooves 129 are provided at the edges of the first flow channel 121, heat exchange tank 122, second flow channel 123, third flow channel 124, and fourth flow channel 125, and sealing rings 134 are provided in the sealing grooves 129. The sealing grooves 129 and sealing rings 134 cooperate to improve the separation between the flow channels, prevent leakage between the flow channels, and ensure that the refrigerant moves in the designed direction.

[0033] Preferably, the top cover 120 has second heat dissipation fins 127 cut at its corners; the bottom plate 110 and the top cover 120 are assembled together by welding or screws. When the cooling fan 132 is working, the second heat dissipation fins 127 can dissipate heat from the top cover 120, further improving its heat dissipation capacity and ensuring a balanced temperature of the water block 10.

[0034] Preferably, a first sintered layer 113 or a first roughened surface is provided on both sides of the first heat dissipation fin 112. A second sintered layer 128 or a second roughened surface is provided on the inner side of the base plate 110 corresponding to the first flow channel 121, the second flow channel 123, the third flow channel 124, and the fourth flow channel 125. The sintered layers (first sintered layer 113, second sintered layer) are formed by sintering metal powder (such as copper powder, aluminum powder) at high temperature, and have high porosity and good capillary properties. Through a specific sintering process, a porous capillary structure can be formed on or inside the heat dissipation fin. This structure can increase the contact area with the fluid and improve the heat dissipation efficiency. For example, in some heat pipe cooling systems, capillary structures are sintered on the inner wall of the heat pipe and on the heat dissipation fins to effectively dissipate the heat generated by the heat-generating element. Some three-dimensional vapor chamber elements with heat dissipation fins also form a three-dimensional porous copper structure layer as a capillary structure on the surface of the heat dissipation fins through a sintering process. The heat dissipation fins have a certain gap between them to meet the sintering requirements. The heat dissipation fins can be cut and shaped using CNC equipment, or multiple fins can be welded together to form a heat dissipation fin module. The first, second, and third roughened surfaces can be formed by sandblasting. Both the sintered layer and the roughened surfaces increase the heat conduction area, helping to improve heat conduction efficiency.

[0035] Preferably, the water pump 130 has a metal casing; this casing is mounted on the top cover 120, and thermally conductive silicone grease is applied between the casing and the top cover 120. The casing can be made of copper or aluminum, which has excellent thermal conductivity. The casing is fixed to the top cover 120 with screws. The casing of the water pump 130 can also absorb some of the heat, and then the water pump 130 delivers the refrigerant to the radiator 131 for heat dissipation. This design cleverly utilizes the casing of the water pump 130 for heat dissipation, further improving the heat dissipation capacity of the radiator.

[0036] Preferably, the outer side of the base plate 110 protrudes to form a plurality of heat-absorbing seats 13 and threaded pillars 14; the heat-absorbing seats 13 have a third rough surface; some of the threaded pillars 14 are stepped pillars. The heat-absorbing seats 13 are in contact with the chip and can quickly absorb heat; some / all of the heat-absorbing seats 13 are provided with heat dissipation fins on their inner sides, and heat can be quickly transferred to the heat dissipation fins for heat exchange, resulting in high heat dissipation efficiency. Some of the threaded pillars (14) are stepped pillars. This design facilitates the installation of the water cooling head 10, and the stepped shape can reserve a certain height for the mounting brackets on the chip, making installation more convenient.

[0037] Preferably, the fin cover 115 has a clearance opening 116 in the middle; openings 117 are provided at both ends of the fin cover 115; and a positioning post is provided on the inner wall of the top cover 120, which is inserted into the fin cover 115. The fifth flow channel 114 corresponds to the clearance opening 116. The openings 117 correspond to the left and right sides of the heat dissipation fins. Refrigerant flows out from the openings 117. The positioning post can be welded or formed on the top cover 120 using CNC equipment. The positioning post inserted into the fin cover 115 can improve the thermal conductivity between the top cover 120 and the fin cover 115, and can also serve to install and fix the fin cover 115.

[0038] Example 2 Example 2 includes the water cooling head of Example 1; the same parts will not be described again. Please refer to... Figure 6-7 The workstation shown includes the aforementioned water-cooled radiator; the motherboard is housed inside a chassis 133, and the water block 10 is fixed to the motherboard; the heat absorber 13 is attached to the chip and absorbs the heat generated by the chip; the radiator 131 is located at the top inner part of the chassis 133, and the distance between the cooling fan 132 and the water pump 130 is between 1-2 cm; the cooling fan 132 blows the heat from the radiator 131 out from the top of the chassis 133. By using this type of radiator, the size of the chassis 133 can be made very small while ensuring its heat dissipation capacity.

[0039] In summary, the key design feature of this utility model is that the internal flow channel of its water cooling head 10 has been optimized, so that the refrigerant can fully contact the heat dissipation fins, which helps to improve the heat exchange capacity and the heat dissipation capacity of the radiator.

[0040] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A water-cooled radiator, comprising a water block (10), a water pump (130), a radiator (131), and a cooling fan (132); a first pipe is provided connecting the water block (10) and the water pump (130); a second pipe is provided connecting the water pump (130) and the radiator (131); characterized in that: The water cooling head (10) includes a base plate (110), a first heat dissipation fin (112), a fin cover (115), and a top cover (120); a first mounting groove (111) is formed by a partial recess on the base plate (110); the first heat dissipation fin (112) is disposed in the first mounting groove (111), and the fin cover (115) covers the first heat dissipation fin (112); the heat absorption seat (13) on the base plate (110) is attached to the chip and absorbs the heat generated by the chip; The top cover (120) has a first flow channel (121), a heat exchange groove (122), a second flow channel (123), a third flow channel (124), and a fourth flow channel (125). The first heat dissipation fins (112) and the fin cover (115) are embedded in the heat exchange groove (122). The cross-sectional area S1 of the first flow channel (121) is locally narrowed to form a first slow flow section. The cross-sectional area S2 of the second flow channel (123) is smaller than the cross-sectional area S3 of the third flow channel (124). The heat exchange groove (122) connects the second flow channel (123) and the third flow channel (124), and the fourth flow channel (125) connects to the third flow channel (124). The bottom plate (110) covers the top cover (120), and the top cover (120) is provided with a water inlet connector (11) and a water outlet connector (12); the water inlet connector (11) is connected to the first flow channel (121), and the water outlet connector (12) is connected to the second flow channel (123) and the fourth flow channel (125); the cooling medium enters the fifth flow channel (114) on the first heat dissipation fin (112) and flows out from both sides of the first heat dissipation fin (112).

2. The water-cooled radiator according to claim 1, characterized in that: A sixth flow channel (126) is provided on the side of the heat exchange tank (122), and the sixth flow channel (126) connects the heat exchange tank (122) on the left and right sides of the first heat dissipation fin (112); the cross-sectional area S6 of the sixth flow channel (126) is smaller than the cross-sectional area S2 of the second flow channel (123).

3. A water-cooled radiator according to claim 1, characterized in that: Sealing grooves (129) are provided at the edges of the first flow channel (121), heat exchange tank (122), second flow channel (123), third flow channel (124), and fourth flow channel (125), and sealing rings (134) are provided in the sealing grooves (129).

4. A water-cooled radiator according to claim 1, characterized in that: The top cover (120) has second heat dissipation fins (127) cut at the corners; the bottom plate (110) and the top cover (120) are assembled together by welding or screw connection.

5. A water-cooled radiator according to claim 1, characterized in that: The first heat dissipation fin (112) has a first sintered layer (113) or a first rough surface on both sides of the fin.

6. A water-cooled radiator according to claim 1 or 5, characterized in that: The inner side of the base plate (110) corresponding to the first flow channel (121), the second flow channel (123), the third flow channel (124), and the fourth flow channel (125) is provided with a second sintered layer (128) or a second rough surface.

7. A water-cooled radiator according to claim 1, characterized in that: The water pump (130) has a metal housing; the housing is disposed on a top cover (120), and thermal grease is disposed between the housing and the top cover (120).

8. A water-cooled radiator according to claim 1, characterized in that: The outer side of the base plate (110) protrudes to form several heat-absorbing seats (13) and threaded pillars (14); the heat-absorbing seats (13) have a third rough surface; some of the threaded pillars (14) are stepped pillars.

9. A water-cooled radiator according to claim 1, characterized in that: An avoidance opening (116) is provided in the middle of the fin cover (115); openings (117) are provided at the left and right ends of the fin cover (115); a positioning post is provided on the inner wall of the top cover (120), and the positioning post is inserted into the fin cover (115).

10. A workstation, characterized in that: The device includes a water-cooled radiator as described in any one of claims 1-9; the motherboard is disposed inside the chassis (133), and the water cooling head (10) is fixed on the motherboard; the heat absorption seat (13) is attached to the chip and absorbs the heat generated by the chip; the radiator (131) is disposed at the top inside the chassis (133), and the distance between the cooling fan (132) and the water pump (130) is between 1-2 cm; the cooling fan (132) blows the heat of the radiator (131) out from the top of the chassis (133).

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